CN107690267B - Data center cooling system and data center - Google Patents
Data center cooling system and data center Download PDFInfo
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- CN107690267B CN107690267B CN201710919651.4A CN201710919651A CN107690267B CN 107690267 B CN107690267 B CN 107690267B CN 201710919651 A CN201710919651 A CN 201710919651A CN 107690267 B CN107690267 B CN 107690267B
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- 238000001816 cooling Methods 0.000 title claims abstract description 257
- 239000007788 liquid Substances 0.000 claims abstract description 138
- 239000000110 cooling liquid Substances 0.000 claims abstract description 130
- 239000000498 cooling water Substances 0.000 claims description 91
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 38
- 230000017525 heat dissipation Effects 0.000 claims description 35
- 239000012809 cooling fluid Substances 0.000 claims description 17
- 238000001914 filtration Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 description 29
- 238000010586 diagram Methods 0.000 description 12
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000002480 mineral oil Substances 0.000 description 3
- 235000010446 mineral oil Nutrition 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a data center cooling system and a data center, which are used for solving the problem that the data center cooling system and the data center which are widely applied, high-efficiency, energy-saving and low in cost cannot be provided in the prior art. The data center cooling system comprises a liquid cooling pond for loading cooling liquid; the cooling units are placed in the liquid cooling pool and are alternately arranged with the servers; and the server is placed in the liquid cooling pool and immersed in the cooling liquid, and a flow channel is formed between the cooling liquid and the server as well as between the cooling liquid and the cooling unit, wherein the top and the bottom of the server are respectively provided with a first interval and a second interval with the cooling liquid. In the embodiment of the invention, the spaces are reserved between the bottom and the top of the server and the cooling liquid, so that the generated height difference can form an omnibearing cooling liquid flowing channel around the server, so that the cooling liquid can more effectively circulate between the cooling unit and the server, and the uniformity of the cooling liquid when flowing through the server is improved.
Description
Technical Field
The invention relates to the technical field of liquid cooling, in particular to a data center cooling system and a data center.
Background
With the rapid increase of global demand for computing, data storage and communication technologies, the demand for data centers has increased more and more in recent years, the total amount has exceeded 40 tens of thousands, the annual power consumption has been about 8325 hundred million kilowatt-hours, and has exceeded 1.5% of the total social power consumption. Four of these are consumed by the data center refrigeration system. With the expansion of the data center machine room, the refrigeration cost and the maintenance cost are greatly increased year by year. There is a strong interest in solving the problem of increasing cooling consumption of data center equipment.
Because the specific volume and specific heat capacity of air are lower, the current method of simply reducing the air supply temperature and increasing the air quantity to meet the heat dissipation requirement of a server has met the bottleneck. The power of the servers which can be borne by a single rack of the air-cooled server rack which is common in the market at present is 3-20 kW. The specific volumetric specific heat capacity of the cooling fluid used in the liquid cooled data center is 1000-1200 times that of air, which allows for server power to be accommodated by a single liquid cooled server rack of 20-100 kW or even higher.
In the prior art, manufacturers have tried to package electronic components in the whole server in a sealed shell, and the inside of the package is filled with cooling liquid to dissipate heat, so that the scheme also has the problems of higher packaging cost, complex sealing process and poor universality. There are also manufacturers attempting to soak the servers with a low boiling point cooling medium, removing the heat generated by the servers by the continuous evaporation of the cooling medium, and re-condensing it into a liquid through a condensing coil that is fed with cooling water. However, such low boiling point cooling media are very expensive and the implementation process is complex, and thus such techniques have not been applied on a large scale.
In view of the foregoing, the prior art cannot provide a data center cooling system and a data center that are widely used, efficient, energy-saving and low-cost.
Disclosure of Invention
The invention provides a data center cooling system and a data center, which are used for solving the problem that the data center cooling system and the data center which are widely applied, high-efficiency, energy-saving and low in cost cannot be provided in the prior art.
The embodiment of the invention provides a data center cooling system, which comprises the following components: the liquid cooling pool is used for loading cooling liquid; cooling units placed in the liquid cooling tank and alternately arranged with the servers; and the server is placed in the liquid cooling pool and immersed in the cooling liquid, and a flow channel is formed between the cooling liquid and the server and between the cooling liquid and the cooling unit, wherein the top and the bottom of the server are respectively provided with a first interval and a second interval with the cooling liquid.
Further, the first and second pitches are determined according to a maximum designed circulation amount of the cooling liquid.
Further, the cooling unit further comprises a circulating pump and a heat exchanger, wherein the configuration ratio of the circulating pump to the heat exchanger is N:1, N is a natural number greater than zero.
Further, the cooling unit further comprises a liquid outlet and a liquid return port, wherein the liquid return port is used for enabling the cooling liquid at the upper part of the server to enter the circulating pump through the liquid return port; the liquid outlet is used for guiding the cooling liquid cooled by the heat exchanger to the bottom of the server through the liquid outlet.
Further, the cooling unit further comprises a first filter screen for filtering the cooling liquid, and the first filter screen is positioned at the upper part of the circulating pump.
Further, the data center cooling system further comprises a cooling water supply pipe, a cooling water return pipe and outdoor heat dissipation equipment;
one end of the cooling water supply pipe is connected with a water inlet of a heat exchanger of the data center, and the other end of the cooling water supply pipe is connected with an outlet of the outdoor heat dissipation device; the cooling water supply pipe is used for guiding the cooling water cooled by the outdoor heat dissipation device into the heat exchanger;
one end of the cooling water return pipe is connected with the water outlet of the heat exchanger, and the other end of the cooling water return pipe is connected with the inlet of the outdoor heat dissipation device; the cooling water return pipe is used for guiding cooling water for cooling liquid in the heat exchanger into the outdoor heat dissipation device;
the outdoor heat dissipation device is used for cooling the cooling water.
Further, the data center cooling system further comprises a micro pump and a flow guide pipe, wherein the micro pump is placed above the server, the flow guide pipe is further arranged above the server, and the micro pump is used for sucking cooling liquid in the liquid cooling pool through the flow guide pipe and outputting the cooling liquid to the liquid cooling pool so that the cooling liquid is cooled.
Further, the data center cooling system further comprises:
and one end of the overflow pipe is connected with the micro pump, and the overflow pipe is used for converging the cooling liquid pumped by the micro pump.
Further, the data center cooling system further comprises:
and the inlet of the heat pool is connected with one end of the overflow pipe, and the heat pool is used for converging the cooling liquid in the overflow pipe.
Further, the data center cooling system further comprises:
the second filter screen is positioned between the hot pool and the overflow pipe and is used for filtering the cooling liquid.
Further, the central cooling system further comprises: a heat exchanger, an outdoor heat-dissipating device;
the first inlet of the heat exchanger is connected with the outlet of the heat pool, and the first outlet of the heat exchanger is connected with the inlet of the outdoor heat radiation equipment; the outdoor heat dissipation device is used for cooling water;
the second inlet of the heat exchanger is connected with the outlet of the outdoor heat radiation device, and the second outlet of the heat exchanger is connected with the liquid cooling pool;
the heat exchanger is used for cooling the cooling liquid in the heat pool by using cooling water.
Further, the data center cooling system further comprises:
and the second outlet of the heat exchanger is connected with the liquid cooling pool through the cooling liquid circulating pump, and the cooling liquid circulating pump is used for inputting the cooling liquid cooled by the heat exchanger back to the liquid cooling pool.
Further, the micro pump operates at a first speed and the coolant circulation pump operates at a second speed.
Further, the data center cooling system further comprises a cooling liquid temperature detector, wherein the cooling liquid temperature detector is positioned in the liquid cooling pool and is used for detecting the temperature of the cooling liquid and sending a rotation speed adjusting signal to the micro pump according to the set relation between the temperature of the cooling liquid and the rotation speed of the micro pump.
Further, the data center cooling system further comprises a cooling water regulating valve, wherein the cooling water regulating valve is positioned at the cooling water inlet end of the heat exchanger and is used for regulating the flow of the cooling water by regulating the opening degree of the cooling water regulating valve.
The embodiment of the invention also provides a data center, which comprises the data center cooling system.
In the embodiment of the invention, the cooling liquid pumped by the circulating pump in the data center cooling system is cooled by the heat exchanger, and the cooling water in the heat exchanger is radiated by the outdoor radiating equipment. Compared with the traditional cooling system, the data center cooling system provided by the embodiment of the invention has the advantages that the structure is simple, and the construction cost of the cooling system is reduced. In addition, the data center cooling system in the embodiment of the invention further comprises a micro pump and a cooling liquid circulating pump, the whole system can be divided into two parts by independently adjusting the rotation speeds of the two different pumps, one part is the circulation of the liquid cooling pool-heat exchanger, the other part is the heat exchanger-outdoor heat dissipation equipment, and the two parts can independently operate and cannot influence each other.
In the embodiment of the invention, the data center can cool the servers placed in the system by utilizing the cooling units in the system, so that the construction cost of the data center is reduced and the reliability of the data center is improved compared with the traditional data center.
In the embodiment of the invention, the spaces are reserved between the bottom and the top of the server and the cooling liquid, so that the generated height difference can form an omnibearing cooling liquid flowing channel around the server, so that the cooling liquid can more effectively circulate between the cooling unit and the server, and the uniformity of the cooling liquid when flowing through the server is improved. And because through outdoor heat-dissipating equipment, need not to carry out other treatments to the cooling water, just can cool off the cooling water, need not to use the installation frame to place the server, place the position restriction less to cooling unit and server, not inject the subregion, therefore space utilization is high, and the change of data center is less, has reduced data center's cost.
In the embodiment of the invention, the data center comprises a data center cooling system, a cooling water supply pipe, a water return pipe and outdoor heat dissipation equipment, wherein the cooling water supply pipe is used for introducing cooling water after heat dissipation of the outdoor heat dissipation equipment to a heat exchanger of the data center cooling system, the cooling water return pipe is used for introducing cooling water after temperature rise in the heat exchanger of the data center cooling system to the outdoor heat dissipation equipment, and the heat dissipation is carried out through the outdoor heat dissipation equipment, so that the cooling function of the heat exchanger is ensured, and the cooling effect of a server in the data center is further ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a cooling unit according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another cooling unit according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a cooling water channel and a gate-shaped cooling liquid channel of a cooling unit according to an embodiment of the present invention;
FIG. 4 is a schematic view of a cooling water channel and a circular arc-shaped cooling liquid channel with openings of a cooling unit according to an embodiment of the present invention;
FIG. 5 is a schematic view of a cooling water channel and a zigzag arc-shaped cooling liquid channel of a cooling unit according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a gate-shaped cooling water channel and a cooling liquid channel of a cooling unit according to an embodiment of the present invention;
FIG. 7 is a schematic view of a circular arc-shaped cooling water channel with an opening and a cooling liquid channel of a cooling unit according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a partially overlapped cooling water channel and cooling liquid channel of a cooling unit according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a cooling unit according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of another cooling unit according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a partial cross-sectional structure of a cooling system for a data center according to an embodiment of the present invention;
FIG. 12 is a schematic view of a partial cross-sectional structure of another cooling system for a data center according to an embodiment of the present invention;
FIG. 13 is a schematic diagram of a cooling system for a data center according to an embodiment of the present invention;
FIG. 14 is a schematic view of a portion of a cooling system for a data center according to an embodiment of the present invention;
FIG. 15 is a schematic view of a portion of a cooling system for a data center including a heat sink according to an embodiment of the present invention;
FIG. 16 is a schematic diagram of a data center cooling system including a heat exchanger and an outdoor heat sink according to an embodiment of the present invention;
FIG. 17 is a schematic diagram of a data center cooling system including a coolant regulator valve and a coolant temperature detector according to an embodiment of the present invention;
FIG. 18 is a schematic diagram of a portion of a data center according to an embodiment of the present invention;
fig. 19 is a schematic view of a portion of another data center according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In an embodiment of the present invention, a data center refers to a complete set of facilities for housing computer systems and related components, capable of housing multiple servers and their associated equipment. The server, also referred to as a server, in the embodiment of the present invention is a device that provides a computing service.
The present invention provides a cooling unit 100 for an immersion server, as shown in fig. 1, the cooling unit 100 includes a circulation pump 101 and a heat exchanger 102, and the cooling unit 100 has a circulating coolant passage outside the heat exchanger 102 and a cooling water passage inside the heat exchanger 102, the circulation pump 101 for driving a circulation behavior of the coolant passage.
In the embodiment of the present invention, the cooling liquid is a liquid with a certain dielectric strength, and various electronic components on the server 130 can normally operate in the liquid without any modification. In addition, the cooling liquid should have the characteristics of nonflammability, innocuity, no peculiar smell and the like. Alternatively, the cooling fluid may be, but is not limited to, mineral oil, synthetic oil, hydrofluoroether, or the like.
The cooling unit 100 in the embodiment of the present invention has two circulation passages, and circulation of the cooling liquid is achieved by circulation of the cooling water, so that heat exchange can be performed at the heat exchanger 102 portion, and thus the cooling liquid can be cooled.
Optionally, the configuration ratio of the circulation pump 101 to the heat exchanger 102 in the cooling unit 100 in the embodiment of the present invention is N:1, n is a natural number greater than zero, that is, in one cooling unit 100, there may be a plurality of circulation pumps 101 and one heat exchanger 102, for example, as shown in fig. 2, each cooling unit 100 includes two circulation pumps 101 and one heat exchanger 102, that is, by the circulation action of the two circulation pumps 101, the circulation of the cooling liquid, that is, the cooling of the cooling liquid, can be accelerated.
Optionally, in the embodiment of the present invention, in order to have two independent circulation channels, the cooling unit 100 further includes a liquid outlet 103 and a liquid return port 104, where the liquid outlet 103, the liquid return port 104 and the circulation pump 101 form a cooling liquid circulation channel.
Alternatively, in the embodiment of the present invention, the path of the cooling liquid channel is in a gate shape, or has an open circular arc shape or is in a zigzag shape, for example, as shown in fig. 3, if the path of the cooling liquid channel is in a gate shape, it may be determined that the liquid outlet 103 and the liquid return port 104 are located at the lower portion of the cooling unit 100, and the liquid outlet 103 and the liquid return port 104 are located at two sides of the lower portion of the cooling unit 100, so that the path of the cooling liquid channel can be in a gate shape.
For example, as shown in fig. 4, the path of the cooling liquid channel is an arc with an opening, the liquid return port 104 may be disposed at the upper portion of the cooling unit 100, the liquid outlet 103 may be disposed at the lower portion of the cooling unit 100, and the liquid return port 104 and the liquid outlet 103 may be located at the same side of the cooling unit 100, so that the path of the cooling liquid channel may be an arc with an opening.
For example, as shown in fig. 5, when the liquid outlet 103 is located at the lower part of the cooling unit 100, the liquid return port 104 is located at the upper part of the cooling unit 100, and the liquid outlet 103 and the liquid return port 104 are located at both sides of the cooling unit 100, the path of the cooling liquid channel is zigzag-like.
In the above embodiment, when the path of the coolant passage is arc-shaped or zigzag-shaped with an opening, the coolant can be made to flow over a larger area, so that a better cooling effect is provided.
Optionally, in the embodiment of the present invention, the heat exchanger 102 further includes a water outlet 105 and a water inlet 106, and the water outlet 105, the water inlet 106, and the heat exchanger 102 form a cooling water circulation channel. That is, the cooling liquid passing through the water inlet 106 passes through the heat exchanger 102 and then is output through the water outlet 105, forming an independent cooling water circulation passage.
Alternatively, in the embodiment of the present invention, the water outlet 105 and the water inlet 106 are located at different positions of the heat exchanger 102, which determines different paths of the cooling water circulation channel. For example, as shown in fig. 6, both the water outlet 105 and the water inlet 106 are located at the bottom of the heat exchanger 102, and the path of the formed cooling water channel is shaped like a gate; as shown in fig. 7, when the water outlet 105 is located at the bottom of the heat exchanger 102 and the water inlet 106 is located at the upper portion of the heat exchanger 102, the path of the cooling water passage is formed in a circular arc shape with an opening.
Optionally, in the embodiment of the present invention, since the positions of the liquid outlet 103 and the liquid return 104 are different, the circulation path of the cooling liquid is changed, and the positions of the water outlet 105 and the water inlet 106 are different, the circulation path of the cooling liquid and the circulation path of the cooling water may be partially overlapped, for example, as shown in fig. 8, when the liquid return 104 is located at the upper portion of the cooling unit 100, the liquid outlet 103 is located at the lower portion of the cooling unit 100, and the liquid return 104 and the liquid outlet 103 are located at the same side of the cooling unit 100, and when the water outlet 105 is located at the bottom of the heat exchanger 102, and the water inlet 106 is located at the upper portion of the heat exchanger 102, the formed cooling water path and the cooling liquid path may be partially overlapped.
Optionally, in the embodiment of the present invention, in order to increase the cooling area of the cooling liquid, the cooling water pipes in the heat exchanger 102 may be folded and tightly arranged, so as to increase the transmission volume of the cooling water and improve the cooling efficiency of the cooling liquid, for example, as shown in fig. 9, the cooling water pipes in the heat exchanger 102 are folded and tightly arranged in the heat exchanger 102, so as to increase the volume of the cooling water and more effectively improve the heat exchange efficiency.
Alternatively, in embodiments of the present invention, the heat exchanger 102 may be a shell and tube heat exchanger or a plate heat exchanger.
Optionally, as shown in fig. 10, the cooling center 100 further includes a flow guide cover 107, where the flow guide cover 107 is located in the cooling liquid channel, and the flow guide cover 107 fixes the circulation pump 101 by a user, and the flow guide cover 107 has a flow guide function to guide the cooling liquid sucked by the circulation pump 101 into the heat exchanger 102. The pod 107 may be funnel-shaped in shape to facilitate the introduction of cooling fluid into the heat exchanger 102.
Optionally, the cooling unit 100 further includes a filter screen 108, where the filter screen 108 is located in the cooling liquid channel, and filters the cooling liquid that is ready to be sucked into the heat exchanger 102, so as to prevent impurities in the cooling liquid from affecting the cooling effect. For better filtering effect, the filter screen 108 is optionally located at the upper part of the air guide sleeve 107, and can filter the cooling liquid which does not enter the air guide sleeve 107.
In the alternative, the cooling unit 100 shown in fig. 10 includes a circulation pump 101, a heat exchanger 102, a liquid outlet 103, a liquid return port 104, a water outlet 105, a water inlet 106, a flow guide cover 107 and a filter screen 108; in the embodiment of the present invention, the ratio of the circulation pump 101 to the heat exchanger 102 is 2:1, the filter screen 108 is located at the upper part of the cooling unit 100, the liquid return port 104 is located at the upper part of the cooling unit 100, the guide cover 107 is used for fixing the circulating pump 101, the circulating pump 101 is located at the upper part of the heat exchanger 102, the liquid outlet 103 is located at the lower part of the cooling unit 100, and the liquid return port 104 and the liquid outlet 103 are both located at the same side of the cooling unit 100.
The water outlet 105 is located at the lower part of the cooling unit 100, the water inlet 106 is located at the upper part of the cooling unit 100, and the water outlet 105 and the water inlet 106 are located at the same side of the cooling unit 100.
In the embodiment of the invention, the cooling liquid channel is a path formed by the liquid return port 104, the air guide sleeve 107, the filter screen 108, the circulating pump 101 and the liquid outlet 103, the path of the cooling liquid channel is an arc with an opening, the cooling liquid channel is a path formed by the water inlet 106, the heat exchanger 102 and the water outlet 105, and the path of the cooling liquid channel is an arc with an opening.
The embodiment of the present invention further provides a data center cooling system 200 having the cooling unit 100 in any one of the embodiments of fig. 1 to 10, in the data center cooling system 200, the cooling unit 100 is used to cool the server 201 in the data center cooling system 200, so the data center cooling system 200 in the embodiment of the present invention at least includes the liquid cooling tank 202, the cooling unit 100, and the server 201 as shown in fig. 11.
Alternatively, in the embodiment of the present invention, the liquid cooling tank 202 is a structure with an open upper portion, a certain internal volume surrounded by four walls and a bottom surface, and the internal volume of the liquid cooling tank 202 is filled with the cooling liquid.
In the embodiment of the present invention, the cooling liquid is a liquid with a certain dielectric strength, and various electronic components on the server 130 can normally operate in the liquid without any modification. In addition, the cooling liquid should have the characteristics of nonflammability, innocuity, no peculiar smell and the like. Alternatively, the cooling fluid may be, but is not limited to, mineral oil, synthetic oil, hydrofluoroether, or the like.
In the embodiment of the present invention, the liquid cooling tank 202 is filled with the cooling liquid, the server 201 is vertically immersed in the liquid cooling tank 202, the liquid level of the liquid cooling tank 202 is higher than the top of the server 201, the cooling unit 100 is also immersed in the liquid cooling tank 202, and the cooling units 100 and the server 201 are alternately arranged.
The server 201 can be freely lifted vertically upwards into the liquid cooling tank 202 or vertically downwards into the liquid cooling tank 202, and the working state of other servers 201 is not affected in the process of placing or extracting.
Alternatively, in the embodiment of the present invention, the servers 201 are vertically disposed in the liquid cooling tank 202, and each server 201 is closely adjacent to each other in the liquid cooling tank 202, so that as many servers 201 as possible can be disposed in the liquid cooling tank 202 in a unit area.
In an embodiment of the present invention, the ratio of the cooling unit 100 to the server 201 may be 1:1, can also be N:1, N is a natural number greater than zero. Optionally, in the embodiment of the present invention, one server 201 is located on each side of each cooling unit 100, that is, any one cooling unit 100 and its adjacent cooling units 100 may form a redundant configuration, and when one cooling unit 100 fails, the adjacent cooling units 100 may continue to dissipate heat for the surrounding servers 201.
Optionally, in the embodiment of the present invention, the circulation process of the cooling liquid and the cooling water in the data center cooling system 200 is shown in fig. 12, in the embodiment of the present invention, the cooling unit 100 includes a circulation pump 101 and a heat exchanger 102, includes a liquid outlet 103 and a liquid return port 104, includes a water outlet 105 and a water inlet 106, includes a flow guide cover 107, and further includes a server 201 disposed adjacently in the data center cooling system 200, and both the cooling center 100 and the server 201 are immersed in the liquid cooling pool 202.
The circulation pump 101 sucks the coolant from both sides of the cooling unit 100 into the cooling unit 100, and the heat exchanger 102 cools the sucked coolant and then discharges the coolant again into the liquid cooling tank 202 after cooling.
In order to reduce the modification of the existing data center cooling system and fully utilize natural heat dissipation to reduce energy waste in the data center cooling system 200 in the embodiment of the present invention, the data center cooling system 200 in the embodiment of the present invention further includes an outdoor heat dissipation device 203, where the outdoor heat dissipation device 203 is used to cool cooling water, and when heat exchange is performed in the heat exchanger 102, the temperature of the cooling water is increased, and in order to continuously cool the cooling liquid, the cooling water after the temperature increase needs to be cooled, and in the embodiment of the present invention, heat dissipation is performed by the outdoor heat dissipation device 203.
Optionally, in an embodiment of the present invention, as shown in fig. 13, the data center cooling system 200 further includes a cooling water supply pipe 204 and a cooling water return pipe 205, one end of the cooling water supply pipe 204 is connected to the water outlet 105 of the cooling unit 100, the other end of the cooling water supply pipe 204 is connected to the outdoor heat dissipation device 203, one end of the cooling water return pipe 205 is connected to the water inlet 106 of the cooling unit 100, and the other end of the cooling water return pipe 205 is connected to the outdoor heat dissipation device 203.
Optionally, in the embodiment of the present invention, the outdoor heat dissipation device 203 further includes a cooling module 2031 and a cold water circulation pump 2032, where the cooling module 2031 may be of various types, including: natural cooling modules (generally referred to as open or closed cooling towers, dry coolers, etc.), mechanical refrigeration (generally referred to as various devices using vapor compression refrigeration, such as a chiller unit, a direct evaporation refrigeration unit, etc.), and heat recovery devices (which may be various heat exchangers or water source heat pumps, etc.). The cooling module 2031 may be one or a combination of the above devices.
The cooling water circulation pump 2032 is for driving cooling water to circulate between the respective cooling units 100 and the cooling module 2031. The cooling water exchanges heat with the cooling liquid in the heat exchanger 102 in the cooling unit 100, and absorbs heat in the cooling liquid. The cooling water after absorbing heat enters the cooling water supply pipe 204 through the water outlet 105 and enters the cooling module 2301, and the cooling module 2301 discharges heat to the natural environment or recycles the waste heat. The re-cooled cooling water is supplied to the heat exchangers 102 in the respective cooling units 100 through the cooling water return pipe 205.
In the embodiment of the present invention, the higher temperature coolant in the upper portion of the liquid cooling tank 202 is maintained in a specific temperature range, and the energy consumed for cooling the servers can be reduced as much as possible while ensuring that the plurality of servers 201 are sufficiently cooled. Generally, the temperature range is typically 35 to 48 ℃. Because the temperature is higher than the environmental temperature of most areas, the heat dissipation of the liquid cooling data center can be satisfied by using natural heat dissipation in most areas, and no additional mechanical refrigeration is needed.
Optionally, in an embodiment of the present invention, the data center cooling system 200 further includes a cover 206, where the cover 206 is configured to prevent dust or debris from falling into the liquid cooling pond 202. While the cover 206 is designed to withstand a certain weight, such as: personnel on the cover 206 can operate or handle the server 201, and the operation and maintenance kit can move on the cover, etc. The cover plate 206 shields the liquid cooling tank 202 and divides the upper region of the liquid cooling tank 202 into operation and maintenance spaces, thereby fully utilizing the space in the vertical direction and improving the space utilization rate of the data center.
In the embodiment of the present invention, there is another data center cooling system 300 in addition to the data center cooling system 200 in the above embodiment, in which the cooling unit 100 is not used in the data center cooling system 300, but a liquid cooling tank 301 filled with a cooling liquid, a server 302 immersed in the liquid cooling tank 301, and a micropump 303 provided above the server 302 are included; the micro pump 303 sucks the cooling liquid in the liquid cooling tank out of the liquid cooling tank through the flow guide pipe 304, so that the cooling liquid can be cooled, and the micro pump 303 sucks the cooling liquid above the server 302, so that the cooling liquid in the liquid cooling tank 301 can be circulated, and the server 302 immersed in the liquid cooling tank 301 can be better cooled.
Alternatively, in the embodiment of the present invention, the liquid cooling tank 301 is a structure with an open upper portion, and a certain internal volume surrounded by four walls and a bottom surface, and the internal volume of the liquid cooling tank 301 is filled with the cooling liquid. Optionally, in the embodiment of the present invention, the cooling liquid is a liquid with a certain dielectric strength, and various electronic components on the server 302 can normally operate in the liquid without any modification. In addition, the cooling liquid should have the characteristics of nonflammability, innocuity, no peculiar smell and the like. Alternatively, the cooling fluid may be, but is not limited to, mineral oil, synthetic oil, hydrofluoroether, or the like.
As shown in fig. 14, the micropump 303 is located above the server 302, and the configuration between the micropump 303 and the server 302 may be N:1, N is a natural number other than 0; the micropumps 303 are arranged in a row like the server 302, and a plurality of micropumps 303 may be arranged in one liquid cooling tank 301. Any micropump 303 may form a redundant configuration with its nearby micropump 303, i.e., when one micropump 303 fails, the flow of coolant pumped by the nearby micropump 303 may still maintain the heat dissipation requirements of the area server 302.
In the embodiment of the present invention, the flow guide pipe 304 serves to restrict the flow of the cooling liquid, so as to ensure that the micro pump 303 can uniformly suck the cooling liquid at the upper part of the server 302. In general, the suction port of the micro pump 303 has only one small hole, and the direct suction of the coolant through the suction port may result in a situation where more coolant is drawn from the upper part of the server 302 and less or even no coolant is drawn from the upper part of the other server 302. The flow guide pipe 304 is used to restrict the flow of the cooling liquid in the embodiment of the present invention, so that the micro pump 303 is ensured to uniformly suck the cooling liquid in the upper portion of the server 302.
Alternatively, in the embodiment of the present invention, the flow guiding tube 304 may be a square tube with two closed ends, the upper portion of the square tube is connected to the suction inlet of the micro pump 303, and the square tube is provided with a plurality of small holes on a side facing the server 302.
Optionally, in an embodiment of the present invention, as shown in fig. 15, in the data center cooling system 300, in order to facilitate collecting the cooling liquid extracted by the plurality of micropumps 303, the data center cooling system 300 further includes an overflow pipe 305; the overflow pipe 305 is used to collect the coolant extracted from the micropump 303 in a row or column.
Optionally, in the embodiment of the present invention, in order to facilitate the aggregation of the cooling liquids collected by the overflow pipes 305 and facilitate the treatment of the aggregated cooling liquids, the data center cooling system 300 further includes a heat pool 306, where the heat pool 306 is connected to the plurality of overflow pipes 305 and aggregates the cooling liquids collected by the overflow pipes 305, and the working state of the circulation pump 305 is not affected.
Alternatively, to ensure stability of the circulation of the coolant in the system, the effective volume of the heat sink 306 is typically sized to accommodate a circulation of the coolant of 10 to 15 minutes.
Optionally, in the embodiment of the present invention, the data center cooling system 300 further includes a filter screen 307, where the filter screen 307 is located between the heat sink 306 and the overflow pipe 305, and the filter screen 307 is used to filter the cooling liquid that is about to enter the heat sink 306, so as to prevent impurities in the cooling liquid from affecting the normal operation of the data center cooling system 300.
Optionally, to enable the pumped coolant to be cooled, the data center cooling system 300 further includes a heat exchanger 308, where the heat exchanger 308 uses cooling water to cool the coolant in the heat tank 306, and the cooled coolant is led back to the liquid cooling tank 301, so that the temperature of the coolant in the liquid cooling tank 301 is kept within a stable temperature, and a circulation of the coolant can be configured, so that the server 302 immersed in the liquid cooling tank 301 performs a cooling function.
Optionally, in the embodiment of the present invention, since the heat exchanger 308 uses cooling water to cool the cooling liquid, the cooling water also needs to dissipate heat after heating, in order to reduce modification of the existing cooling system of the data center, and fully utilize natural heat dissipation to reduce energy waste, the cooling system 300 of the data center further includes an outdoor heat dissipation device, where the outdoor heat dissipation device is used to cool the cooling water.
Also, in the embodiment of the present invention, the outdoor heat-dissipating apparatus further includes a cooling module 3091 and a cold water circulating pump 3092, wherein the cooling module 3091 may be of various types including: natural cooling modules (generally referred to as open or closed cooling towers, dry coolers, etc.), mechanical refrigeration (generally referred to as various devices using vapor compression refrigeration, such as a chiller unit, a direct evaporation refrigeration unit, etc.), and heat recovery devices (which may be various heat exchangers or water source heat pumps, etc.). The cooling module 3091 may be one or a combination of the above devices.
The cooling water circulation pump 3092 is used to drive the cooled cooling water back into the heat exchanger 308 so that the cooling water in the heat exchanger 308 is maintained at a set temperature.
Alternatively, as shown in fig. 16, the first inlet 3081 of the heat exchanger 308 is connected to the outlet of the heat sink 306, the first outlet 3082 of the heat exchanger 308 is connected to the cooling module 3091 of the outdoor heat sink, the cooling water is cooled by the cooling module 3091 and then is driven back to the heat exchanger 308 by the cooling water circulating pump 3092, one end of the cooling water circulating pump 3092 is connected to the cooling module 3091, the other end of the cooling water circulating pump 3092 is connected to the second inlet 3083 of the heat exchanger 308, and the cooling water in the heat exchanger 308 completes the circulation process.
Optionally, in fig. 16, in order to enable the cooling fluid cooled by the heat exchanger 308 to quickly return to the liquid cooling tank 301, the data center cooling system 300 in the embodiment of the present invention further includes a cooling fluid circulation pump 310, one end of the cooling fluid circulation pump 310 is connected to the second outlet 3084 of the heat exchanger 308, the other end of the cooling fluid circulation pump 310 is connected to the liquid cooling tank 301, and the cooling fluid cooled by the heat exchanger 308 is reinjected into the liquid cooling tank 301 under the driving of the cooling fluid circulation pump 310, so as to implement the circulation process of the cooling fluid.
Optionally, in the embodiment of the present invention, since there are two independent circulation systems, that is, the cooling liquid circulation system and the cooling water circulation system, the two circulation systems do not affect each other, optionally, the micro pump 303 located above the server 301 operates at a first speed, and the cooling liquid circulation pump 310 operates at a second speed, which may be the same or different.
Optionally, in the embodiment of the present invention, as shown in fig. 17, the factor for determining the first speed is determined according to the capacity of the cooling liquid that needs to dissipate heat, and in order to more accurately adjust the operation speed of the micro pump 303, a cooling liquid temperature detector 311 is further included in the data center cooling system 300, where the cooling liquid temperature detector 311 is located in the liquid cooling tank 301 and is used for detecting the temperature of the cooling liquid, the cooling liquid temperature detector 311 stores an adjustment relation table of the temperature and the rotation speed, and when it is determined that the detected temperature of the cooling liquid needs to be adjusted, an adjustment signal is sent to the micro pump 303, so that the micro pump 303 adjusts the first speed.
Alternatively, in order to more accurately determine the temperature of the coolant, a coolant temperature detector 311 is located at the inlet of the liquid cooling tank 301, and detects the temperature of the coolant driven back to the liquid cooling tank 301 by the coolant circulation pump 310.
In the embodiment of the present invention, since the heat sink 306 has a volume limitation, after the first speed of the micro pump 303 is adjusted, the flow rate of the cooling liquid entering the heat sink 306 needs to be adjusted, and the data center cooling system 300 further includes a cooling water adjusting valve 312, where the cooling water adjusting valve 312 is located at the inlet of the heat exchanger 306, and the cooling water adjusting valve 312 adjusts the flow rate of the cooling water passing through the heat exchanger through opening adjustment.
Optionally, in an embodiment of the present invention, the data center cooling system 300 further includes a cover plate 313, where the cover plate 313 is used to prevent dust or debris from falling into the liquid cooling pond 301. While the cover plate 313 is designed to be able to withstand a certain weight, such as: personnel on the cover 313 can operate or carry the server 302, and the operation and maintenance kit can move on the cover, etc. The cover plate 313 shields the liquid cooling tank 301 and divides the upper region of the liquid cooling tank 301 into operation and maintenance spaces, thereby fully utilizing the space in the vertical direction and improving the space utilization rate of the data center.
The foregoing describes two data center cooling systems, namely, the data center cooling system 200 and the data center cooling system 300, based on the two data center cooling systems, in order to better radiate heat from the servers in each data center cooling system, it is specified that in the data center cooling system, the servers are completely immersed in the liquid cooling tank, and the top and the bottom of the servers have a first distance and a second distance from the liquid level and the bottom of the cooling liquid in the liquid cooling tank, respectively.
The two spaces form two channels for the flow of cooling fluid so that the cooling fluid can circulate between the servers. Furthermore, a sufficiently large spacing may improve the uniformity of the cooling fluid as it flows through the plurality of servers.
Optionally, since the circulating pump is located at the upper part of the server, the first distance between the top of the server and the liquid level of the cooling liquid can ensure that the circulating pump sufficiently sucks the cooling liquid without sucking air, and the distance of the first distance is generally 50-100 mm.
The bottom of the server is separated from the bottom of the liquid cooling pool by a second distance, and a certain volume of cooling liquid with lower temperature is stored in the space. The specific heat capacity per unit volume of the cooling liquid is higher, namely, the heat absorbed by the cooling liquid at one time after the temperature rise is more. Therefore, even if the heat exchanger fails, the temperature of the whole liquid cooling pool only slowly rises, and the normal operation of the server can be maintained for a period of time.
Alternatively, in two data center cooling systems, the first space and the second space are determined according to the maximum design circulation amount of the cooling liquid, for example, when the cooling unit operates at the maximum design circulation amount, the flow rate in the flow cross section area defined by the first space between the top of the server and the liquid surface of the cooling liquid and the liquid return port should be kept within the range of 0.2-0.4 m/s, and the too small flow cross section area causes the circulating pump to not suck enough cooling liquid. The flow velocity in the flow sectional area enclosed by the second interval between the bottom of the server and the bottom of the liquid cooling pool and the liquid outlet is kept within the range of 0.5-0.8 m/s, and the cooling liquid can flow through each server uniformly in the flow velocity range.
For example, as shown in FIG. 12, in a partial cross-sectional view of data center cooling system 200, a first spacing exists between the top of server 201 and the liquid level of the cooling fluid, and a second spacing exists between the bottom of server 201 and the bottom of liquid cooling pond 202. Referring to FIG. 16, a partial cross-sectional view of a data center cooling system 300 is shown with a first spacing between the top of a server 302 immersed in a liquid cooling pond 301 and the liquid level of the cooling liquid, and a second spacing between the bottom of the server 302 and the bottom of the liquid cooling pond 202.
Optionally, in the above two data center cooling systems, the mounting frame is disposed in the liquid cooling tank, and the position of the mounting frame is determined according to the first interval and the second interval, so that when the server is placed in the liquid cooling tank, the mounting frame can support the server, and the top and the bottom of the server have the first interval and the second interval with the liquid level and the bottom surface of the cooling liquid in the liquid cooling tank respectively. The width between the two mounting frames is set to be matched with a conventional server, so that the conventional server can be directly placed in the liquid cooling pool without additional structural modification.
With respect to the cooling center and the data center cooling system in the foregoing embodiments, the present invention provides a data center, for example, a partial structure sectional view of the data center as shown in fig. 18 and fig. 19, where the data center includes any of the cooling center 100, any of the data center cooling system 200, and any of the data center cooling system 300.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (5)
1. A data center cooling system, comprising:
the liquid cooling pool is used for loading cooling liquid;
cooling units placed in the liquid cooling tank and alternately arranged with the servers; the cooling unit comprises a circulating pump, a heat exchanger, a liquid outlet and a liquid return port, and the circulating pump is positioned at the upper part of the server; the liquid return port is used for enabling the cooling liquid at the upper part of the server to enter the circulating pump through the liquid return port; the liquid outlet is used for guiding the cooling liquid cooled by the heat exchanger to the bottom of the server through the liquid outlet;
the server is placed in the liquid cooling pool and immersed in the cooling liquid, and a flow channel is formed between the cooling liquid and the server as well as between the cooling liquid and the cooling unit, wherein the top and the bottom of the server are respectively provided with a first interval and a second interval with the cooling liquid; the first space and the second space are determined according to the maximum design circulation amount of the cooling liquid, and the flow velocity in the flow sectional area defined by the first space between the top of the server and the liquid level of the cooling liquid and the liquid return port is kept within the range of 0.2-0.4 m/s; the flow velocity in the flow sectional area enclosed by the second distance between the bottom of the server and the bottom of the liquid cooling pool and the liquid outlet is kept within the range of 0.5-0.8 m/s.
2. The data center cooling system of claim 1, wherein a configuration ratio of the circulation pump to the heat exchanger is N:1, N is a natural number greater than zero.
3. The data center cooling system of claim 1, wherein the cooling unit further comprises a first filter screen for filtering the cooling fluid, the first filter screen being located at an upper portion of the circulation pump.
4. The data center cooling system of any one of claims 1 to 3, further comprising a cooling water supply pipe, a cooling water return pipe, and an outdoor heat dissipation device;
one end of the cooling water supply pipe is connected with a water inlet of a heat exchanger of the data center, and the other end of the cooling water supply pipe is connected with an outlet of the outdoor heat dissipation device; the cooling water supply pipe is used for guiding the cooling water cooled by the outdoor heat dissipation device into the heat exchanger;
one end of the cooling water return pipe is connected with the water outlet of the heat exchanger, and the other end of the cooling water return pipe is connected with the inlet of the outdoor heat dissipation device; the cooling water return pipe is used for guiding cooling water for cooling liquid in the heat exchanger into the outdoor heat dissipation device;
the outdoor heat dissipation device is used for cooling the cooling water.
5. A data center, comprising: the data center cooling system of claim 4.
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| CN201710919651.4A CN107690267B (en) | 2017-09-30 | 2017-09-30 | Data center cooling system and data center |
| PCT/CN2017/110956 WO2019061721A1 (en) | 2017-09-30 | 2017-11-14 | Data center cooling system and data center |
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| CN201710919651.4A CN107690267B (en) | 2017-09-30 | 2017-09-30 | Data center cooling system and data center |
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| CN107690267B true CN107690267B (en) | 2023-11-28 |
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| CN110730601A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
| US20230284413A1 (en) * | 2020-07-14 | 2023-09-07 | Canaan Creative Co., Ltd. | Immersed liquid cooling heat dissipation system |
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| CN107690267A (en) | 2018-02-13 |
| WO2019061721A1 (en) | 2019-04-04 |
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