1286461 九、發明說明： 【發明所屬之技術領域】 ’特別是 本發^㈣於—錄料置及其製造方法 關於一種熱均溫腔體及其製造方法。 【先前技術】 旦赭電子^件單位面積上的電晶體數 作時發熱量的增加。因此，為了 用外Λ Π ::::有效工作溫度内，現行的做法多是利 用外加風扇和散誠片來處理這些耗熱。而由於熱導管 ^atinpe)可在很小的截面積與溫度差之下，將大量的 :傳送-段可觀的距離，且不需外加電源供應即可運 :在無須動力提供和空間利用經濟性的考量之下，熱 ^官已是電子散熱產品中廣為應用的傳熱元件之一。 典型的熱導管係由腔體、毛細結構（wick Structure) 以及工作流體所組成，且其作用原理係利用工作流體在 腔，的蒸發段吸收熱量蒸發，再流向腔體的冷凝段放出 熱里後减結成液態，並藉由毛細結構所提供的毛細力使 作/爪體"丨L回蒸务^又。熱均溫腔體（vap〇r chamber )屬於 熱，管的一種，而熱均溫腔體所佔之體積一般均大於熱 導官。常見之毛細結構主要分為以下四種：網狀毛細結 構（mesh wick)、纖維狀毛細結構（fiber wick)、燒結毛 細結構（sinter wick)與溝狀毛細結構（gro〇ve wick)。 對於溝狀毛細結構而言，其毛細結構係利用機械加 工方式在腔體内壁上挖刻痕而形成，然而，受限於模具 在腔體中係以直線型或旋轉式推進，造成内壁所挖的刻 1286461 益法依H株或早—直線方向’使得玉作流體的流向 :;：!依；熱70件所需被引導至特定方向或以特定路徑快 狀發部二另外，由於利用機械加工之方式，其溝 满:構之寬度在極小化時有__定的限制，—般所能 ，成之取小寬度約為_微米（micrometer，"„〇,使得 熱工作流體流回蒸發部的速率緩慢，使得散 M f燒結毛細結構，係利用粉末充填後加高溫予以 rj 其毛細結構之寬度可達到比溝狀毛細結構之 ^度要小’故燒結毛細結構之散熱功率較佳。但，由於 t燒結後，金屬之退火的現象會造成金屬腔體軟化，、 避免金屬腔體軟化後’―旦遭受到外力便容易發生 = 必須使用較厚的金屬腔體，才^以支撐。然而， 二旱的金屬腔體會使得熱均溫腔體之散熱 增加整體的重量。 nf各種電子襄置内組裝元件不斷的密集化，然體積 趨縮1、的趨勢之下，由於元件集積度不斷提升，致 、:玄:？熱罝逐步增加，因此，要如何製作具有更高導熱 速率與效率的散熱裝置，係未來一研究方向。 【發明内容】 因此，為解決上述問題，本發明係提出一種重量輕 3有較佳導熱能力之散熱裝置，可提升散熱效率並減 輕熱均溫腔體重量、節省使用材料。 根據本發明的目的’提出一種散熱裝置，係一埶均 溫腔體’應用於一發熱元件上。散熱裝置包括-腔；、 1286461 工作々IL體 蒸發部與一冷凝部，以及至少一第一汽 細溝槽。工作流體位於腔體中，蒸發部與冷凝部，位二 腔體的内壁上’而第—微細溝槽連接蒸發部與冷凝部。' 其甲係、以-雷射切割方式或精密加工技術製作一模 後，再利用此模具模造形成蒸發部、冷凝部與第一微細 溝槽於腔體之内壁上’或採用微模造成型方法。工作漭 ，«發部吸收發熱元件之熱量而蒸發，於冷凝部放^ I:後=液態：並藉由第一微細溝槽所提供的毛細 力使工作流體流回蒸發部。 严板ji更形成有至少一第二微細溝槽，且位於内壁 ’母二第二微細溝槽係同時與多個第一微細 f二Ϊ内壁係利用摺曲之方式形成，且每-第二Ϊ 二處，第二微細溝槽之寬度係大於 母从細溝槽之寬度。 根^^發明的再一目的’提出一種散 提供:基板；以-雷射切割方式或精密i: 模造成型方法;使基板形成一=於=:或採用微 與第:微細溝槽係位於腔體之内壁上。^ 、冷凝部 序。：1方法包括模具製造程序以及模造程 預模^ 包括提供—基材；於基材上形成- 形成：‘模並以：微:幾電加工方法，將預模仁層加工而 风t為核仁，以及將模^二制你士、& 程序包括利用模具模造基板，、使為：模具。模造 使瘵發部、冷凝部，與第 1286461 一微細溝槽形成於基板上。 為讓本發明之上述和其他目的、特徵、和優點能# 作詳細說明：3較佳實施例’並配合所附圖式， 【實施方式】 請參照第1圖’其繪示乃本發明較佳實施例之散敎 f/及其所應用之發熱元件示意圖。本發明之散熱裝置 10 ’係一熱均溫腔體（vapor chamber)，應用於一發熱元 件12上，發熱元件12例如是一 cpu。在第^圖中，發 熱元件12的上方可直接貼附一金屬製底板u，例如^ 一銅製底板，而散熱裝置1〇則配置於底板11上，故發 熱元件12所產生的熱可直接透過底板11傳導到熱均溫 腔體:主〇’並上由熱均溫腔體10 f夬速的將熱傳送至外部。 凊參照第2圖’其緣示乃熱均溫腔體之剖示圖。熱 均溫腔體1G包括-腔體、—工作流體、—蒸發部21 ^ -冷凝部22,以及至少一第—微細溝槽所組成的毛細結 構23。蒸叙部21、冷凝部22與毛細結構23位於腔體的 内壁24上，而工作流體位於封閉的腔體中不斷循環流 動，達成散熱的效用。所使用的工作流體例如是無機化 合物、水、醇類、液態金屬、酮類、冷媒、或一有機化 合物。 熱均溫腔體1 〇之蒸發部21較佳地相對於該發熱元 件配置’使得發熱元件12所產生的熱可直接透過底板 11傳導到而蒸發部21。在蒸發部21的工作流體吸收發 熱元件12之熱量而蒸發為氣態，氣態的工作流體於冷凝 1286461 (5 22放出熱畺後凝結成液態，並藉由毛細結構μ所提 共的毛細力使液態的工作流體流回蒸發部21。 髀展Γ時參照第3A圖與第3B圖，第3A圖繪示乃腔 :立幵日、的不思圖’第3B圖繪示乃摺曲基板形成腔體的 :思圖。熱均溫腔體之製造方法包括下列步驟：首先， 基板25。接著，在絲25上形絲發部2卜冷 方毛細結構23’如第3A圖所*。然後，利用擅 以焊接基板25形成一管體26 ’並將基板25兩端 =或山其他方式結合在一起’如第3β圖所示。將管體 將管體1行m流體與抽真空的步驟後， 装i ^ 一知封閉’即完成熱均溫腔體1 〇的製作， "° 、冷'旋部22與毛細結構23則位於腔體内壁上。 1 =，25上形成蒸發部21、冷凝部22與毛細 =3的方式，可利用諸如雷射切割 = 利用此模具模造基板 模具製造程序以及模造程纟纟成/法為例’係包括 二層，並" 基板二成為之二且=上與欲在 模具模造基板25，使郎部/ 心私序’利用 構23形成於基板25上，、。^ 21、冷凝部22，與毛細結 結成21料_2’使得凝 4作机體传以從冷凝部22,藉由毛細結構^ 1286461 所提供的毛細力，流回蒸發部21。在此，特別要注意的 是，毛細結構23在腔體内壁（亦即基板烈上）的分佈方 式並不限m 3A圖為例，毛細結構23包括多個第 一微細溝槽23la、231b以及多個第二微細溝槽232。每 :第二微細溝槽232係同時與多個第一微細溝槽馳 或231b相連接，可避免當第—微細溝槽㈣中某處被 阻斷’則整條路徑便無法發生作用的情況。另一方面， 第^微=溝槽232之寬度可大於每一微細溝槽23ia、 之見度。如此一來，在第一微細溝槽231a或231b 2工作流體能夠更快速的先匯集至第二微 现 再流回蒸發部21。 护成體=用將基板25摺曲並焊接基板邊緣 开4 g體26後’再加以兩端封f的方式 二微細溝槽232於基板25上時，第二微細溝槽232 ^ 別設置於摺曲處，以利後續形成管體26時方便應用。 乃另請H第圖：第4A圖與第4B圖，第4A圖繪示 乃f 一種基板的不⑽，而第則緣示乃再—種基 不:,圖=於本發明係利用—㈣㈣方式、精密加= 挖溝槽來製作溝狀構不 ==的=度可達1〇〇微米（㈣）以下，使得毛細: 大為:t曰加’另外’毛細結構23的分佑古导 用盖之發熱元件的需要’而作彈性設計。二，1=f 3Α圖所不。或，，多個第—微細溝槽 二 弟二微細溝槽232可互相搭配，呈網格狀配置^ 1286461 第？所示。又或者，第-微細溝槽231c成非 二為中心，成複數個同心圓配置Ϊ 弟锨細溝槽231a係以蒸發部21為中心，呈 連己=’且，-微細溝槽231a分別與第一微細田1286461 IX. Description of the invention: [Technical field to which the invention pertains] ‘Specially, the present invention is directed to a recording device and a method of manufacturing the same, and a method for manufacturing the same. [Prior Art] The number of transistors per unit area of the electronic device is increased by the amount of heat generated. Therefore, in order to use the external Λ Π :::: effective working temperature, the current practice is to use external fans and loose film to deal with these heat. And because the heat pipe ^atinpe can be under a small cross-sectional area and temperature difference, a large number of: transmission - segment considerable distance, and no additional power supply can be shipped: no need for power supply and space utilization economy Under the consideration of the heat, the official has been one of the widely used heat transfer components in electronic heat dissipation products. A typical heat pipe is composed of a cavity, a wick structure, and a working fluid, and its working principle is to use the working fluid to absorb heat in the evaporation section of the cavity, and then flow to the condensation section of the cavity to release the heat. It is reduced to a liquid state, and by the capillary force provided by the capillary structure, the claw/body is returned to the steam. The vap〇r chamber is a type of heat and tube, and the volume of the hot isothermal chamber is generally larger than that of the thermal guide. Common capillary structures are mainly classified into the following four types: mesh wick, fiber wick, sintered sinter wick and gro〇ve wick. In the case of a fluted capillary structure, the capillary structure is formed by machining a scoring on the inner wall of the cavity, however, it is limited by the linear or rotary propulsion of the mold in the cavity, causing the inner wall to be dug. The engraving of 1286461 Yifayi H strain or early-straight direction makes the flow of jade fluid:::!; 70 pieces of heat need to be guided to a specific direction or a specific path to the fast part 2, due to the use of machinery The way of processing, the groove is full: the width of the structure has a limit of __ when it is minimized, and the width is about _micron (micrometer, " 〇, so that the hot working fluid flows back The rate of the evaporation part is slow, so that the powder structure is sintered, and the powder is filled with high temperature to increase the width of the capillary structure to be smaller than that of the groove-shaped capillary structure. Therefore, the heat dissipation power of the sintered capillary structure is better. However, since the annealing of the metal after t is sintered, the metal cavity is softened, and after the metal cavity is softened, it is easy to occur after being subjected to external force. = A thick metal cavity must be used to support However, the metal cavity of the two droughts will increase the heat dissipation of the heat-averaged cavity. The internal assembly components of various electronic devices are continuously densified, but the volume is shrinking, and the component accumulation is constant. Enhancement, Zhi,: Xuan: The enthusiasm is gradually increasing. Therefore, how to make a heat sink with higher heat transfer rate and efficiency is a future research direction. [Invention] Therefore, in order to solve the above problems, the present invention proposes The utility model relates to a heat dissipating device with light weight 3 and better thermal conductivity, which can improve the heat dissipation efficiency and reduce the weight of the heat average temperature chamber and save the use of materials. According to the object of the invention, a heat dissipating device is proposed, which is a uniform temperature chamber application. The heat dissipating device comprises a cavity, a 1286461 working 々IL body evaporation portion and a condensation portion, and at least one first vapor groove. The working fluid is located in the cavity, the evaporation portion and the condensation portion, and the second portion On the inner wall of the cavity, the first fine groove connects the evaporation portion and the condensation portion. After the nail system is fabricated by a laser cutting method or a precision machining technique, The mold is molded by using the mold to form the evaporation portion, the condensation portion and the first fine groove on the inner wall of the cavity or by a micro-mold forming method. The working portion, the hair portion absorbs the heat of the heating element and evaporates, and is discharged in the condensation portion. : after = liquid: and the working fluid flows back to the evaporation portion by the capillary force provided by the first fine groove. The strict plate is formed with at least one second fine groove, and is located at the inner wall 'the second second fine groove of the mother 2 The groove system is simultaneously formed with a plurality of first fine f-two inner walls by bending, and the width of the second fine grooves is greater than the width of the mother-small grooves per second to second. A further object of the invention is to provide a dispersion: a substrate; a laser-cutting method or a precision i: mold-forming method; forming a substrate with a ==: or using micro-and:-fine grooves in the inner wall of the cavity on. ^, condensation section. The :1 method includes a mold manufacturing process and a molding process pre-mold comprising: providing a substrate; forming on the substrate - forming: 'module and: micro: several electrical processing methods, processing the pre-molded layer and the wind is a core Ren, as well as the mold, and the program, including the use of the mold to mold the substrate, made: mold. Molding The bridging portion, the condensing portion, and the 1286461 fine groove are formed on the substrate. The above and other objects, features, and advantages of the present invention will be described in detail: 3 preferred embodiments and in conjunction with the accompanying drawings, in which: FIG. A schematic diagram of the heat sink element of the preferred embodiment and the heat generating component to which it is applied. The heat dissipating device 10' of the present invention is a heat chamber which is applied to a heat generating element 12, and the heat generating element 12 is, for example, a cpu. In the figure, a metal substrate u can be directly attached to the upper portion of the heating element 12, for example, a copper substrate, and the heat sink 1 is disposed on the substrate 11, so that the heat generated by the heating element 12 can be directly transmitted. The bottom plate 11 is conducted to the heat equalizing temperature chamber: the main crucible' is heated by the heat equalizing temperature chamber 10f to the outside. Referring to Figure 2, there is a cross-sectional view of the thermal isothermal chamber. The heat equalizing temperature chamber 1G includes a cavity, a working fluid, an evaporation portion 21^-condensing portion 22, and a capillary structure 23 composed of at least one first fine groove. The evaporating section 21, the condensing section 22 and the capillary structure 23 are located on the inner wall 24 of the cavity, and the working fluid is continuously circulated in the closed cavity to achieve the effect of heat dissipation. The working fluid used is, for example, an inorganic compound, water, an alcohol, a liquid metal, a ketone, a refrigerant, or an organic compound. The evaporation portion 21 of the heat averaging chamber 1 is preferably disposed relative to the heat generating member so that heat generated by the heat generating element 12 can be conducted directly to the evaporation portion 21 through the bottom plate 11. The working fluid in the evaporation portion 21 absorbs the heat of the heating element 12 and evaporates into a gaseous state, and the gaseous working fluid condenses into a liquid state after the condensation is released, and the liquid is condensed by the capillary force of the capillary structure μ. The working fluid flows back to the evaporation portion 21. Referring to Figures 3A and 3B, the 3A diagram shows the cavity: the vertical day, the inconspicuous figure 3B shows the bending substrate forming cavity The method of manufacturing the thermal uniform temperature chamber includes the following steps: first, the substrate 25. Next, the filament portion 2 is formed on the filament 25 as the cold capillary structure 23' as shown in Fig. 3A. Then, A tube body 26' is formed by welding the substrate 25, and the two ends of the substrate 25 are combined or the other way of the mountain is combined, as shown in the 3rd figure. After the tube body is subjected to a step of fluid and evacuation of the tube body , the installation of i ^ I know closed 'that completes the production of the hot isothermal chamber 1 ,, " °, cold 'curve 22 and capillary structure 23 are located on the inner wall of the cavity. 1 =, 25 forms the evaporation part 21, The condensation portion 22 and the capillary = 3 can be used, for example, by laser cutting = using the mold to mold the substrate mold For example, the manufacturing process and the molding process are as follows: the system includes two layers, and the substrate 2 becomes the second and the upper substrate and the substrate 25 are formed on the mold, so that the langs/hearts are formed on the substrate 25 by the structure 23 The upper portion, the second portion, and the condensing portion 22 are entangled with the capillary material to form a material _2' so that the condensing body is transferred from the condensing portion 22 to the evaporation portion 21 by the capillary force provided by the capillary structure ^ 1286461. Here, it is particularly noted that the distribution of the capillary structure 23 on the inner wall of the cavity (ie, the substrate) is not limited to the m 3A diagram, and the capillary structure 23 includes a plurality of first fine grooves 23la, 231b. And a plurality of second fine grooves 232. Each of the second fine grooves 232 is simultaneously connected to the plurality of first fine grooves or 231b to avoid being blocked somewhere in the first fine groove (four). Then, the entire path cannot be actuated. On the other hand, the width of the second micro-groove 232 may be larger than the visibility of each fine groove 23ia. Thus, in the first fine groove 231a or 231b 2 The working fluid can be collected more quickly to the second micro-current and then flow back to the evaporation portion 21. When the substrate 25 is bent and the edge of the substrate is soldered to the 4 g body 26, and then the two fine grooves 232 are formed on the substrate 25, the second fine groove 232 is disposed at the bent portion. It is convenient to apply the subsequent formation of the tubular body 26. It is also shown in Figure H: Figure 4A and Figure 4B, Figure 4A shows that the substrate is not (10), and the first edge is the re-species: Fig. = In the present invention, the method of (4) (4), precision addition = trenching is used to make the groove structure ================================================== In addition, the 'fine structure of the capillary structure 23 is designed to be used for the heating element of the cover' and is elastically designed. Second, 1 = f 3 is not shown. Or, a plurality of first-fine grooves, two second fine grooves 232 can be matched with each other, and arranged in a grid shape ^ 1286461 first? Shown. Alternatively, the first fine groove 231c is centered on the non-two, and is formed in a plurality of concentric circles. The fine groove 231a is centered on the evaporation portion 21, and is connected to the lower portion ‘and the fine groove 231a is respectively First micro field
It m 232 9 _ a 231c相連通，如第圖所示。 综上所述，本發明所揭露之散熱裝置，係一 導熱能力之熱均溫腔體，應用一雷射切害上 ς 4抢加工技術或微模造成型方法製造微細溝槽， 僅減輕熱均溫腔體重量、節省使用材料並提升散熱效率。 雖然本發明已以一較佳實施例揭露如上，然j：並非 =限定本發明，任何熟習此技藝者，在不脫離ς發明 七神和範圍内，當可作各種之更動與潤飾，因此本發 月之保濩氣圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示乃本發明較佳實施例之散熱裝置及其所 應用之發熱元件的示意圖。 第2圖繪示乃熱均溫腔體之剖示圖。 第3A圖繪示乃腔體展開時的示意圖。 第3B圖繪示乃摺曲基板形成腔體的示意圖。 第4A圖繪示乃另一種基板的示意圖。 第4B圖繪示乃再一種基板的示意圖。 【主要元件符號說明】 1 〇 :熱均溫腔體 11 11 底板 12 發熱元件 21 蒸發部 22 冷凝部 23 毛細結構 1286461 23卜231a、231b、231c :第一微細溝槽 232 :第二微細溝槽 24 腔體内壁 25 基板 26 管體 12It m 232 9 _ a 231c are connected as shown in the figure. In summary, the heat dissipating device disclosed in the present invention is a thermal uniform temperature chamber of thermal conductivity, and a micro-groove is manufactured by using a laser cutting method or a micro-mold forming method to reduce heat. Warm body weight, save materials and improve heat dissipation efficiency. Although the present invention has been described above with reference to a preferred embodiment, the present invention is not limited to the invention, and any person skilled in the art can make various changes and refinements without departing from the scope of the invention. The warranty for the month of the month is determined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a heat dissipating device and a heat generating component to which the present invention is applied. Figure 2 is a cross-sectional view showing the chamber of the heat equalization temperature. Fig. 3A is a schematic view showing the cavity when it is unfolded. FIG. 3B is a schematic view showing the formation of a cavity by bending the substrate. FIG. 4A is a schematic view showing another substrate. FIG. 4B is a schematic view showing still another substrate. [Main component symbol description] 1 〇: Thermal average temperature chamber 11 11 Base plate 12 Heating element 21 Evaporation portion 22 Condensation portion 23 Capillary structure 1286461 23 231a, 231b, 231c: First fine groove 232: Second fine groove 24 cavity inner wall 25 substrate 26 tube body 12