JP2010267841A - Cooling unit, cooling structure, and method of constructing cooling system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily cool an electronic device rack by using a cooling unit that uses a refrigerant. <P>SOLUTION: A cooling structure includes: a fan unit wherein a plurality of fans for exhausting hot air generated by a heat source from a rack are arranged; a radiator unit wherein pipes for guiding a refrigerant are arranged to eliminate the hot air exhausted from the rack by rotation of the fans; a cooling unit having a supporting section for supporting a cooling panel that is an integrated fan unit and radiator unit, in a standing position; and a wind tunnel body that connects one side of the cooling unit and one side of an electronic device rack while the cooling unit is disposed in a standing position with its radiator unit side opposite to the exhaust side of the electronic device rack. The hot air exhausted from the electronic device rack is guided through the wind channel body. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cooling unit, a cooling structure, and a cooling system construction method, and in particular, a cooling panel for cooling a rack of an electronic device such as a computer using a refrigerant, and a cooling structure for an electronic device rack using the cooling panel. And a method for constructing a cooling system using a cooling panel.

  Conventionally, regarding cooling of a server rack, for example, in Patent Document 1, cold air blown from an air conditioning unit is supplied to an air supply port at the bottom of the rack, and the equipment in the rack is cooled by this cold air and is also warmed by the equipment. A rack cooling structure is disclosed in which air discharged from an exhaust port at the top of the rack is returned to the air conditioning unit and circulated.

  In Patent Document 2, cold air is supplied from a cooler unit to a downflow unit that is detachably installed at the upper front of the server rack through an exchange panel, and the cold air is forced downward by the downflow unit. A server rack cooling device is disclosed in which an electronic device is cooled by blowing air to exhaust the waste heat of the cooler unit to the outside through an outdoor exhaust duct.

JP 2004-63755 A JP 2006-93388 A

The techniques of the above-mentioned patent documents all cool the equipment in the rack by blowing cool air, and it is important to treat the air (hot air) that has become hot in the rack. In the technique of Patent Document 1, air generated in the rack is circulated through the air conditioning unit, but the room temperature rises due to waste heat released from the server and the air conditioning unit. Therefore, in order to suppress an increase in the room temperature, it is necessary to sufficiently operate the room cooler. In this cooling method, the cooling efficiency of the rack is not good, and it cannot be denied that the power consumption increases as a whole.
In the technique of Patent Document 2, hot air in the rack is exhausted to the outside using an outdoor exhaust duct, so that an increase in the temperature of the room can be suppressed.

  However, any of the techniques described in the above-mentioned patent documents still cools the heated equipment in the rack by blowing cool air, so that the cooling efficiency is still not good. In addition, in any of the above technologies, in order to guide cold air, hot air, or exhaust gas into the server rack, the structure inside the server rack is significantly changed, and further, the arrangement and mounting structure of electronic devices inside the rack are changed. Must. The cost for that increases.

  Further, since such a design change is involved, the server rack adopting these conventional cooling methods can be applied only from a new model, and it is difficult to apply it to a server rack already installed at a customer site. Therefore, customers who use the old model are still forced to use the conventional cooling system that cools the server room.

An object of the present invention is to provide a cooling unit, a cooling structure, and a method for constructing a cooling system that easily realizes cooling of an electronic device rack using a cooling unit using a refrigerant.
Another object of the present invention is to realize a cooling structure using a cooling unit that can flexibly cope with electronic device racks of different sizes.

The cooling unit according to the present invention is preferably a cooling unit that cools an electronic device rack including a heat source, and a fan unit in which a plurality of fans are arranged to discharge hot air generated from the heat source from the rack; A radiator unit in which pipes for guiding the refrigerant are arranged to remove the hot air discharged from the rack by the rotation of the fan, and a structure in which the fan unit and the radiator unit are integrally configured in an upright state. And a support unit for supporting the cooling unit.
In a preferred example, the support portion includes a support leg that supports the structure and a caster attached to the lower side of the support leg.

The cooling structure for an electronic device rack according to the present invention is preferably a cooling structure for cooling an electronic device rack including a heat source, and a plurality of fans are arranged to discharge hot air generated from the heat source from the rack. A fan unit, a radiator unit in which pipes for guiding the refrigerant are arranged to remove the hot air discharged from the rack by the rotation of the fan, and a cooling panel integrally configured with the fan unit and the radiator unit A cooling unit having a support portion to support in a standing position;
The cooling unit is placed in an upright position on the exhaust side of the electronic device rack so as to face the radiator unit side, and the wind tunnel body that connects one side of the cooling unit and one side of the electronic device rack is provided. And
The cooling structure is characterized in that hot air discharged from the electronic device rack through the wind tunnel is guided to the cooling unit.

In a preferred example, the wind tunnel body includes at least a first frame facing the exhaust side of the electronic device rack and a second frame facing the radiator unit side of the cooling unit, The frame and the second frame are connected to the electronic device rack and the cooling unit via connection means.
Preferably, the wind tunnel body includes a bellows structure between the first frame and the second frame, and the exterior of the wind tunnel body is formed of a flexible member.
Preferably, the first frame and the second frame have a quadrilateral shape, and the quadrilateral shape of the first frame and the quadrilateral shape of the second frame have the same shape.
Preferably, the first frame and the second frame are quadrilaterals, and the size of the quadrilaterals of the first frame is a shape corresponding to the size of the exhaust side of the electronic device rack. .

A method for constructing a cooling system according to the present invention is a method for constructing a cooling system that cools an electronic device rack including a heat source, and a fan in which a plurality of fans are arranged to discharge hot air generated from the heat source from the rack. A unit, a radiator unit in which pipes for guiding the refrigerant are arranged to remove the hot air discharged from the rack by the rotation of the fan, and a cooling panel integrally configured with the fan unit and the radiator unit are provided. Disposing a cooling unit having a support portion to be supported in a position on the exhaust surface side of the electronic device rack;
Connecting a wind tunnel body for guiding hot air discharged from the electronic device rack to the cooling unit to one side of the cooling unit and one side of the electronic device rack;
Attaching one end of a hose through which the refrigerant flows to the pipe of the radiator unit;
And a step of attaching the other end of the hose to the heat exchanger.

  ADVANTAGE OF THE INVENTION According to this invention, the cooling unit using a refrigerant | coolant can be arrange | positioned in an electronic device rack, and cooling of the electronic device rack which improved the cooling efficiency easily can be implement | achieved. In addition, it is possible to realize a cooling structure with a cooling unit that can flexibly cope with electronic devices of different sizes.

The disassembled perspective view which shows the cooling structure of the server rack by one Example. The disassembled perspective view which shows the structure of the cooling panel 10 by one Example. The figure which shows the structure of the pipe assembly of the radiator unit 11 by one Example (back side view). The figure (surface side figure) which shows the structure of the radiator unit 11 by one Example. The figure which shows the partial structure of the pipe aggregate 22 of the radiator unit 11 by one Example. The figure which shows the structural example of the cooling system of the server rack by one Example. The perspective view which shows the support structure of the cooling panel 10 by another Example.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows a server rack cooling structure.
A structure for cooling the server rack by disposing the cooling unit 1 according to the present invention on the back surface (exhaust surface side) of the server rack 9 is disclosed.
The server rack 9 stores a plurality of, for example, twelve (four stages and three rows) blade servers 91 in an array. The server rack 9 may have a normal structure installed in a data center or the like. Each blade server 91 is an electronic device in which electronic components such as a CPU, a memory, a hard disk, and a power source and a blower fan are housed. The power source, the memory, and the like serve as a heat source. The server rack 9 installed in the server room guides cooling air from the front or lower side of the apparatus by the blower fan of each blade server, and generates air (hot air) generated inside by the action of the blower fan. Drain from the back of the device to the outside of the device (in the direction of arrow B)

The cooling unit 1 is mainly a radiator unit 11 that removes hot air discharged from the back surface, and a fan unit in which a large number of, for example, 36 (vertical and horizontal 12 × 3) fans for forcibly discharging hot air are arranged. 13 and a cooling panel composed of a frame unit 12 to which the radiator unit 11 and the fan unit 13 are integrally attached. The radiator unit 11 is provided with a pipe 221 for circulating a cooling refrigerant such as water, and a hose for passing the refrigerant is connected to one end of the pipe. One hose sends the refrigerant before heat absorption into the pipe 221 and the other hose sends the heat absorbed refrigerant in the direction of discharging from the pipe. A detailed configuration of the cooling unit 1 will be described later with reference to FIGS.
Furthermore, the cooling unit 1 includes a pair of legs 14 that support the cooling panel and a plurality of casters 15 provided on the legs 14, and the cooling unit 1 is placed on the back surface of the server rack 9 in a standing state and moved. Make it easy to do.

  A wind tunnel body 7 is used to accurately connect the cooling unit 1 to the back surface of the server rack 9, and hot air discharged from the server rack is circulated in the wind tunnel body 1. The wind tunnel body 7 includes a frame 71 on the server rack 9 side and a frame 72 on the cooling panel 1 side. The frames 71 and 72 have a quadrilateral shape and a bellows structure therebetween. In order to maintain the bellows structure, one or more frames may be further provided between the frames 71 and 72. The exterior of the wind tunnel body 7 is composed of a flexible member made of synthetic resin.

  Magic fasteners (registered trademark) (hereinafter simply referred to as fasteners) 73 are fixed to the frames 71 and 72 as connection means for connecting the frames 71 and 72 to the back surface of the server rack 9 and the cooling unit 1. On the other hand, the back surface of the server rack 9 and the cooling unit 1 are also provided with the other fastener 73 ′ for engaging the fastener 73. Note that the fastener 73 ′ (not visible in the shadow of the drawing) fixed to the back surface of the server rack 9 does not need to be fixed to the back surface of the server rack from the beginning. When installing the cooling unit 1 with respect to the server rack 1, an operator may appropriately bond the fastener 73 ′ (the back surface is an adhesive surface) to the back surface of the server rack 9.

If the cooling panel 10 can be prepared in accordance with the shape of the back side (exhaust surface) of the server rack 9, it is preferable that the frame 71 and the frame 72 have the same shape. However, the frame 71 and the frame 72 of the wind tunnel body 7 do not necessarily have the same size. Server racks actually operating in a data center or the like have various sizes. It is not preferable from the viewpoint of manufacturing man-hours and costs to manufacture the cooling panel 10 in accordance with the size of the server racks. Therefore, a minimum type (or one type) of cooling panels 10 having different sizes is prepared in advance, and the frame 71 of the wind tunnel body 7 is made to correspond to the size of the back side of various server racks 9. By preparing that the size is changed, the frame 71 and the back side of the server rack 9 can be reliably connected. Therefore, even when there are various sizes of server racks that are already in operation, there is no need to manufacture a cooling panel 10 with a different size each time, and it is possible to flexibly and easily cope with server rack cooling. it can.
The wind tunnel body 7 itself does not need to be prepared as an independent structure. For example, the cooling panel 10 and the wind tunnel body 7 may be integrated in advance by fixing the frame 72 side to the cooling panel 10 side.

Next, the configuration of the cooling unit 1 will be described in detail with reference to FIGS.
The cooling unit 10 is configured by integrally fixing the radiator unit 11 and the fan unit 13 to the frame unit 12. Here, a view seen from the right side (server rack side) of FIG. 2 is referred to as a front side view (for example, FIG. 4), and a view seen from the opposite direction is referred to as a front side view.

For the sake of understanding, the configuration of the frame unit 12 will be described first.
Referring to FIG. 2, the frame unit 12 includes a radiator unit storage frame portion 31 that stores and fixes the radiator unit 11, and a fan frame storage frame portion 32 that stores and fixes the fan unit 13. .

The radiator unit storage frame 31 has a thickness W1 sufficient to accommodate the radiator unit 11 (thickness W1 ′), and the fan frame storage frame 32 is sufficient to accommodate the fan unit 13 (thickness W2 ′). A thickness W2 is secured.
The radiator unit storage frame 31 is aligned with the engaging portions 225 provided on the frames 1101 and 1102 of the radiator unit 11, for example, the recesses 311 provided at four locations, and the radiator unit 11 with screws. Screw holes 312 are provided at four locations. The fan frame storage frame portion 32 includes screw mounting portions 36 provided at, for example, six locations on the left and right sides for screwing the fan unit 13.

Next, the configuration of the radiator unit 11 will be described.
As shown in FIG. 2, the radiator unit 11 includes a protection panel 21 disposed on the server rack 9 side and a pipe assembly 22 (FIG. 3) disposed on the inner side of the frame 1101 and 1102 of the radiator unit 11. Fixed and configured.
The protection panel 21 protects the pipe assembly 22 and is an aluminum plate having a number of slits formed on the surface. The hot air discharged from the server rack 9 passes through a large number of slits of the protective panel 21 and is sent to the pipe assembly 22.

  FIG. 4 shows a state in which the pipe assembly is fixed to the frames 1101 and 1102 of the radiator unit 11. The main structure of the radiator unit 11 is an assembly (pipe assembly) 22 of multiple meandering pipes. The pipe assembly 22 is connected to a set of lower pipes 221 that circulate refrigerant, a set of vertical pipes 2221 and 2222 that are connected to the lower pipe 221 and arranged in the vertical direction, and the vertical pipes 2221 and 2222. The upper pipes 2231 and 2232 are connected to the vertical pipes 2221 and 2222, respectively, and are composed of horizontal pipes 224 meandering in multiple directions and arranged in the horizontal direction.

  The lower pipe 2211, the vertical pipe 2221, and the upper 2231 are inflow side pipes that flow the refrigerant before heat absorption in the direction of the arrow C1. The lower pipe 2212, the vertical pipe 2222, and the upper 2232 are outflow side pipes that flow the heat-absorbed refrigerant in the direction of arrow C <b> 2. The other end of the lower pipe 221 is connected to the heat exchanger 86 (FIG. 7) via a hose. The refrigerant that has absorbed heat that has returned through the outflow side pipe 2212 flows to the heat exchanger 86, thereby constructing a cooling system in which the refrigerant circulates.

  The pipe assembly 22 is mainly an assembly structure of the horizontal pipes 224, and it can be said that the cooling effect is exerted by the action of the horizontal pipes 224. The horizontal pipe 224 is an aggregate of a plurality of horizontal pipe sets 2241, 2242 to 224n, each of which has a structure of a meandering pipe having three meanders. The plurality of horizontal pipe sets 2241 to 224n are arranged from the top to the bottom along the vertical pipes 2221, 2222, and the pipe ends of each horizontal pipe set are welded to the vertical pipes, so that the skeleton of the pipe assembly 22 can be obtained. It is formed.

Here, with reference to FIG. 5, the horizontal pipe set which is the partial structure of the pipe aggregate 22 is demonstrated.
In the horizontal pipe set 224n, a plurality of pipes 2240 pass through holes formed in a large number of long fins 231, and both ends of the pipe 2240 bent into a U shape are adjacent to each other. It is welded and configured as a single horizontal pipe as a whole. One end 22401 of the pipe 2240 is connected to the vertical pipe 2221, and the other end 22402 is connected to the vertical pipe 2222. Here, the many fins 231 are made of aluminum having a heat dissipation effect, and hot air passes between the slits 232 formed between the many fins 231. A large number of fins 231 of the same long shape arranged through the pipe 231 and arranged at regular intervals not only act to guide and flow hot air in a predetermined direction, but also serve to firmly support the pipe 231. Yes.

Here, the pipe assembly 22 is attached to the frames 1101 and 1102 by fixing fasteners to appropriate portions of these pipe groups (vertical pipe 222 *, upper pipe 223 *, and horizontal pipe 224 *).
As another example, the right-end fin 2311 and the left-end fin 2312 in FIG. 5 can also be used as members constituting the frames 1101 and 1102. By forming the left and right end fins 2311 and 312, as the frames 1101 and 1102, the entire pipe assembly 22 can be constructed more robustly. 3 does not show the fins 231 and FIG. 4 shows the fins 231 in the vertical direction.

  As shown in FIG. 4, a large number of rectangular slits 232 partitioned by the fins 231 of the pipe assembly 22 arranged in the radiator unit 11 are formed. The many fins 231 forcibly guide the hot air discharged from the server rack 9 by the rotation of the fan 43 toward the pipe assembly 22 and further guide the hot air that has passed through the pipe assembly 22 toward the fan unit 13. In this way, a flow path of hot air is formed by the fins 231 and the slits 232, and the heat absorption efficiency by the refrigerant flowing in the pipe assembly 22 is increased.

Joint portions 261 and 262 are fixed to one ends of the lower pipes 2211 and 2122, respectively. A hose 81 for passing the refrigerant from the heat exchanger 86 (FIG. 7) is connected to the joint part 261, and a hose 82 for sending the absorbed refrigerant to the heat exchanger 86 is connected to the other joint part 262. The joint portion 261 is provided with an opening / closing lever 27 that controls the flow of the refrigerant sent from the hose 81.
The radiator unit 11 has a vertical and horizontal length and a thickness W1 ′ such that the radiator unit 11 is accommodated in the radiator unit storage frame 31 of the frame unit 12. On the edge of the radiator unit 11, for example, convex engagement portions 225 that are hooked on the recesses 311 of the frame unit 12 are provided at four places. The engagement unit 225 and the recess 311 are engaged to fix the radiator unit storage frame 31 of the radiator unit 11 and the frame unit 12.

Next, the configuration of the fan unit will be described.
As shown in FIG. 2, the fan unit 13 is housed and attached to each frame 42 of an iron fan frame 41 divided into 36 vertical and horizontal (12 × 3). Note that the fan frame 41 may be configured by joining 18 frames (6 × 3) 42 in advance in the upper and lower two stages. A plurality of screw attachment portions 46 for screwing the fan unit 13 to the attachment portion 36 of the frame unit 12 are provided at the edge of the fan frame 41. The fan frame 41 has a vertical and horizontal length and a thickness W2 ′ that can be accommodated in the fan frame housing frame portion 32 of the frame unit 12, and the screw attachment portion 36 and the screw attachment portion 46 are screwed to each other.
By the rotation of these fans 43, hot air is forcibly discharged from the back surface of the server rack 9.
The power cords that supply power to the fans 43 are not visible in the figure, but are embedded in the inner portion of the fan frame 41.

FIG. 6 shows a configuration example of a server rack cooling system.
This example shows a plurality of server racks 9 installed in the server room. The server may be up and running. The cooling unit 1 is installed on the back side of the two server racks 9 by an operator, and the back side of the server rack 9 and the cooling unit 1 are connected by the wind tunnel body 7.
The server room has a free access floor 99, and hoses 81 and 82 for circulating the refrigerant are disposed under the floor 99. The other ends of the hoses 81 and 82 are connected to a heat exchanger 86 disposed outdoors via a pump 85. The pump 85 is driven to forcibly circulate the refrigerant.

Here, the heat exchanger 86 is, for example, an AC (Air Chiller) type heat exchanger or an AW (Air Water) type heat exchanger. In the case of an AC heat exchanger as shown in the figure, a pump 85 is disposed in the middle of a hose 81 through which the refrigerant passes, and the refrigerant is forcedly circulated by the action of the pump. The AC heat exchanger 86 is installed outdoors, and the heat contained in the refrigerant is discharged in the direction of arrow W by the rotation of the fan. Since the AC system can be expected to have a strong cooling effect, it is possible to cool a plurality of racks simultaneously.
On the other hand, although the cooling capacity of the AW type heat exchanger is slightly lower than that of the AC type, it is possible to install the heat exchanger in the same room as the server room where the server rack to be cooled is installed. The AW system is relatively easy to introduce the system because it does not require outdoor equipment work compared to the AC system.

Both the AC method and the AW method are more efficient than conventional server rack cooling in which the entire server room is cooled. Therefore, it is possible to mount electronic devices or electronic components in the rack with high density. Moreover, the common cooling unit 1 can be used for both the AC method and the AW method. For this reason, AW type cooling was initially employed, but it is easy to change to AC type in order to increase the cooling capacity thereafter. That is, the heat exchanger 86 may be changed from the AW system to the AC system.
In the illustrated example, when the server rack 9 is further expanded, similarly, a new cooling unit 1 is arranged for the added server rack, and the hoses 81 ′ and 82 are installed in the server rack. 'And the other end of the hose may be connected to the common hoses 81 and 82.

  As described above, according to the present embodiment, the cooling unit 1 can be easily arranged on the exhaust surface side of a conventional server rack, and a cooling system with improved cooling efficiency can be constructed. It becomes. In this case, there is no need to change the mounting or layout of the server housed in the conventional server rack, so that the cooling system can be constructed while the server is in an operating state.

  In addition, although the amount of heat generation varies depending on the size of the server rack and the number and capacity of servers stored in the server rack, according to the present embodiment, the size of the cooling unit to be installed depends on the size of the server rack. Alternatively, it is possible to easily cope with the problem by freely changing the size of the frame of the wind tunnel body. Further, the number of fans of the fan unit can be changed and adjusted according to the heat generation amount of the server. Furthermore, depending on the amount of heat generated by the servers in the server rack, or the number and capacity of servers installed in the server room, AW or AC cooling can be employed. In addition, even with the same cooling method, the capacity of the heat exchanger can be changed to cope with changes in the number of servers and the capacity.

[Other embodiments and modifications]
The present invention is not limited to the above-described embodiments, and various modifications can be made.

  In the embodiment described above, the cooling panel 10 has the legs 14 with casters 15. However, according to the example shown in FIG. 9, the legs 14 'to which the cooling panel 10 is fixed have a plurality of screw holes 16 at predetermined locations. Is formed. The cooling unit 1 may be fixed to the floor of the server room by passing a screw through the screw hole 16.

Various modifications of the wind tunnel body 7 are also conceivable. If the frames 71 and 72 of the wind tunnel body 7 are used, it is relatively easy to connect the cooling panel and the electronic device rack, but the frames 71 and 72 of the wind tunnel body 7 are not necessarily required. In short, any structure is acceptable as long as both ends of the wind tunnel body 7 can be connected to the cooling panel and the electronic device rack. For example, both ends of the wind tunnel body 7 are attached to the cooling panel and the electronic device rack using gummed tape or an adhesive. You may connect.
Further, the shape of the wind tunnel body 7 is not limited to the above-described example. It is not always necessary to have a bellows structure.

  Furthermore, according to another modification, the wind tunnel body 7 is not necessarily required. For example, if the cooling panel 10 can be installed in close contact with the back of the server rack, even if there is no wind tunnel body 7, most of the hot air discharged from the server rack is absorbed by the cooling panel. However, even in that case, outside air may be sucked into the cooling panel from the gap between the cooling panel and the back of the server rack. As a result, the cooling efficiency decreases, or the cooling fan drive power is increased to increase the cooling efficiency. Must be maintained. As a simple means for that purpose, the outer edge of a slight gap between the server rack and the cooling panel arranged on the back thereof is affixed with gummed tape, or vinyl is disposed on the outer edge of the gap and the vinyl is attached to the server rack with the gummed tape. It is also possible to adhere to the cooling panel.

Moreover, in the said Example, although the radiator unit 11 and the fan unit 13 are made into the structure integrally attached to the frame unit 12, the frame unit 12 is not necessarily comprised independently. For example, it can be configured as a structure configured to fix the fan frame 41 on the outer frame of the fan unit 13 or the fan frame 41 itself configured to be sturdy. Further, if there is a sturdy frame-like structure for fixing the radiator unit 11, the structure may be used as the frame unit 12.
Further, the number of fans 43 arranged in the fan unit 13 may be changed as appropriate. For example, since a large number of fans are required for a large server rack, the shape of the fan unit 13 becomes larger.

  Further, the number of fans mounted on the fan unit 13 can be adjusted as appropriate. For example, when six (3 × 2) blade servers 91 are mounted only in the upper two stages of the server rack 9 in FIG. 1, the number of fans 43 of the fan unit 13 corresponds to the entire rear surface of the rack 9. It is not necessary that the number is a fixed number, and a number corresponding to only the upper two stages may be sufficient.

In the above embodiment, the cooling unit is applied to a server rack that houses blade servers. However, according to other examples, the disk array device that houses a large number of disk units is not limited to the server rack, The present invention can be applied to an electronic device rack that generally stores an electronic device having a heat source, such as a communication rack that stores a plurality of communication devices.
The coolant is preferably water-cooled from the viewpoint of low cost, but is not limited thereto.

1: Cooling unit 10: Cooling panel 11: Radiator unit 12: Frame unit 13: Fan unit 14: Leg 15: Caster 21: Protection panel 22: Pipe assembly
7: Wind tunnel body 71, 72: Frame 9: Server rack 91: Blade server
31: Radiator unit storage frame 32: Fan frame storage frame
81, 82: Hose 85: Pump 86: Heat exchanger 99: Floor.

Claims (10)

A cooling unit for cooling an electronic equipment rack including a heat source,
A fan unit in which a plurality of fans are arranged to discharge hot air generated from the heat source from the rack, and a pipe for guiding the refrigerant that removes the hot air discharged from the rack by the rotation of the fan are arranged. A cooling unit comprising: a radiator unit; and a support unit that supports a structure integrally configured with the fan unit and the radiator unit in a standing state. 2. The cooling unit according to claim 1, wherein the support portion includes a support leg that supports the structure and a caster attached to a lower side of the support leg. The cooling unit according to claim 1, wherein the support portion includes a support leg that supports the structure and a screw hole that fixes the support leg to the floor. A cooling structure for cooling an electronic device rack including a heat source,
A fan unit in which a plurality of fans are arranged to discharge hot air generated from the heat source from the rack, and a pipe for guiding the refrigerant that removes the hot air discharged from the rack by the rotation of the fan are arranged. A cooling unit having a radiator unit, and a support unit that supports a cooling panel integrally configured with the fan unit and the radiator unit in a standing position;
The cooling unit is placed in an upright state facing the radiator unit side to the exhaust side of the electronic device rack, and the wind tunnel body connecting one side of the cooling unit and one side of the electronic device rack Have
A cooling structure characterized in that hot air discharged from the electronic device rack through the wind tunnel is guided to the cooling unit. The wind tunnel body has at least a first frame facing the exhaust side of the electronic device rack and a second frame facing the radiator unit side of the cooling unit, and the first frame and the 5. The cooling structure according to claim 4, wherein the second frame is connected to the electronic device rack and the cooling unit via a connecting means. The cooling structure according to claim 4 or 5, wherein the wind tunnel body has a bellows structure between the first frame and the second frame, and the exterior of the wind tunnel body is formed of a flexible member. . 7. The cooling according to claim 5 or 6, wherein the first frame and the second frame are quadrilaterals, and the quadrilaterals of the first frame and the second frame have the same shape. Construction. The first frame and the second frame are quadrilateral, and the size of the quadrilateral of the first frame is a shape corresponding to the size of the exhaust side of the electronic device rack. The cooling structure according to claim 5 or 6. The connecting means is a fastener, and a first fastener that connects the exhaust side of the electronic device rack and the first frame, and a radiator unit side of the cooling unit and the second frame that connects the second frame. The cooling structure according to claim 5, wherein the cooling structure is constituted by two fasteners. A method for constructing a cooling system for cooling an electronic equipment rack including a heat source, comprising:
A fan unit in which a plurality of fans are arranged to discharge hot air generated from the heat source from the rack, and a pipe for guiding the refrigerant that removes the hot air discharged from the rack by the rotation of the fan are arranged. Disposing a radiator unit and a cooling unit having a support portion for supporting a cooling panel integrally configured with the fan unit and the radiator unit in an upright state on an exhaust surface side of the electronic device rack; and
Connecting a wind tunnel body for guiding hot air discharged from the electronic device rack to the cooling unit to one side of the cooling unit and one side of the electronic device rack;
Attaching one end of a hose through which the refrigerant flows to the pipe of the radiator unit;
Attaching the other end of the hose to a heat exchanger;
A method for constructing a cooling system, comprising:

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