CN102467201A - Cooling circulation system of server - Google Patents

Cooling circulation system of server Download PDF

Info

Publication number
CN102467201A
CN102467201A CN201010547298XA CN201010547298A CN102467201A CN 102467201 A CN102467201 A CN 102467201A CN 201010547298X A CN201010547298X A CN 201010547298XA CN 201010547298 A CN201010547298 A CN 201010547298A CN 102467201 A CN102467201 A CN 102467201A
Authority
CN
China
Prior art keywords
rack
fan
server
module
cooling
Prior art date
Application number
CN201010547298XA
Other languages
Chinese (zh)
Inventor
林茂青
童凯炀
陈建安
Original Assignee
英业达股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英业达股份有限公司 filed Critical 英业达股份有限公司
Priority to CN201010547298XA priority Critical patent/CN102467201A/en
Publication of CN102467201A publication Critical patent/CN102467201A/en

Links

Abstract

The invention discloses a cooling circulation system of a server. The cooling circulation system comprises a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules and two wind guide covers, wherein the first fan modules and the second fan modules are arranged on the cabinet assembly; each first fan module blows a first airflow to first direction; each second fan module blows a second airflow to second direction; the wind guide covers are respectively arranged at two ends of the cabinet assembly; and the first airflow is connected with the second airflow through the wind guide covers to form a cooling circulation loop in the cabinet assembly.

Description

服务器的冷却循环系统 Cooling system server

技术领域 FIELD

[0001] 本发明涉及一种服务器机柜,特别是涉及一种服务器的冷却循环系统。 [0001] The present invention relates to a server rack, in particular, it relates to a server-cooling system. 背景技术 Background technique

[0002] 近年来,因特网迅速且蓬勃的发展扩张,尤其一些大型企业,或者是网络的营业场所等,由于业务的扩增需求,使得服务器的数量也愈来愈多,致使服务器的排列管理更为集中,以节省服务器所占用的空间。 [0002] In recent years, the Internet's rapid and vigorous growth and expansion, especially in some large enterprises, or place of business networks and so on, because the amplification needs of the business, so that there is a rising number of servers, resulting in server management arrangement more centralized to save server space occupied. 因为如此大量且排列密集的服务器及其它设备,势必会造成过多的热量产生,进而导致整体服务器系统的运转不稳定,而这一直是数据中心(data center)所必须面对的重要问题。 Because of this large and dense arrangement of servers and other equipment, it will inevitably lead to excessive heat generation, which led to instability in the overall server operating system, which has been an important issue data center (data center) must face.

[0003] 以数据中心为例,为了解决放置数量庞大的服务器机架且为密闭式机房(例如为货柜机房)的散热问题,目前现有的方式是于机房内配置冷却空调系统,藉此进行散热,而当服务器数量较少时,则是利用服务器本身的散热风扇进行冷却降温。 [0003] In the data center, for example, in order to solve a large number of server racks and placed (for example, a container room) heat dissipation problems, the conventional way is now arranged as a closed cooling room air-conditioning system in the engine room, whereby for heat, and when the number of servers, it is cooled using cooling fans to cool the server itself. 然而现有的冷却空调系统随着服务器的数量越来越多,机柜排列越来越密集,冷却空调系统所吹出的冷空气根本无法充分流动到机房的各处,导致热空气容易集中在特定区域,当然会造成服务器系统的不稳定。 However, the conventional air-conditioning cooling system as the number of servers, the more intensive cabinet arrangement, cooling air conditioning system can not sufficiently cool air blown out flows around the room, leading to the hot air tends to be concentrated in a particular area , of course, will cause instability server system.

[0004] 现有服务器机架内部的风扇模块安装于机架的顶部或后侧面,其中将风扇模块安装于机架顶部的设置方式,于机架顶部装设多个散热风扇,用以将服务器机架内部的热空气抽引至外界。 [0004] The existing internal server rack fan module mounted to the side or the top of the rack, wherein the fan module is installed on top of the rack arrangement, the rack on top of the plurality of cooling fans mounted to the server hot air inside the rack evacuating to the outside. 然而,一般服务器机架皆容纳有多个服务器并具有一预定高度。 Generally, however, the server rack containing a plurality of servers, and all having a predetermined height. 因此在散热风扇抽引热空气的过程中,热空气于服务器内的流通路径时常会受到多个服务器的阻挡, 造成散热风扇仅能将相邻于服务器机架顶部的热空气排出,而对于服务器机架底部的热空气则无明显的抽引作用,导致热空气于服务器机柜底部囤积,进而严重影响服务器的运作效能。 Thus in the process of evacuating the cooling fan in the hot air, the hot air flow path within the server often be blocked by the plurality of servers, only cooling fan causing hot air at the top of the adjacent server rack exhaust, and for the server hot air at the bottom of the rack no significant evacuating effect, lead to the accumulation of hot air in the bottom of the server rack, which would seriously affect the operation performance of the server.

[0005] 而现有将风扇模块安装于后侧面的服务器机架,其风扇模块所产生的气流分别通过各个服务器主机板之间的通道,再由机架的前侧面排出。 [0005] the gas stream prior to the server rack is attached to the rear side of the fan module, which is generated by the fan module respectively through channels between the server motherboard, and then discharged from the front side of the rack. 虽然可避免热空气于服务器机架底部囤积的情形发生,但由于这种现有风扇模块以导引气流或热对流的方式,将服务器内部的热空气排出至外界,因此并无法确保风扇模块所产生的气流流通至每一服务器的主机板或主机板上的发热组件,进而造成气流于服务器机架内部四处溢散,无法于服务器机架内部形成稳定的流场。 While avoiding the accumulation of hot air in the case of a server rack bottom occurs, but since such conventional fan module to direct air flow or heat convection, the hot air is discharged to the outside the internal server, and thus can not be sure that the fan modules air flow generated flow to the motherboard or each heat generating components on the motherboard of the server, which causes the air flow inside the server rack four fugitive, can not form a stable flow field inside the server rack. 因此,将造成服务器机架内部的每一服务器的散热不平均的现象, 导致部分服务器容易因温度过热而毁损,进而影响服务器机架的整体运作效能。 Therefore, the heat will cause each server's internal server rack uneven phenomenon, resulting in some server vulnerable to overheating and damage, thereby affecting the overall operational efficiency of the server rack.

[0006] 美国专利第7,511,960号专利案所揭示的数据中心(data center)的冷却系统, 是于货柜机房内部形成多个服务器机架的闭回路冷却路径,而得以于货柜机房内部产生稳定的流场进行冷却散热。 [0006] Patent U.S. Pat. No. 7,511,960 disclosed text data center (data center) cooling system, a cooling path forming a closed circuit of a plurality of server racks inside the container room, and the room is inside the container produce a stable cooling flow field for cooling.

[0007] 但,第7,511,960号专利案所揭示的冷却系统必须于货柜机房内部设计有冷、热通道,方可使货柜机房内部的流场稳定地流动。 [0007] However, the case of Patent No. 7,511,960 disclosed cooling system must be designed in a container inside a cold room, the hot aisle, so that only the flow field inside of the container room to flow stably. 如此一来,将导致单一货柜机房内所能装载的服务器机架亦相对受到局限,而无法装载到最大的数量,使得数据中心的整体运作效能无法得以提升,而被迫需要更多的货柜机房方可顺利安装预定数量的服务器机架。 In this way, it will cause the server racks in a single container load of the engine room can also relatively been limited, and can not be loaded to the maximum number, making the overall operational efficiency of the data center can not be improved, and forced the need for more container room only a predetermined number of the successful installation of the server racks.

3发明内容 3 SUMMARY OF THE INVENTION

[0008] 鉴于以上的问题,本发明提供一种服务器的冷却循环系统,用以改良现有服务器机柜的设计无法让每个服务器得以平均散热,以及机房内部的冷、热通道占据过多的使用空间,致使单一机房内无法装载最大数量的服务器,导致服务器机柜或是机房的散热效能与运作效能不彰等问题。 [0008] In view of the above problems, the present invention provides a server-cooling system, and used to improve the conventional server rack is designed so that each server can not be cold average cooling, and the inside of the room, the channel occupied by the use of excessive heat space, makes it impossible to load the maximum number of servers in a single room, resulting in thermal performance and operational efficiency server cabinet or room not been apparent issues.

[0009] 本发明所提供的服务器的冷却循环系统,包括有一机柜总成、多个第一风扇模块、 多个第二风扇模块、以及二导风罩。 [0009] The cooling system according to the present invention, a server is provided, comprising a rack assembly, a first plurality of fan modules, a second plurality of fan modules, and two air guide cover. 其中,机柜总成具有串行连接的多个机架,第一风扇模块装设于机架上,并且朝向第一方向吹送一第一气流,而第二风扇模块装设于机架上,并且朝向第二方向吹送一第二气流。 Wherein the assembly has a plurality of rack cabinets connected in series, a first fan module mounted to the rack, and the first direction is blown toward a first airflow, a second fan module mounted to the rack, and blowing a second direction toward the second gas stream. 导风罩分别装设于机柜总成的二相对端部上,且二导风罩分别具有至少一流体通道。 Air duct are respectively mounted on the two opposite ends of the enclosure assembly, and the two air guide housing having at least one fluid passage, respectively.

[0010] 第一风扇模块所产生的第一气流进入其中一导风罩的流体通道,并与第二风扇模块所产生的第二气流相衔接,以及第二风扇模块所产生的第二气流进入另一导风罩的流体通道,并与第一风扇模块所产生的第一气流相衔接,以构成冷却循环回路。 The first gas stream [0010] generating a first fan module enters a fluid passage wherein the air duct, and with a second gas stream generated by a second fan module are connected, and a second air flow generated by second fan module into the another air guide cover the fluid passage, and a first dovetail with the first gas stream generated by the fan module to constitute a cooling cycle.

[0011] 所述的服务器的冷却循环系统,其中,各该机架具有相对的一第一侧面及一第二侧面,各该机架的该第一侧面与该第二侧面为一镂空结构,且各该机架以该第一侧面朝向相邻的该机架的该第二侧面依序串行连接成该机柜总成。 Cooling system [0011] The server, wherein each of the frame has a first side surface and opposing a second side surface, the side surface of each of the first rack and the second side surface of a hollow structure, and each of the rack adjacent to the first side surface toward the second side of the rack to the rack sequential serial connection assembly.

[0012] 所述的服务器的冷却循环系统,其中,各该机架的该第一侧面上还具有多个组装框,所述第一风扇模块与所述第二风扇模块分别装设于所述组装框内。 [0012] The cooling system of the server, wherein the first side of each of the rack assembly further having a plurality of frames, the first module and the second fan are mounted to the fan module assembled box.

[0013] 所述的服务器的冷却循环系统,其中,还包括有多个散热器,分别装设于各该机架的该第一侧面上,且所述第一风扇模块及所述第二风扇模块介于该散热器与该第二侧面之间。 [0013] The cooling system of the server, which further comprises a plurality of radiators, respectively mounted on the first side of each of the rack, and the first fan and the second fan module module interposed between the heat sink and the second side surface.

[0014] 所述的服务器的冷却循环系统,其中,所述散热器分别具有多个散热孔,该第一气流及该第二气流通过所述散热孔、该第一侧面及该第二侧面而进入该二导风罩的该二流体通道内。 [0014] The cooling system of the server, wherein, said heat sink having a plurality of cooling holes, respectively, the first gas stream and the second air flow through the cooling hole, the first side and the second side surface the two inner air duct entering the two fluid channels.

[0015] 所述的服务器的冷却循环系统,其中,各该导风罩具有二该流体通道,所述第一风扇模块的该第一气流与所述第二风扇模块的该第二气流分别进入该二流体通道内,以构成二该冷却循环回路。 [0015] The cooling system of the server, wherein each of the two air duct with the fluid passage, the first stream and the second stream of the first fan and said second fan module respectively into the module the two inner fluid passage, to constitute two of the cooling circuit.

[0016] 本发明的技术效果在于,服务器的机柜总成内部可通过导风罩的设计而构成冷却循环回路,各个机柜总成可独自进行冷却散热作业,并不需要于机房内额外设计冷、热通道,即可达到自体循环冷却的效果。 [0016] A technical effect of the present invention, a server within the cabinet assembly may constitute a cooling cycle through the air duct design, each rack assembly may be independently cooled cooling operation, it does not require additional cooling in the room design, heat passage, can achieve the effect of cooling from the circulation. 因此,机房内可装载最大数量的机柜总成,得以具备最大的运作效能。 Thus, the engine room can be loaded with the maximum number of the cabinet assembly, is provided with the maximum operational efficiency.

[0017] 以上的关于本发明内容的说明及以下的实施方式的说明用以示范与解释本发明的原理,并且提供本发明的专利申请范围更进一步的解释。 Above [0017] description and the following description of embodiments of the present invention is used SUMMARY exemplary and explain the principles of the present invention, and the scope of the present patent application to provide further explanation of the invention.

附图说明 BRIEF DESCRIPTION

[0018] 图1为本发明第一实施例的分解示意图; [0018] FIG. 1 is an exploded schematic view of a first embodiment of the present invention;

[0019] 图2为本发明第一实施例的立体示意图; [0019] FIG. 2 is a perspective schematic view of a first embodiment of the present invention;

[0020] 图3为本发明第一实施例的侧面示意图;[0021] 图4为本发明第二实施例的侧面示意图; [0020] Figure 3 a schematic side view of the first embodiment of the present invention; [0021] FIG. 4 illustrates a second embodiment of the present invention, a side;

[0022] 图5为本发明第三实施例的侧面示意图。 [0022] FIG. 5 schematic side view of a third embodiment of the present invention.

[0023] 其中,附图标记: [0023] wherein reference numerals:

[0024] 100机柜总成 [0024] The cabinet assembly 100

[0025] 110 机架 [0025] Rack 110

[0026] 111 第一侧面 [0026] The first side surface 111

[0027] 112 第二侧面 [0027] The second side surface 112

[0028] 113 开口 [0028] 113 opening

[0029] 114组装框 [0029] The frame assembly 114

[0030] 120第一风扇模块 [0030] a first fan module 120

[0031] 130第二风扇模块 [0031] 130 second fan module

[0032] 140导风罩 [0032] 140 of the wind scooper

[0033] 141流体通道 [0033] The fluid passage 141

[0034] 150散热器 [0034] Radiator 150

[0035] 151散热孔 [0035] The thermal via 151

[0036] 160电路板 [0036] The circuit board 160

[0037] 170承载盘 [0037] 170 carrier plate

[0038] Dl第一方向 [0038] Dl first direction

[0039] D2第二方向 [0039] D2 second direction

具体实施方式 Detailed ways

[0040] 以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。 [0040] The following embodiments in conjunction with accompanying drawings and specific embodiments of the present invention will be described in detail, but do not limit the present invention.

[0041] 图1至图3为本发明第一实施例的立体示意图及侧面示意图,如图所示,本发明的服务器的冷却循环系统包括有一机柜总成100、多个第一风扇模块120、多个第二风扇模块130、二导风罩140、一散热器(radiator) 150、一电路板160、及一承载盘170。 [0041] Figures 1 to 3 and a side perspective view of a schematic embodiment as shown in the first embodiment of the present invention, the cooling cycle of the server system of the present invention comprises a rack assembly 100, a first plurality of fan modules 120, a second plurality of fan modules 130, two air guide cover 140, a heat sink (radiator) 150, a circuit board 160, and a tray 170.

[0042] 其中,机柜总成100具有多个机架110,而各机架110由多个钢条、钢板及角钢所构成的中空架体,机架Iio具有相对且间隔设置的第一侧面111及第二侧面112,以于机架110内部构成一容置空间。 [0042] wherein the cabinet assembly 100 having a plurality of racks 110, and each frame 110 by a hollow frame body, the frame Iio plurality of steel bars, angle steel and having a first side consisting of opposite and spaced 111 and the second side 112 to form a receiving space 110 in the internal housing. 各个机架110以第一侧面111朝向相邻的机架110的第二侧面112依序串行连接成机柜总成100,并且多组机柜总成100置放于货柜机房(图中未示)内, 以组成数据中心(data center)。 Each rack 110 adjacent to the first side surface 111 toward the second side 112 of the frame 110 are sequentially connected in serial cabinet assembly 100 and the plurality of sets of rack assembly 100 disposed in the container room (not shown) inside, to form the data center (data center).

[0043] 另外,机架110的侧边位置开设有一开口113,且此一开口113与容置空间相连通, 使得机架110内部可通过此一开口113而与外界相通。 [0043] Further, the position of the side frame 110 defines an opening 113, and this opening 113 communicating with the receiving space, such that this internal housing 110 through an opening 113 in communication with the outside.

[0044] 其中,机架110的第一侧面111上还设有多个组装框114,此一组装框114位于机架110的容置空间内,且各机架110的整个第一侧面111(即组装框114所位于的侧面)及整个第二侧面112(即相对于组装框114的另一侧面)为镂空结构,令第一侧面111与第二侧面112构成一大面积的出风/入风口,用以做为风扇模块120、130的气流的出风/入风之用。 [0044] wherein, on a first side 111 also has a plurality of rack assembly 110 to block 114, positioned within a frame assembly 110 of the rack accommodating space 114, and the entire first side 111 of each rack (110 i.e. block assembly 114 is positioned side) and the entire second side surface 112 (i.e., with respect to the other side of the frame assembly 114) is hollow structure, so that a first side surface 111 and the second side surface 112 constituting a large area of ​​the wind / into outlet for the air fan as a module 120, 130 out of the wind / air into use. 各机架110通过其第二侧面112而与相邻机架110的第一侧面111相连接,使得相邻各机架110的内部容置空间因而相互连通(如图3所示)。 Each rack 110 which is connected to a second side surface 112 adjacent a first side 111 of the frame 110, such that the internal accommodating space of each adjacent rack 110 thus communicate with each other (FIG. 3).

[0045] 请继续参阅图1至图3,第一风扇模块120与第二风扇模块130以侧向装设方式置入机架110的组装框114内,第一风扇模块120及第二风扇模块130因而保持于机架110 上而不致变动其装设位置,因此第一风扇模块120及第二风扇模块130可稳定的分别朝向第一方向Dl及第二方向D2吹送气流。 [0045] Please refer to FIG. 1 to FIG. 3, the first module 120 and the second fan 130 fan module mounted laterally manner into the frame assembly 114 of the frame 110, a first fan and a second fan module 120 module 130 thus held to the frame 110 and mounted without changes in its position, the first fan and the second fan module 120 module 130 are stably in the first direction and the second direction D2 Dl blowing stream. 二导风罩140分别装设于机柜总成100的二相对端部,也就是说,其中一导风罩140设置于机柜总成100最外侧的机架110的第一侧面111上, 而另一导风罩140设置于机柜总成100最外侧的另一机架110的第二侧面112上。 Two air duct 140 are respectively mounted to two opposite ends of the rack assembly 100, i.e., wherein the first side 111 a air duct 140 is provided on the outermost side 100 of the frame 110 of the cabinet assembly, while the other the air duct 140 is provided a rack assembly 100 in a second side of the other outermost side 112 of the frame 110. 二导风罩140的内部分别设计有一流体通道141,用以将外部的气流进入导风罩140内并导引其流动方向。 Two internal air duct 140 are designed with a fluid passage 141, for guiding the external air into the hood 140 and the guide flow direction.

[0046] 详细而言,本实施例的第一风扇模块120设置于机架110上半部的组装框114内, 且第一风扇模块120朝向一第一方向Dl进行气流的吹送,而第二风扇模块130设置于机架110下半部的组装框114内,且第二风扇模块130朝向一第二方向D2进行气流的吹送。 [0046] Specifically, a first embodiment according to the present embodiment of the fan module 120 is disposed within the frame assembly 114 on the frame half 110, and a first fan module 120 toward a first direction Dl for blowing stream and the second the fan module 130 is disposed within the frame assembly 114 lower half of the frame 110, and a second fan module 130 toward the second direction D2 for blowing airflow. 因此,机柜总成100的内部空间由于第一风扇模块120与第二风扇模块130的摆放位置,而可大致分隔成上、下半部且各自独立的气流流动区域。 Thus, the inner space of the cabinet assembly 100 due to the placement of the first fan and the second fan module 120 module 130 may be substantially divided into upper and lower half of the air flow and separate regions.

[0047] 如图1至图3所示,本发明的散热器(radiator) 150装设于机架110的第一侧面111上(即机架110装设有第一风扇模块120与第二风扇模块130的侧面),并且位于机架110的外部,也就是说,第一风扇模块120与第二风扇模块130介于散热器150与机架110 的第二侧面112之间,而多个散热孔151开设于散热器150上。 The [0047] FIG 1 through FIG radiator (Radiator) 150 of the present invention 3 is mounted on a first side 111 of the frame 110 (i.e., the rack 110 mounted with a first fan module 120 and the second fan side of the module 130), and located outside the frame 110, i.e., a first fan and the second fan 120 module 130 module 112 is interposed between the radiator 150 and the second side of the frame 110, and a plurality of heat hole 151 is defined in the heat sink 150.

[0048] 本发明的散热器150与第一风扇模块120与第二风扇模块130邻近设置,第一风扇模块120与第二风扇模块130所吹出的气流通过散热器150进行降温,而散热器150连通有一冷却水以进行散热。 [0048] 150 and the first radiator 120 and the fan module 130 disposed adjacent to the second fan module of the present invention, the first fan and the second fan module 120 module 130 to cool the air blown through the radiator 150, the radiator 150 communicating with a cooling water for cooling. 因此,散热器150可有效降低第一风扇模块120与第二风扇模块130所吹出气流的温度,使得吹入机架110的气流温度不致过高。 Thus, the radiator 150 can effectively reduce the temperature of the first fan and the second fan module 120 module 130 blowing air flow, such that the blown air flow without high temperature of the rack 110. 进而使机柜总成100 内部产生效果良好的对流散热效果。 Inside the cabinet assembly 100 and thus make yield good results convection cooling effect.

[0049] 本发明的承载盘170可以金属材质制成,而电路板160置放于承载盘170上,电路板160随着承载盘170由各个机架110的侧向方向穿过开口113而滑入并装载于机架110 的容置空间内。 [0049] The carrier plate according to the present invention may be made of metal material 170, and the circuit board 160 placed on the tray 170, the circuit board 160 with the tray 170 in a lateral direction through the opening 113 of each rack 110 and the slide and loaded into the accommodating space 110 of the rack.

[0050] 本发明的电路板160亦可直接装载于机架110内,并不需要通过承载盘170进行装设作业,然为了使电路板160不直接与机架110的框体相接触,承载盘170提供了良好的保护效果,有效避免电路板160因震动等外力原因而与机架110碰撞而遭受损毁。 [0050] The circuit board 160 of the present invention may also be directly loaded in the rack 110, does not require the installation work by the tray 170, and then to the circuit board 160 is not in direct contact with the rack housing 110, the carrier plate 170 provides good protection effect, effectively prevent the circuit board 160 due to external shock or the like reasons collide with the rack 110 from any damages.

[0051] 请参阅图1至图3,第一风扇模块120及第二风扇模块130分别与外界的电源供应装置电性连接而被致动,各个第一风扇模块120朝向第一方向Dl产生第一气流,并经过各机架110的第一侧面111及第二侧面112而横穿过机柜总成100的上半部气流流动区域, 而第二风扇模块130朝向第二方向D2产生第二气流,并经过各机架110的第一侧面111及第二侧面112而横穿过机柜总成100的下半部气流流动区域。 [0051] Please refer to FIGS. 1 to 3, a first fan and a second fan module 120 and the power supply module 130 are electrically connected to the external apparatus is actuated, each of the first fan 120 toward the first module generates a first direction Dl a gas flow, and after each of the first side 111 of frame 110 and the second side 112 and the upper half of the air flow across the region of the cabinet assembly 100 and the second fan 130 toward the second module generates a second airflow direction D2 and a first side surface of each rack 110 through 111 and the second side 112 and the lower half of the gas flow across the flow region 100 of the rack assembly.

[0052] 此时,第一风扇模块120的第一气流吹送至其中一导风罩140内(即装设于机架110的第一侧面111的导风罩140),并穿过此一导风罩140的流体通道141而与第二风扇模块130的第二气流相衔接,并且第二风扇模块130的第二气流吹送至另一导风罩140内(即装设于机架110的第二侧面112的导风罩140),并穿过此一导风罩140的流体通道141 而与第一风扇模块120的第一气流相衔接,以于机柜总成100内部构成一冷却循环回路。 [0052] At this time, the first gas stream a first fan module 120 within which a blown air duct 140 (i.e., the frame 110 is mounted on the first side 111 of the air duct 140), and through this guide a fluid passage 141 hood 140 and a second fan module linked with the second gas stream 130 and second stream 130 of a second fan module to another within the blown air duct 140 (i.e., mounted to a first rack 110 air duct 112 of the second side 140), and an air duct through this fluid passage 141 and 140 linked with the first gas stream a first fan module 120, internal to the cabinet assembly 100 includes a cooling circuit.

[0053] 由第一气流及第二气流所衔接而成的循环气流穿过各散热器150的散热孔151与各机架110的第一侧面111与第二侧面112,进而吹送至各个机架110内的电路板160。 [0053] The airflow passes through a first recycle stream and a second gas flow from a first side of each adapter radiator cooling holes 150 and 151 of each rack 111 and the second side 110 of 112, and thus each rack blown 110 in the circuit board 160. Follow

6环气流与单一机架110内的电路板160进行对流散热后之后,再横穿过此一电路板160进入至相邻的另一机架110内进行散热。 After 6 cycloalkyl stream within a single circuit board 160 after the rack 110 convection cooling, and then traverses this circuit board 160 enters another adjacent to the inner chassis 110 to dissipate heat.

[0054] 值得注意的是,本发明所提供的第一风扇模块120、第二风扇模块130、与机架110 的组装框114的数量为多个,散热器150的数量亦设置有多个,以提供给机柜总成100最佳的散热效果,而电路板160的数量亦设置有多个,以使单一机柜总成100得以具备最大的运作效能。 [0054] Notably, the present invention provides a first fan module 120, a second fan module 130, and the number of assembly block 110 of the rack 114 is plural, the number of radiators 150 is also provided with a plurality of, 100 to provide the best cooling effect to the cabinet assembly, and the number of the circuit board 160 is also provided with a plurality, so that a single rack assembly 100 is provided with maximum operational efficiency. 上述的机柜总成100的各组件的数量皆为相互对应,并且熟悉此项技术者可依据实际使用需求而增减其设置数量,并不以本发明所提供的实施例为限。 The number of the components of the cabinet assembly 100 are all correspond to each other, those skilled in the art and may be increased or decreased according to actual needs and the number provided is not to embodiments of the present invention, provided is limited.

[0055] 图4所示为本发明第二实施例的侧面示意图,本发明第二实施例的具体组成结构与第一实施例相似,本发明第二实施例的机柜总成100的第一风扇模块120与第二风扇模块130的设置位置与第一实施例略有不同,以下将针对二实施例之间的差异处进行说明。 [0055] FIG. 4 shows a side view of a second embodiment of the present invention, the specific structure of the second embodiment of the composition of the present invention is similar to the first embodiment, the second embodiment of the rack assembly of the present invention, the first fan 100 module 120 is provided in the position of the second fan module 130 is slightly different from the first embodiment, the following description will be made for differences between the two embodiments.

[0056] 请参阅图4,并同时参酌图1,本发明第二实施例的第一风扇模块120及第二风扇模块130装设于机架110的组装框114内,且第一风扇模块120与第二风扇模块130之间以交错排列的方式设置于机架110上,而本实施例以二个第一风扇模块120与二个第二风扇模块130的组合进行说明,并不以此数量为限。 [0056] Referring to FIG. 4, and at the same time taking into account any FIG. 1, a first embodiment of the fan module of the second embodiment of the present invention, module 120 and the second fan assembly 130 is mounted on the frame 114 of the frame 110, and a first fan module 120 number 130 and the second fan module disposed in a staggered manner on the rack 110, whereas in the present embodiment, two combinations of two of the first fan module 120 and a second fan module 130 will be described below, this is not limit. 各个导风罩140内部具有二流体通道141, 分别对应于第一风扇模块120与第二风扇模块130的组合。 Inside of each air duct 140 having two fluid passages 141, respectively corresponding to the combination of the first module 120 and the second fan 130 of the fan module. 二第一风扇模块120的第一气流分别吹送至导风罩140的二流体通道141内,并与第二风扇模块130的第二气流相衔接, 并且第二风扇模块130的第二气流吹送至导风罩140的二流体通道141内,并与第一风扇模块120的第一气流相衔接,以于机柜总成100内部构成二冷却循环回路。 The first two of the first gas flow fan module 120 are blown into the air duct 140, a two-fluid passage 141, and a second fan module linked with the second gas stream 130, and a second fan module 130 of the second airflow blown the two air guiding cover 140 fluid passage 141, the first gas stream and a first dovetail with the fan module 120, internal to the cabinet assembly 100 includes two cooling circuit.

[0057] 因此,通过第一风扇模块120与第二风扇模块130的搭配,使得机柜总成100内部的上、下半部空间各自构成完整且独立的至少二冷却循环回路。 [0057] Thus, by a second fan module 130 with a first fan module 120, such that the interior of the cabinet assembly 100 on the lower half of each space constituting at least two complete and independent cooling circuit. 值得注意的是,本实施例将第二风扇模块130装载于机架110的顶部,并且第一风扇模块120与第二风扇模块130交错排列,因而本实施例的机柜总成100内部的冷却循环回路皆以顺时针方向运作。 It is noted that, in this embodiment the second fan 130 is mounted on top of the frame module 110, and a first fan module 120 and the second interleaver 130 are arranged fan module, a cooling loop inside the cabinet assembly 100 of the present embodiment thus clockwise loop operations begin. 然而,熟悉此项技术者亦可将第一风扇模块120装载于机架110的顶部,且第一风扇模块120与第二风扇模块130交错排列,使机柜总成100内部的冷却循环回路皆以逆时针方向运作。 However, those skilled in the art may also be the first fan 120 is mounted on top of the frame module 110, and a first fan module 120 and a second staggered fan module 130, the cooling circulation loop inside the cabinet assembly 100 begin counterclockwise operation.

[0058] 本发明第二实施例的设计可大幅缩短二风扇模块120、130所形成的循环气流的行进路径,使得机柜总成100的整体冷却效能更为提升。 [0058] The design of the second embodiment of the present invention can significantly shorten the travel path of the circulating air fan module two 120, 130 are formed, so that the entire cabinet assembly 100 is further enhanced cooling performance.

[0059] 当然,亦可更动本发明的第一风扇模块120与第二风扇模块130装设于机架110 上的位置,如图5所示的第三实施例的侧面示意图。 [0059] Of course, a first fan module can cover modifications of the present invention, the fan 120 and the second module 130 is mounted on the frame 110 position, a schematic side view of a third embodiment as shown in FIG. 第三实施例的第一风扇模块120装载于机架110的顶部,因此本实施例的机柜总成100上半部的冷却循环回路以逆时针方向运作,而机柜总成100下半部的冷却循环回路以顺时针方向运作。 A first fan module 120 of the third embodiment is mounted on top of the frame 110, so that the upper half of the cabinet assembly 100 of the present embodiment is a cooling circuit operating in a counterclockwise direction, while the lower half of the cabinet assembly 100 is cooled circulation loop operation in a clockwise direction. 本发明第三实施例的设计同样可缩短二风扇模块120、130所形成的循环气流的行进路径,使得机柜总成100的整体冷却效能更为提升。 Design of a third embodiment of the present invention is equally shortened travel path of the circulating air fan module two 120, 130 are formed, so that the entire cabinet assembly 100 is further enhanced cooling performance.

[0060] 另外,本发明所述的第一风扇模块120及第二风扇模块130亦可改变其设置位置, 例如装设于承载盘170上,或是机架110的任何适合位置。 [0060] Further, according to the present invention, the first fan and the second fan module 120 module 130 may change its setting position, for example, is mounted on the tray 170, or 110 in any suitable position of the rack. 只要第一风扇模块120与第二风扇模块130朝向不同方向吹送其气流即可,并不限定风扇模块120、130必须装载于机架110的组装框114内。 As long as that module 120 first fan 130 and the air flow in different directions to the second blowing fan module, module 120, 130 is not limited to the fan assembly must be mounted on the frame 110 of the frame 114.

[0061] 通过本发明的服务器的各风扇模块与导风罩的搭配设计,以于本发明的机柜总成内部构成至少一冷却循环回路,使各个机柜总成得以成为独立的模块,并可各自进行自体循环的冷却作业。 [0061] through the fan module and the air duct with the design of the server of the present invention, to form at least one cooling circuit inside the cabinet assembly of the present invention, the respective cabinet assembly is an independent module, and each for self-circulation cooling operation. [0062] 因此,本发明并不需要于货柜机房内另外设计冷、热通道,货柜机房的使用空间可以得到最有效的利用,且机房内部可装载最大数量的机柜总成,得以具备最大的运作效能。 [0062] Accordingly, the present invention does not require additional cooling in the design of the container room, using hot aisle space, the container room can be most effectively utilized and the maximum number that can be loaded inside the engine room of the cabinet assembly, is provided with the maximum operating efficacy.

[0063] 当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明做出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。 [0063] Of course, the present invention may have a variety of other embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can be made when various corresponding modifications and variations according to the present invention, these corresponding modifications and variations shall fall within the scope of the appended claims.

Claims (6)

1. 一种服务器的冷却循环系统,其特征在于,包括有:一机柜总成,具有串行连接的多个机架;多个第一风扇模块,分别设置于所述机架上,并朝向一第一方向吹送一第一气流;多个第二风扇模块,分别设置于所述机架上,并朝向一第二方向吹送一第二气流;以及二导风罩,分别装设于该机柜总成的二相对端部,该二导风罩分别具有至少一流体通道,该第一气流进入其中一该导风罩的该流体通道,并与该第二气流相衔接,以及该第二气流进入另一该导风罩的该流体通道,并与该第一气流相衔接,以构成一冷却循环回路。 CLAIMS 1. A cooling system server, wherein, comprising: a rack assembly, the frame having a plurality of serially connected; a first plurality of fan modules, respectively, provided on the frame, and toward blowing a first direction, a first gas flow; a second plurality of fan modules, respectively, provided on the frame, and a second direction toward a second blowing gas stream; and two air duct, respectively, mounted to the rack two opposite end portions of the assembly, each of the two air duct having at least one fluid passage, the first passage of the fluid stream enters one of the air duct and the second gas flow convergence, and the second gas stream into another derivative of the fluid passage of the hood, and the convergence with the first gas stream, to form a cooling circuit.
2.根据权利要求1所述的服务器的冷却循环系统,其特征在于,各该机架具有相对的一第一侧面及一第二侧面,各该机架的该第一侧面与该第二侧面为一镂空结构,且各该机架以该第一侧面朝向相邻的该机架的该第二侧面依序串行连接成该机柜总成。 2. The cooling system as claimed in claim 1, said server, wherein each of the frame has a first side surface and opposing a second side surface, each of the first side surface of the chassis with the second side It is a hollow structure, and each of the rack adjacent to the first side surface toward the second side of the rack to the rack sequential serial connection assembly.
3.根据权利要求2所述的服务器的冷却循环系统,其特征在于,各该机架的该第一侧面上还具有多个组装框,所述第一风扇模块与所述第二风扇模块分别装设于所述组装框内。 3. The cooling system as claimed in claim 2, the server, wherein the assembly further having a plurality of blocks on the first side of each of the rack, the first fan module and fan modules, respectively, the second mounted to the frame assembly.
4.根据权利要求2所述的服务器的冷却循环系统,其特征在于,还包括有多个散热器, 分别装设于各该机架的该第一侧面上,且所述第一风扇模块及所述第二风扇模块介于该散热器与该第二侧面之间。 4. The cooling system as claimed in claim 2, the server, characterized by further comprising a plurality of radiators, respectively mounted on the first side of each of the rack, and the first fan module and the second module is interposed between the radiator fan and the second side surface.
5.根据权利要求4所述的服务器的冷却循环系统,其特征在于,所述散热器分别具有多个散热孔,该第一气流及该第二气流通过所述散热孔、该第一侧面及该第二侧面而进入该二导风罩的该二流体通道内。 5. The cooling system as claimed in claim 4, wherein the server, wherein, the heat sink having a plurality of cooling holes, respectively, the first gas stream and the second air flow through the cooling hole, and the first side surface the second side surface and into the two air guiding cover the two fluid channels.
6.根据权利要求1所述的服务器的冷却循环系统,其特征在于,各该导风罩具有二该流体通道,所述第一风扇模块的该第一气流与所述第二风扇模块的该第二气流分别进入该二流体通道内,以构成二该冷却循环回路。 6. The cooling system as claimed in claim 1, said server, wherein each of the two air guide cover having the fluid passage, the first stream of the first fan and the second fan module to module the second gas stream into respectively the two fluid channels to constitute two of the cooling circuit.
CN201010547298XA 2010-11-12 2010-11-12 Cooling circulation system of server CN102467201A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010547298XA CN102467201A (en) 2010-11-12 2010-11-12 Cooling circulation system of server

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010547298XA CN102467201A (en) 2010-11-12 2010-11-12 Cooling circulation system of server

Publications (1)

Publication Number Publication Date
CN102467201A true CN102467201A (en) 2012-05-23

Family

ID=46070922

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010547298XA CN102467201A (en) 2010-11-12 2010-11-12 Cooling circulation system of server

Country Status (1)

Country Link
CN (1) CN102467201A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102858142A (en) * 2012-09-16 2013-01-02 李明科 Cooling device of server
CN103079387A (en) * 2012-12-31 2013-05-01 华数传媒网络有限公司 Integrated rack cooling system
CN103384459A (en) * 2013-07-12 2013-11-06 深圳市阿尔法特网络环境有限公司 Cabinet cold-hot channel module and cabinet combination structure
CN103671059A (en) * 2012-09-07 2014-03-26 富士通株式会社 Cooling system
CN104284154A (en) * 2014-10-16 2015-01-14 四川君逸易视科技有限公司 ATM computer room environment comprehensive collection instrument

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1508650A (en) * 2002-12-16 2004-06-30 国际商业机器公司 Method for constituting multi-computer system and the multi-computer system thpereof
EP1448040A2 (en) * 2003-02-14 2004-08-18 Hitachi, Ltd. Liquid cooling system for a rack-mount server system
CN1836473A (en) * 2004-04-26 2006-09-20 克奴尔股份公司 Cooling system for equipment and wiring cabinets and method for cooling equipment and wiring cabinets
US20090122483A1 (en) * 2007-11-13 2009-05-14 International Business Machines Corporation Water-assisted air cooling for a row of cabinets
CN101588699A (en) * 2008-05-23 2009-11-25 华为技术有限公司 Heat dissipation system and heat dissipation method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1508650A (en) * 2002-12-16 2004-06-30 国际商业机器公司 Method for constituting multi-computer system and the multi-computer system thpereof
EP1448040A2 (en) * 2003-02-14 2004-08-18 Hitachi, Ltd. Liquid cooling system for a rack-mount server system
CN1836473A (en) * 2004-04-26 2006-09-20 克奴尔股份公司 Cooling system for equipment and wiring cabinets and method for cooling equipment and wiring cabinets
US20090122483A1 (en) * 2007-11-13 2009-05-14 International Business Machines Corporation Water-assisted air cooling for a row of cabinets
CN101588699A (en) * 2008-05-23 2009-11-25 华为技术有限公司 Heat dissipation system and heat dissipation method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103671059A (en) * 2012-09-07 2014-03-26 富士通株式会社 Cooling system
CN102858142A (en) * 2012-09-16 2013-01-02 李明科 Cooling device of server
CN103079387A (en) * 2012-12-31 2013-05-01 华数传媒网络有限公司 Integrated rack cooling system
CN103384459A (en) * 2013-07-12 2013-11-06 深圳市阿尔法特网络环境有限公司 Cabinet cold-hot channel module and cabinet combination structure
CN104284154A (en) * 2014-10-16 2015-01-14 四川君逸易视科技有限公司 ATM computer room environment comprehensive collection instrument

Similar Documents

Publication Publication Date Title
DE69920842T2 (en) Liquid cooled electronic device
US7254022B2 (en) Cooling system for equipment and network cabinets and method for cooling equipment and network cabinets
CN101137950B (en) Rack-mounted air deflector
EP2675259B1 (en) Hot Aisle Containment Cooling Unit and Method for Cooling
US7361081B2 (en) Small form factor air jet cooling system
JP5209802B2 (en) Hot aisle containment type cooling system and method
US9992914B2 (en) Commmonly submersed servers with velocity augmentation and partial recirculation in tank
CN100571497C (en) Cooled electronic equipment system and method for cooling electronic device frame
US6421240B1 (en) Cooling arrangement for high performance electronic components
US6351381B1 (en) Heat management system
US20030077998A1 (en) Cooling airflow distribution device
US7768780B2 (en) Flow-through cooling for computer systems
US9261310B2 (en) Gas cooled condensers for loop heat pipe like enclosure cooling
US7660109B2 (en) Apparatus and method for facilitating cooling of an electronics system
US6525935B2 (en) Low profile highly accessible computer enclosure with plenum for cooling high power processors
US7068509B2 (en) Small form factor cooling system
CN101502192B (en) Controlled warm air capture
US20070135032A1 (en) Minimized exhaust air re-circulation around air cooled hardware cabinets
US7916483B2 (en) Open flow cold plate for liquid cooled electronic packages
US7848101B2 (en) System and method for cooling electronic systems
US5828549A (en) Combination heat sink and air duct for cooling processors with a series air flow
US20050207116A1 (en) Systems and methods for inter-cooling computer cabinets
US6819563B1 (en) Method and system for cooling electronics racks using pre-cooled air
CN101631447B (en) Cooling method and device for chassis
US8045328B1 (en) Server and cooler moduel arrangement

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)