CN207443331U - A kind of electronic equipment cooling system - Google Patents
A kind of electronic equipment cooling system Download PDFInfo
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- CN207443331U CN207443331U CN201721596757.7U CN201721596757U CN207443331U CN 207443331 U CN207443331 U CN 207443331U CN 201721596757 U CN201721596757 U CN 201721596757U CN 207443331 U CN207443331 U CN 207443331U
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- liquid
- heat exchanger
- deflector
- shaped retainer
- electronic equipment
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Abstract
A kind of electronic equipment cooling system, it is characterised in that：Including cabinet, the first liquid is contained in the cabinet；U-shaped retainer, the U-shaped retainer are immersed in the first liquid；Electronic equipment, the electronic equipment are placed in the U-type groove of U-shaped retainer, and electronic equipment is completely submerged in the first liquid；Deflector, the deflector are mounted obliquely on the top of U-shaped retainer, baffle portion or are fully immersed in the first liquid；Heat exchanger, the heat exchanger are located at U-shaped retainer and the discontiguous side of deflector, and heat exchanger is completely submerged in the first liquid；Present application addresses the technical issues of data center's radiating efficiency is low, energy consumption is big.
Description
Technical field
This application involves data service field, in particular to a kind of electronic equipment cooling system.
Background technology
As society and economic rapid development, computer application field are more and more extensive.Compared to traditional calculating
Machine, server have more excellent stability, autgmentability and performance.With the further development of social economy, each large-scale enterprise
Industry further improves the performance requirement of server, and the raising of server performance causes the heat that server generates in the process of running
Amount increases, in order to ensure that server normally runs the radiating mode, it is necessary to more efficient.
Current server cabinet is radiated using single cool wind mode, in server system back side fan group into fan wall
There is provided the system distinguished and admirable power, working media uses acquired air.With the continuous renewal of CPU platforms, mainboard cabling
It is more and more intensive, CPU power consumption is higher and higher, and heat density is caused constantly to increase, traditional cool wind mode cannot meet high fever
The heat sinking function of density.In addition, computer room is mostly Air Conditioning Facilities at present, cabinet demand air quantity is big, computer room generally existing air-supply deficiency
The problem of, cabinet to high power consumption is, it is necessary to the very high rotating speed of fan wall, and the thing followed is the exceeded of noise, and system
Fan and air conditioner in machine room load are high, and consumed energy is excessive, PUE（Power Usage Effectiveness）It can only accomplish 1.3-
1.5, it is further improved.
For the problem of above-mentioned data center's radiating efficiency is low, energy consumption is big, currently no effective solution has been proposed.
The content of the invention
The utility model embodiment provides a kind of electronic equipment cooling system, at least to solve data center's radiating efficiency
Low, the technical issues of energy consumption is big.
In order to achieve the above object, the technical solution of the utility model is：A kind of electronic equipment cooling system, feature exist
In：Including：
Cabinet is contained with the first liquid in the cabinet；
U-shaped retainer, the U-shaped retainer are immersed in the first liquid；
Electronic equipment, the electronic equipment are placed in the U-type groove of U-shaped retainer, and electronic equipment is completely submerged in
In one liquid；
Deflector, the deflector are mounted obliquely on the top of U-shaped retainer, baffle portion or are fully immersed in
In first liquid；
Heat exchanger, the heat exchanger are located at U-shaped retainer and the discontiguous side of deflector, and heat exchanger is completely submerged in
In one liquid.
Further, the deflector is mounted on the one side wall top of U-shaped retainer, and the bottom of U-shaped retainer is provided with
Fluid passageway.
Further, the deflector can be done above U-shaped retainer 0 ° ~ 90 ° rotation or 90 ° ~ 180 ° of rotation
Turn.
Further, it is in parallel between all heat exchangers in the cabinet, is parallel to and changes at the top of all heat exchangers
First collector of hot device, the bottom of all heat exchangers are parallel to the second collector of heat exchanger；Filled with for cold in all heat exchangers
But the second liquid of the first liquid.
Further, the liquid level of the first liquid held in the cabinet is higher than heat exchanger top surface and less than deflector top
Face.
Further, first liquid is non-conductive liquid.
Further, the electricity of combination, i.e., every group including multigroup electronic equipment, U-shaped retainer, heat exchanger and deflector
Sub- equipment is placed in the U-type groove of U-shaped retainer, and deflector is mounted on the one side wall top of U-shaped retainer, and heat exchanger is located at
U-shaped another sidewall outer of retainer.
Further, the combination of the electronic equipment, U-shaped retainer, heat exchanger and deflector it is vertical or it is inclined simultaneously
Row is placed in cabinet, and is completely or partially immersed in the first liquid held in cabinet.
Compared with prior art, the utility model has the advantage that：At least part of leaching of the utility model electronic equipment
In the liquid not held in cabinet liner, heat and liquid that such electronic equipment generates in the running carry out heat exchange, from
And achieve the purpose that cool down server；The top of the liquid heated toward cabinet liner is walked, by the movement of deflector exposure level to
It above the Heat exchanger sheet on deflector opposite, and is cooled in heat exchanger both sides, the liquid cooled down is under the effect of gravity along heat exchange
Device both sides sink and continue to be cooled, and cold liquid enters through the opening below water conservancy diversion frame and supplements the liquid of heated floating, after
It is continuous to carry out heat exchange with electronic equipment, and float after being heated, so as to fulfill heat exchange cycle；What the electronic device cooling system used
Component is simple, and this electronic device cooling system carries out server the build-in attribute that cooling uses liquid, is not required to
Additional energy input is wanted, has achieved the purpose that cool down server by direct-cooled mode, cooling velocity is fast and energy consumption is small, solves
The problem of data center's radiating efficiency is low in the prior art, energy consumption is big.
Description of the drawings
Fig. 1 is the schematic cross-section of the utility model electronic device cooling system.
Fig. 2 is the exploded perspective schematic diagram of the utility model electronic device cooling system.
Fig. 3 is the utility model electronic device cooling system operation principle structure diagram.
In figure：1st, cabinet；2nd, electronic equipment；3rd, U-shaped retainer；31st, fluid passageway；4th, heat exchanger；5th, deflector；
61st, the first collector of heat exchanger；62nd, the second collector of heat exchanger.
Specific embodiment
The utility model is further illustrated with embodiment, as described below is only the preferred embodiment of the utility model below
, it is not intended to limit the utility model, it is right although the utility model is described in detail with reference to the foregoing embodiments
For those skilled in the art, can still modify to the technical solution recorded in foregoing embodiments or
Equivalent substitution is carried out to which part technical characteristic.Any modification within the spirit and principle of the utility model, being made,
Equivalent substitution, improvement etc., should be included within the scope of protection of this utility model.
It please refers to Fig.1 with shown in Fig. 2, the electronic device cooling system of the utility model includes cabinet 1, in the cabinet 1
It is contained with the first liquid；U-shaped retainer 3, the U-shaped retainer 3 are immersed in the first liquid；Electronic equipment 2, the electronics are set
Standby 2 are placed in the U-type groove of U-shaped retainer 3, and electronic equipment 2 is completely submerged in the first liquid；Deflector 5, the deflector
5 are mounted obliquely on the top of U-shaped retainer 3, and deflector 5 is some or all of to be immersed in the first liquid；Heat exchanger 4, institute
It states heat exchanger 4 and is located at U-shaped retainer 3 and 5 discontiguous side of deflector, heat exchanger 4 is completely submerged in the first liquid.
In the present embodiment, there are the combination of six groups of electronic equipments 2, U-shaped retainer 3, heat exchanger 4 and deflector 5, i.e. institute
It states electronic equipment 2 to be placed in the U-type groove of U-shaped retainer 3, the deflector 5 is mounted on the one side wall top of U-shaped retainer 3
On, the heat exchanger 4 is located at U-shaped 3 another sidewall outer of retainer；Electronic equipment 2 described above, U-shaped retainer 3, heat exchanger 4
It is vertical or inclined lay out in parallel is in cabinet 1 with the combination of deflector 5, and it is immersed in the first liquid held in cabinet 1
In.
The deflector 5 is rotatably installed on the one side wall top of U-shaped retainer 3, and the bottom of U-shaped retainer 3 is provided with stream
Body passage 31；Deflector 5 can be done above U-shaped retainer 30 ° ~ 90 ° rotation or 90 ° ~ 180 ° of rotation.
The liquid level of the first liquid held in the cabinet 1 is higher than 4 top surface of heat exchanger and less than 5 top surface of deflector.
It is in parallel between all heat exchangers 4 in cabinet 1, the top of all heat exchangers 4 is parallel to the first of heat exchanger
Collector 61, the bottom of all heat exchangers 4 are parallel to the second collector 62 of heat exchanger.
Filled with second liquid in all heat exchangers 4, for cooling down the first liquid heated by electronic equipment 2.
First liquid is non-conductive liquid.
The second liquid is condensed water, freon or other condensate liquids；The second liquid absorbs the first liquid
After heat, heat exchange is carried out with other low-temperature receivers, other low-temperature receivers can be cooling column, earth source heat pump, air or artificial cold source
（It is useless cold）.
The second liquid absorbs the heat of the first liquid, can be used for the heat utilization that heats.
Shown in please referring to Fig.3, the operation principle of the utility model electronic device cooling system：Include in cabinet 1 multiple small
Cycle, each electronic equipment 2, U-shaped retainer 3, heat exchanger 4 and deflector 5 built-up section or be fully immersed in the first liquid
All there are one partial circulating in body, electronic equipment 2 is immersed in the first liquid, and the heat that electronic equipment 2 generates when working is by first
Liquid absorption, the first heated liquid rear rack top are walked, and the guiding through deflector 5 goes to the top of heat exchanger 4, due to heat exchanger
The second liquid temperature of 4 the insides is relatively low, and low-temperature space, the first hot liquid and heat exchanger both sides shape are formed around heat exchanger 4
Into convection current, i.e. the cold sidewall of hot the first liquid along heat exchanger 4 flows to cabinet 1 in the following, the first liquid of heat is in 4 both sides of heat exchanger
Heat exchange is carried out with cold second liquid when walking downward, the first hot liquid is cooled, and the first cold liquid reaches cabinet 1
31 return electron equipment of fluid passageway, 1 bottom through U-shaped 3 bottom of retainer when bottom is cycled for next time.
By above-described embodiment, the component that the utility model electronic device cooling system uses is simple, and this electronics
Device cooling system carries out server the build-in attribute that cooling uses liquid, and additional energy input is not required, passes through
Energy conversion has achieved the purpose that cooling server, and cooling velocity is fast and energy consumption is small, and abatement apparatus running noises, solves existing
There is the problem of data center's radiating efficiency is low, energy consumption is big in technology.
Electronic equipment 2 in above-described embodiment can be server, and cabinet 1 can be the cabinet at integrated data center.
It can include one or more above-mentioned electronic equipment 2, U-shaped retainer 3, heat exchanger 4 and deflectors 5 in data center systems
Combination.
Wherein, cabinet 1 is the container that can hold the first liquid, which can not be corroded by the first liquid.
It should be noted that for foregoing each embodiment, in order to be briefly described, therefore the component that it is all expressed as or portion
Part combines, but those skilled in the art should know, the application and from the limitation of described component names, because foundation
The application, some components can realize the function of above-mentioned corresponding component also within the protection domain of the application.Secondly, ability
Field technique personnel should also know that embodiment described in this description belongs to preferred embodiment, and involved component is not
Necessary to must being the application.
One of ordinary skill in the art will appreciate that all or part of component in the various systems of above-described embodiment can be with
It is completed by hardware.
Above-mentioned the embodiment of the present application sequence number is for illustration only, does not represent the quality of embodiment.
In above-described embodiment of the application, all emphasize particularly on different fields to the description of each embodiment, do not have in some embodiment
The part of detailed description may refer to the associated description of other embodiment.
In several embodiments provided herein, it should be understood that disclosed technology contents can pass through others
Mode is realized.Wherein, the apparatus embodiments described above are merely exemplary, such as the division of the unit, is only
A kind of division of logic function, can there is an other dividing mode in actual implementation, for example, multiple units or component can combine or
Person is desirably integrated into another system or some features can be ignored or does not perform.Another, shown or discussed is mutual
Between coupling, direct-coupling or communication connection can be INDIRECT COUPLING or communication link by some interfaces, unit or module
It connects, can be electrical or other forms.
The above is only the preferred embodiment of the application, it is noted that for the ordinary skill people of the art
For member, on the premise of the application principle is not departed from, several improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (8)
1. a kind of electronic equipment cooling system, it is characterised in that：Including：
Cabinet is contained with the first liquid in the cabinet；
U-shaped retainer, the U-shaped retainer are immersed in the first liquid；
Electronic equipment, the electronic equipment are placed in the U-type groove of U-shaped retainer, and electronic equipment is completely submerged in the first liquid
In body；
Deflector, the deflector are mounted obliquely on the top of U-shaped retainer, baffle portion or are fully immersed in first
In liquid；
Heat exchanger, the heat exchanger are located at U-shaped retainer and the discontiguous side of deflector, and heat exchanger is completely submerged in the first liquid
In body.
2. electronic device cooling system according to claim 1, it is characterised in that：The deflector is mounted on U-shaped holding
On the one side wall top of frame, the bottom of U-shaped retainer is provided with fluid passageway.
3. electronic device cooling system according to claim 2, it is characterised in that：The deflector can be in U-shaped holding
Do above frame 0 ° ~ 90 ° rotation or 90 ° ~ 180 ° of rotation.
4. electronic device cooling system according to claim 1, it is characterised in that：All heat exchangers in the cabinet it
Between be in parallel, the first collector of heat exchanger is parallel at the top of all heat exchangers, the bottom of all heat exchangers is parallel to heat exchange
Second collector of device；Filled with the second liquid for the first liquid of cooling in all heat exchangers.
5. electronic device cooling system according to claim 1, it is characterised in that：The first liquid held in the cabinet
Liquid level higher than heat exchanger top surface and less than water conservancy diversion plate top surface.
6. electronic device cooling system according to claim 1, it is characterised in that：First liquid is non-conductive liquid
Body.
7. electronic device cooling system according to claim 1, it is characterised in that：Including multigroup electronic equipment, U-shaped holding
The combination of frame, heat exchanger and deflector, i.e., every group of electronic equipment are placed in the U-type groove of U-shaped retainer, deflector installation
On the one side wall top of U-shaped retainer, heat exchanger is located at another sidewall outer of U-shaped retainer.
8. electronic device cooling system according to claim 7, it is characterised in that：The electronic equipment, U-shaped retainer,
The combination of heat exchanger and deflector is vertical or inclined lay out in parallel is in cabinet, and is completely or partially immersed in cabinet
In the first liquid inside held.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721596757.7U CN207443331U (en) | 2017-11-26 | 2017-11-26 | A kind of electronic equipment cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721596757.7U CN207443331U (en) | 2017-11-26 | 2017-11-26 | A kind of electronic equipment cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207443331U true CN207443331U (en) | 2018-06-01 |
Family
ID=62287962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721596757.7U Active CN207443331U (en) | 2017-11-26 | 2017-11-26 | A kind of electronic equipment cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207443331U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846822A (en) * | 2017-11-26 | 2018-03-27 | 北京中热能源科技有限公司 | A kind of electronic equipment cooling system |
| CN110730604A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
| CN110730602A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
| CN110730603A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
-
2017
- 2017-11-26 CN CN201721596757.7U patent/CN207443331U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846822A (en) * | 2017-11-26 | 2018-03-27 | 北京中热能源科技有限公司 | A kind of electronic equipment cooling system |
| CN110730604A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
| CN110730602A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
| CN110730603A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Sun Jidong Inventor after: Ding Shiping Inventor after: Jin Youguang Inventor after: He Huili Inventor before: Sun Jidong Inventor before: Ding Shiping Inventor before: He Huili |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100097 the 4 floor of 3 building, 11 Teng Ren Road, Niu Lan Shan town, Shunyi District, Beijing. Patentee after: Beijing hot Mdt InfoTech Ltd Address before: 100097 the 4 floor of 3 building, 11 Teng Ren Road, Niu Lan Shan town, Shunyi District, Beijing. Patentee before: Beijing medium heat energy technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190730 Address after: 100020 Chaoyang District City, Chaoyang Street, No. 15, floor 1518, unit 18, Patentee after: Beijing Science and Technology Co., Ltd. Germany To Hanson Address before: 100097 No. 11 Tengren Road, Niulanshan Town, Shunyi District, Beijing, 3 buildings, 4 floors Patentee before: Beijing hot Mdt InfoTech Ltd |