TWI375507B - - Google Patents

Description

1375507 (2) Brief description of the symbol of the representative figure: CPL dual-phase flow heat sink 2 Evaporator 10 head side 12 Liquid head 13 tail side vapor steam head 15 capillary body ( Porouswickpart) 16 open groove 161 φ flange 162 vapor groove 17 chamber 18 annular channel 20 VIII. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: (none) IX. : [Technical Field to Which the Invention Is Affiliated]

A non-fluid capillary pumping loop (CPL) two-phase flow heat sink, especially one that can be applied to high energy density electronic components such as digital video recording systems (MDVR). The production of MDVR requires a temperature control of _3 〇 to 6 〇 1 temperature control requirements. [Prior Art] With the development of semiconductor technology, lithography and other process technologies have made the size of electronic components significantly smaller, and more and more ί : 曰 circuits (ic), in other words, the number of ί = per unit area ~遽, 遽 increase, coupled with the increase in the speed of 1C, resulting in a very large thermal power during operation, in the current central computer g 3 1375507 processor (CPU), the heat from the Pentium 20W to the Pentium Π 30W or even 43W, and PentiumFV is estimated to be above 150W, CPU junction temperature can be as high as 150 °C, if you can not effectively and quickly remove the heat generated by the CPU, the CPU will accumulate heat The temperature is very high and the machine is even damaged. At present, in order to prevent the electronic components from affecting their working performance or even being damaged due to high heat and high temperature, a heat sink fin (frn) is usually added thereto, and the air is forced by an axial fan. Convection increases its heat removal capability, which is the structure of a conventional electronic component heat sink. In general, single-phase air forced convection heat transfer coefficient and heat transfer surface area increase φ Therefore, in order to increase the heat transfer rate, it is usually achieved by increasing the fin area or using a fan with a large air flow rate, but the disadvantages of increasing surface area and air flow are volume increase, vibration noise, etc. In addition to using heat sink fins and fans as heat sinks, there are two methods of air impingement cooling and heat pipe cooling. The air impingement cooling method is used for heat dissipation of electronic components, and the average heat convection coefficient can reach 140W/ M2-°c is even higher. Although this method can have a better thermal convection coefficient than the general air-cooling method, the disadvantage is that a high-pressure air source needs to be provided. If the air-cooling method only requires a fan to drive the air flow. Another φ external 'mesh, the most commonly used heat pipe is a high thermal conductivity device, its equivalent heat transfer coefficient can be greater than 1000W / m2 - ΐ, it can transfer a large amount of heat, profit, liquid absorption heat changes phase change The vapor 'transfers heat from the hot zone to the low temperature zone, and the working fluid circulates continuously in the heat pipe, adding any power to drive the working fluid flow. In this case, the heat pipe is just a device for transferring heat, not a tool for dissipating heat. The above-mentioned heat dissipation methods all have their fatal shortcomings. Although they can meet the requirements of heat dissipation of the current sub-pieces, they will not meet the requirements. In the future, electronic components are required to 'space space, heat removal capability, and integration with 1C packaging. Because the heat pipe type heat radiator cannot meet the heat dissipation requirements, it must be used in other heat dissipation methods. In order to achieve the best heat transfer efficiency, the improved 4f method separates the liquid and vapor transfer channels and uses a specially designed separator to generate a unidirectional flow of the working fluid. When the heat source and heat sink The heatsink is partly because the external environment is in the same phase. If the temperature is set, the heat transfer mechanism is different. In general, if the position of the heat source is low and the position of the heat sink is high, the power of the loop circulation source 2 is mainly the buoyancy of the liquid due to the density difference formed by heat. If the relative position of the heat sink is horizontal or the loop is in a microgravity environment, the driving force of the ring cannot be based on the extra/milk force of the liquid on the ground due to the change in density (bu〇y as the driving force ( Driving force): When heating on the evaporator, the working fluid in the liquid passage must be adsorbed into the evaporator by the action of the captiveary force, and the heat is applied to the evaporator, and the steam is generated. Then, through the steam channel in the evaporator, the gas is introduced into the condenser. The vapor bubble flows into the condenser to release the latent heat, and then flows into the evaporator through the liquid head to evaporate and complete the natural circulation (natural ^«•culation). The mechanism of heat transfer, and the mechanism developed according to this concept, = the capillary suction force of the porous material as the driving force of the loop, is called the Capillary Pumped Loop, abbreviated as "CPL". The two-phase capillary pumping loop (CPL) is a kind of latent heat that changes the phase between the working fluid and the vapor phase, and does not require any mechanical pumping. The working fluid is completely internal. The capillary force of the capillary material is transferred in a unidirectional direction to transfer heat. Because it is transferred by the latent heat of the working fluid, it can be easily transferred from the heat source (CPU) to the outer casing of the notebook computer through the design of the CPL. Then, using the Case Fan, you can remove a very high amount of heat, far more than the usual single-phase heat dissipation (such as fans, fins). This is light and simple. The device with long heat transfer distance and no gravity constraint and no need for any external power is most suitable for general high-value electronic components for heat dissipation or artificial satellites. The CPL was applied to the Challenge Space Shuttle in 1986. The two-phase flow loop with capillary force can effectively remove heat, and can remove 25W of heat under the natural condensation convection condition of 1375507 and keep the CPU at 卯°c. According to this principle, if forced Convection will effectively remove heat from the box fan (caseFan). Capillary pumping two-phase flow high efficiency heat transfer system CPWCapillary PumPed Lo〇P) The main four components include: evaporator, steaming Head, condenser and condenser head. In addition, since the case fan must be used as a tool for heat sinking, the influence of the amount of the axial fan and the impedance of the system must be considered. The thermal test of the CPL system can be measured by the CPU thermal simulation test system, but how to design a higher efficiency CPL loop has taken away more than 150W of φ heat depends on the capillary structure including the capillary radius (WickRadius), capillary permeability ( Permeability), the improvement of the specifications of the condensing unit, depends on the establishment of the theoretical model. The traditional thermal planning and management of electronic components is often classified as the last part of the entire packaging process, that is, the electronic components are manufactured. After the package test is completed, the heat dissipation problem is considered and how the heat sink is combined with the electronic components. For a less demanding application, this kind of planning can have lower cost and better heat dissipation. However, when faced with the need to tighten the package size, the high performance of electronic components leads to high heat generation, and the electronic components are in a high temperature environment, the old concepts and methods will not be able to meet the requirements of electronic components. Therefore, a new cooling method and device is needed to solve the problems that will be encountered. Also, September 11, 2001, the United States, the nine events, the October 12, 2002, the Indonesian Afghan terrorist attacks, the 2nd March, the Japanese train explosions ^ = July 7, 2005, the London Underground and buses The terrorist attacks such as the bombings have made the European and American crisis awareness constantly improved. Through the security monitoring equipment, there is evidence related to 1 episode. Therefore, under the situation that the terrorist attacks continue, and the evidence demand continues to improve, the security monitoring products are used. The digital video system DVR (Digital Video α ' or digital video recorder), such as the Digital Video Recorder (MDVR), is a small computer monitoring security system installed in the car. It is especially popular in large foreign buses or school buses of all primary and high schools. Its system is mainly used for advertising, description, warning, broadcasting, internet, satellite navigation, etc. It is a security device and a service device. Therefore, it is getting more and more attention from foreign large buses. In order to overcome the large impedance in the space where the MobileDVR is so tight, the present invention proposes a gravity-type capillary pumping loop heat sink (CPLCooler) for high energy density electronic mechanism products such as MobileDVR. The effect of maximum heat transfer without a fan. SUMMARY OF THE INVENTION The main object of the present invention is to provide a gravity-type capillary pumping loop (CPL) dual-phase flow heat sink for supplying high-density electronic components such as a vehicle digital video recording system (MDVR); The capillary pumping loop (CPL) mainly comprises: at least one evaporation portion (evap〇rat〇r), the outer bottom surface of which is closely attached to a heat source portion such as a central processing unit (CPU) of the system motherboard, the head thereof A liquid head and a vapor head are respectively disposed on the side of the tail two for the liquid phase of the working liquid to flow in and the vapor phase to flow out, and a capillary portion is disposed inside (p〇r〇us wick part) And a plurality of vapor grooves are disposed at the periphery of the capillary portion; an annular passage is disposed and connected between the steam head and the liquid head; and a condensation portion, which may include an annular passage and Fit the heat sink fins or connect to the outer casing to form a heat sink; then fill the loop with a working fluid such as Freon; whereby the liquid phase working fluid can be from the liquid head Flow into the evaporation section, and then by the hair ^ The capillary force of the part adsorbs and simultaneously evaporates to form a vapor phase, and a plurality of steam channels are introduced into the steam head to flow from the evaporation portion to the production passage, and the latent heat is released by the condensation portion. The liquid is returned to the evaporation portion through the liquid head and then evaporated by heat to complete a gravity-type natural circulation of the capillary 1375507. The heat transfer effect is achieved, thereby achieving the maximum heat transfer effect and effectively overcoming the bulkiness and volume of the product. : Can't solve the wattage and can't meet the width of 30. (: to 60 C) temperature control problem. The invention further provides a gravity capillary pumping loop (CPLO capillary pumping loop (c can be provided with two hair portions, and the evaporation portions are arranged in parallel to arrange the channel ten, so that the liquid head of each evaporation portion It is connected to the same annular passage 2, and operates in the liquid phase condensed by the condensation portion while entering each evaporation portion from each liquid head. Another object of the present invention is to provide a gravity capillary pumping loop (CPL) double Ϊ=device's one step can first increase the capillary pumping loop (CPL) to 1XlG _ (Taul, " (four) cm mercury high icmHg working fluid, in order to enhance the heat dissipation effect, to meet the system's temperature control It is not required to meet the temperature control requirements of MDVR in the wide temperature _3〇艺至仞^. Another object of the present invention is to provide a gravity pump (CPL) two-phase flow heat sink 'the step of which can be in the capillary pumping ring The external bottom surface of the road (CPL) is first _-spreader, and then attached to the heat source part such as the central processing unit (CPU) to improve the heat dissipation effect, and the control system can be controlled. Temperature requirements such as MDVR require a wide temperature of -30 ° C to 60. (: 押,, 田,本本Another object is to provide a gravity/fine fruit suction loop (CPL) two-phase flow heat dissipating device, which can further be condensed in the capillary pumping loop (CPL) (eGndense〇 and evaporation section (evapQfatQf } < A working fluid storage tank is added between the liquid heads to enhance the heat dissipation effect, and can meet the temperature control requirement of the system temperature control requirement WMDyj^^ wide temperature -30 °C to 60 °C. 8 1375507 The above and other technical features and advantages of the present invention are described in more detail below with reference to the accompanying drawings: Referring to Figures 1, 2, and 3, respectively, an embodiment of the present invention (providing an evaporation portion) The basic structure and the schematic diagram of the internal structure of the evaporation section and the transverse section. The present invention is a gravity-type capillary pumping loop (Capillary Pumped Loop, abbreviated as CPL) two-phase flow heat dissipation device 1, and the two-phase flow heat transfer mode is far It is more efficient than single-phase heat transfer. It is characterized by the rapid removal of a large number of heat sources by the latent heat change between the working fluids. It can be applied to high-energy density electronic components such as vehicles. Video recording system (MDVR, Mobile Digital Video

Recorder 'MobileDVR), etc. 'Used to remove the heat generated by the system, such as the heat generated by the central processing unit (CPU) of the system board; and in the state where the liquid phase and the vapor phase coexist, there is no temperature difference between the two phases. The direction of heat absorption or release changes from the liquid phase back to the vapor phase or from the vapor phase back to the liquid phase. The former is the evaporation process, the latter is the condensation process, and the heat transfer device developed according to this concept is called the capillary pump. Suction loop (CPL). The gravity type CPL dual-phase flow heat dissipation device 1 of the present invention mainly comprises: at least one evaporation unit 10, an annular passage 20 and a condensation portion 30, and is constituted by the evaporation portion 10, the annular passage 20 and the condensation portion 30. A capillary pumping loop... Lu (CPL), while the loop is filled with a working fluid such as Freon. The evaporator 10 can be a square casing made of a metal having a good heat conducting effect, such as a metal alloy, and the outer bottom surface 11 serves as a heat transfer surface for being closely attached to a heat source portion such as a system motherboard. The central processing unit CPU (not shown) removes the heat generated by the central processing unit (CPU) from the operation of the central processing unit (CPU) to the evaporation unit (evap〇rat〇r) 1; A liquid head (Liquidhead) 13 is provided for the liquid phase working liquid 40a to flow into the evaporation portion 1b, and a steam head (vap〇r head) 15 is disposed on the tail side 14 for vaporized working liquid 4〇b to flow out of the evaporation portion. 10. The interior of the evaporation portion 10 is provided with at least one porous wick part 16 and a plurality of vapor grooves 17'. The capillary portion 16 has a capillary structure and an active function inside, and can be high-density and A polyethylene or sinter powder having a permeability of 1.05xl (T5m and a permeability of 6xl (T1()m2). The plurality of vaporgrooves 17 are provided. On the periphery of the capillary portion 16, the design concept must be how to increase the driving force of the overall capillary pumping loop (CPL).

Considering both the increase of the capillary pressure difference and the reduction of the entire loop pressure drop, on the one hand, in order to require a small capillary radius to adsorb the condensed liquid phase, the working liquid 40a reaches the inner surface of the evaporator 1 and is heated. In addition, problems such as an increase in flow resistance caused by the flow of the working fluid in the inner porous capillary portion 16 of the evaporator 1 due to the use of a smaller aperture are considered, and thus a plurality of steam channels 17 are employed. The design is such that it can transport the vapor phase working liquid 4〇b which is evaporated by the absorption of heat, and the vapor phase working liquid 40b is collected at the end of the plurality of steam channels 17 by the tail side 14 of the evaporator 1 The steam head (Vap〇r head) 15 is discharged. The annular passage 20 is disposed outside the evaporator 1 and is connected to the steam head! liquid? Between them, the layout is not limited, and the layout can be changed with the application of high-energy electronic products such as the digital space of the digital video recording system (MDVR). It has been shackled on the annular passage 2, that is, the annular venting function is used to remove the "flying phase working liquid 4 〇 b discharged from the steaming/flying head 15 of the evaporator 10 as the liquid 40b. The phase change (condensation) becomes ^, and the eight-phase workpiece head 13 is caused to flow into the evaporation portion 10. The cold ^ = = body 40a and via the liquid thunder; a ^ coagulation 30 can be used with all of the high-energy dense annular channels 20 (as shown in the figure: ":" can be covered with the conductor 31) 'It can be combined with the heat sink fins (as shown in Figure 9 and Figure 18, Figure 18) or the 1375507 conductor 31 and/or heat sink fins 32 can be connected to the MDVR outer casing (not shown) to form The heat sink is used to effectively remove the heat of the vapor phase working fluid 40b in the soil channel 20; in other words, the structure of the condensation portion 3 is relatively simple 'in order to reduce the flow resistance', all the annular passages 20 can be used as condensation. The tubes are both smooth and thermally conductive. The condensing unit 30 can also be made into a hollow aluminum shell by using the existing housing of the mobileDVR. The main consideration of the design is that it has sufficient capacity to be produced by the evaporator 10. The vapor is completely condensed. With the above structure, the liquid phase working fluid 40a can flow from the liquid head 13 into the interior of the evaporation portion 10, and then adsorbed by the capillary force of the capillary portion 16 and simultaneously evaporates to a vapor phase by the endothermic heat. Working fluid 40b, and then borrowing a plurality of steam channels 17 The flow introduction steam head 15 discharges and flows into the annular passage 2, flows, and releases the latent heat by the condensation portion 30 to return to the liquid phase working fluid 4〇a, and then flows into the evaporation portion 10 via the liquid head 13 to be evaporated by the heat. To complete the heat transfer effect of the gravity-type natural circulation that enhances the capillary action of the capillary, thereby achieving the heat dissipation effect of the maximum heat transfer without the fan, and effectively overcoming the cumbersome, bulky and incapable of the conventional pump circuit. Solve the problem of high wattage and temperature control (eg -30 ° C to 60 ° C). μ In addition, the gravity capillary pumping loop (CPL) of the present invention is a two-phase flow and heat device 1 The vacuum problem must be considered, because the vacuum will cause an increase in the non-condensing gas, and also affect the heat transfer properties of the condensation portion 30 and the evaporation portion 1 and the control temperature of the overall loop, so the true 'empty' degree for the system The requirements are particularly strict, the loop design must reduce the use of the valve, to "unnecessary leakage, the general design vacuum specification is lxl〇-5t〇rr (Tayl, pressure unit 'equivalent to 1 cm Hg quotient cm-Hg column height), ie Before the working fluid 40 has been filled, the internal pressure of the capillary pumping loop (cpl) of the present invention is preferably reduced to lxl〇-5 torr (Tayl), and the atmosphere is 760 torr (Tayl). The evaporator 10 is designed as a square casing, which is a geometry of 1375507 in conjunction with an electronic heating element (such as a CPU), and its size can be set to 50 mm><50 mm x 20 mm to conform to Intel's Pentium IV single chip (single). Chip ), or set to 105 mmx 162 mmx24 mm to meet the needs of dual CPUs.

4-8, which are schematic views of the internal structure of the other embodiment of the evaporation portion of the present invention, the upper cross section, the front cross section, and the used capillary portion and the assembled capillary portion (and Mark the reference size). The interior of the evaporator 10 of the present embodiment is provided with at least one capillary portion 16 and a plurality of vapor grooves 17, and between the capillary portion 16 and the plurality of steam channels 17. The structure type is not particularly limited, and a plurality of vapor fooves 17 may be respectively disposed above and below the inside of the casing of the evaporating portion (evac〇rat〇r) 10 as shown in FIGS. 4 and 5, and A chamber 18 is formed between the upper and lower rows of the plurality of steam channels 17 for providing a correspondingly shaped capillary portion 16 as shown in FIG. 7, so that the capillary portion 16 can be sandwiched between the upper and lower portions. A plurality of steamings are arranged between the flying guide grooves 17 as shown in FIG. 8; and the capillary portion 16 is provided with a liquid-to-liquid, open groove 161 of the head 13 for the liquid phase working fluid 4 which can be used by the liquid head 13乂5 The inside of the hair part 10 flows into the capillary body through the opening groove 161: at the same time, referring to 4_8 households, the 俾 can be evaporated to become a vapor phase by the second heat of the capillary body fluid; and the capillary body is introduced into the steam head 15 The opening end of the row @ slot is provided with a capillary stop for the convex portion 16 of the capillary portion 16 Gamma working fluid flows back to the suction force of the liquid head 13.

(There are shown in the 'there are separate embodiments of the invention. FIG. 1 is a schematic diagram of the partial perspective and decomposition of the evaporation section. The schematic thermal device 2 is provided with a two-phase flow (CPL) of two-phase flow (Fig. Not shown, and 13⁄2 2 corresponds to a two-electron heating element such as a CPU. The treatment unit 10 is arranged in a 12^/^507 ^ arrangement with respect to the annular channel 20, that is, the liquid of the two evaporation portions 1 The liquid phase in which the condensation portion 30 is condensed: When it is 2, the liquid heads 13 are introduced into the respective evaporation portions 1Q.

The condensing portion 30 does not limit the partial structure as shown in FIG. 9, and the cold, the conductor Μ covers all of the annular passage 2Q as shown in FIG. 18 = part = Li 2 heat sink 32 (shown in Figures 9 and 18). Or the conductors 31 and / / ..., the fins 32 are connected to the outer casing (not shown) of the MDVR. 1 The inside of the embodiment 1G is provided with at least a capillary portion (a ceramic part) and a plurality of steam guide grooves (vap〇rgr〇〇ve), a portion 16 and a plurality of steam channels 17 The structural type between them is not particularly limited.

In the lower inner surface of the casing of the evaporator 10, a plurality of vapor grooves 17 may be disposed, as shown in Figs. 10 and 11, and a plurality of steam guide grooves on the lower edge surface. A chamber 18 is formed above for providing a correspondingly shaped capillary portion 16 as shown in FIG. U such that the capillary portion 16 can be disposed above the plurality of steam channels 17; and the capillary portion 16 is provided with an orientation The opening groove 161 of the liquid head 13 allows the liquid phase working fluid 40a to flow from the liquid head 13 into the interior of the evaporation portion 10 and into the inside of the capillary portion 16 via the opening groove 161 (please refer to FIG. 1 and u simultaneously). The capillary body working fluid 40b is adsorbed by the capillary force of the capillary portion 16 and simultaneously evaporated to the vapor phase working fluid 40b'. The plurality of steam guiding channels 17 are merged and introduced into the steam head 15 to discharge; and the capillary portion 16 is in the open groove 161. A stopper flange 162' is provided at the open end to prevent the liquid phase working fluid 40a from being adsorbed by the capillary force of the capillary portion 16 and being returned to the liquid head 13. Referring to Figures 12-15, there are shown, respectively, partial perspective, exploded, partial perspective and exploded views of another embodiment of the evaporation section of Figure 9. The two-phase flow heat dissipating device 2 of the gravity capillary pumping loop (CPL) of the present embodiment is provided with two evaporation portions 10 to correspond to two electronic heating elements such as a CPU (not shown), which is dual-phased as shown in FIG. The main difference between the flow heat dissipating devices 2 is the internal structure of the evaporation portion 10; the inside of the evaporation portion 10 of the present embodiment is provided with a hair 13 1375507 thin part (p0rous wick part) 16 and a plurality of steam grooves (vapor groove) 17) wherein the lower edge of the inner casing of the evaporation chamber 10 (which may be an aluminum extruded body) may be formed into a circular arc shape and a plurality of steaming portions may be disposed.

As shown in FIG. 13-15, a vapor groove 21 is formed on the arc-shaped lower edge surface of the plurality of steam channels 17 to form a corresponding cavity portion 16 as shown in FIG. 13 As shown in Fig. 15, the capillary portion 16 can be embedded above the plurality of steam guiding grooves 17; and the capillary portion 16 is provided with an opening groove 161 facing the liquid head 13, for the liquid phase working fluid 40a to flow from the liquid head 13. The inside of the evaporation portion 10 flows into the interior of the capillary portion 16 via the opening groove 161. The crucible can be adsorbed by the capillary force of the capillary portion 16 and simultaneously evaporates to the vapor phase working fluid 40b by the heat absorption, and the plurality of vapor guides are borrowed. The groove 17 is merged and introduced into the steam head 15 to discharge; and the capillary portion 16 is provided with a stopper flange 162 at the open end of the open groove 161, thereby blocking the liquid phase working fluid 4〇a from being affected by the capillary force of the capillary portion 16. Adsorbed and returned to the liquid head 13.

As shown in Figure 16, a part of the three-dimensional flow diagram of the evaporation section of the gravity type capillary pump (CPL) of the present embodiment is shown in Figure 1-3. The steaming product having a larger length, that is, the capillary portion (P〇rouswickpart) 16 and the plurality of g (vap〇rgr〇〇ve) 17 have a larger length, so that the evaporation portion is opposite to each other. The striking money corresponds to a two-electron heating element such as [not shown], that is, the evaporating portion is opposite to the annular passage 2: a body head (8) and a steam head (15), and the evaporation portion ;; the length of the length is relatively close to the two electrons (not shown), to remove the heat generated by the operation to the same-evaporation part by heat conduction, also ^

The position of the CPU is 70, and the position of the CPU is connected to the annular channel 2G. This is not the same as the arrangement of the two evaporation sections in Fig. 9. The evaporation section is arranged in series to correspond to 2 ray. , 7L cattle, the removal effect of the heat source is worse than the parallel arrangement. 14 1375507 Referring to Fig. 17, a schematic cross-sectional view of a heat transfer surface for spreading the spreader on the outer bottom surface of the evaporation portion of the present invention is shown. The two-phase flow heat dissipating device (1, 2) of the gravity capillary pumping loop (CPL) of the present invention may further attach a spreader 50 for spreading on the outer bottom surface 11 of the evaporation portion 1A. Then, it can be matched with the heat source part such as the central processing unit (CPU) 61 of the MDVR system motherboard 60 to improve the heat dissipation effect of the system, such as the MDVR requirement at a wide temperature of -30 ° C to 60 °. C temperature control requirements.

Referring to Fig. 18, there is shown a perspective view of another embodiment of the condensing portion of the embodiment shown in Fig. 9. The specifications of the dual-phase flow heat sink of the gravity capillary pumping loop (CPL) of this embodiment are as follows: 1. Material of CPL: Aluminum or Copper 2. Evaporation section: 45X45X23.5 mm3 & 45X45X23 .5 mm3 3, Condensation: 8ψ 4, Steam head: 8mm 5, Liquid head: 8mm 6 with 9 10 11 12 13 14

Capillary body: Porous Polyethylene, Porous Effect Radius: 10*4 m~ 10'5 m, Porous Permeability: 6X10]0m2, working fluid (Working Fluid ): Freon, System Vacuum : 10*4~1〇·5 Torr :^Large heat (Qmax ) : 100W , System Thermal Resistance : 0.3 °C /W. System operating temperature Tcpu (System Operation Temperature): 70 c, Ambient temperature: 40. . Referring again to Figures 19 and 20, the embodiment shown in Figure 18 is further illustrated as an exploded perspective view and a combined perspective view of the liquid reservoir. The method of the present invention can add a storage tank 40 of the working fluid 40 between the condenser 15 1537575 30 of the capillary pumping loop (CPL) and the liquid head 13 of the evaporator 10, thereby enhancing The heat dissipation effect can meet the temperature control requirements of the system, such as the temperature control requirement of the wide temperature -30 ° C to 60 ° C required by the MDVR; therefore, the difference between the embodiment and the embodiment shown in FIG. 18 is added to the embodiment. A storage tank 70 is used for temperature control of the loop. When the steam enters the condensation portion 30 from the steam head 15, the latent heat is released therefrom to complete the heat transfer. The main point of the design of this embodiment is to ensure the outlet of the condensation portion 30. It is subcooled. The specifications of this embodiment are as follows: I. Material of CPL: Aluminum or Copper • 2. Evaporation: 45 X 45X23.5 mm3 & 45 X 45X23.5 mm3 3. Condensation: 8ψ 4. Steam head: 8mm 5, liquid head: 8 mm 6. Capillary part: Porous Polyethylene 7. Porous Effect Radius: 10'4 m~ ΙΟ'5 m 8. Porous Permeability * 6X10*10m2 9. Working Fluid (FingerFluid): Freon 10, Loop Vacuum: 10·4 〜l〇·5 Torr

II. Maximum heat (Qmax): l〇〇W

Lu 12, System Thermal Resistance (SystemThermalResistance): <0.95 °C /W

13, system operating temperature Tcpu (SystemOperationTemperature): 70 °C

14. Ambient temperature: -25 °C ~70 °C 15. Reservoir: 30 X 30 X 20 mm3 16. Applicable: mobile DVR (Digital Video Recording System MDVR) The preferred embodiments of the present invention are intended to be illustrative and not restrictive. It will be understood by those skilled in the art that many modifications and even equivalent changes may be made within the spirit and scope of the invention as defined by the appended claims. The basic structure of the embodiment of the hairpin (evaporator) is a three-dimensional evaporation section (evap_) - a schematic cross-sectional view of the internal structure of the internal structure of the embodiment. (The rod indicates 夂5 with a ruler!; f: another - the internal structure of the embodiment is viewed from the top but the capillary portion has not been assembled). A schematic cross-sectional view of the internal structure of the reference metric ruler is shown. (The internal structure of the standard part is a schematic view of the section. (1$ for the standard test). The three-dimensional diagram of the capillary part of the non-evaporation part. (The schematic diagram shows the transverse section of the internal structure of the evaporation part.) Another embodiment of the present invention is a schematic diagram of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Fig. 12 is a perspective view of the evaporation section of Fig. 9. Fig. 12 is a partial perspective view of the internal structure of the hair extension section. A schematic diagram of the decomposition of the U-temperature evaporation section formed by the series arrangement - the longer evaporation section 17 1375507 Figure 17 is a schematic diagram of a transverse section of a heat transfer surface on the outer bottom surface of the evaporation section of the present invention. Figure 18 is a perspective view showing another embodiment of the condensing portion of the embodiment shown in Figure 9. Figure 19 is an exploded perspective view showing the working fluid storage tank of the embodiment shown in Figure 18. Figure 20 is an embodiment shown in Figure 19. A schematic diagram of the combination of the examples. [Main component symbol description] External bottom surface 11 liquid Liquid head 13 vapor head 15 open slot 161 vaporgroove 17 annular passage 20 conductor 31 working fluid 40 vapor phase working fluid 40b main plate 60 storage tank 70 CPL dual phase flow heat sink 1, 2 Evaporator 10 φ Head side 12 Tail side 14 Capillary part 16 Flange 162 Chamber 18 Condensation part 30 Heat sink fin 32 Liquid phase working fluid 40a Heat spreader for spreading 50 Central processing unit (CPU) 61

Claims (1)

Applying for patents Fan Park········································································ ~^); The system comprises: at least one evaporation portion, (CpL), and the 凝j condensation portion, thereby forming a capillary pumping loop evaporation portion, which is filled with a working fluid, wherein: The shell made of metal with heat conduction effect is externally heat-transferred and moved by p/v2f, which can be closely attached to a heat source part to borrow liquid from the working fluid: inside; on the side - liquid ^ The liquid capillary liquid flows out of the evaporation portion, and is provided with at least a bridge and a plurality of steam guiding grooves, wherein the capillary portion has a capillary knot; and the plurality of steam guiding grooves are disposed outside the capillary portion. The system is disposed outside the evaporator and connected between the steam head and the liquid head; the condensation portion is mainly disposed on the annular passage to form a heatsink for removing the steam head discharged from the evaporator. The heat of the vapor phase working liquid makes the vapor phase working liquid Forming a liquid phase working liquid and flowing into the evaporation portion through the liquid head; by the above structure, the liquid phase working fluid can flow from the liquid head into the interior of the evaporation portion, and then adsorbed by the capillary force of the capillary portion and simultaneously evaporates into a vapor at the end of the heat absorption. The phase working fluid is further introduced into the steam head by a plurality of steam guiding channels and discharged to flow into the annular passage, and then released into the liquid working fluid by releasing the latent heat from the condensation portion, and then flows into the evaporation portion through the liquid head and then is evaporated by the heat. , complete the heat transfer of a natural cycle. 2. A gravity-type capillary pumping loop (CPL) two-phase flow heat dissipating device as described in claim 1, wherein the capillary pumping loop can be provided with 1375507 having two or more evaporation portions, and such The tomb makes each steaming: Ministry == 3: The liquid phase of the flow of fine-headed knots, the scope of patent application! The gravity type capillary described in the item is a two-phase flow heat dissipating device, wherein the evaporation portion can be a gravity capillary pumping loop of the square 4, L item i. a double U heat device, wherein the evaporation portion is densely produced by the gravity capillary pumping loop described in the first item of the method 5, and the political device is in which the capillary portion can be utilized. Translucent polyethylene or sintered copper powder (sinterp_ group 5, the gravity type capillary pumping loop described in item 1 3ϋ〇5χ10·5ιη, its permeability is 6xl〇_%2 wide pores ΚΐΪίΠ The gravity-type capillary suction loop described in item 1 = thermal device, wherein the capillary is sucked in a good loop. The actual work is reduced to 1χ1〇5 ton·(Tayl) for the gravity described in item 91. Type capillary drip loop (iL f device 'where the working fluid is a gravity-type capillary fruit mouth and loop heat device according to item 1 of the gas-fired one, the plurality of steam channel systems 10, the sigh is evaporating The lower edge surface of the inner portion of the casing. The gravitational capillary fruit suction loop (CPL) two-phase flow heat dissipating device described in Item 1 wherein the plurality of steam channel guides 20 1375507 are disposed in the evaporation portion a circular arc-shaped lower edge surface inside the casing. The gravity capillary pumping loop (CPL) duplex as described in claim 1 a flow dissipating device, wherein the condensing portion can be coated on all or a part of the annular passage by using a heat conductor, and can be disposed on the crucible, and the gravity capillary pumping as described in claim 11 The loop jCP is a dual-phase flow heat sink, wherein the heat conductor digital video recording system (MDVR) is used. The gravity type capillary pumping loop dual-phase flow heat sink according to the first item is used. The capillary body is provided with an open groove for the liquid phase working fluid to flow from the inside of the liquid head and into the inside of the capillary body through the open groove. (&23, the gravity-type capillary fruit suction ring door described in Item 13 a heat sink of the eyepiece, wherein the capillary portion is provided with a flange for stopping at the opening groove h of the opening groove, and is returned to the liquid head. I wrong to pull the liquid phase working fluid, the gravity type capillary pump according to item 1. The bottom surface of the suction loop portion can be used in the outer portion of the evaporation portion for the use of a spreader. (ci) The gravity capillary pumping loop described in item 1 is thermally placed. - Step can be used in the capillary suction ring as the fluid reservoir I and the 4 parts of the liquid Disposed between a station 111314151621