1328421 099年05月24日修j£替換"ϊ 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱模組，特別涉及—種利用相變方式 散熱之散熱模組。 【先前技術】 [0002] 近年來，隨著半導體器件集成工藝快速發展以及對其輕 、薄、短、小之需求，半導體器件之集成化程度愈來愈 高，而器件體積卻變得愈來愈小，為保證半導體器件正1328421 On May 24th, 2008, the repair and replacement of the invention is based on the invention. [0001] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module that uses a phase change method to dissipate heat. . [Prior Art] [0002] In recent years, with the rapid development of semiconductor device integration processes and the demand for light, thin, short, and small, the integration of semiconductor devices has become higher and higher, and the device size has become more and more The smaller, to ensure that the semiconductor device is positive
常工作，其散熱成為一個愈來愈重要之問題，其對散熱 I 之要求也愈來愈高。為滿足這些需要，各種散熱方式被 大量運用，如常見之利用風扇散熱成採用水冷輔助散熱 以及熱管散熱等方式。其中，熱管係依靠自身内部工作 流體相變實現導熱之導熱元件，其臭有高導熱性、優良 等溫性等優良特性，導熱效果好，應用廣泛。 [0003] 典型熱管由管殼、毛細結構以及密封於管内之工作流體 組成。熱管之製作通常先將管内抽成真空後充以適當工 作流體，使緊貼管殼内壁之毛細結搆中充滿工作流體後 馨 加以密封。熱管一端為蒸發段（加熱段）’另一端為冷凝 段（冷卻段），根據應用需要可於所述蒸發段與冷凝段之 間佈置絕熱段。當所述蒸發段受熱時’所述毛細結構中 之工作流體蒸發氣化形成蒸汽；所述蒸汽於微小壓力差 作用下通過孔道流向所述冷凝段’放出熱量後凝結成工 作流體；所述工作流體再靠毛細祚用沿所述毛細結構流 回蒸發段。如此循環，熱量由熱管之蒸發段不斷地傳至 冷凝段，並被冷凝段一端之冷源吸收° 094127468 表單編號Α0101 第4頁/共16頁 0993180253-0 1328421 [0004] [0005]Often working, its heat dissipation has become an increasingly important issue, and its requirements for heat dissipation I have become higher and higher. In order to meet these needs, various heat dissipation methods have been widely used, such as the use of a fan to dissipate heat into a water-cooled auxiliary heat sink and heat pipe heat dissipation. Among them, the heat pipe is a heat-conducting element that realizes heat conduction by relying on its internal working fluid phase change, and its odor has excellent characteristics such as high thermal conductivity and excellent isothermality, and has good heat conduction effect and wide application. [0003] A typical heat pipe consists of a casing, a capillary structure, and a working fluid sealed within the tube. The heat pipe is usually made by vacuuming the inside of the pipe and then filling it with a suitable working fluid, so that the capillary structure close to the inner wall of the casing is filled with the working fluid and then sealed. One end of the heat pipe is an evaporation section (heating section), and the other end is a condensation section (cooling section), and an adiabatic section can be arranged between the evaporation section and the condensation section according to application requirements. When the evaporation section is heated, the working fluid in the capillary structure is vaporized and vaporized to form steam; the steam is condensed into a working fluid by flowing a heat to the condensation section through a pore flow under a slight pressure difference; The fluid is then returned to the evaporation section along the capillary structure by capillary. In this cycle, heat is continuously transferred from the evaporation section of the heat pipe to the condensation section and absorbed by the cold source at one end of the condensation section. 094127468 Form No. 1010101 Page 4 of 16 0993180253-0 1328421 [0004] [0005]
[0006] [0007] [0008][0007] [0008] [0008]
094127468 099年05月24日修正替換頁 先前技術中提供之熱管散熱裝置中，通常係將熱管之蒸 發段設於一與熱源相接觸之散熱片上，通過與所述散熱 片之結合來增加所述蒸發段之接觸面積，以充分利用所 述熱管之導熱性能。 惟，由於單個熱管所能負載之熱傳·量較小，為適應愈來 愈高之散熱需求，所述熱管散熱裝置通常具有多個熱管 ，其體積亦隨之增大，難以滿足輕、薄、短、小之需求 。另，所述熱管散熱裝置中，熱管之蒸發段係通過散熱 片與熱源間接接觸，故所述熱管與熱源之熱傳遞還受限 於所述散熱片之導熱性能，其散熱性能仍不理想。 有鑑於此，提供一種體積較小且能負載較大熱傳量之散 熱模組實為必要。 【發明内容】 以下，將以實施例說明一種散熱模組。 為實現上述内容，提供一種散熱模組，其包括：一底座 ;所述底座包括一毛細結構層；以及一與所述底座相接 合之蓋體，所述蓋體包括一隔板；所述底座及蓋體形成 由所述隔板隔離之回流腔及蒸發腔，所述回流腔及蒸發 腔均與所述毛細結構層相連，且分別包括一通孔，所述 回流腔用於容置工作流體，所述蒸發腔包括一導流部及 一集氣室，該導流部包括複數個導流件，相鄰兩個導流 件之間形成一導流通道，所述毛細結構層位於該導流部 之下方以使蒸氣經由所述毛細結構層進入所述導流通道 ，並沿所述導流通道進入該集氣室，所述蒸氣係工作流 體於所述毛細結構層所處位置吸收熱量後形成。 表單编號A0101 第5頁/共16頁 0993180253-0 1328421 099年05月24日梭正替換頁 [0009] [0010] [0011] [0012] [0013] [0014] [0015] [0016] [0017] 所述蒸發腔包括1流部及-集氣室。 所述蒸發狀料，包括魏個導流件。 所述底座及蓋體之;^料包括銅、鐵、銘等金屬或其合金 〇 所述毛細結構層包括燒結層或碳奈米管陣列。 所述燒結層係由金屬粉末燒結而成。 所述金屬粉末包括崎、錄或鐵粉。 相較於先前技術，本實關提供讀熱模組巾，所述底 座可直接與熱源相連，接觸熱阻較小，且所述底座上具 有毛細結構層，該毛細結構層可根據散熱需要而設定大 小，甚至完全覆蓋所述底座，以使所述散熱模組能負載 較大之熱傳量。 【實施方式】 下面將結合附圖對本發明作進一步之詳細說明》 叫一併參閱第一圖及第二圖，本發明之實施例提供之散 熱模組10，其包括一板狀底座1〇〇，所述板狀底座1〇〇之 主體呈矩形且一側延伸為弓形之形狀，所述矩形與弓形 交界處具有一凸條11〇 ; —設於所述板狀底座1〇〇上，且 與所述板狀底座100主體之矩形結構相對應之毛細結構層 200 ;以及一蓋體30〇，所述蓋體30{)包括與所述板狀底 座100主體形狀相對應之頂部，於所述頂部週邊垂直延伸 之側邊，以及與所述側邊同向延伸於所述蓋體300頂部之 —隔板310及複數個導流件338。所述隔板31〇將所述蓋 094127468 表單坞號A0101 第6頁/共16頁 0993180253-0 1328421 . ,_ 099年05月24日修正替换頁 體300分隔為一回流腔320及一蒸發腔33〇，所述回流腔 320及蒸發腔330均與所述毛細結構層200相連，且側邊 分別包括通孔325、335。所述毛細結構層200包括燒結 層或碳奈米管陣列。本實施例中，所述毛細結構層2〇〇採 用燒結層’當然於其他實施增中，所述毛細結構層2〇〇亦 可採用碳奈米管陣列。 [0018]優選，所述隔板310及導流件338與蓋體300係一體成形 [0019] 所述燒結層係由金屬粉末燒結而成。 [0020] 所述金屬粉末包括銅粉、鋁粉或鐵粉。 [0021] 所述底座100及蓋體300係通過焊接或粘貼結合。 [0022] 所述蒸發腔330包括一位於所述凸條11〇與隔板31〇之間 之導流部及一位於所述弓形部分之集氣室。 [0023] 所述複數個導流件338分佈於所述導流部之蓋體3〇〇頂部 且相互平行，將所述導流部分隔為複數個導流通道。所 述複數個導流通道一端與所述隔板31()相連，另一端與所 述蒸發腔330中通孔335附近之弓形集氣室相連β [0024] 所述底座100及蓋體300之材料包括銅 '鐵、鋁等金屬或 其合金。 [0025]凊一併參閱第一圖至第四圖，本實施例中，所述散熱模 組10處於使用狀態時，所述底座100中位於蒸發腔33〇之 部分與一熱源20相連，所述散熱模組之兩通孔325、 335與一冷凝裝置30相連。將工作流體通過通孔325注入 0993180253-0 094127468 表單編號Α0101 第7頁/共16頁 1328421 099年 05月 所述回流腔320中，工作流體受毛細結構層200之毛細作 用由所述回流腔320吸至所述毛細結構層200位於所述蒸 發腔330之部份中。由於所述蒸發腔330與熱源20相連， 故底座100將熱量迅速傳遞至所述毛細結構層200。所述 毛細結構層200中之工作流體吸收熱量後形成蒸氣蒸發至 所述複數個導流件3 3 8形成之複數個導流通道中，然後經 所述導流通道流至所述集氣室中，由所述集氣室之通孔 335流出至所述冷凝裝置30。所述蒸氣經所述冷凝裝置3〇 冷凝成工作流體後再由通孔325注入所述回流腔320中， 如此循環，利用工作流體之相變冷卻所述熱源2〇。 Φ [0026] 相較於先前技術，本實施例提供之散熱模組中，所述 底座100可直接與熱源20相連，接觸熱阻較小，且所述底 座上具有毛細結構層200，該毛細結構層2〇〇可根據散熱 需要而設定大小’甚至完全覆蓋所述底座1〇〇，以使所述 散熱模組10能負載較大之熱傳量。所述散熱模組1〇處於 使用狀態時，所述複數個導流通道流出之蒸氣經所述弓 形集氣室流出通孔335，可有效降低流阻。 [0027] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0028]第一圖係本發明實施例之散熱模組之爆炸圖。 [0029] 094127468 第二圖係本發明實施例之散熱模組之立體圖。 表單編號A0101 第8頁/共16頁 0993180253-0 1328421 099年05月24日修正钥^頁 [0030] 第三圖係本發明實施例沿第二圖瓜_ Μ方向之剖面示意圖 [0031] 第四圖係本發明實施例使用狀態之剖面示意圖。 【主要元件符號說明】094127468 Modified on May 24, 2008, in the heat pipe heat dissipating device provided in the prior art, the evaporation section of the heat pipe is usually disposed on a heat sink which is in contact with the heat source, and is added by the combination with the heat sink. The contact area of the evaporation section is utilized to fully utilize the thermal conductivity of the heat pipe. However, due to the small amount of heat transfer of a single heat pipe, in order to meet the ever-increasing heat dissipation requirements, the heat pipe heat sink usually has a plurality of heat pipes, and the volume thereof also increases, which is difficult to meet the requirements of light and thin. Short, small demand. In addition, in the heat pipe heat dissipating device, the evaporation section of the heat pipe is in indirect contact with the heat source through the heat sink, so the heat transfer between the heat pipe and the heat source is also limited by the heat conduction performance of the heat sink, and the heat dissipation performance is still not satisfactory. In view of this, it is necessary to provide a heat dissipation module that is small in size and capable of carrying a large heat transfer amount. SUMMARY OF THE INVENTION Hereinafter, a heat dissipation module will be described by way of embodiments. To achieve the above, a heat dissipation module is provided, comprising: a base; the base includes a capillary structure layer; and a cover body engaged with the base, the cover body includes a partition; the base And the cover body forms a return chamber and an evaporation chamber separated by the partition plate, wherein the return chamber and the evaporation chamber are connected to the capillary structure layer, and respectively comprise a through hole for accommodating a working fluid, The evaporation chamber includes a flow guiding portion and a gas collecting chamber, the flow guiding portion includes a plurality of flow guiding members, and a flow guiding channel is formed between the two adjacent flow guiding members, and the capillary structure layer is located at the guiding flow. a portion below the portion to allow vapor to enter the flow guiding channel via the capillary structure layer and enter the gas collecting chamber along the flow guiding channel, the vapor-based working fluid absorbing heat after being located at the capillary structure layer form. Form No. A0101 Page 5 / Total 16 Pages 0993180253-0 1328421 On May 24th, 2008, the shuttle is replacing the page [0009] [0011] [0012] [0014] [0016] [0016] The evaporation chamber includes a flow portion and a gas collection chamber. The evaporating material includes Wei flow guiding members. The base and the cover body comprise a metal such as copper, iron, or the like or an alloy thereof. The capillary structure layer comprises a sintered layer or an array of carbon nanotubes. The sintered layer is formed by sintering a metal powder. The metal powder includes sacrificial, recorded or iron powder. Compared with the prior art, the present embodiment provides a reading thermal module towel, the base can be directly connected to a heat source, the contact thermal resistance is small, and the base has a capillary structure layer, and the capillary structure layer can be according to heat dissipation requirements. The size is set to even completely cover the base so that the heat dissipation module can carry a large heat transfer amount. The present invention will be further described in detail with reference to the accompanying drawings. Referring to the first and second figures, a heat dissipation module 10 according to an embodiment of the present invention includes a plate-shaped base 1〇〇 The main body of the plate-shaped base 1 has a rectangular shape and one side has an arcuate shape, and the rectangular and arc-shaped intersection has a ridge 11〇; and is disposed on the plate-shaped base 1〇〇, and a capillary structure layer 200 corresponding to the rectangular structure of the main body of the plate-like base 100; and a cover body 30) including a top portion corresponding to the shape of the main body of the plate-shaped base 100, The side of the top periphery extends vertically, and the partition 310 and the plurality of deflectors 338 extend in the same direction as the side of the cover 300. The partition 31 〇 separates the cover 094127468 form dock number A0101 page 6 / 16 pages 0993180253-0 1328421 . _ 099 May 24 modified replacement page body 300 into a recirculation chamber 320 and an evaporation chamber 33, the recirculation chamber 320 and the evaporation chamber 330 are both connected to the capillary structure layer 200, and the side edges respectively include through holes 325, 335. The capillary structure layer 200 includes a sintered layer or an array of carbon nanotubes. In the present embodiment, the capillary layer 2 is made of a sintered layer. Of course, in other embodiments, the capillary layer 2 can also be an array of carbon nanotubes. Preferably, the separator 310 and the flow guide 338 are integrally formed with the lid 300. [0019] The sintered layer is sintered from metal powder. [0020] The metal powder includes copper powder, aluminum powder or iron powder. [0021] The base 100 and the cover 300 are joined by welding or bonding. [0022] The evaporation chamber 330 includes a flow guiding portion between the rib 11 〇 and the partition 31 及 and a plenum located at the arcuate portion. [0023] The plurality of flow guiding members 338 are distributed on the top of the cover body 3 of the flow guiding portion and are parallel to each other, and the guiding portion is partitioned into a plurality of guiding channels. One end of the plurality of flow guiding channels is connected to the partition plate 31 (), and the other end is connected to the arcuate gas collecting chamber near the through hole 335 in the evaporation chamber 330. [0024] The base 100 and the cover 300 Materials include metals such as copper 'iron, aluminum, or alloys thereof. [0025] Referring to the first to fourth figures, in the embodiment, when the heat dissipation module 10 is in use, the portion of the base 100 located in the evaporation chamber 33 is connected to a heat source 20, The two through holes 325, 335 of the heat dissipation module are connected to a condensing device 30. The working fluid is injected through the through hole 325 0993180253-0 094127468 Form No. Α0101 Page 7 / Total 16 Page 1328441 In the recirculation chamber 320 described in May, 99, the working fluid is subjected to the capillary action of the capillary structure layer 200 by the recirculation chamber 320. The capillary structure layer 200 is drawn into a portion of the evaporation chamber 330. Since the evaporation chamber 330 is connected to the heat source 20, the base 100 transfers heat to the capillary structure layer 200 quickly. The working fluid in the capillary structure layer 200 absorbs heat to form vapor evaporation into a plurality of flow guiding channels formed by the plurality of flow guiding members 338, and then flows to the plenum through the guiding channel. The flow through the through hole 335 of the plenum to the condensing device 30. The vapor is condensed into a working fluid through the condensing device 3, and then injected into the return chamber 320 through the through hole 325, and thus circulated, and the heat source 2 is cooled by a phase change of the working fluid. Φ [0026] Compared with the prior art, in the heat dissipation module provided in this embodiment, the base 100 can be directly connected to the heat source 20, the contact thermal resistance is small, and the base has a capillary structure layer 200, the capillary The structural layer 2〇〇 can be sized according to the heat dissipation requirement to even completely cover the base 1〇〇, so that the heat dissipation module 10 can carry a large heat transfer amount. When the heat dissipation module 1 is in use, the vapor flowing out of the plurality of flow guiding channels flows out through the through holes 335 through the arcuate plenum, which can effectively reduce the flow resistance. [0027] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0028] The first figure is an exploded view of a heat dissipation module of an embodiment of the present invention. [0029] 094127468 The second figure is a perspective view of a heat dissipation module of an embodiment of the present invention. Form No. A0101 Page 8 / Total 16 Pages 0993180253-0 1328421 Correction Key Page of May 24, 2008 [0030] The third figure is a schematic cross-sectional view of the embodiment of the present invention along the second map [0031] The four figures are schematic cross-sectional views showing the state of use of the embodiment of the present invention. [Main component symbol description]
[0032] 散熱模組10 [0033] 熱源 20 [0034] 冷凝裝置30 [0035] 底座 100 [0036] 凸條 110 [0037] 毛細結構層200 [0038] 蓋體 300 [0039] 隔板 310 [0040] 回流腔 320 [0041] 通孔 325,3〇 [0042] 蒸發腔 330 [0043] 導流件 338 094127468 表單編號A0101 第9頁/共16頁 0993180253-0[0032] Heat Dissipation Module 10 [0033] Heat Source 20 [0034] Condensing Device 30 [0035] Base 100 [0036] Rib 110 [0037] Capillary Structure Layer 200 [0038] Cover 300 [0039] Separator 310 [0040] Reflow chamber 320 [0041] Through hole 325, 3〇 [0042] Evaporation chamber 330 [0043] Flow guide 338 094127468 Form number A0101 Page 9 / Total 16 page 0993180253-0