1339331 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種熱虹_環式散熱裝置。 【先前技術】 一般用以散除電子、半逡 sink) ’例如錢專利第熱器（heat 材(wick)貼近發熱源(如來自cpu或"不^ 含有了51339331 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a thermal rainbow-ring heat sink. [Prior Art] Generally used to dissipate electrons, semi-sinks.] For example, the money patent (heater material (wick) is close to the heat source (such as from cpu or " not ^ contains 5
.ΐΐ工rti 5作流體之蒸汽接觸散熱器：壁冷 SI術放熱以散除發熱源之熱量。但此-先 1.=作流體吸熱蒸發、經冷卻 '再滴下回流，係在— ?4=熱器？體内進行，加熱上昇之蒸汽與冷卻下流之 撞」’遂阻礙流體汽、液相循環之路徑， 而降低散熱效率。 · 2.光靠則等習知之散熱方式所能散除的熱量有限，無法有 ，因應近來電子、半導體與光電越湖產品其功率增 尚、發熱量增加之趨勢，而現其缺點。 本案發明人有雲於此’乃加研究創新，揭示出本發明新賴 之熱虹吸循環式散熱裝置。 、 【發明内容】 本發明之目的旨在提供一種熱虹吸循環式散熱裝置，係包 括：一蒸發器貼置於一中央處理器（CPU)或LED燈等熱源之上； 一毛細管熱傳導介質安裝於該蒸發器底部以吸收熱源之熱，且 浸含（impregnated)以易（或可）蒸發之熱傳流體(vap〇rizable heat-transfer fluid); —汽相管連通該蒸發器以引導因吸收熱源 之熱而向上蒸發之熱傳流體之蒸汽；一冷凝器連通該汽相管俾 5 冷卻該熱傳流體之蒸汽以釋放凝結熱㈣福細⑽㈣以及 疑器至該蒸發器俾將冷凝之卫作流體循環 之毛細管熱傳導介質之中’如是週而復始地 吸,、，、' 祕赠去熱源所傳導之熱而達到散熱之目的者。 本發明之可取實體，可由以下實施例配合騎諸圖式而得 以明晰之。 【實施方式】 參閱，卜4 ® ’本發明散熱裝置，係包括：一蒸發器⑴， :毛^ 管熱料介質(2，eapiuary heaMransfei> medium)置於該 ?备發盗(1)底部，-易(或可)蒸發之熱傳流體(F)浸含於該蒸發^ ⑴底部及該毛細管熱傳導介質⑺之中，一汽相管' °， ，卿—咖)連通該蒸發器⑴，-冷凝器(4)連接該汽相管 及""液相奶’ hqUid_phase pipe)連接該冷凝器(4)與該 崧务器（1)以完成一熱虹吸循環系統者。 ^ ^玄易蒸f之熱傳流體(F)可選自：甲醇、乙醇、水、奈米(職〇) /，》體、及其他可洛發 '無毒、不腐蝕之流體者。 該蒸發器(1)及整個熱虹吸循環系統係呈錢系統且可加以 抽真空以加速熱傳流體(F)之蒸發者。 該蒸發器⑴係包括··-底盤⑴，或底座)可貼置(或設)於一 發熱源(Η)如CPU或LED燈之上，-||罩(12)藉突緣(u)固 該底盤(11)，罩(12)内職-蒸發室(vap。细iQnehamber),以 及-錐形罩頂⑽連接該器罩(12)與該汽相管⑶之進汽管端 (31) ’俾將受熱蒸發之歸流體(F)紐導人料凝器⑷之中 者。 該毛細管鋪導介質(2)可選自··純性材f，粉末冶金， ^卞燒結體，多孔性發泡郎咖），多孔性碳化(咖b〇nized) 體·#寻’本發明並未加以限制。 粉末冶金或多孔性燒結體則可選自：銀、銅、紹合金，及 其他適當金屬、合金材料者。 該汽相管(3)應有一定之高度，以增加其抽引(drafting)之「煙 国效應」’以強化本發明之熱虹吸循環作用，增進其散熱效率。 該汽相管(3)之内管壁由下而上可螺旋地設有螺旋型邊板或 導流板(30，helical baffle)如第1圖之虛線所示者，以促進蒸發 蒸/飞之旋風流向(cyclone)，以加速蒸汽迅速迴旋地流入該冷凝 器(4)當中加以冷凝、散熱，且可讓小部份蒸汽於逸昇過程中 遇到汽相管(3)管壁而稍許冷凝之冷凝液滴可循該螺旋型邊板 螺旋向下引流，不會與上昇之蒸汽「碰撞」而不會礙及熱虹吸 之循環效用。此節猶加步搶中之來福線(Rifling)者然，但邊板 之寬度極微小，以免阻礙「正常」之上昇蒸汽之流道。 當然’該螺旋型邊板(30)亦可免設，而可視發熱源(H)之負 荷與功率而定’而本發明相關元件之尺寸大小、構造細節，材 料之選用等等，容可視實際需要而可於不違本發明之精神及範 圍下作適當之修飾或·改變。例如，該器罩(12)與其他部份可一 體成型或結合為一體，而呈一拱型或半球型者，本發明實不限 制之。 該冷凝器(4)如第1〜4圖中所示者，係包括：一冷凝管裝置 (41) ’ 一冷卻器(42)，以及一器殼(40)用以固裝該冷凝管裝置(41) 與冷卻器(42)者；該冷凝管裝置(41)連接該汽相管⑶之出汽管 端(32)俾將來自蒸發器（丨)之受熱蒸汽導入該冷凝管裝置(41) 中’而為該冷卻器(42)所冷卻、冷凝者。 該冷凝器(4)可為熱交換器(Heat-exchanger)之型式，係包 括：一冷凝管裝置(41)置於該器殼(40)之内；該器殼(4〇)裝有冷 卻器(42)進液管(421)將冷卻劑(如水，W)導入該器殼(4〇)之、、殼 端夕（shell side) ’與出液管(422)將冷卻劑(如水)自器殼(4〇)上端 導出；由是冷的冷卻劑由進液管(411)進入后與位於、、管端夕 (tube side)之冷凝管裝置(41)管内之熱蒸汽「熱交換」後吸收其 熱，帶走蒸汽之熱，使管内蒸汽放出凝結熱或潛熱而冷凝為液 :i由=相官之出液管端(51)流出，經回流管端(52)迴流入 該热發器⑴底部内；雨熱交換過之熱的冷卻液則由殼上方之 出液管(422)流出，彼可經風料吹驅、冷卻后，以栗浦或重 力方式(未示出)再循環流入進液管(421)循環操作之。 該冷凝管裝置(41)可包括：一上管集(4U，upper㈣⑼連 =汽相f (3)，多數支管(412)上連該上管集(411)俾將進來之 洛汽分流進入多數支管⑷2)之中，以增加散熱(或熱交換)面 積，以有效散熱者，以及一下管集(413)連接該等支管(412)之 下方，將冷凝之液體經液相管(5)回流入該蒸發器（丨)之中。 本發明相關元件之連接可以焊接或其他方法加以密接，為 防止漏汽，或漏水，在相接之處可以〇型環(〇)、迫緊(packing) 材等加以密封、止漏之。 士當本發明之蒸發器（1)貼置於熱源(H)如CPU或LED燈上 時熱源弋熱傳入蒸發器（1)底部(II)由毛細管熱傳導介質(2) ，熱，將浸含其中的可(易）蒸發熱傳流體(F)加熱、蒸發，受熱 度減小，熱八上昇，進行熱虹吸(丁 herm〇Syph〇n)作用， 而汽相管(3)司如煙囪，更促進抽引(drafting)作用，遂加速受熱 洛汽循管(3)進入冷凝器(4)之中加以冷凝，釋放凝結熱而達到 散熱之自的，而凝結液則由液相管(5)回流進入蒸發器（丨）中循 環操作，週而復始，以有效冷卻熱源所釋出之熱。 必須一提的是，該毛細管熱傳導介質(2)主要由粉末冶金 (powder metallurgy)或多孔性燒結(Sintered)材料製成，充滿毛細 管之多孔性，故當它浸含以可蒸發之熱傳流體后，透過殊多毛 細管以毛細現象滲流經各多孔性之細孔，故形成多數「涓涓細 流」之熱傳流體，大大擴增熱傳導面積，故能迅速而充份受熱， 且多數毛細管形成多股細流使受熱之蒸汽不會因分子之「群 聚」現象形成集團狀，而可迅速往上蒸發，促進熱虹吸作用， 提高本發明之散熱效率；同理，回流之冷凝液亦可經由形如「海、 棉」狀之多孔性介質(2)迅速滲流進入多孔性之介質(2)中，在 增大熱傳面積讀境下，迅速崎效地再受 進行循環賴操作，喊優贱馳術者，故能_功^= ^大型電子、資訊、光電產品，且因在環狀之循環散熱系 =先i^i、液相互不衝突，故散熱效率提高，優異、進 如第5圖所示者，該冷凝器(4)之冷卻器 ，將冷凝管裝置⑼諸管安裝j以散 此亦構成另型之散熱實施例。 而，第6圖所示者，該冷凝器(4)之冷卻胃⑽則修挪為冷卻 =扇(42b)，卩冷卻冷凝管裝置(41)諸管而構成再一可取實施例 者。 製Ϊ述二:t冷，器(4)之器殼(4〇)須加以適當設計、 衣=抓成少數進風口與出風口，而非密閉式之殼體，特此 一表0 0本 本㈣之料及範4下作適度之修飾或改 k ’本發明實不限制之。 ，，管(5)中亦可於管内壁加設螺旋型邊板(未示 助冷喊液之回流者。 国第75，本發明亦可採取組合式或複合式之應用方式， ^兩組蒸發器⑴並聯，蒸汽循兩汽相管⑶進入一共用之 卻 '回流之冷卻液麵液相管(5)下流，分流、 操作。當然，本㈣可有多組蒸發 口夕組冷凝窃(4)加以變化應用，或並聯或串聯，本發 明並未限制之。 【圖式簡單說明】 第1圖係本發明之組成外觀示意圖 第2圖係本發明之元件分解圖。 第3圖係本發明之組成正視圖。 1339331 第4圖係本發明之組成側視圖。 第5圖係本發明另一可取實例示意圖。 第6圖係本發明他一可取實例示意圖。 第7圖為本發明再一組合式之可取實例圖。 【主要元件符號說明】 1…. ..蒸發器； 2.… ..毛細管熱傳導介質； F…. ..工作流體； 3.… ..汽相管； 4··.. ..冷凝器； W".. ..冷卻液(水）； 5…. ..液相管； .11.... ..底盤； 12... …器罩； 13·… ..突緣； 14... …錐形罩頂； 31.… ..進汽管端; 32... …出汽管端； . 41··" ..冷凝管裝置； 42... ··_冷卻器（冷卻管）； 40.... 32. -kn.. • · σσ Λ又， 51... …出液管端； 52.… ..回流管端； Η…·. 42a" ....鰭片式冷卻器； 42b. ‘ .....冷卻風扇。 10. Rti 5 as a fluid steam contact radiator: wall cooling SI heat release to dissipate heat from the heat source. But this - first 1. = for fluid absorption by evaporation, after cooling 're-drip reflux, tied in - 4 = heat? In the body, the heated rising steam collides with the cooling downflow, which hinders the path of the fluid vapor and liquid phase circulation, and reduces the heat dissipation efficiency. · 2. The heat that can be dissipated by the conventional heat dissipation method is limited, and there is no way. In view of the recent increase in power and heat generation of electronic, semiconductor and photovoltaic products, the shortcomings are present. The inventor of the present invention has clouded this innovation, revealing the new thermal-syphon circulating heat sink of the present invention. SUMMARY OF THE INVENTION The object of the present invention is to provide a thermosyphon circulating heat sink comprising: an evaporator attached to a heat source such as a central processing unit (CPU) or an LED lamp; a capillary thermal conduction medium mounted on The bottom of the evaporator absorbs the heat of the heat source and is impregnated with a vap〇rizable heat-transfer fluid; the vapor phase tube communicates with the evaporator to guide the heat source due to absorption a vapor of heat transfer fluid that evaporates upwards; a condenser communicates with the vapor phase tube 俾5 to cool the steam of the heat transfer fluid to release condensation heat (4) (10) (4) and the suspicion to the evaporator In the capillary heat transfer medium of the fluid circulation, if it is absorbed by the heat, the heat that is transmitted by the heat source to achieve the purpose of heat dissipation. The desirable entities of the present invention can be clarified by the following embodiments in conjunction with riding patterns. [Embodiment] Referring to the following, the heat dissipating device of the present invention comprises: an evaporator (1), and a thermal medium (2, eapiuary heaMransfei> medium) is placed at the bottom of the pirate (1). - an easy (or escapable) evaporating heat transfer fluid (F) is impregnated in the bottom of the evaporation ^ (1) and the capillary heat transfer medium (7), the vapor phase tube ' °, qing - coffee) is connected to the evaporator (1), - condensation The (4) is connected to the vapor phase tube and the "" liquid milk 'hqUid_phase pipe) is connected to the condenser (4) and the server (1) to complete a thermosyphon cycle system. ^ ^Xuanyi steaming heat transfer fluid (F) can be selected from: methanol, ethanol, water, nano (professional) /, "body" and other can be 'non-toxic, non-corrosive fluids. The evaporator (1) and the entire thermosyphon circulation system are in the form of a money system and can be evacuated to accelerate the evaporator of the heat transfer fluid (F). The evaporator (1) comprises: a chassis (1), or a base) can be placed (or placed) on a heat source (Η) such as a CPU or an LED lamp, and the || cover (12) is flanged (u) The chassis (11), the cover (12) inner-evaporation chamber (vap. fine iQnehamber), and the conical cover top (10) connect the cover (12) with the steam inlet end (31) of the vapor phase tube (3) '俾 will be heated by the evaporation of the fluid (F) New Zealand guide condenser (4). The capillary-guided medium (2) may be selected from the group consisting of: pure material f, powder metallurgy, sintered body of yttrium, porous foaming granules, porous carbonized body, #寻' the invention There are no restrictions. The powder metallurgy or porous sintered body may be selected from the group consisting of silver, copper, sinter alloy, and other suitable metals and alloy materials. The vapor phase tube (3) should have a certain height to increase the "smoke effect" of its drafting to enhance the thermosiphon cycle of the present invention and to improve its heat dissipation efficiency. The inner wall of the vapor phase tube (3) is spirally provided with a spiral side plate or a baffle (30) as shown by the broken line in Fig. 1 to promote evaporation/flying. The cyclone flows to accelerate the swirling of steam into the condenser (4) for condensation and heat dissipation, and allows a small portion of the steam to encounter the vapor phase tube (3) wall during the elevating process. The condensed condensed droplets can be spirally drained down the spiral side plate without colliding with the rising steam without hindering the thermosiphon circulation effect. This section is still a step in the Rifling, but the width of the side panels is extremely small, so as not to hinder the "normal" rising steam flow. Of course, the spiral side plate (30) can also be omitted, and depending on the load and power of the heat source (H), and the size, construction details, material selection, etc. of the related components of the present invention can be visually observed. Appropriate modifications or changes may be made without departing from the spirit and scope of the invention. For example, the cover (12) may be integrally formed or integrated with other parts, and in an arched or hemispherical shape, the present invention is not limited thereto. The condenser (4), as shown in Figures 1 to 4, comprises: a condenser device (41) 'a cooler (42), and a casing (40) for fixing the condenser device (41) with a cooler (42); the condensing pipe device (41) is connected to the outlet pipe end (32) of the vapor phase pipe (3), and the heated steam from the evaporator (丨) is introduced into the condensing pipe device (41) In the middle, it is cooled and condensed by the cooler (42). The condenser (4) may be of a heat exchanger type, comprising: a condensing pipe device (41) disposed inside the casing (40); the casing (4 〇) is equipped with cooling The inlet pipe (421) introduces a coolant (such as water, W) into the casing (4 〇), the shell side '' and the outlet pipe (422) to cool the coolant (such as water). It is derived from the upper end of the casing (4 〇); the hot steam "heat exchange" in the tube of the condensing pipe device (41) located at the tube side of the tube is entered by the inlet pipe (411). After absorbing the heat, taking away the heat of the steam, causing the steam in the tube to release condensation heat or latent heat and condense into liquid: i is discharged from the outlet end (51) of the phase, and is returned to the outlet end (52) through the return pipe. The inside of the bottom of the heat generator (1); the coolant heated by the rain heat is discharged from the liquid outlet pipe (422) above the shell, which can be blown by the wind material, cooled, and then pumped or gravityd (not shown) The recirculation into the inlet pipe (421) is circulated. The condensing tube device (41) may include: an upper tube set (4U, upper (4) (9) connected = vapor phase f (3), and the plurality of branch tubes (412) connected to the upper tube set (411), the incoming steam is diverted into the majority In the branch pipe (4) 2), to increase the heat dissipation (or heat exchange) area, the effective heat sink, and the lower pipe set (413) are connected below the branch pipes (412), and the condensed liquid is returned through the liquid phase pipe (5). Flow into the evaporator (丨). The connection of the related components of the present invention may be welded or otherwise adhered to prevent leakage or water leakage, and the joints may be sealed and leaked at the joints. When the evaporator (1) of the present invention is placed on a heat source (H) such as a CPU or an LED lamp, the heat source is heated to the bottom of the evaporator (1) (II) by capillary heat transfer medium (2), heat, and will be dipped. The (e) evaporating heat transfer fluid (F) containing therein is heated and evaporated, the heat is reduced, the heat is raised, the thermosiphon is applied, and the vapor phase tube (3) is like a chimney. It promotes the drafting effect, accelerates the heated Luoqi steam tube (3) into the condenser (4) to condense, releases the condensation heat to achieve the heat dissipation, and the condensate is from the liquid phase tube ( 5) Circulating into the evaporator (丨) for cyclic operation, and repeated to effectively cool the heat released by the heat source. It must be mentioned that the capillary heat transfer medium (2) is mainly made of powder metallurgy or porous sintered (Sintered) material, which is filled with capillary porosity, so when it is impregnated with a vaporizable heat transfer fluid After that, the capillary is permeated through the porous pores through a capillary phenomenon, so that a large number of "small flow" heat transfer fluids are formed, and the heat conduction area is greatly expanded, so that it can be quickly and fully heated, and most of the capillary forms multiple strands. The trickle makes the heated steam not form a group due to the "clustering" phenomenon of the molecules, but can quickly evaporate upward, promote the thermosiphon effect, and improve the heat dissipation efficiency of the present invention; similarly, the reflux condensate can also be shaped like The "sea, cotton" porous medium (2) rapidly seeps into the porous medium (2), and in the case of increasing the heat transfer area, it is quickly and responsibly subjected to the recirculation operation. The operator, so can _gong ^ = ^ large-scale electronics, information, optoelectronic products, and because of the circular cooling system = first i ^ i, liquid does not conflict with each other, so the heat dissipation efficiency is improved, excellent, enter as shown in Figure 5. As shown, A condenser (4) of the cooler, the condenser tube mounting means such ⑼ j to dissipate heat also goes to form another type of embodiment. Further, as shown in Fig. 6, the cooling stomach (10) of the condenser (4) is trimmed to a cooling = fan (42b), and the tubes of the condenser unit (41) are cooled to constitute a further preferred embodiment. System Description 2: t cold, the shell of the device (4) (4〇) must be properly designed, clothing = grab a small number of air inlets and outlets, rather than a closed shell, here a table 0 0 books (4) The material and the mode 4 are moderately modified or modified. The present invention is not limited thereto. In the tube (5), a spiral type edge plate may be added to the inner wall of the tube (the returning of the cold shouting liquid is not shown. The national 75th, the invention may also adopt a combined or composite application mode, ^ two groups The evaporator (1) is connected in parallel, and the steam follows the two-fluid phase tube (3) to enter a common but reflowed cooling liquid surface liquid tube (5) to flow down, divert and operate. Of course, this (4) can have multiple sets of evaporation ports. 4) The application is changed, or in parallel or in series, and the present invention is not limited. [Simplified description of the drawings] Fig. 1 is a schematic view showing the appearance of the composition of the present invention. Fig. 2 is an exploded view of the components of the present invention. A front view of the composition of the invention. 1339331 Figure 4 is a side view of the composition of the present invention. Fig. 5 is a schematic view showing another example of the present invention. Fig. 6 is a schematic view showing an example of the present invention. Example diagram of combined type. [Explanation of main component symbols] 1.... .. evaporator; 2.... .. capillary thermal conduction medium; F.... working fluid; 3.... .. vapor phase tube; 4·· .. .. condenser; W".. .. coolant (water); 5.... .. liquid phase tube; .11.... .. chassis; 12... hood; 13·... .. flange; 14... cone cover; 31..... inlet pipe end; 32... ... steam pipe end; 41··" ..Condensing tube device; 42... ··_cooler (cooling tube); 40.... 32. -kn.. • · σσ Λ again, 51... Pipe end; 52.... ..return pipe end; Η...·. 42a" .... fin cooler; 42b. '..... cooling fan. 10