CN107846822A - A kind of electronic equipment cooling system - Google Patents
A kind of electronic equipment cooling system Download PDFInfo
- Publication number
- CN107846822A CN107846822A CN201711199171.1A CN201711199171A CN107846822A CN 107846822 A CN107846822 A CN 107846822A CN 201711199171 A CN201711199171 A CN 201711199171A CN 107846822 A CN107846822 A CN 107846822A
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- Prior art keywords
- liquid
- heat exchanger
- shaped retainer
- deflector
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 32
- 239000007788 liquid Substances 0.000 claims abstract description 68
- 239000012530 fluid Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of electronic equipment cooling system, it is characterised in that：Including rack, the first liquid is contained with the rack；U-shaped retainer, the U-shaped retainer are immersed in the first liquid；Electronic equipment, the electronic equipment are placed in the U-type groove of U-shaped retainer, and electronic equipment is completely submerged in the first liquid；Deflector, the deflector are mounted obliquely on the top of U-shaped retainer, baffle portion or are fully immersed in the first liquid；Heat exchanger, the heat exchanger are located at U-shaped retainer and the discontiguous side of deflector, and heat exchanger is completely submerged in the first liquid；Present application addresses the technical problem that data center's radiating efficiency is low, energy consumption is big.
Description
Technical field
The application is related to data, services field, in particular to a kind of electronic equipment cooling system.
Background technology
As society and economic rapid development, computer application field are more and more extensive.Compared to traditional calculating
Machine, server have more excellent stability, autgmentability and performance.With the further development of social economy, each large-scale enterprise
Industry further improves to the performance requirement of server, and the raising of server performance causes server caused heat in the process of running
Amount increases, in order to ensure that server normally runs the radiating mode, it is necessary to more efficient.
Current server rack is radiated using single cool wind mode, in server system back side fan group into fan wall
To provide system distinguished and admirable power, working media uses acquired air.With the continuous renewal of CPU platforms, mainboard cabling
More and more intensive, CPU power consumption more and more higher, causes heat density constantly to increase, and traditional cool wind mode can not meet high fever
The heat sinking function of density.In addition, computer room is mostly Air Conditioning Facilities at present, rack demand air quantity is big, computer room generally existing air-supply deficiency
The problem of, rack to high power consumption is, it is necessary to the very high rotating speed of fan wall, and the thing followed is the exceeded of noise, and system
Fan and air conditioner in machine room load are high, and consumed energy is excessive, PUE（Power Usage Effectiveness）1.3- can only be accomplished
1.5, it is further improved.
For the problem of above-mentioned data center's radiating efficiency is low, energy consumption is big, effective solution is not yet proposed at present.
The content of the invention
The embodiments of the invention provide a kind of electronic equipment cooling system, with least solve data center's radiating efficiency it is low,
The big technical problem of energy consumption.
In order to achieve the above object, the technical scheme is that：A kind of electronic equipment cooling system, it is characterised in that：
Including：
Rack, the first liquid is contained with the rack；
U-shaped retainer, the U-shaped retainer are immersed in the first liquid；
Electronic equipment, the electronic equipment are placed in the U-type groove of U-shaped retainer, and electronic equipment is completely submerged in the first liquid
In body；
Deflector, the deflector are mounted obliquely on the top of U-shaped retainer, baffle portion or are fully immersed in first
In liquid；
Heat exchanger, the heat exchanger are located at U-shaped retainer and the discontiguous side of deflector, and heat exchanger is completely submerged in the first liquid
In body.
Further, the deflector is arranged on a side wall top of U-shaped retainer, and the bottom of U-shaped retainer is provided with
Fluid passage.
Further, the deflector can do 0 ° ~ 90 ° of rotation or 90 ° ~ 180 ° of rotation above U-shaped retainer
Turn.
Further, it is in parallel between all heat exchangers in the rack, is parallel to and changes at the top of all heat exchangers
First collector of hot device, the bottom of all heat exchangers are parallel to the second collector of heat exchanger；Filled with for cold in all heat exchangers
But the second liquid of the first liquid.
Further, the liquid level of the first liquid held in the rack is higher than heat exchanger top surface and is less than deflector top
Face.
Further, first liquid is non-conductive liquid.
Further, including multigroup electronic equipment, U-shaped retainer, heat exchanger and deflector combination, i.e., every group electricity
Sub- equipment is placed in the U-type groove of U-shaped retainer, and deflector is arranged on a side wall top of U-shaped retainer, and heat exchanger is located at
U-shaped another sidewall outer of retainer.
Further, the combination of the electronic equipment, U-shaped retainer, heat exchanger and deflector it is vertical or it is inclined simultaneously
Row is placed in rack, and is completely or partially immersed in the first liquid held in rack.
Compared with prior art, the present invention has the advantage that：Electronic equipment of the present invention is at least part of to be immersed in rack
In the liquid held in inner bag, caused heat carries out heat exchange to such electronic equipment with liquid in the running, cold so as to reach
But the purpose of server；The top of heated liquid toward rack inner bag is walked, by deflector exposure level move guidance flowing plate pair
Above the Heat exchanger sheet in face, and it is cooled in heat exchanger both sides, the liquid cooled down is under gravity along under heat exchanger both sides
Sink and continue to be cooled, cold liquid enters through the opening below water conservancy diversion frame and supplements the liquid of heated floating, continuation and electronics
Equipment carries out heat exchange, and is floated after being heated, so as to realize recuperated cycle；The part letter that the electronic device cooling system uses
It is single, and this electronic device cooling system carries out the build-in attribute that cooling uses liquid to server, it is not necessary to it is extra
Energy input, the purpose of cooling server has been reached by direct-cooled mode, cooling velocity is fast and power consumption is small, solves existing
The problem of data center's radiating efficiency is low in technology, energy consumption is big.
Brief description of the drawings
Fig. 1 is the schematic cross-section of electronic device cooling system of the present invention.
Fig. 2 is the exploded perspective schematic diagram of electronic device cooling system of the present invention.
Fig. 3 is electronic device cooling system operation principle structural representation of the present invention.
In figure：1st, rack；2nd, electronic equipment；3rd, U-shaped retainer；31st, fluid passage；4th, heat exchanger；5th, deflector；
61st, the first collector of heat exchanger；62nd, the second collector of heat exchanger.
Embodiment
The present invention is further illustrated with embodiment below, as described below is only the preferred embodiments of the present invention, and
The limitation present invention is not used in, although the present invention is described in detail with reference to the foregoing embodiments, for the technology of this area
For personnel, it can still modify to the technical scheme described in foregoing embodiments, or to which part technology
Feature carries out equivalent substitution.Within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc.,
It should be included within protection scope of the present invention.
It refer to shown in Fig. 1 and Fig. 2, electronic device cooling system of the invention includes rack 1, is held in the rack 1
There is the first liquid；U-shaped retainer 3, the U-shaped retainer 3 are immersed in the first liquid；Electronic equipment 2, the electronic equipment 2
It is placed in the U-type groove of U-shaped retainer 3, electronic equipment 2 is completely submerged in the first liquid；Deflector 5, the deflector 5 incline
It is oblique installed in the top of U-shaped retainer 3, deflector 5 is some or all of to be immersed in the first liquid；Heat exchanger 4, it is described to change
Hot device 4 is located at U-shaped retainer 3 and 5 discontiguous side of deflector, and heat exchanger 4 is completely submerged in the first liquid.
In the present embodiment, there are the combination of six groups of electronic equipments 2, U-shaped retainer 3, heat exchanger 4 and deflector 5, i.e. institute
State electronic equipment 2 to be placed in the U-type groove of U-shaped retainer 3, the deflector 5 is arranged on a side wall top of U-shaped retainer 3
On, the heat exchanger 4 is located at U-shaped 3 another sidewall outer of retainer；Electronic equipment 2 described above, U-shaped retainer 3, heat exchanger 4
It is vertical or inclined lay out in parallel is in rack 1 with the combination of deflector 5, and it is immersed in the first liquid held in rack 1
In.
The deflector 5 is rotatably installed on a side wall top of U-shaped retainer 3, and the bottom of U-shaped retainer 3 is provided with stream
Body passage 31；Deflector 5 can do 0 ° ~ 90 ° of rotation or 90 ° ~ 180 ° of rotation above U-shaped retainer 3.
The liquid level of the first liquid held in the rack 1 is higher than the top surface of heat exchanger 4 and is less than the top surface of deflector 5.
It is in parallel between all heat exchangers 4 in rack 1, the top of all heat exchangers 4 is parallel to the first of heat exchanger
Collector 61, the bottom of all heat exchangers 4 are parallel to the second collector 62 of heat exchanger.
Filled with second liquid in all heat exchangers 4, for cooling down the first liquid heated by electronic equipment 2.
First liquid is non-conductive liquid.
The second liquid is condensed water, freon or other condensate liquids；The second liquid absorbs the first liquid
After heat, heat exchange is carried out with other low-temperature receivers, other low-temperature receivers can be cooling column, earth source heat pump, air or artificial cold source
（It is useless cold）.
The second liquid absorbs the heat of the first liquid, can be used for the heat utilization that heats.
It refer to shown in Fig. 3, the operation principle of electronic device cooling system of the present invention：Include multiple partial circulatings in rack 1,
Each electronic equipment 2, U-shaped retainer 3, heat exchanger 4 and deflector 5 built-up section or be fully immersed in the first liquid
There is a partial circulating, electronic equipment 2 is immersed in the first liquid, and electronic equipment 2 works caused heat by the first liquid
Absorb, walked above the first heated liquid rear rack, the guiding through deflector 5 goes to the top of heat exchanger 4, due in heat exchanger 4
The second liquid temperature in face is relatively low, forms low-temperature space around heat exchanger 4, and the first hot liquid and heat exchanger both sides are formed pair
Cold sidewall of first liquid along heat exchanger 4 of stream, i.e. heat is flowed to below rack 1, the first hot liquid in the both sides of heat exchanger 4 down
Heat exchange is carried out with cold second liquid when walking, the first hot liquid is cooled, and the first cold liquid reaches the bottom of rack 1
When the bottom of 31 return electron equipment of fluid passage 1 through the U-shaped bottom of retainer 3, for next time circulate.
By above-described embodiment, the part that electronic device cooling system of the present invention uses is simple, and this electronic equipment
Cooling system carries out the build-in attribute that cooling uses liquid to server, it is not necessary to extra energy input, passes through energy
Conversion has reached the purpose of cooling server, and cooling velocity is fast and power consumption is small, and abatement apparatus running noises, solves existing skill
The problem of data during operation center radiating efficiency is low, energy consumption is big.
Electronic equipment 2 in above-described embodiment can be server, and rack 1 can be the rack at integrated data center.
One or more above-mentioned electronic equipment 2, U-shaped retainer 3, heat exchanger 4 and deflectors 5 can be included in data center systems
Combination.
Wherein, rack 1 is the container that can hold the first liquid, and the container can not be corroded by the first liquid.
It should be noted that for foregoing each embodiment, in order to be briefly described, therefore the part that it is all expressed as or portion
Part is combined, but those skilled in the art should know, the application is not limited by described component names, because foundation
The application, some parts can realize the function of above-mentioned corresponding component also within the protection domain of the application.Secondly, ability
Field technique personnel should also know that embodiment described in this description belongs to preferred embodiment, and involved part is not
Necessary to must being the application.
One of ordinary skill in the art will appreciate that all or part of part in the various systems of above-described embodiment can be with
Completed by hardware.
Above-mentioned the embodiment of the present application sequence number is for illustration only, does not represent the quality of embodiment.
In above-described embodiment of the application, the description to each embodiment all emphasizes particularly on different fields, and does not have in some embodiment
The part of detailed description, it may refer to the associated description of other embodiment.
In several embodiments provided herein, it should be understood that disclosed technology contents, others can be passed through
Mode is realized.Wherein, device embodiment described above is only schematical, such as the division of the unit, is only
A kind of division of logic function, can there is an other dividing mode when actually realizing, for example, multiple units or component can combine or
Person is desirably integrated into another system, or some features can be ignored, or does not perform.Another, shown or discussed is mutual
Between coupling or direct-coupling or communication connection can be INDIRECT COUPLING or communication link by some interfaces, unit or module
Connect, can be electrical or other forms.
Described above is only the preferred embodiment of the application, it is noted that for the ordinary skill people of the art
For member, on the premise of the application principle is not departed from, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (8)
1. a kind of electronic equipment cooling system, it is characterised in that：Including：
Rack, the first liquid is contained with the rack；
U-shaped retainer, the U-shaped retainer are immersed in the first liquid；
Electronic equipment, the electronic equipment are placed in the U-type groove of U-shaped retainer, and electronic equipment is completely submerged in the first liquid
In body；
Deflector, the deflector are mounted obliquely on the top of U-shaped retainer, baffle portion or are fully immersed in first
In liquid；
Heat exchanger, the heat exchanger are located at U-shaped retainer and the discontiguous side of deflector, and heat exchanger is completely submerged in the first liquid
In body.
2. electronic device cooling system according to claim 1, it is characterised in that：The deflector is arranged on U-shaped holding
On one side wall top of frame, the bottom of U-shaped retainer is provided with fluid passage.
3. electronic device cooling system according to claim 2, it is characterised in that：The deflector can be in U-shaped holding
0 ° ~ 90 ° of rotation or 90 ° ~ 180 ° of rotation is done above frame.
4. electronic device cooling system according to claim 1, it is characterised in that：All heat exchangers in the rack it
Between be in parallel, the first collector of heat exchanger is parallel at the top of all heat exchangers, the bottom of all heat exchangers is parallel to heat exchange
Second collector of device；Filled with the second liquid for cooling down the first liquid in all heat exchangers.
5. electronic device cooling system according to claim 1, it is characterised in that：The first liquid held in the rack
Liquid level higher than heat exchanger top surface and be less than water conservancy diversion plate top surface.
6. electronic device cooling system according to claim 1, it is characterised in that：First liquid is non-conductive liquid
Body.
7. electronic device cooling system according to claim 1, it is characterised in that：Including multigroup electronic equipment, U-shaped holding
The combination of frame, heat exchanger and deflector, i.e., every group of electronic equipment are placed in the U-type groove of U-shaped retainer, deflector installation
On a side wall top of U-shaped retainer, heat exchanger is located at another sidewall outer of U-shaped retainer.
8. electronic device cooling system according to claim 7, it is characterised in that：The electronic equipment, U-shaped retainer,
The combination of heat exchanger and deflector is vertical or inclined lay out in parallel is in rack, and is completely or partially immersed in rack
In the first liquid inside held.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711199171.1A CN107846822A (en) | 2017-11-26 | 2017-11-26 | A kind of electronic equipment cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711199171.1A CN107846822A (en) | 2017-11-26 | 2017-11-26 | A kind of electronic equipment cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107846822A true CN107846822A (en) | 2018-03-27 |
Family
ID=61680299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711199171.1A Pending CN107846822A (en) | 2017-11-26 | 2017-11-26 | A kind of electronic equipment cooling system |
Country Status (1)
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|---|---|
| CN (1) | CN107846822A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113948228A (en) * | 2021-09-17 | 2022-01-18 | 中广核研究院有限公司 | Heat exchange system and heat exchange device thereof |
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| CN113948228A (en) * | 2021-09-17 | 2022-01-18 | 中广核研究院有限公司 | Heat exchange system and heat exchange device thereof |
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Address after: 100097 the 4 floor of 3 building, 11 Teng Ren Road, Niu Lan Shan town, Shunyi District, Beijing. Applicant after: Beijing hot Mdt InfoTech Ltd Address before: 100097 the 4 floor of 3 building, 11 Teng Ren Road, Niu Lan Shan town, Shunyi District, Beijing. Applicant before: Beijing medium heat energy technology Co., Ltd. |
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Inventor after: Sun Jidong Inventor after: Ding Shiping Inventor after: Jin Youguang Inventor after: He Huili Inventor before: Sun Jidong Inventor before: Ding Shiping Inventor before: He Huili |
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Effective date of registration: 20190724 Address after: 100020 Chaoyang District City, Chaoyang Street, No. 15, floor 1518, unit 18, Applicant after: Beijing Science and Technology Co., Ltd. Germany To Hanson Address before: 100097 No. 11 Tengren Road, Niulanshan Town, Shunyi District, Beijing, 3 buildings, 4 floors Applicant before: Beijing hot Mdt InfoTech Ltd |
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