US20100275618A1 - System and method for cooling fluid distribution - Google Patents
System and method for cooling fluid distribution Download PDFInfo
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- US20100275618A1 US20100275618A1 US12/433,430 US43343009A US2010275618A1 US 20100275618 A1 US20100275618 A1 US 20100275618A1 US 43343009 A US43343009 A US 43343009A US 2010275618 A1 US2010275618 A1 US 2010275618A1
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- Prior art keywords
- cooling fluid
- heat exchanger
- rack
- airflow
- generating component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0003—Exclusively-fluid systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
Abstract
A system for distributing a cooling fluid in a room containing at least one heat generating component includes a primary heat exchanger having an inlet for receiving the cooling fluid, a heat exchange section configured to facilitate exchange of heat between airflow in the room and the cooling fluid, and an outlet for exhausting heated cooling fluid from the heat exchange section. The system also includes a secondary heat exchanger having a receiving section connected to the second section of a cooling fluid line for receiving heated cooling fluid, a heat exchange section configured to facilitate exchange of heat between the at least one heat generating component and the heated cooling fluid, and an exhaust section configured to exhaust secondarily heated cooling fluid.
Description
- The present application has the same Assignee and shares some common subject matter with U.S. Patent Application Publication No. 2004/0020224, entitled “Cooling System with Evaporators Distributed in Parallel”, filed on Dec. 4, 2002, by Bash et al.; U.S. Patent Application Publication No. 2004/0020226, entitled “Cooling System with Evaporators Distributed in Series”, filed on Dec. 4, 2002, by Bash et al.; U.S. patent application Ser. No. 11/142,557 (Attorney Docket No. 200403658-1), entitled “Air-Cooled Heat Generating Device Airflow Control System”, filed on Jun. 1, 2005; and U.S. patent application Ser. No. 11/142,558 (Attorney Docket No. 200403657-1), entitled “Refrigeration System with Parallel Evaporators and Variable Speed Compressor”, filed on Jun. 1, 2005. The disclosures of the above-listed applications are incorporated by reference in their entireties.
- A data center may be defined as a location, e.g., room, that houses computer systems arranged in a number of racks. A standard rack may be defined as an Electronics Industry Association (EIA) enclosure, 78 in. (2 meters) wide, 24 in. (0.61 meter) wide and 30 in. (0.76 meter) deep. The computer systems typically include a number of components, e.g., one or more of printed circuit boards (PCBs), mass storage devices, power supplies, processors, micro-controllers, semi-conductor devices, and the like, that may dissipate relatively significant amounts of heat during the operation of the respective components.
- Conventional data centers are typically cooled by operation of one or more air conditioning units. The one or more air conditioning units typically receive cooled cooling fluid from a separate cooling apparatus and use the cooled cooling fluid to cool airflow in the data center. In addition, the heated cooling fluid is returned back to the cooling apparatus to be re-cooled and used again in cooling the airflow.
- Features of the present invention will become apparent to those skilled in the art from the following description with reference to the figures, in which:
-
FIGS. 1A-1D show cross-sectional side views of a room containing a cooling fluid distribution system, according to various embodiments of the invention; -
FIGS. 2A and 2B show alternative schematic diagrams of the cooling fluid distribution system depicted inFIGS. 1A-1D , according to embodiments of the invention; -
FIGS. 3A-3D show respective schematic diagrams of portions of the secondary heat exchanger depicted inFIGS. 1A-1D , 2A, and 2B, according to embodiments of the invention; and -
FIG. 4 illustrates a flow diagram of a method of distributing cooling fluid in a room containing a cooling fluid distribution system, according to an embodiment of the invention. - For simplicity and illustrative purposes, the present invention is described by referring mainly to an exemplary embodiment thereof. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent however, to one of ordinary skill in the art, that the present invention may be practiced without limitation to these specific details. In other instances, well known methods and structures have not been described in detail so as not to unnecessarily obscure the present invention.
- Disclosed herein are a system and method of distributing a cooling fluid in a room containing at least one heat generating component. The cooling fluid distribution system includes a primary heat exchanger, a secondary heat exchanger, and a cooling fluid line connecting the primary heat exchanger to the secondary heat exchanger. In one embodiment, the primary heat exchanger is configured to cool airflow supplied into the room through heat exchange with the cooling fluid and the secondary heat exchanger is configured to cool the at least one heat generating component through heat exchange with cooling fluid that has been heated in the primary heat exchanger.
- Thus, the secondary heat exchanger is configured to provide an additional level of cooling to the at least one heat generating component beyond the cooling afforded by the cool airflow supplied by the primary heat exchanger. In addition, the secondary heat exchanger is configured to provide the additional level of cooling through use of the waste heated cooling fluid from the primary heat exchanger. The secondary heat exchanger is able to utilize the heated cooling fluid from the primary heat exchanger because the heated cooling fluid remains at a sufficiently low temperature with respect to the temperature of the at least one heat generating component.
- Through implementation of the systems and method disclosed herein, the secondary heat exchanger is able to utilize available cooling capacity that would otherwise have been wasted by utilizing the heated cooling fluid from the primary heat exchanger. In addition, because the secondarily heated cooling fluid is at a relatively higher temperature than the heated cooling fluid, a cooling apparatus configured to cool the cooling fluid may operate at a relatively higher efficiency. Moreover, the overall cooling system infrastructure cost may be substantially reduced because various parts of the infrastructure may be re-used and the water flow capacity may not need to be increased due to increased demand.
- With reference first to
FIG. 1A , there is shown a cross-sectional side view of aroom 100 containing a coolingfluid distribution system 120, according to an example. It should be understood that theroom 100 and the coolingfluid distribution system 120 may include additional components and that some of the components described herein may be removed and/or modified without departing from a scope of theroom 100 and the coolingfluid distribution system 120. - As depicted in
FIG. 1A , theroom 100, for instance, a data center, houses arack 102, which may house a plurality of heat generating components (not shown), for instance, processors, micro-controllers, memories, semi-conductor devices, and the like. The components may be elements of a plurality of subsystems (not shown), for instance, computers, servers, etc. The subsystems and the components may be implemented to perform various electronic, for instance, computing, switching, routing, displaying, and the like, functions. In the performance of these electronic functions, the components, and therefore the subsystems, may dissipate relatively large amounts of heat. - The
rack 102 is depicted as being positioned on a raisedfloor 104 that forms aspace 106 above a subfloor of theroom 100. Thespace 106 provides an area in which wires, tubes, and the like may be placed. Thespace 106 also operates as a plenum for the delivery of cooledairflow 108 through avent tile 110 into theroom 100 and into therack 102 to cool the heat generating components contained therein. - The cooling
fluid distribution system 120 includes aprimary heat exchanger 130, acooling fluid line 140, and asecondary heat exchanger 150. The coolingfluid distribution system 120 may also include acooling apparatus 160. Thecooling fluid line 140 is depicted as comprising a loop that runs through each of theprimary heat exchanger 130,secondary heat exchanger 150 and thecooling apparatus 160. Although not explicitly shown, a cooling fluid, for instance chilled water, R134a, ethylene glycol mixture, and the like, is contained in thecooling fluid line 140 and is configured to be circulated through the loop. In addition, one ormore pumps 142 may be provided along thecooling fluid line 140 to pressurize the cooling fluid contained therein and cause the cooling fluid to be circulated through thecooling fluid line 140. - The
cooling apparatus 160 is configured to receive heated cooling fluid from either or both of theprimary heat exchanger 130 and thesecondary heat exchanger 150 and to cool the heated cooling fluid. Thecooling apparatus 160 may comprise any reasonably suitable type of cooling apparatus designed to adequately cool the cooling fluid to, for instance, temperatures around 42-48° F. Thecooling apparatus 160 may include a cooling apparatus that implements an air conditioner, a heat exchanger, a heat pump, a variable capacity chiller, an evaporative cooling system, and the like. By way of particular example, thecooling apparatus 160 may comprise a closed-loop refrigeration cycle apparatus having a heat transfer section where the heat from the cooling fluid in acooling fluid line 140 may be transferred to a refrigerant contained in the closed-loop refrigeration cycle apparatus. - Although the
cooling apparatus 160 has been illustrated as being located outside of theroom 100, it should be understood that thecooling apparatus 160 may be positioned within theroom 100 without deviating from the scope of theroom 100 and coolingfluid distribution system 120 depicted inFIG. 1A . - The
primary heat exchanger 130 includes aninlet 132 for receiving cooledcooling fluid 170 from thecooling apparatus 160, aheat exchange section 134 that facilitates exchange of heat between heatedairflow 112 received into theprimary heat exchanger 130 and the cooledcooling fluid 170, and anoutlet 136 for exhausting heatedcooling fluid 172 from theheat exchange section 134. Theprimary heat exchanger 130 may comprise any reasonably suitable apparatus configured to receiveheated airflow 112, to cool theheated airflow 112, and to provide cooledairflow 108 into theroom 100. Theprimary heat exchanger 130 may thus comprise an air conditioning unit, a data center air handler, etc. - The
primary heat exchanger 130 of thecooling distribution system 120 may also comprise, for instance, a ceiling mounted heat exchanger unit. An example of this configuration is depicted inFIG. 1B , which shows a cross-sectional side view of aroom 100 containing the coolingfluid distribution system 120. As shown therein, theprimary heat exchanger 130 is a ceiling based heat exchanger unit configured to delivercool airflow 108 from above therack 102. A more detailed description of various manners in which theprimary heat exchanger 130 may be positioned and operated as a ceiling mounted heat exchanger unit is described in U.S. Patent Application Publication No. 2004/0020226. - The
secondary heat exchanger 150 includes aninlet 152 for receiving heated cooling fluid 172 from theoutlet 136 of theprimary heat exchanger 130, aheat exchange section 154 that facilitates exchange of heat between cooled airflow supplied into therack 102 and theheated cooling fluid 172 received from theprimary heat exchanger 130, and an exhaust section for exhausting the secondarily heated cooling fluid 174 from thesecondary heat exchanger 150. Although thesecondary heat exchanger 150 has been depicted as being positioned at an inlet of therack 102, thesecondary heat exchanger 150 may be positioned at the exhaust of therack 102 to thereby cool airflow heated in therack 102. Thesecondary heat exchanger 150 may comprise various other configurations as discussed in greater detail herein below. - As such, the
secondary heat exchanger 150 is configured to utilize the heated cooling fluid 172 from theprimary heat exchanger 130 to further cool the heat generating components (not shown) housed in therack 102. Theheated cooling fluid 172 in thesecondary heat exchanger 150 may be able to cool the airflow supplied into therack 102 because the airflow temperature may be relatively higher than the temperature of theheated cooling fluid 172. The airflow temperature is often affected by recirculation of heated airflow into the cool airflow supplied into therack 102, which increases the temperature of the cool airflow and which may cause the cool airflow temperature to be substantially higher than theheated cooling fluid 172 temperature. - In another example, and as shown in
FIG. 1C , theprimary heat exchanger 130 may be positioned at the inlet of therack 102 to cool airflow supplied directly into therack 102. In this example, thesecondary heat exchanger 150 may be positioned within therack 102 to directly cool one or moreheat generating components 320 contained in therack 102. - In a further example, and as shown in
FIG. 1D , theprimary heat exchanger 130 may be positioned at the inlet of therack 102, similarly toFIG. 1C . However, in theroom 100 depicted inFIG. 1D , the secondary heat exchanger is positioned at the exhaust of therack 102 to cool airflow exhausted from the one or moreheat generating components 320 contained in the rack. - In all of the examples above, the secondarily heated cooling fluid 174 may be returned to the
cooling apparatus 160 to be cooled again and the process discussed above may be repeated to continuously provide cooling resources to the components contained in theroom 100, while utilizing the waste heated cooling fluid 172 from theprimary heat exchanger 130. - Although the
rooms 100 depicted inFIGS. 1A-1D are illustrated as containing asingle rack 102, a singleprimary heat exchanger 130 and a singlesecondary heat exchanger 150, it should be understood that theroom 100 may contain any number ofracks 102,primary heat exchangers 130, andsecondary heat exchangers 150 without deviating from scope of therooms 100 and the coolingfluid distribution system 120 depicted therein. In addition, the coolingfluid line 140 may be connected from theprimary heat exchanger 130 to a plurality ofsecondary heat exchangers 150 to thereby enable the heated cooling fluid from theprimary heat exchanger 130 to be delivered to the plurality ofsecondary heat exchangers 150. - Turning now to
FIGS. 2A and 2B , there are shown alternative schematic diagrams of the coolingfluid distribution system 120, according to two examples. It should be understood that the coolingfluid distribution systems 120 depicted inFIGS. 2A and 2B may include additional components and that some of the components described herein may be removed and/or modified without departing from scopes of the coolingfluid distribution systems 120. - The cooling
fluid distribution system 120 depicted inFIGS. 2A and 2B include aprimary heat exchanger 130, a plurality ofsecondary heat exchangers 150, and a coolingfluid line 140. As such, the coolingfluid distribution system 120 depicted inFIGS. 2A and 2B include all of the features discussed above with respect to the coolingfluid distribution system 120 depicted inFIGS. 1A-1D . As also discussed above, one ormore pumps 142 may be positioned along either or both of the coolingfluid line 140 and the coolingfluid sub-lines 144 to cause the cooling fluid to be circulated through the coolingfluid line 140 and the coolingfluid sub-lines 144. - With particular reference now to
FIG. 2A , theprimary heat exchanger 130 is depicted as being connected to the plurality ofsecondary heat exchangers 150 through a plurality of coolingfluid sub-lines 144. More particularly, the plurality ofsecondary heat exchangers 150 are depicted as each receiving heated cooling fluid 170 from theprimary heat exchanger 130 and are thus considered as being in a parallel relationship with respect to each other along the coolingfluid sub-lines 144. As such, each of thesecondary heat exchangers 150 receives theheated cooling fluid 170 directly from theprimary heat exchanger 130. - Turning now to
FIG. 2B , theprimary heat exchanger 130 is depicted as being connected to a firstsecondary heat exchanger 150 and the firstsecondary heat exchanger 150 is depicted as being connected to a secondsecondary heat exchanger 150 along the coolingfluid line 140. In other words, the firstsecondary heat exchanger 150 is in a serial relationship with respect to the secondsecondary heat exchanger 150 along the coolingfluid line 140. As such, the secondsecondary heat exchanger 150 is configured to receive secondarilyheated cooling fluid 174 exhausted from the firstsecondary heat exchanger 150 and the firstsecondary heat exchanger 150 may be capable of cooling higher heat loads as compared with the secondsecondary heat exchanger 150. Thus, in one example, the firstsecondary heat exchanger 150 is configured to cool one or more components that generate greater amounts of heat, are more critical, etc., as compared with one or more components that the secondsecondary heat exchanger 150 is configured to cool. - In both of the configurations depicted in
FIGS. 2A and 2B , thesecondary heat exchangers 150 may comprise any of a liquid to air heat exchanger, a liquid to liquid heat exchanger, a cold plate, and a liquid cooled rack heat exchanger as discussed with respect toFIGS. 3A-3D below. In addition, althoughFIGS. 2A and 2B have been depicted as having particular numbers ofprimary heat exchangers 130 andsecondary heat exchangers 150, it should be understood that the coolingfluid distribution systems 120 depicted therein may include any number ofprimary heat exchangers 130 andsecondary heat exchangers 150 without departing from scopes of the coolingfluid distribution systems 120 depicted inFIGS. 2A and 2B . Moreover, various aspects of the configurations depicted inFIGS. 2A and 2B may be merged with each other. Thus, for instance, inFIG. 2B , thesecondary heat exchangers 150 may comprise a plurality of secondary heat exchangers arranged in parallel with respect to each other as shown inFIG. 2A . - With reference now to
FIGS. 3A-3D , there are respectively shown portions of the coolingfluid distribution system 120, according to various examples. It should be understood that the portions of the coolingfluid distribution systems 120 depicted inFIGS. 3A-3D may include additional components and that some of the components described herein may be removed and/or modified without departing from scopes of the coolingfluid distribution systems 120 depicted inFIGS. 3A-3D . - With reference first to
FIG. 3A , thesecondary heat exchanger 150 is depicted as being positioned within the path ofcool airflow 304 supplied into arack 102. In this regard, theheat exchange section 154 of thesecondary heat exchanger 150 is configured to further cool thecool airflow 304 prior to being supplied into therack 102. Theheat exchange section 154 may thus be provided with a plurality of fins or other means for facilitating the transfer of heat from thecool airflow 304 to theheated cooling fluid 172. - As the
cool airflow 304 flows through therack 102 and theheat generating components 320 housed therein, thecool airflow 304 may become heated and may be exhausted asheated airflow 306 from a rear section of therack 102. The transfer of heat from theheat generating components 320 to theairflow 304/306 may dissipate heat from theheat generating components 320, thereby cooling theheat generating components 320. - In addition, or alternatively, a
secondary heat exchanger 150 may be positioned at the rear section of therack 102 to thereby cool theheated airflow 306 exhausted from theheat generating components 320. In this example, the temperature of theheated airflow 306 may be reduced, for instance, when theheated airflow 306 is likely to be recirculated back into therack 102 or into an inlet of another rack. - With reference now to
FIG. 3B , thesecondary heat exchanger 150 is depicted as being positioned within therack 102. In this embodiment, thesecondary heat exchanger 150 is a liquid to air heat exchanger and comprises a plurality ofheat exchange sections 154 configured to cool specificheat generating components 320 housed within therack 102. More particularly, for instance, theheat exchange sections 154 of thesecondary heat exchanger 150 may be in direct contact with one or more of theheat generating components 320 to enable heat from theheat generating components 320 to be directly transferred into theheated cooling fluid 172 at theheat exchange sections 154. - Although the
secondary heat exchanger 150 has been depicted as running through arack 102, it should be understood that thesecondary heat exchanger 150 may also run through individualheat generating components 320 without departing from thesecondary heat exchanger 150 depicted inFIG. 3B . In this example, theheat exchange sections 154 may be positioned to collect heat from particular elements, such as, processors, hard drives, power supplies, etc., of a particularheat generating component 320. - Turning now to
FIG. 3C , theheat generating component 320 is depicted as comprising, for instance, a server, a disk drive, etc., or an element housed in any of these devices, such as, a processor, a hard drive, a power supply, etc. In addition, theheat exchange section 154 of thesecondary heat exchanger 150 is depicted as being in direct contact with theheat generating component 320. As such, thesecondary heat exchanger 150 may be considered as being a cold plate. - Turning now to
FIG. 3D , theheat exchange section 154 of thesecondary heat exchanger 150 is depicted as being in thermal contact with atertiary heat exchanger 330 positioned to cool aheat generating component 320. Thetertiary heat exchanger 330 may include a loop containing a separate cooling fluid configured to be conveyed to different locations in theheat generating component 320. Thetertiary heat exchanger 330 may be configured in any of the configurations depicted inFIGS. 2A , 2B, and 3A-3C. - Generally speaking, the plurality of
secondary heat exchangers 150 may be configured for various cooling applications according to the temperature of theheated cooling fluid 172 and/or secondarily heated cooling fluid 174 supplied by the preceding primary and/orsecondary heat exchanger fluid distribution line 140. For instance, less criticalheat generating components 320 may be positioned to receiveheated cooling fluid - By way of particular example, cold plates that are used to cool servers and/or components contained therein, may utilize
heated cooling fluid secondary heat exchangers - With reference now to
FIG. 4 , there is shown a flow diagram of amethod 400 of distributing cooling fluid in aroom 100 having a coolingfluid distribution system 120, according to an example. It is to be understood that the following description of themethod 400 is but one manner of a variety of different manners in which an example of the invention may be practiced. It should also be apparent to those of ordinary skill in the art that themethod 400 represents a generalized illustration and that other steps may be added or existing steps may be removed, modified or rearranged without departing from a scope of themethod 400. - At
step 402, aprimary heat exchanger 130 is supplied with a cooled cooling fluid 170 from acooling apparatus 160. Atstep 404, theheat exchange section 134 facilitates exchange of heat betweenheated airflow 112 in theroom 100 and the cooled coolingfluid 170. - At
step 406,heated cooling fluid 172 is conveyed from theprimary heat exchanger 130 to thesecondary heat exchanger 150 through the coolingfluid line 140. In addition, atstep 408, one or moreheat generating components 320 contained in theroom 100 are cooled through exchange of heat with theheated cooling fluid 172. Atstep 410, the secondarily heated cooling fluid 174 is conveyed back to thecooling apparatus 160. In addition, steps 402-410 may be repeated in a substantially continuous manner to substantially continuously cool theheat generating components 320 housed in theroom 100. - What has been described and illustrated herein is a preferred embodiment of the invention along with some of its variations. The terms, descriptions and figures used herein are set forth by way of illustration only and are not meant as limitations. Those skilled in the art will recognize that many variations are possible within the spirit and scope of the invention, which is intended to be defined by the following claims—and their equivalents—in which all terms are meant in their broadest reasonable sense unless otherwise indicated.
Claims (20)
1. A system for distributing a cooling fluid in a room containing at least one heat generating component, said system comprising:
a primary heat exchanger having an inlet for receiving the cooling fluid, a heat exchange section configured to facilitate exchange of heat between airflow in the room and the cooling fluid, and an outlet for exhausting heated cooling fluid from the heat exchange section;
a cooling fluid line having a first section and a second section, said first section being connected to the outlet of the primary heat exchanger; and
a secondary heat exchanger having a receiving section connected to the second section of the cooling fluid line for receiving the heated cooling fluid, a heat exchange section configured to facilitate exchange of heat between the at least one heat generating component and the heated cooling fluid from the primary heat exchanger, and an exhaust section configured to exhaust secondarily heated cooling fluid from the secondary heat exchanger.
2. The system according to claim 1 , further comprising:
a cooling apparatus for cooling at least one of the heated cooling fluid from the primary heat exchanger and the secondarily heated cooling fluid from the secondary heat exchanger.
3. The system according to claim 1 , further comprising:
a plurality of secondary heat exchangers having receiving sections, wherein the cooling fluid line is split into a plurality of sub-lines, each of said plurality of sub-lines being connected to a receiving section of a respective secondary heat exchanger, and wherein the plurality of secondary heat exchangers are arranged in a parallel relationship with respect to each other along the plurality of sub-lines.
4. The system according to claim 1 , further comprising:
a plurality of secondary heat exchangers arranged in a serial configuration with respect to each other along the cooling fluid line.
5. The system according to claim 1 , wherein the primary heat exchanger comprises one of a floor based and a ceiling based air conditioning unit.
6. The system according to claim 1 , wherein the at least one heat generating component is housed in a rack having an inlet for receiving airflow and an outlet for exhausting airflow, and wherein the secondary heat exchanger is configured to be positioned in at least one of the inlet and the outlet of the rack to cool airflow that is one of supplied into and exhausted from the rack.
7. The system according to claim 1 , wherein the at least one heat generating component is housed in a rack, and wherein the secondary heat exchanger is configured to be positioned within the rack.
8. The system according to claim 7 , wherein the secondary heat exchanger comprises a plurality of heat exchange sections, said plurality of heat exchange sections being configured to be positioned to cool a plurality of heat generating components contained in the rack.
9. The system according to claim 7 , wherein the heat exchange section of the secondary heat exchanger comprises at least one cold plate configured to be positioned in thermal contact with the at least one heat generating component.
10. The system according to claim 1 , wherein the at least one heat generating component is housed in a rack having an inlet for receiving airflow and an exhaust for exhausting airflow, and wherein the primary heat exchanger is configured to be positioned in the inlet to cool airflow supplied into the rack and wherein the secondary heat exchanger is configured to be positioned within the rack to directly cool the at least one heat generating component housed in the rack.
11. The system according to claim 1 , wherein the at least one heat generating component is housed in a rack having an inlet for receiving airflow and an exhaust for exhausting airflow, and wherein the primary heat exchanger is configured to be positioned in the inlet to cool airflow supplied into the rack and wherein the secondary heat exchanger is configured to be positioned in the to exhaust to cool airflow exhausted from the rack.
12. The system according to claim 1 , further comprising a tertiary heat exchanger containing a separate cooling fluid, wherein the heat exchange section of the secondary heat exchanger is configured to facilitate heat transfer from the separate cooling fluid contained in the tertiary heat exchanger and the heated cooling fluid.
13. The system according to claim 1 , wherein the cooling fluid comprises one of the group consisting of chilled water, R134a, and ethylene glycol mixture.
14. A method of distributing cooling fluid in a room, said method comprising:
supplying a primary heat exchanger with cooled cooling fluid from a cooling apparatus, wherein the primary heat exchanger comprises a heat exchange section that cools airflow supplied into the room thereby causing the cooling fluid to become heated; and
conveying the heated cooling fluid from the primary heat exchanger to a secondary heat exchanger, said secondary heat exchanger being configured to facilitate heat exchange between at least one heat generating component housed in the room and the heated cooling fluid, thereby causing the heated cooling fluid to become secondarily heated.
15. The method according to claim 14 , further comprising:
conveying at least one of the heated cooling fluid and the secondarily heated cooling fluid to the cooling apparatus.
16. A data center comprising:
at least one heat generating component;
a cooling fluid distribution system for cooling the at least one heat generating component, said cooling fluid distribution system comprising,
a primary heat exchanger having an inlet for receiving the cooling fluid, a heat exchange section configured to facilitate exchange of heat between airflow in the data center and the cooling fluid, and an outlet for exhausting heated cooling fluid from the heat exchange section;
a cooling fluid line having a first section and a second section, said first section being connected to the outlet of the primary heat exchanger; and
a secondary heat exchanger having a receiving section connected to the second section of the cooling fluid line for receiving the heated cooling fluid, a heat exchange section configured to facilitate exchange of heat between the at least one heat generating component and the heated cooling fluid from the primary heat exchanger, and an exhaust section configured to exhaust secondarily heated cooling fluid from the secondary heat exchanger.
17. The data center according to claim 16 , further comprising:
at least one rack having an inlet for receiving airflow and an exhaust for exhausting airflow, wherein the at least one heat generating component is housed in the at least one rack, and wherein the secondary heat exchanger is positioned on at least one of the inlet and the exhaust of the rack.
18. The data center according to claim 16 , further comprising:
at least one rack, wherein the at least one heat generating component is housed in the at least one rack, and wherein the secondary heat exchanger is positioned within the rack and configured to directly cool the at least one heat generating component.
19. The data center according to claim 16 , further comprising:
at least one rack having an inlet for receiving airflow and an exhaust for exhausting airflow, wherein the at least one heat generating component is housed in the at least one rack, and wherein the primary heat exchanger is positioned in the inlet to cool airflow supplied into the rack and wherein the secondary heat exchanger is positioned within the rack to directly cool the at least one heat generating component housed in the rack.
20. The data center according to claim 16 , further comprising:
at least one rack having an inlet for receiving airflow and an exhaust for exhausting airflow, wherein the at least one heat generating component is housed in the at least one rack, and wherein the primary heat exchanger is positioned in the inlet to cool airflow supplied into the rack and wherein the secondary heat exchanger is positioned in the exhaust to cool airflow exhausted from the rack.
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US12/433,430 US20100275618A1 (en) | 2009-04-30 | 2009-04-30 | System and method for cooling fluid distribution |
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US12/433,430 US20100275618A1 (en) | 2009-04-30 | 2009-04-30 | System and method for cooling fluid distribution |
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US8955347B2 (en) | 2011-07-21 | 2015-02-17 | International Business Machines Corporation | Air-side economizer facilitating liquid-based cooling of an electronics rack |
US20150337691A1 (en) * | 2014-05-23 | 2015-11-26 | Google Inc. | Providing power to a data center |
DE102015101022B3 (en) * | 2015-01-23 | 2016-04-07 | Rittal Gmbh & Co. Kg | Data Center |
WO2017050344A1 (en) * | 2015-09-21 | 2017-03-30 | Abb Schweiz Ag | Cooling arrangement for example for cooling a converter valve hall |
EP3182026A1 (en) * | 2015-12-17 | 2017-06-21 | Eisenmann SE | Air feed assembly with cooling device |
EP3829279B1 (en) * | 2019-11-29 | 2024-01-24 | Ovh | Cooling arrangement for autonomous cooling of a rack |
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Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BEITELMAL, ABDIMONEM;BASH, CULLEN E.;SIGNING DATES FROM 20090429 TO 20090430;REEL/FRAME:022673/0214 |
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