CN117015204A - Backboard air conditioner - Google Patents

Abstract

The application provides a backboard air conditioner which is applied to a data center, wherein the data center comprises a server cabinet, a plurality of servers are arranged in the server cabinet, the backboard air conditioner comprises a shell and a plurality of heat exchange modules, the shell is provided with an air inlet side and an air outlet side which are opposite, and the air inlet side is used for being connected with the server cabinet; the plurality of heat exchange modules are arranged in the shell and are mutually connected in parallel, and each liquid cooling heat dissipation module is at least positioned on a heat dissipation path of one server. The heat exchange modules of the backboard air conditioner can be in a modularized design, can be deployed according to the specific on-frame condition of the server on the server mechanism, can provide cold energy for the part with refrigeration requirement on the server cabinet, can avoid the waste of the cold energy, improves the cold energy utilization rate of the backboard air conditioner, and reduces the acquisition cost and the use cost of the backboard air conditioner.

Description

Backboard air conditioner

Technical Field

The application relates to the technical field of refrigeration, in particular to a back plate air conditioner.

Background

Along with the requirement of a large number of AI training, a large number of GPU servers are needed to be used as a calculation power basis, the power consumption of the GPU servers is relatively high, the latest A100 server at present reaches 5KW, so that the heat generation is very serious, the traditional room-level air conditioner cannot meet the refrigeration requirement of a large number of servers, the refrigeration capacity of the backboard air conditioner is larger than that of the traditional room-level air conditioner, the single-machine refrigeration capacity of some backboard air conditioners can reach more than 30KW, and the refrigeration requirement of the current servers can be met.

Because the power supply capability of a single server cabinet is limited, as the power consumption of the current server is higher and higher, the server cabinet is easy to put on shelf and is not completely full. However, in the related art, most of the backboard air conditioners used in the market at present are integrated, so that the places on the server cabinet where the servers are not installed can also perform refrigeration, and the waste of cold energy resources is caused.

Disclosure of Invention

The application provides a back plate air conditioner, which is used for improving the cold energy utilization rate of the back plate air conditioner and improving the refrigerating effect of the back plate air conditioner.

The application provides a backboard air conditioner which is applied to a data center, wherein the data center comprises a server cabinet, a plurality of servers are arranged in the server cabinet, and the backboard air conditioner comprises:

the shell is provided with an air inlet side and an air outlet side which are opposite, and the air inlet side is used for being connected with the server cabinet; a kind of electronic device with high-pressure air-conditioning system

The heat exchange modules are arranged in the shell and are mutually connected in parallel, and each liquid cooling heat dissipation module is at least positioned on a heat dissipation path of the server.

According to the backboard air conditioner provided by the embodiment of the application, the plurality of heat exchange modules are arranged, so that the heat exchange modules can be in a modularized design, the heat exchange modules of the backboard air conditioner can be deployed according to the specific loading condition of the server, the heat exchange modules can be arranged at the positions corresponding to the backboard air conditioner when the server is arranged on the server cabinet, and the heat exchange modules are not required to be arranged at the rest empty positions on the server cabinet.

In addition, the plurality of heat exchange modules are arranged in parallel, rather than being arranged in series, so that the refrigerant supplied to the backboard air conditioner can be divided into a plurality of paths to flow through each heat exchange module independently, each heat exchange module can have nearly the same temperature, the whole backboard air conditioner is uniform in cold quantity distribution, compared with the backboard air conditioner adopting a whole plate heat exchanger in the related art, the flow path of the refrigerant in each heat exchange module is far smaller than the flow path of the refrigerant in the whole plate heat exchanger, the problem of uneven cold quantity distribution caused by overhigh temperature of the refrigerant at the tail end of the path after multiple heat exchange can be solved, the uniform cold quantity distribution of the backboard air conditioner is further ensured, the uniform cooling and heat dissipation of hot air entering the backboard air conditioner can be ensured, and the refrigerating effect of the backboard air conditioner is improved.

In addition, in the back plate air conditioner provided by the embodiment of the application, the heat exchange module is correspondingly arranged only aiming at the part with the cold energy demand on the server cabinet, compared with the back plate air conditioner adopting a whole plate heat exchanger in the related art, the flow path of the refrigerant is reduced, and the supply pressure of the refrigerant provided to the heat exchange module can be reduced, so that the energy consumption consumed by the supply and input of the refrigerant can be reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic layout diagram of a back panel air conditioner applied to a data center according to an embodiment of the present application.

Fig. 2 is a first assembly schematic diagram of a back panel air conditioner and a server cabinet according to an embodiment of the present application.

Fig. 3 is a second assembly schematic diagram of a back panel air conditioner and a server cabinet according to an embodiment of the present application.

Fig. 4 is a third assembly schematic diagram of a back panel air conditioner and a server cabinet according to an embodiment of the present application.

Fig. 5 is a schematic diagram of an air outlet side of a back panel air conditioner according to an embodiment of the present application.

Fig. 6 is a fourth assembly schematic of a back panel air conditioner and a server cabinet according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to fig. 1 to 6 in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.

Reference herein to "an embodiment" or "implementation" means that a particular feature, component, or characteristic described in connection with the embodiment or implementation may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Along with the requirement of a large number of AI training, a large number of GPU servers are needed to be used as a calculation power basis, the power consumption of the GPU servers is relatively high, the latest A100 server at present reaches 5KW, so that the heat generation is very serious, the traditional room-level air conditioner cannot meet the refrigeration requirement of a large number of servers, the refrigeration capacity of the backboard air conditioner is larger than that of the traditional room-level air conditioner, the single-machine refrigeration capacity of some backboard air conditioners can reach more than 30KW, and the refrigeration requirement of the current servers can be met.

Because the power supply capability of a single server cabinet is limited, as the power consumption of the current server is higher and higher, the server cabinet is easy to put on shelf and is not completely full. However, in the related art, most of the backboard air conditioners currently used in the market are integrated, and these backboard air conditioners usually use an entire heat exchange module, for example, a monolithic large-area board heat exchanger (one board heat exchanger covers the entire backboard air conditioner), so that cooling is performed in a place where no server is installed on the server cabinet, which results in waste of cold energy resources.

In view of this, in order to reduce the waste of cold energy and provide the cold energy utilization rate of the back panel air conditioner, the application provides a new back panel air conditioner.

Specifically, the backboard air conditioner provided by the embodiment of the application is applied to a data center, a large number of server cabinets are arranged in a machine room of the data center, a plurality of servers are arranged in the server cabinets, and the backboard air conditioner can be used for radiating and cooling the servers arranged in the server cabinets. Of course, the backboard air conditioner provided by the embodiment of the application can also be applied to other machine rooms for processing and storing data resources.

For convenience of understanding, the general principle of the backboard air conditioner for radiating and cooling the server cabinet will be described. Referring to fig. 1, a back panel air conditioner provided by an embodiment of the present application is applied to a data center. In general, the server cabinet 20 includes a plurality of installation cavities 201, the server 21 is disposed in the installation cavities 201, and since a large amount of heat is generated during the operation of the server 21, the server cabinet 20 is internally provided with an air cooling system, and the air cooling system sucks air in the data center room into the server cabinet 20 to cool the server 21 and blow out the heat-exchanged hot air. As shown in fig. 1, the back panel air conditioner 10 may be disposed at the back of the server cabinet 20 (i.e. at one side from which hot air is discharged), so that the hot air discharged from the server cabinet 20 directly enters the back panel air conditioner 10, is cooled by the back panel air conditioner 10 and then is changed into cold air, and is discharged into a machine room, and then the next server cabinet 20 located in a downwind area sucks cold air in the machine room to cool the server 21, so that the circulation is repeated.

Referring to fig. 2, fig. 2 is a first assembly schematic diagram of a back panel air conditioner 10 and a server cabinet 20 according to an embodiment of the application. In an embodiment of the present application, the back panel air conditioner 10 includes a casing 100 and a plurality of heat exchange modules 200.

Wherein the enclosure 100 has opposite air inlet side 101 and air outlet side 102. It will be appreciated that the air inlet side 101 is a side of the back-panel air conditioner 10 that draws in hot air, the air inlet side 101 may be provided with one or more air inlets, the air outlet side 102 is a side of the back-panel air conditioner 10 that discharges cold air (here cold air is compared to hot air), and the air outlet side 102 may be provided with one or more air outlets.

The air intake side 101 is used for connecting with the server cabinet 20, so that hot air discharged from the server cabinet 20 is blown into the back panel air conditioner 10 through the air intake side 101. It can be appreciated that the air inlet side 101 is in sealing connection with the server cabinet 20, so that the back plate air conditioner 10 and the server cabinet 20 form a sealed heat exchange air duct, and hot air blown out from the server cabinet 20 is prevented from being directly discharged into the machine room without being cooled, and the temperature of air in the machine room is prevented from rising.

The heat exchange modules 200 are disposed in the casing 100, and the heat exchange modules 200 are disposed in parallel with each other, and each heat exchange module 200 is at least located on a heat dissipation path of the server 21.

It can be understood that the heat exchange module 200 is a core component of the back-plate air conditioner 10, and the back-plate air conditioner 10 mainly cools the air entering the back-plate air conditioner 10 through the heat exchange module 200. The heat exchange module 200 may be provided with a coolant channel through which a coolant flows, and the flowing coolant may enable the heat exchange module 200 to continuously store cold, so that the heat exchange module 200 has a relatively low temperature, and hot air blown into the back panel air conditioner 10 from the server cabinet 20 exchanges heat with the heat exchange module 200, thereby reducing the temperature of the air. Wherein, the refrigerant can be chilled water or other refrigerants.

For example, the heat exchange module 200 may employ a heat exchange device such as a surface cooler (surface cooler), a tube cooler, etc.

Each heat exchange module 200 is located at least on a heat dissipation path of one server 21, in other words, each heat exchange module 200 is disposed face-to-face (not in direct contact) with at least one server 21, so that the blown hot air from at least one server 21 can be blown onto one heat exchange module 200, thereby cooling the blown hot air from at least one server 21 to cool air.

Optionally, a plurality of accommodating grooves 110 may be disposed in the casing 100, the heat exchange module 200 may be installed in the accommodating grooves 110, and the accommodating grooves 110 may support and position the heat exchange module 200, so that the plurality of heat exchange modules 200 are stably installed inside the casing 100. Each accommodating groove 110 is communicated with at least one mounting cavity 201 of the server cabinet 20, and a plurality of heat exchange modules 200 can be installed in the accommodating grooves 110 one to one, so that each heat exchange module 200 is located on at least one heat dissipation path of the server 21.

Optionally, in order to make the server cabinet 20 have a regular shape design, so that more server cabinets 20 can be placed in a limited space in the data center room, the installation cavities 201 of the server cabinets 20 can be arranged in an array, and then the plurality of accommodating grooves 110 are also arranged in an array, and correspondingly, the plurality of heat exchange modules 200 can be arranged in an array.

In other embodiments, the plurality of heat exchange modules 200 may be arranged arbitrarily.

Alternatively, each heat exchange module 200 may be located on a heat dissipation path of one server 21, that is, one heat exchange module 200 is disposed opposite to one server 21, and then the hot air blown out from one server 21 on the server cabinet 20 is cooled down by one heat exchange module 200 and then discharged. Each heat exchange module 200 may be located on the heat dissipation path of two or more servers 21, that is, one heat exchange module 200 is disposed face to face with two or more servers 21, and then the hot air blown out from two or more servers 21 on the server cabinet 20 is cooled by one heat exchange module 200 and discharged. Of course, it should be noted that the number of servers 21 corresponding to each heat exchange module 200 for providing cooling capacity cannot be excessive, and the number of servers 21 corresponding to each heat exchange module 200 is determined by the maximum cooling capacity of each heat exchange module 200.

For example, in an alternative embodiment, please refer to fig. 3, fig. 3 is a second assembly schematic diagram of a back panel air conditioner and a server cabinet according to an embodiment of the present application. One receiving groove 110 of the cabinet 100 communicates with four mounting cavities 201 of the server cabinet 20, that is, one heat exchange module 200 is disposed face-to-face with four servers 21, that is, one heat exchange module 200 is located on a heat dissipation path of the four servers 21.

The heat exchange modules 200 are disposed in parallel with each other, in other words, the heat exchange modules 200 are not connected in series, that is, the head (liquid inlet) of each heat exchange module 200 is connected to each other, and the tail (liquid outlet) of each heat exchange module 200 is connected to each other, so that the refrigerant supplied to the back-plate air conditioner 10 is divided into multiple paths to flow through each heat exchange module 200 individually.

According to the back panel air conditioner 10 of the embodiment of the application, the heat exchange modules 200 can be in a modularized design by arranging the plurality of heat exchange modules 200, the heat exchange modules 200 of the back panel air conditioner 10 can be deployed according to the specific loading condition of the server 21, the heat exchange modules 200 can be arranged at the positions corresponding to the back panel air conditioner 10 on the server cabinet 20, and the heat exchange modules 200 are not required to be arranged at the rest of the vacant positions on the server cabinet 20.

Moreover, it should be noted that, in the related art, a large number of backboard air conditioners adopting a monolithic large-area plate heat exchanger are used in the market at present, because the area of the plate heat exchanger is too large, the flow path of the refrigerant in the plate heat exchanger is too long, so that the temperature of the refrigerant at the tail end of the path after multiple heat exchanges is higher, the cold quantity of the plate heat exchanger is unevenly distributed, the hot air entering the backboard air conditioner cannot be uniformly cooled and radiated, and the temperature of the discharged cold air is unevenly.

By arranging the plurality of heat exchange modules 200 in parallel rather than in series, the refrigerant provided to the back plate air conditioner 10 can be divided into a plurality of paths to flow through each heat exchange module 200 independently, so that each heat exchange module 200 can have nearly the same temperature, the whole back plate air conditioner 10 can uniformly distribute cold energy, and compared with the back plate air conditioner 10 adopting a whole plate heat exchanger in the related art, the problem of uneven cold energy distribution caused by overhigh temperature of the refrigerant at the tail end of the path after multiple heat exchange can be solved, the uniformity of the cold energy distribution of the back plate air conditioner 10 can be further ensured, the uniform cooling and heat dissipation of hot air entering the back plate air conditioner 10 can be ensured, and the refrigerating effect of the back plate air conditioner 10 can be improved.

In addition, it should be noted that, for the back plate air conditioner adopting a monolithic plate heat exchanger in the related art, since the flow path of the refrigerant is too long, a larger supply pressure needs to be provided to drive the refrigerant to flow through the monolithic plate heat exchanger, but the back plate air conditioner 10 provided in the embodiment of the application only needs to correspondingly deploy the heat exchange module 200 for the part with the cold demand on the server cabinet 20, so that the flow path of the refrigerant is reduced, and the supply pressure of the refrigerant provided to the heat exchange module 200 can be reduced, thereby reducing the energy consumption consumed by the supply and input of the refrigerant.

Optionally, referring to fig. 2 and 3, the back panel air conditioner 10 further includes a liquid supply pipe 500 and a liquid return pipe 600. Each heat exchange module 200 includes a liquid inlet (not shown) and a liquid outlet (not shown). The liquid supply pipe 500 is used for being connected with a supply device, and the liquid supply pipe 500 is connected with the liquid inlet end of each heat exchange module 200. The liquid return pipe 600 is used for being connected with a recovery device, and the liquid return pipe 600 is connected with the liquid outlet end of each heat exchange module 200.

It can be appreciated that the supply device is configured to provide the flowing refrigerant with a lower initial temperature to the heat exchange module 200, and the recovery device is configured to recover the refrigerant with an increased temperature after heat exchange by the heat exchange module 200. Alternatively, the supply means and the recovery means may be integrated as one device.

The liquid inlet end of the heat exchange module 200 may be connected to the liquid supply pipe 500 through a quick connector, and the liquid outlet end may also be connected to the liquid return pipe 600 through a quick connector. Specifically, the refrigerant provided by the supply device is delivered to the liquid inlet end of each heat exchange module 200 through the liquid supply pipe 500, flows into each heat exchange module 200, flows into the liquid return pipe 600 through the liquid return end of each heat exchange module 200, and flows into the recovery device through the liquid return pipe 600.

Optionally, referring to fig. 3 and fig. 4, fig. 4 is a third assembly schematic diagram of a back panel air conditioner and a server cabinet according to an embodiment of the present application. Each heat exchange module 200 includes at least one surface cooler 210.

Specifically, each heat exchange module 200 may include a surface cooler 210. For example, as shown in fig. 3, when one heat exchange module 200 is disposed face-to-face with four servers 21 (not shown) in the server cabinet 20, each heat exchange module 200 may include one surface cooler 210, that is, one surface cooler 210 is disposed face-to-face with the four servers 21, and the hot air blown by the servers 21 in the four installation cavities 201 is cooled by the one surface cooler 210. In other embodiments, each heat exchange module 200 may include two surface coolers 210. For example, when one heat exchange module 200 is disposed face-to-face with two servers 21 in the server cabinet 20, each heat exchange module 200 may include two surface coolers 210, that is, each surface cooler 210 is disposed face-to-face with two servers 21, and the hot air blown by the servers 21 in the two installation cavities 201 is cooled by one surface cooler 210.

It should be noted that, when the number of the surface coolers 210 included in each heat exchange module 200 is plural, the surface coolers 210 of each heat exchange module 200 may be connected in parallel. For example, when one heat exchange module 200 includes two surface coolers 210, each surface cooler 210 has a liquid inlet end, each surface cooler 210 has a liquid outlet end, the liquid inlet ends of the two surface coolers 210 may be connected to the liquid supply pipe 500 through a three-way pipe, and the liquid outlet ends of the two surface coolers 210 may be connected to the liquid return pipe 600 through another three-way pipe, so as to realize that the two surface coolers 210 of one heat exchange module 200 are connected in parallel.

In an alternative embodiment, each heat exchange module 200 includes a surface cooler 210, which may simplify the overall structure of the heat exchange module 200, facilitate the modular design of the heat exchange module 200, and facilitate the assembly of the heat exchange module 200 with other structures of the back-plate air conditioner 10.

Referring to fig. 2 and 3, a second structural schematic diagram of the back panel air conditioner 10 according to an embodiment of the application is shown. The back panel air conditioner 10 may further include a plurality of fan modules 300, wherein the plurality of fan modules 300 are disposed in the casing 100, and the plurality of fan modules 300 are disposed one-to-one with the plurality of heat exchange modules 200.

Alternatively, the fan module 300 may be installed in the accommodating groove 110, and the accommodating groove 110 is used for supporting and positioning the fan module 300, so that the fan modules 300 may be stably installed inside the casing 100. The fan modules 300 may be installed in the accommodating grooves 110 one by one, so that the fan modules 300 are disposed one by one with the heat exchange modules 200.

Optionally, in order to make the server cabinet 20 have a shape design rule, so that more server cabinets 20 can be placed in a limited space in the data center room, the installation cavities 201 of the server cabinets 20 can be arranged in an array, and then the plurality of accommodating grooves 110 are also arranged in an array, and correspondingly, the plurality of fan modules 300 can be arranged in an array.

In other embodiments, the fan modules 300 may be arranged arbitrarily.

Specifically, the hot air discharged from the server cabinet 20 enters the back-panel air conditioner 10 from the air inlet side 101 of the back-panel air conditioner 10, is cooled by the heat exchange module 200, becomes cold air, and is blown out from the air outlet side 102 of the back-panel air conditioner 10 under the driving of the fan module 300. It will be appreciated that the fan module 300 is configured to provide a suction force to increase the flow rate of air so that the cooled air within the back panel air conditioner 10 is more easily blown out of the air outlet side 102 of the back panel air conditioner 10.

The backplate air conditioner 10 is through setting up a plurality of fan modules 300 for fan modules 300 can be the modularized design, can be according to the concrete condition of putting on the shelf of server 21 to the fan modules 300 of backplate air conditioner 10 and heat transfer module 200 corresponds the setting with the server 21 of settling on the server rack 20, that is to say, can be according to the deployment condition of heat transfer module 200 to the fan modules 300 deployment, can correspond to the fan modules 300 to the position that has set up heat transfer module 200 in the casing 100, and the rest vacant position need not to set up fan modules 300, avoids there being fan modules 300 idle and not utilized, avoids the waste of resource, can reduce the cost of backplate air conditioner 10 simultaneously.

In addition, the fan module 300 and the heat exchange module 200 are in a modularized design, so that the back plate air conditioner 10 is convenient to install and detach and convenient to update and maintain subsequently. For example, when the number of servers 21 on the server cabinet 20 increases, a corresponding number of fan modules 300 and heat exchange modules 200 can be directly added at the corresponding positions of the back-plate air conditioner 10, so that the original setting of the back-plate air conditioner 10 is not affected, and the upgrading and reconstruction of the data center are facilitated. For example, when the fan module 300 or the heat exchange module 200 of the back panel air conditioner 10 is damaged, the damaged fan module 300 or the heat exchange module 200 can be directly detached, and the new fan module 300 or the new heat exchange module 200 is replaced without replacing the whole back panel air conditioner 10.

Optionally, the plurality of fan modules 300 are disposed on a side of the plurality of heat exchange modules 200 away from the server cabinet 20.

Because the heat exchange module 200 generally includes heat exchange tubes and fins, the heat exchange module 200 causes a certain obstruction to the air flowing, in this embodiment, the fan module 300 is disposed on the side of the heat exchange module 200 away from the server cabinet 20, so that the fan module 300 is closer to the air outlet side 102, thereby avoiding obstruction when cold air is discharged out of the back panel air conditioner 10, and the fan module 300 can accelerate the air flowing, so that the cold air in the back panel air conditioner 10 is easier to blow out from the air outlet side 102 into the ambient air of the machine room. Meanwhile, the heat exchange module 200 is closer to the air inlet side 101, and the flow rate of the hot air entering the back plate air conditioner 10 is slower when passing through the heat exchange module 200 through a certain blocking function of the heat exchange module 200, so that the hot air has enough time to exchange heat with the heat exchange module 200, and the air entering the back plate air conditioner 10 can be reduced to a lower temperature.

Optionally, each fan module 300 includes at least one fan 310.

Specifically, each fan module 300 may include one fan 310. For example, when one heat exchange module 200 is disposed opposite to a smaller number of servers 21 (one or two servers 21) in the server cabinet 20, each fan module 300 may include one fan 310, and then one fan 310 blows one or two servers 21 into the back panel air conditioner 10 and blows out cool air cooled by heat exchange of the heat exchange module 200. Each fan module 300 may also include two or more fans 310. For example, when one heat exchange module 200 is disposed opposite to a larger number of servers 21 (three or more servers 21) on the server rack 20, each fan module 300 may include two or more fans 310, and three or more servers 21 are blown into the back panel air conditioner 10 through the two or more fans 310 and cooled air cooled by the heat exchange module 200 is blown out.

For example, in an alternative embodiment, please refer to fig. 3 and fig. 5 in combination, and fig. 5 is a schematic diagram of an air outlet side of a back panel air conditioner according to an embodiment of the present application. Each receiving groove 110 of the casing communicates with four mounting cavities 201 of the server cabinet 20, each heat exchange module 200 is disposed face-to-face with four servers 21, and each fan module 300 includes two fans 310. Then, each fan 310 can blow the servers 21 in each two installation cavities 201 into the back panel air conditioner 10 and blow the cool air cooled by the heat exchange module 200, so that the fan module 300 can provide enough wind force (suction force), and the structure of the fan module 300 is relatively simple. Moreover, by arranging two fans 310, when one fan 310 is suddenly damaged, the other fan 310 can still work normally, and the operation of the fan module 300 can still be ensured, so that the larger influence on the cooling and heat dissipation of the server 21 is avoided.

The fan 310 may be an EC fan (also referred to as an electronic ac motor fan), and the EC fan adopts an electronic frequency conversion technology, so that the rotation speed and the air volume of the fan 310 can be adjusted at any time according to actual needs, and the refrigeration requirement of the back-plate air conditioner 10 can be met.

Optionally, in an embodiment, the casing 100 includes a plurality of receiving grooves 110, and each receiving groove 110 communicates with at least one mounting cavity 201. The heat exchange modules 200 are detachably installed in the accommodating grooves 110 one by one, the fan modules 300 are detachably installed in the accommodating grooves 110 one by one, and the heat exchange modules 200 and the fan modules 300 in each accommodating groove 110 are mutually independent.

Then, the heat exchange module 200 and the fan module 300 are detachably installed in the accommodating groove 110 respectively, so that the heat exchange module 200 and the fan module 300 are independent of each other, and the heat exchange module 200 and the fan module 300 can be independently replaced, thereby facilitating maintenance of the back panel air conditioner 10.

Alternatively, the fan module 300 and the heat exchange module 200 may be provided as a single body, for example, the fan module 300 and the heat exchange module 200 may be integrally connected. Illustratively, in another embodiment, the housing 100 includes a plurality of receiving slots 110, each receiving slot 110 being in communication with at least one mounting cavity 201. The back-plate air conditioner 10 includes a plurality of refrigeration cases, each of which includes a heat exchange module 200 and a fan module 300, and the refrigeration cases are detachably installed in the accommodating grooves 110 one to one.

Then, by integrating the fan module 300 and the heat exchange module 200 into one refrigeration box, the fan module 300 and the heat exchange module 200 are connected into one body, so that the transportation and the installation of each component of the back panel air conditioner 10 can be facilitated, and the delivery of the back panel air conditioner 10 is facilitated.

Specifically, each refrigeration box may include a box body, where at least two sliding cavities are provided, the heat exchange module 200 is disposed in one sliding cavity in a sliding manner, and the fan module 300 is disposed in the other sliding cavity in a sliding manner. Thus, the fan module 300 and the heat exchange module 200 can be conveniently installed in the refrigeration box, and when the fan module 300 and the heat exchange module 200 are assembled into a whole, the fan module 300 and the heat exchange module 200 can be conveniently maintained or replaced independently.

Referring to fig. 2 and 3, the air inlet side 101 is provided with a plurality of air inlets 120, and each air inlet 120 is in communication with at least one mounting cavity 201.

Specifically, each air intake 120 may be in communication with one of the mounting cavities 201, that is, one air intake 120 is opposite one of the servers 21, and then one air intake 120 receives hot air blown from one of the servers 21 on the server rack 20. Each air intake 120 may be opposite to two or more mounting cavities 201, that is, one air intake 120 is opposite to two or more servers 21, and then one air intake 120 receives hot air blown from two or more servers 21 on the server rack 20.

For example, in one embodiment, each air intake 120 is opposite to four mounting cavities 201, in other words, one air intake 120 may be opposite to four servers 21, i.e., one air intake 120 receives hot air blown from four servers 21 on the server rack 20.

Alternatively, the plurality of heat exchange modules 200 are disposed one-to-one with the plurality of air inlets 120, that is, the number of heat exchange modules 200 is the same as the number of air inlets 120, and one heat exchange module 200 is opposite to one air inlet 120.

Referring to fig. 2, the back panel air conditioner 10 further includes a plurality of air door modules 400, the plurality of air door modules 400 are disposed on the air inlet side 101, and the plurality of air door modules 400 are disposed on the air inlet 120 in a one-to-one manner, and each air door module 400 is used for covering or opening one air inlet 120.

By arranging the air door module 400, accurate air supply can be realized to the server 21 in the server cabinet 20, and the condition of air quantity short circuit is reduced.

It should be noted that, in the case where the "air volume short circuit" exists in the case where the server rack 20 is not fully set up, because the power supply capability of the single server rack 20 is limited, when more servers 21 with larger power consumption are installed on the server rack 20, an empty installation cavity 201 exists on the server rack 20. For the installation cavities 201 in which the servers 21 are arranged, a certain resistance exists when the air flows due to the blocking of the servers 21, while for the empty installation cavities 201, no blocking exists in the interior, and the air can easily directly pass through the empty installation cavities 201. In the related art, when a large number of backboard air conditioners are used in the market at present and applied to a data center, under the condition that the upper rack of a server cabinet is not fully loaded, cold air blown out from the backboard air conditioner in an upwind area directly flows through an empty installation cavity of the server cabinet in a downwind area, and no cooling is carried out on servers in the server cabinet in the downwind area, or only a small part of cold air can enter the installation cavity where the servers are arranged to exchange heat with the servers, and most of cold air directly flows away through the empty installation cavity, so that the temperature of the servers in the server cabinet is still high.

Specifically, in this embodiment, the damper module 400 is disposed on the air inlet side 101 of the back panel air conditioner 10, in the case that the server cabinet 20 is not fully up, for the empty installation cavity 201 on the server cabinet 20, the damper module 400 may be in a state of covering the air inlet 120, so that the damper module 400 separates the empty installation cavity 201 from the corresponding accommodating groove 110, the damper module 400 may cause obstruction to the air flow, so that a windage area may be formed in front of the empty installation cavity 201, and the cold air is prevented from entering the empty installation cavity 201, so that more cold air is easier to enter the installation cavity 201 of the server cabinet 20 where the server 21 is disposed, so that accurate air supply to the server 21 in the server cabinet 20 can be realized, and the cold air blown out from the back panel air conditioner 10 in the windage area can be reduced to directly flow through the empty installation cavity 201, the cold air is prevented from not performing heat exchange with the server 21 to directly blow away, the condition of air quantity short circuit can be avoided, the back panel air conditioner 10 is prevented from invalidity to the server cabinet 20, the heat dissipation effect of the back panel air conditioner 20 to the server cabinet 20 is improved, the cooling effect of the back panel air conditioner 20 is improved, and the cooling effect of the back panel air conditioner 20 is improved.

Moreover, by providing the damper module 400, the servers 21 within the server cabinet 20 can be protected. For example, when the leakage condition of the heat exchange module 200 is detected, the air inlet 120 can be covered by the air door module 400, so that IT assets such as the server 21 in the server cabinet 20 can be isolated from the leaked heat exchange module 200, and the damage to the IT assets such as the server 21 caused by the leakage entering the server cabinet 20 can be prevented.

Specifically, each heat exchange module 200 of the back panel air conditioner 10 may be provided with a leakage detection device, for example, a leakage rope may be provided to detect whether the heat exchange module 200 leaks.

To realize the closing or opening of the air inlets 120 by the air door modules 400, each air door module 400 includes at least one air door 410, and the at least one air door 410 is rotatably disposed on the air inlet side 101.

Specifically, each damper module 400 may include a damper 410, one of the dampers 410 may cover or uncover one of the air inlets 120, and one of the air inlets 120 may communicate and block one of the receiving slots 110 of the back-panel air conditioner 10 from the plurality of mounting cavities 201 of the server rack 20 when the one of the air inlets 120 is in communication with the plurality of mounting cavities 201. Each damper module 400 may also include a plurality of dampers 410. Referring to fig. 6, fig. 6 is a fourth assembly schematic diagram of a back panel air conditioner and a server cabinet according to an embodiment of the application. As shown in fig. 6, when one air intake 120 communicates with four mounting cavities 201, each damper module 400 may include four dampers 410, and the four dampers 410 are disposed one-to-one with the four mounting cavities 201, and movement of each damper 410 may be controlled individually.

Illustratively, the configuration of the damper modules 400 is simplified to simplify the control procedure of the damper modules 400 to facilitate controlling the movement of the damper modules 400, and in one embodiment, each damper module 400 includes one damper 410.

The back plate air conditioner provided by the embodiment of the application is described in detail above. Specific examples are set forth herein to illustrate the principles and embodiments of the present application and are provided to aid in the understanding of the present application. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.

Claims (10)

1. A back panel air conditioner, characterized in that is applied to data center, data center includes server rack, install a plurality of servers in the server rack, back panel air conditioner includes:

the shell is provided with an air inlet side and an air outlet side which are opposite, and the air inlet side is used for being connected with the server cabinet; a kind of electronic device with high-pressure air-conditioning system

The heat exchange modules are arranged in the shell and are mutually connected in parallel, and each liquid cooling heat dissipation module is at least positioned on a heat dissipation path of the server.

2. The back panel air conditioner of claim 1, wherein each heat exchange module comprises a liquid inlet end and a liquid outlet end; the back panel air conditioner further includes:

the liquid supply pipe is used for being connected with the supply device and connected with the liquid inlet end of each heat exchange module; a kind of electronic device with high-pressure air-conditioning system

And the liquid return pipe is used for being connected with the recovery device and is connected with the liquid outlet end of each heat exchange module.

3. The back panel air conditioner of claim 1, wherein each of the heat exchange modules comprises at least one surface cooler.

4. A back panel air conditioner according to any one of claims 1 to 3, further comprising a plurality of fan modules, a plurality of the fan modules being disposed in the cabinet, and a plurality of the fan modules being disposed one-to-one with a plurality of the heat exchange modules.

5. The back panel air conditioner of claim 4, wherein a plurality of the fan modules are disposed on a side of the plurality of the heat exchange modules away from the server cabinet.

6. The back panel air conditioner of claim 4, wherein each of said fan modules comprises at least one fan.

7. A back panel air conditioner according to any one of claims 1 to 3, wherein the server cabinet comprises a plurality of mounting cavities for housing the servers; the air inlet side is provided with a plurality of air inlets, and each air inlet is communicated with at least one mounting cavity;

the back plate air conditioner further comprises a plurality of air door modules, the air door modules are arranged on the air inlet side, the air door modules and the air inlets are arranged one to one, and each air door module is used for sealing or opening one air inlet.

8. The back panel air conditioner of claim 7, wherein each of the damper modules includes at least one damper, at least one of the dampers being rotatably disposed on the air intake side.

9. The back panel air conditioner of claim 4, wherein the server cabinet includes a plurality of mounting cavities for housing the servers; the shell comprises a plurality of accommodating grooves, and each accommodating groove is communicated with at least one mounting cavity;

the back plate air conditioner comprises a plurality of refrigeration boxes, each refrigeration box comprises a heat exchange module and a fan module, and the refrigeration boxes are detachably arranged in the accommodating grooves one by one.

10. The back panel air conditioner of claim 4, wherein the server cabinet includes a plurality of mounting cavities for housing the servers; the shell comprises a plurality of accommodating grooves, and each accommodating groove is communicated with at least one mounting cavity;

the heat exchange modules are detachably arranged in the accommodating grooves one by one, the fan modules are detachably arranged in the accommodating grooves one by one, and the heat exchange modules in the accommodating grooves and the fan modules are mutually independent.