TW200530552A - Heat sink - Google Patents

Abstract

A heat sink comprises a case and a plurality of porous structures. The case has a plurality of hollow fins and a base. An airtight room is formed by the base and said fins, and said fins are parallel. Each porous structure is set on inside surface of different fin, and connects to the base. Each porous structure has one vapor chamber.

Description

200530552 V. Description of the invention (1) TECHNICAL FIELD The present invention relates to a heat sink, and more particularly to a heat sink that can quickly dissipate heat and has high heat dissipation efficiency. [Prior art]

Pf is that electronic components are becoming more and more precise, and the heat generated by electronic components is also increasing, ′, so that it is not enough to dissipate heat to the environment only by natural or forced convection. In order to enhance the heat dissipation effect of electronic components, the current practice is mostly to dissipate heat with a heat sink at the heat source, and to dissipate heat to the environment through natural or forced convection through the fins (f 1 η) of the heat sink. However, there are still some problems that cannot be overcome in current radiators with fans. For example, the temperature difference between the surface of the fins and the airflow flowing through the radiator is only 5-10 degrees Celsius, which causes insufficient temperature gradients. The material and structure of the radiator itself The problems of thermal resistance, the fin efficiency of traditional heat sinks with a maximum of 70% or less, etc. 'The aforementioned problems caused the current heat sinks to not provide higher heat dissipation', which was insufficient to solve the heat dissipation of electronic components with high heat generation. problem. Therefore, U.S. Patent No. 6,490,160 proposes a heat sink including a vapor chamber (ν a ρ ο r c h a m b e r). This technology forms a single steam chamber in the radiator. The top of the steam chamber is formed by sheet-shaped pointed hollow tubes (tapered ho Π nu ,.) that penetrate into the fins of the radiator. The bottom of the steam chamber is In order to connect to the bottom of all pointed hollow tubes, the company has a single chamber. This technology uses the liquid to absorb heat in the chamber to evaporate into the sharp ft core tube, and then condenses with the outside heat to condense along the hollow surface of the hollow tube The way in which the structure flows back from the outermost side wall into the chamber, reaches j, said hair.

200530552 V. Description of the invention (2) '一 ~ ---- However, because the path taken by the liquid to return to the chamber is too long, under the condition of large heat load, the entire vapor chamber will be overheated. There is no dryout phenomenon in the condensate. At this time, the $ ^ = system has been changed to a single-phase fluid, and the return path is too long, which results in the failure of all fins except the near-most peripheral fins. . In this case, the heat dissipation area with a bite will be greatly reduced, and the heat dissipation effect of the heat sink will be greatly reduced. Another application, US Patent No. 20002/0118511, proposes another type of heat dissipation with a tritium gas chamber. Device. This technology also forms a single vapor tube in the radiator, and only changes the vapor tube to the top of the columnar hollow tube array. The bottom of the vapor chamber is still a single chamber connected to the bottom of all hollow tubes. This technology uses the liquid to absorb heat in the chamber to evaporate into the hollow tube, and then exchanges heat with the outside to condense. The gravity of the liquid drops back to the chamber along the concrete surface to achieve heat dissipation. However, since the simple liquid mechanism of this method uses gravity, it has a problem of directionality. When the installation direction of the radiator is changed, the water return mechanism is immediately invalidated. In view of this, there is also a way of combining the above two technologies to form a porous structure inside the cylindrical hollow tube of the application of US 2 0 0 2/0 1 1 8 5 1 1 so that the liquid can follow the porosity of the hollow tube wall surface. The structure flows back into the cavity from the outermost side wall by capillary force. However, this technology also has the problem of the US 64 90 1 60 patent case. When it is used in a high heat load, the phenomenon of drying out and the failure of other hollow officials except the outermost hollow tube will fail, and Significantly reduces the dispersion effect. [Content] ^ Therefore, in order to solve the above problems, the present invention proposes a heat sink,

200530552 V. Description of the invention (3) In order to greatly improve the heat dissipation effect under any heating load, the present invention also proposes a heat sink, which has a heat dissipation effect under a high heat load. 7 /, the same The present invention further proposes a heat sink, which can achieve high heat dissipation effect in any installation direction. = The present invention further proposes a heat sink to prevent drying phenomenon and spots from occurring. To this end, the present invention provides a heat sink, which is composed of a casing and a porous structure. The shell has a plurality of hollow fins and a base,: 5 =: = 间 'and the binding pieces are arranged in parallel. Porous two structure system: It is located on the inner wall surface of different fins and is connected to the base. A porous structure has an evaporation chamber. The mother's invention provides another kind of radiator, which is composed of a shell and a plurality of porous structures. The shell has a plurality of hollow through, inner, and inner wall surfaces, and the toilet bottom is relatively thin: the structure is located in a different protruding one evaporation chamber ❶ /, the bottom is connected, each porous structure has The porous structure is capillary 纟 .. (_h), _, (fiber), and 2) (wick), which may be groove. Porous structure angina. : Dichotomous and / or furrow-shaped, filled and / or deposited. The "multi-biome" combination method can be sintered, viscous &, and the materials of the 4 structure include plastic, metal, alloy or porous non-metal material: porous: structure: filled with liquid 'this liquid Can be inorganic compounds, water, liquid metals such as mercury, _, refrigerants such as HFC_134a,

$ 7 pages 200530552 5. Description of the invention (4) or other organic compounds. The housing may be integrally formed, or may be a combination of multiple components. The combination of the foregoing components may be welding, clamping, embedding, integral molding and / or adhesion. Adjacent evaporation chambers can communicate with each other via a porous structure or directly communicate with each other. The evaporation chambers are arranged in an array, a longitudinal arrangement, a parallel arrangement and / or a transverse arrangement in the closed space.

In summary, since the radiator of the present invention is divided into a plurality of small vapor chambers and / or small regions by a capillary structure (porous structure), the capillary structure of each protrusion can form an independent cycle, so, Even under high heat load, there is no drying phenomenon caused by insufficient liquid return, and high heat dissipation effect can be maintained. Furthermore, since the small vapor chamber and / or the bottom of the small area in the radiator of the present invention are composed of interconnected capillary tissues (heat-absorbing portions), the liquid in each small vapor chamber and / or the small area can pass through the bottom. The capillary tissues circulate with each other, so the chance of local hot spots can be greatly reduced, and the heat can be evenly distributed to each small vapor chamber and / or small area.

Furthermore, since the liquid return mechanism in the radiator of the present invention uses capillary force instead of relying solely on gravity, the installation direction of the radiator does not affect the liquid return speed. Furthermore, since the vapor chamber in the radiator of the present invention is composed of multiple small vapor chambers and / or small regions, the liquid return path of each small vapor chamber and / or small region is short, so the liquid return speed can be greatly improved. This further improves the heat dissipation effect.

Page 8 200530552 V. Description of the invention (5) = To make the above and other objects, features, and advantages of the present invention clearer and easier. «A preferred embodiment is given below, and the detailed description is as follows: 8 ^ [Implementation method] Fig. 1 is a diagram showing a heat sink of a preferred embodiment of the present invention. The heat sink 100 is composed of a housing 0202 and a porous structure u located in the housing 102, and the inside of the housing 102 forms a closed space 124. 、 &Quot; 118 has a plurality of hollow protrusions 120 and is used for ^ thermal structure = ϋ1122. The base 122 is changed in shape and / or size according to the arrangement area of the protrusion 120 and the shape of the structure 118. The shape of the protrusion 120 is hollow inside and opens toward one of the bases 122. The opposite end is closed. Η: Specifically, the shape is, for example, a conical shape, a columnar shape, a sheet shape, a tapered shape, or a block shape, and the form is, for example, a curved shape, an inclined shape, or any shape. The housing 102 can be integrally formed or shaped: it can be formed from a straight shape or = each other ', where the way of bonding is as long as it can be mutually independent; it can be fixed, for example, welding, + solid, and old-fashioned. For the integrated cj, the closed space 124 may be subjected to f regions of the porous structure 110, and the steam chambers 112. Knife and knife

MioL is formed on the inner wall surface of the casing 102 and is sealed in the casing 2 '. The porous structure 110 forms a plurality of vapors 6 112 in the casing 102. The porous structure 110 is divided into conductive portions 104, 106 and heat absorbing portions to 108 to absorb liquid, and the condensed liquid system is conducted to the heat absorbing portion i 08 through the conductive portions 104, 106. Among them, liquids are, for example, inorganic compounds, alcohols, liquid metals such as mercury, ketones, such as H F C-1 3 4 a

200530552 V. Description of the invention (6) Refrigerant 'or other organic compounds. The boiling temperature of the liquid can be controlled by the pressure in the vapor chamber 1 1 2. The heat absorbing portion 108 is located on the inner surface of the base 1 2 ′ and absorbs the aforementioned liquid. The conductive portion 104 is located on the inner surface of the protruding portion 120 to conduct the condensed liquid in the direction of the heat absorption portion. The conductive portion 106 is located between the heat absorbing portion 108 and the conductive portion 104, and is connected to the heat absorbing portion 108 and the conductive portion 104 at the same time. The material of the conductive portion 104, 106, and the heat absorption portion 108 is, for example, copper, aluminum, iron, or other metal and / or alloy, plastic, or porous non-metal material. The form of the conducting portion 104, 106, and the endothermic portion 108 may be any type as long as it has pores, for example, a capillary structure (wick), specifically, a mesh, a fiber, and a sintering ( sinter), groove, or other structures. In addition, the bonding method of the porous structure 110 and the shell 102 is, for example, sintering, adhesion, filling, and deposition. Furthermore, the conductive portion 106 is located between the adjacent protruding portions 20 and 20, so that the liquid in the conductive portion 104 can quickly return to the heat absorbing portion 108 along the conductive portion 106. The conductive portion 10 6 divides the enclosed space 1 2 4 into a plurality of small vapor chambers 1 12, and each vapor chamber 1 12 corresponds to at least one protruding portion 2 0. The conductive portion i 0 6 may also divide the closed space 1 2 4 into a plurality of interconnected small areas, and each small area corresponds to at least one protruding portion 1 2 0. Furthermore, the steam chambers 2 or small areas may be arranged in an array ', may be arranged vertically, may be arranged horizontally, may be arranged in parallel, may be arranged obliquely, or may be arranged irregularly. ^ In addition, although the closed space 1 24 is divided into a plurality of small vapor chambers 112 and / or small regions by the conductive portion 〇〇6, the bottom of each vapor chamber 112 and / or small region:

II

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^ The liquid contained in section 108 can still be circulated in the suction section ι 08 which communicates with each other, and greatly reduces the opportunity for the bottom board of the heat sink. The heat can be evenly distributed to the heat sink. Bottom (= female one.) The above-mentioned heat sink 100 is taken as an example to explain the heat dissipation mechanism of the present invention. In this example, the base 122 of the heat sink 100 is mounted on the heat generating structure 1 1 8 'the heat generating structure 1 1 8 For example, it is composed of a heating element 1 1 6 and a thermally conductive structure 1 1 4 connected to the heating structure 1 1 6. Specifically, the thermally conductive structure 1 1 4 is, for example, a thermal paste, a phase change metal sheet, and a heating element 丨 6 For example, a central processing unit (CPU), a semiconductor wafer. In addition, in this example, the protruding portion 120 is described by taking a fin as an example. When the heating temperature at the bottom of the vapor chamber 11 2 rises to the boiling point of the liquid, it is included in the heat absorption The large amount of evaporation and boiling of the liquid in the section 108 causes the pressure in the vapor chamber 丨 2 to rise and the vapor quickly moves to the fins. Then, the fins are dissipated by natural convection or forced convection, and the vapors are dissipated. Inside surface of fin After 纟 η becomes a liquid, it penetrates into the conductive portion 104 (capillary tissue) inside the fin. Since the heat absorbing portion 108 (capillary tissue) is dry, and the conductive portion 104 is wet, Capillary force allows the liquid to flow back from the fins to the bottom of the vapor chamber 11 2 to complete a cycle. Since the bottom edge of the fins and the base 1 2 2 are connected by a conductive portion 10 6 (capillary tissue), it can be effectively lifted Reflow speed, and avoid the situation of drying phenomenon. In summary, because the radiator of the present invention is divided into a plurality of small vapor chambers and / or small areas by capillary tissue (porous structure), each process

200530552 V. Description of the invention (8), the capillary structure of the ministry can form an independent cycle, so ’even under the heat load, there will be no liquid return and dryness, and J maintains high heat dissipation effect. Since the small vapor chamber and / or small area in the radiator of the present invention is small, and is composed of interconnected capillary tissues (heat-absorbing portions), the liquid in the lice chamber and / or small area can be obtained by The capillary tissue at the bottom communicates with the spleen, so the chance of local hot spots can be greatly reduced, and the heat can be evenly distributed to the small steam chambers and / or the residential city. For those who are small, since the liquid return mechanism in the radiator of the present invention uses wool instead of relying solely on gravity, the installation direction of the radiator does not mean the speed of liquid return. The chamber and / or I or the steam chamber on the radiator of the present invention are obviously formed by a plurality of small steam flow paths / each small steam chamber and / or a small area of liquid backflow, i 隹 ^ 柯 述Known technology can therefore greatly improve the liquid ^ ^ i and greatly improve the heat dissipation effect. Although the present invention is disclosed above by limiting the preferred embodiment of the present invention, it is not within the scope of God. Anyone who is familiar with this art can make various changes and decorations without departing from the scope of the present invention. Therefore, the scope of the patent application attached to Baumann of the present invention shall prevail. 200530552 Brief Description of Drawings Figure 1 is a schematic diagram showing a heat sink according to a preferred embodiment of the present invention. [Description of Symbols in the Figure] 1 0 0: heat sink 1 0 2: case 1 0 4 and 10 6: conductive part 1 0 8: heat absorption part 1 1 0: porous structure 1 1 2: steam chamber 1 1 4: Thermally conductive structure 1 1 6: Heating element 1 1 8: Heating element 1 2 0: Protrusion 122: Base 124: Confined space

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Claims (1)

200530552 VI. Scope of patent application1. A radiator, comprising: a casing with a plurality of hollow fins and a base to form a closed space, and a plurality of porous structures of the binding pieces, each of which is identical to the fins The inner wall surface of the sheet has an evaporation chamber inside the porous structure. 2. As described in item 1 of the patent application, the sheet is hollow inside and faces one end of the base. 3. The porous structure is capillary tissue (w i ck) as described in item 1 of the scope of patent application. 4. The shape of the pore structure as described in item 1 of the scope of the patent application is composed of mesh (sinter) and groove (groove). The method of combining with the shell is to select one of the groups formed by the sediment. 6. The porous structure is filled with a liquid as described in item 1 of the scope of the patent application. _ 7. It is selected from the group consisting of inorganic compounds, water, alcohols, and liquid organic compounds as described in item 6 of the scope of patent application! / 8. The material of the porous structure as described in item 1 of the scope of the patent application includes a base selected from plastic, gold, and the fins are arranged in parallel with the system; and the porous structure is connected to the base without a base. Some of the radiators, among which the open-ended, closed opposite end-shaped radiators, among which the multiple radiators, among them, the multiple, fiber, burned one. Heat sinks, which are self-sintering, adhesive, filling, heat sinks, which are many heat sinks, which are liquid metal, ketones, refrigerants, and heat sinks which are mostly multi-alloys, alloys Porous non-gold Page 14 200530552 VI. Scope of patent application One of the groups of materials. 9 · The heat sink as described in item 1 of the scope of patent application, wherein the materials of the porous structures include one selected from the group consisting of copper, aluminum, and iron. The radiator, wherein the shell is integrally formed. 11. The heat sink according to item 1 of the patent application scope, wherein the shell system is formed by combining a plurality of components with each other. 12. The heat sink according to item 11 of the scope of patent application, wherein the combination of these components is selected from one of the group consisting of welding, clamping, fitting, integral molding, and adhesion. 13. The heat sink according to item 1 of the scope of patent application, wherein adjacent evaporation chambers communicate with each other via the porous structure. 14. The radiator according to item 1 of the scope of patent application, wherein adjacent evaporation chambers communicate with each other. 15. A heat sink comprising: a casing having a plurality of hollow protrusions and a base, the protrusions and the base forming a closed space; and a plurality of porous structures, each of which is located at The walls of different protrusions are connected to the base, and each of the porous structures has an evaporation chamber. 16. The heat sink according to item 15 of the scope of patent application, wherein the protrusions are hollow inside, open toward one end of the base, and closed at the opposite end. Page 15 200530552 Sixth, the scope of patent application 17. The heat sink according to item 15 of the scope of patent application, wherein the shape of the protrusions is selected from the group consisting of fins, ridges, flakes, cones, and blocks. one of them. 18. The heat sink according to item 15 of the scope of patent application, wherein the porous structures are capillary structures (w i c k). 19. The heat sink according to item 15 of the scope of patent application, wherein the shapes of the porous structures are selected from the group consisting of mesh (me h), fibrous (fi ber), sinter (groove), and groove (groove) ). 20. The heat sink according to item 15 of the scope of patent application, wherein the method of combining the porous structure and the shell is one of a group consisting of sintering, adhesion, filling, and deposition. Xi 21. The heat sink according to item 15 of the scope of patent application, wherein the porous structures are filled with a liquid. And 2 2 · The political heater described in item 21 of the scope of the patent application, wherein the liquid system is selected from the group consisting of inorganic compounds, water, alcohols, wavy metals, S similar, cold, and organic compounds. &Amp; / 2 3 · The heat sink as described in item 15 of the scope of patent application, wherein the materials of the two-porous structure include a group selected from the group consisting of plastics, metals, alloys, and porous non-genus materials one. 24. The heat sinks described in Item 15 of the scope of patent application by 々 口 Wherein: The material of the porous structure includes a group selected from the group consisting of copper, inscription, and iron. 2 5 · Body forming as described in item 15 of the scope of patent application. Mentioned the heat sink ’wherein the shell Page 16 200530552 6. Scope of patent application 26. The heat sink as described in item 15 of the scope of patent application, wherein the shell system is composed of a plurality of components combined with each other. 27. The heat sink according to item 26 of the scope of patent application, wherein the combination of these components is selected from the group consisting of welding, clamping, fitting, integral molding, and adhesion. 28. The heat sink according to item 15 of the scope of patent application, wherein adjacent evaporation chambers communicate with each other via the porous structure. 29. The radiator according to item 15 of the scope of patent application, wherein adjacent evaporation chambers are connected to each other. 30. The heat sink as described in item 15 of the scope of patent application, wherein the evaporation chambers of the porous structures are arranged in an array, longitudinal arrangement, parallel arrangement, lateral arrangement, oblique arrangement, irregular arrangement in the closed space. arrangement. Page 17