CN210119724U - Upper rack type industrial computer - Google Patents
Upper rack type industrial computer Download PDFInfo
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- CN210119724U CN210119724U CN201920809371.2U CN201920809371U CN210119724U CN 210119724 U CN210119724 U CN 210119724U CN 201920809371 U CN201920809371 U CN 201920809371U CN 210119724 U CN210119724 U CN 210119724U
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Abstract
A rack-mounted industrial computer comprises a case, a mainboard arranged in the case, an expansion card and a CPU connected with the mainboard, and a heat dissipation mechanism; one end of the case is provided with a first air inlet and a second air inlet, and the other end of the case is provided with a first air outlet corresponding to the first air inlet and a second air outlet corresponding to the second air inlet; the CPU and the expansion card are respectively arranged on two sides of the case; the heat dissipation mechanism comprises a first heat dissipation piece and a second heat dissipation piece which are connected with two opposite ends of the case; the first heat dissipation piece is arranged on one side of the first air inlet; the second heat dissipation part is arranged on one side of the second air outlet. The computer is characterized in that a first air inlet, a second air inlet and a first heat radiating piece are arranged at one end of a case, and a first air outlet, a second air outlet and a second heat radiating piece are arranged at the other end of the case to form a heat radiating air duct with air inlet at one end and air outlet at the other end of the case; the expansion card and the CPU are arranged in parallel, so that thermal interference is avoided. The computer has compact structure and good heat dissipation effect, and is suitable for narrow installation space.
Description
Technical Field
The utility model relates to a computer equipment technical field especially relates to a compact structure's upper rack type industrial computer.
Background
At present, the heat dissipation design of the upper rack type industrial computer is generally a multi-surface ventilation mode, the size of the whole computer is large, the heat dissipation cost is high, and even some whole computers still have airflow dead zones, namely, areas with air flow rate equal to 0 exist, so that the heat dissipation effect is poor. Most of the upper rack type industrial computers are heavy and large in size, so that the whole upper rack unit is filled with the size of the case, the transportation, packaging, installation and other costs are high, and the light weight requirements are not met.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a rack-mounted industrial computer with a compact structure and an excellent heat dissipation effect.
A rack-mounted industrial computer comprises a case, a mainboard arranged in the case, an expansion card and a CPU connected with the mainboard, and a heat dissipation mechanism; a first air inlet and a second air inlet are formed in one end of the case, and a first air outlet corresponding to the first air inlet and a second air outlet corresponding to the second air inlet are formed in the other end of the case; the CPU and the expansion card are respectively arranged on two sides of the case; the heat dissipation mechanism comprises a first heat dissipation piece and a second heat dissipation piece which are connected with two opposite ends of the case; the first heat dissipation piece is arranged on one side of the first air inlet; the second heat dissipation part is arranged on one side of the second air outlet.
The utility model discloses an upper rack type industrial computer, through locating first air intake, second air intake and first heat dissipation piece in one end of the machine case, locate first air outlet, second air outlet and second heat dissipation piece in the other end of the machine case, form the heat dissipation wind channel of one end air inlet, other end air outlet of machine case; the expansion card and the CPU are arranged in parallel, so that thermal interference is avoided. The upper rack type industrial computer is compact in structure, good in heat dissipation effect and suitable for narrow installation space.
In one embodiment, the chassis includes a bottom plate, a first panel and a second panel connected to opposite ends of the bottom plate, a first side plate and a second side plate connected to opposite sides of the bottom plate, and a cover plate.
In one embodiment, the first air inlet and the second air inlet are arranged on the first panel; the first air outlet and the second air outlet are arranged on the second panel; one end of the expansion card is inserted into the second panel.
In one embodiment, the system further comprises a memory bank; the memory bank is arranged at one end, close to the first heat dissipation part, of the mainboard, and the memory bank is perpendicular to the expansion card.
In one embodiment, the system further comprises a bridge chip arranged between the memory bank and the CPU; the bridge chip is connected to the main board.
In one embodiment, the heat dissipation mechanism further includes a third heat dissipation element connected to the CPU and a fourth heat dissipation element connected to the bridge chip.
In one embodiment, the expansion cards are arranged in parallel at intervals, and the memory banks are arranged in parallel at intervals.
In one embodiment, the system further comprises a first hard disk; the first hard disk is connected to one side of the case, which is far away from the expansion card; one end of the first hard disk is arranged close to the second air inlet.
In one embodiment, the system further comprises a second hard disk connected with one side of the first hard disk; the second hard disk is connected to one side of the case, which is far away from the mainboard.
In one embodiment, the heat sink further comprises a power supply connected between the second hard disk and the second heat sink; the power supply is connected to one side of the case far away from the mainboard.
Drawings
Fig. 1 is an assembly structure diagram of an upper rack type industrial computer according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the rack-mounted industrial computer shown in FIG. 1, except for a cover plate, a support frame and a second hard disk;
FIG. 3 is a schematic view from another angle of FIG. 2;
fig. 4 is a schematic view of the gas flow of fig. 2.
Reference is made to the accompanying drawings in which:
a rack-mounted industrial computer 100;
the air conditioner comprises a case 10, a first panel 11, a first air inlet 110, a second air inlet 111, a second panel 12, a first air outlet 120, a second air outlet 121, a first side plate 13, a second side plate 14 and a cover plate 15;
the heat dissipation device comprises a main board 20, an expansion card 30, a heat dissipation mechanism 40, a first heat dissipation member 41, a second heat dissipation member 42, a third heat dissipation member 43, a fourth heat dissipation member 44, a memory bank 50, a first hard disk 60 and a power supply 70.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully below. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 4, a rack-mounted industrial computer 100 according to an embodiment of the present invention includes a case 10, a main board 20 disposed in the case 10, an expansion card 30 and a CPU (not shown) connected to the main board 20, and a heat dissipation mechanism 40; a first air inlet 110 and a second air inlet 111 are arranged at one end of the case 10, and a first air outlet 120 corresponding to the first air inlet 110 and a second air outlet 121 corresponding to the second air inlet 111 are arranged at the other end of the case 10; the CPU and the expansion card 30 are respectively arranged at two sides of the case 10; the heat dissipation mechanism 40 includes a first heat dissipation member 41 and a second heat dissipation member 42 connected to opposite ends of the case 10; the first heat dissipation member 41 is disposed at one side of the first air inlet 110; the second heat dissipation member 42 is disposed at one side of the second air outlet 121. In the rack-mounted industrial computer 100, the first air inlet 110, the second air inlet 111 and the first heat sink 41 are arranged at one end of the case 10, and the first air outlet 120, the second air outlet 121 and the second heat sink 42 are arranged at the other end of the case 10, so that a heat dissipation air duct for supplying air to one end of the case 10 and discharging air from the other end is formed; the expansion card 30 is arranged in parallel with the CPU to avoid thermal interference.
As shown in fig. 1 to 3, in the present embodiment, the chassis 10 includes a bottom plate (not shown), a first panel 11 and a second panel 12 connecting opposite ends of the bottom plate, a first side plate 13 and a second side plate 14 connecting opposite sides of the bottom plate, and a cover plate 15. The cover plate 15 is detachably connected to one side of the first panel 11, the second panel 12, the first side plate 12 and the second side plate 14 away from the bottom plate, so that the maintenance and the disassembly are convenient. Optionally, the chassis 10 further includes a supporting frame (not shown), and two ends of the supporting frame are respectively connected to the first panel 11 and the second panel 12. Further, the first air inlet 110 and the second air inlet 111 are disposed at two ends of the first panel 11; the first outlet 120 and the second outlet 121 are disposed at two ends of the second panel 12, and the first outlet 120 and the second outlet 121 are disposed near the cover plate 15. The main board 20 is connected with the bottom board; one end of the expansion card 30 is inserted into the second panel 12, and the expansion cards 30 are arranged in parallel at intervals so that the cold air flows through the expansion cards 30 to dissipate heat. Alternatively, the expansion card 30 is disposed adjacent to the first side plate 13, and the CPU is disposed adjacent to the second side plate 14.
Referring to fig. 4, the CPU and the expansion card 30 are main high-power devices, and are arranged in parallel, so that the heat-generating devices are arranged in a staggered manner along the airflow direction, thereby avoiding thermal interference between two high-power devices and reducing the mutual influence between the upstream device and the downstream device. The first heat dissipating member 41 blows air toward the inside of the cabinet 10, and the second heat dissipating member 42 draws air toward the outside of the cabinet 10 to directly draw in the outside cold air through the second air inlet 111 into the cabinet 10. The heat dissipation mechanism 40 further includes a third heat dissipation member 43 and a fourth heat dissipation member 44, and the third heat dissipation member 43 is connected to the CPU for dissipating heat. Optionally, the third heat sink 43 is attached to the CPU to draw heat from the CPU toward the cover plate 15. Further, the first heat dissipation element 41, the second heat dissipation element 42, the third heat dissipation element 43, and the fourth heat dissipation element 44 are fans. In operation, the expansion card 30 faces the first heat sink 41, and the first heat sink 41 sucks external cold air into the chassis 10, and then blows the air to the expansion card 30, and finally the air is discharged from the first air outlet 120 of the second panel 12. The second heat sink 42 directly sucks the cold air from the first panel 11, and discharges the hot air through the second air outlet 121 of the second panel 12.
In one embodiment, the rack-mounted industrial computer 100 further includes a memory bank 50; the memory bank 50 is disposed at an end of the motherboard 20 close to the first heat sink 41, the memory bank 50 is perpendicular to the expansion card 30, and the memory bank 50 is parallel to the first panel 11. Optionally, the memory banks 50 are arranged in parallel at intervals to dissipate heat. In operation, the memory bank 50 is disposed near the first panel 11, and the air flowing inside the case 10 must pass through the memory bank 30 and then be discharged out of the case 10. The rack-mounted industrial computer 100 further includes a bridge chip (not shown) disposed between the memory bank 50 and the CPU; the bridge chip is connected to the main board 20. The fourth heat sink 44 is attached to the bridge chip to draw heat from the bridge chip toward the cover plate 15. During operation, the third heat dissipation part 43 and the fourth heat dissipation part 44 are respectively arranged on the CPU and the bridge chip in a laminating mode, forced convection active heat dissipation is achieved, and heat dissipation efficiency is high. The rack-mounted industrial computer 100 further includes a first hard disk 60; the first hard disk 60 is connected to one side of the case 10 far away from the expansion card 30; one end of the first hard disk 60 is disposed near the second air inlet 111 so as to ventilate and dissipate heat; optionally, a first hard disk 60 is attached to the second side panel 14. The rack-mounted industrial computer 100 further includes a second hard disk (not shown) connected to one side of the first hard disk 60; the second hard disk is connected to one side of the case 10 far away from the main board 20; optionally, a second hard disk is attached to the support frame to fully utilize the space above the motherboard 20. During operation, the first hard disk 60 and the second hard disk are disposed at the second air inlet 111, and the cold air entering the enclosure 10 first flows through the first hard disk 60 and the second hard disk to dissipate heat thereof. The rack-mounted industrial computer 100 further includes a power supply 70 connected between the second hard disk and the second heat sink 42; the power supply 70 is connected to a side of the chassis 10 remote from the motherboard 20. Optionally, a power source 70 is attached to the support frame. To facilitate heat dissipation, the power supply 70 has through holes at both ends. In other embodiments, the second heat dissipation element 42 is integral with the power source 70, i.e., the power source 70 carries the second heat dissipation element 42 itself.
The main heating devices in the case 10 of the rack-up industrial computer 100 include an expansion card 30, a CPU, a memory stick 50, a first hard disk 60, a second hard disk, a bridge chip, and a power supply 70, which are all located on different air ducts in the case 10. All heating elements are cooled by forced convection of air, no air flow dead zone, namely the zone with the air flow rate equal to 0, and the cooling efficiency of the heating elements is high. The device is not only suitable for standard cabinet installation, but also suitable for more industrial field installation with narrow space, such as a numerical control machine tool, a subway gate machine, an ATM machine and the like.
The utility model discloses a rack-mounted industrial computer 100 is through locating first air intake 110, second air intake 111 and first heat dissipation piece 41 in the one end of quick-witted case 10, locate first air outlet 120, second air outlet 121 and second heat dissipation piece 42 in the other end of quick-witted case 10, form the heat dissipation wind channel of the one end air inlet of quick-witted case 10, the other end air outlet; the expansion card 30 is arranged in parallel with the CPU to avoid thermal interference. The upper rack type industrial computer 100 has a compact structure and a good heat dissipation effect, is suitable for a narrow installation space, and saves the transportation and packaging costs.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An upper rack type industrial computer is characterized by comprising a case, a mainboard arranged in the case, an expansion card and a CPU connected with the mainboard, and a heat dissipation mechanism; a first air inlet and a second air inlet are formed in one end of the case, and a first air outlet corresponding to the first air inlet and a second air outlet corresponding to the second air inlet are formed in the other end of the case; the CPU and the expansion card are respectively arranged on two sides of the case; the heat dissipation mechanism comprises a first heat dissipation piece and a second heat dissipation piece which are connected with two opposite ends of the case; the first heat dissipation piece is arranged on one side of the first air inlet; the second heat dissipation part is arranged on one side of the second air outlet.
2. The rack-top industrial computer as claimed in claim 1 wherein the chassis comprises a base, first and second panels connected to opposite ends of the base, first and second side panels connected to opposite sides of the base, and a cover.
3. The rack-mounted industrial computer as claimed in claim 2, wherein the first and second air inlets are formed on the first panel; the first air outlet and the second air outlet are arranged on the second panel; one end of the expansion card is inserted into the second panel.
4. The rack-top industrial computer of claim 1, further comprising a memory stick; the memory bank is arranged at one end, close to the first heat dissipation part, of the mainboard, and the memory bank is perpendicular to the expansion card.
5. The rack-mounted industrial computer as claimed in claim 4, further comprising a bridge chip disposed between the memory bank and the CPU; the bridge chip is connected to the main board.
6. The rack-top industrial computer of claim 5, wherein the heat dissipation mechanism further comprises a third heat sink coupled to the CPU and a fourth heat sink coupled to the bridge chip.
7. The rack-top industrial computer as claimed in claim 5 wherein the expansion cards are spaced apart in parallel and the memory banks are spaced apart in parallel.
8. The rack-top industrial computer of claim 1, further comprising a first hard disk; the first hard disk is connected to one side of the case, which is far away from the expansion card; one end of the first hard disk is arranged close to the second air inlet.
9. The rack-mounted industrial computer as claimed in claim 8, further comprising a second hard disk connected to one side of the first hard disk; the second hard disk is connected to one side of the case, which is far away from the mainboard.
10. The rack-top industrial computer as claimed in claim 9 further comprising a power supply connected between the second hard disk and the second heat sink; the power supply is connected to one side of the case far away from the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920809371.2U CN210119724U (en) | 2019-05-29 | 2019-05-29 | Upper rack type industrial computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920809371.2U CN210119724U (en) | 2019-05-29 | 2019-05-29 | Upper rack type industrial computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210119724U true CN210119724U (en) | 2020-02-28 |
Family
ID=69616504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920809371.2U Active CN210119724U (en) | 2019-05-29 | 2019-05-29 | Upper rack type industrial computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210119724U (en) |
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2019
- 2019-05-29 CN CN201920809371.2U patent/CN210119724U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230713 Address after: 518057 1701, Yanxiang science and technology building, 31 Gaoxin middle Fourth Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Yanxiang Smart Technology Co.,Ltd. Address before: 518107 5th floor, No.1, Yanxiang Zhigu chuangxiangdi, No.11, Gaoxin Road, Guangming New District, Shenzhen City, Guangdong Province Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |