CN105658033A - Device with heat exchange - Google Patents
Device with heat exchange Download PDFInfo
- Publication number
- CN105658033A CN105658033A CN201610051956.3A CN201610051956A CN105658033A CN 105658033 A CN105658033 A CN 105658033A CN 201610051956 A CN201610051956 A CN 201610051956A CN 105658033 A CN105658033 A CN 105658033A
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- cabinet
- heat
- circulation fan
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域technical field
本发明实施例涉及通信领域,更具体地,涉及通信领域中具有热交换的装置。Embodiments of the present invention relate to the field of communications, and more specifically, to devices with heat exchange in the field of communications.
背景技术Background technique
电子设备在工作时产生的热量,使电子设备内部温度迅速上升,如果不及时将该热量散发,该电子设备会继续升温,当温度超出了该电子设备内的电子器件的正常工作温度范围时,该电子设备的性能显著下降,极大地影响电子设备的可靠性,因此电子设备的散热问题越来越受到重视。为了防止通讯电子系统受到环境中灰尘、腐蚀性气体、霉菌等不利环境因素的影响,保证电子系统可靠稳定运行,电子系统中的电子器件及设备往往放置在密闭的机柜中,而机柜的散热能力由散热面积、风量等因素决定,受机柜体积的制约。随着信息技术产业(InformationTechnology,简称为“IT”)和通讯技术产业(CommunicationTechnology,简称为“CT”)业务能力的不断提升,户外密闭机柜需要更强的散热能力。The heat generated by electronic equipment during operation causes the internal temperature of the electronic equipment to rise rapidly. If the heat is not dissipated in time, the electronic equipment will continue to heat up. When the temperature exceeds the normal operating temperature range of the electronic components in the electronic equipment, The performance of the electronic equipment drops significantly, which greatly affects the reliability of the electronic equipment, so the heat dissipation problem of the electronic equipment has been paid more and more attention. In order to prevent the communication electronic system from being affected by adverse environmental factors such as dust, corrosive gas, and mold in the environment, and to ensure the reliable and stable operation of the electronic system, the electronic devices and equipment in the electronic system are often placed in a closed cabinet, and the cooling capacity of the cabinet It is determined by factors such as heat dissipation area and air volume, and is restricted by the volume of the cabinet. With the continuous improvement of the business capabilities of the information technology industry (Information Technology, referred to as "IT") and the communication technology industry (Communication Technology, referred to as "CT"), outdoor airtight cabinets need stronger heat dissipation capabilities.
为了实现更强的散热能力,需要更大体积的温控单元。现有技术通常将温控单元整体设置于机柜顶部,通过增加温控单元的高度,实现散热能力的提升。但是,在内部电子设备热耗很大时,这种方式需要温控单元的高度增大很多,导致机柜整体的体积增大很多,影响机柜的紧凑度(即机柜的单位体积散热能力)。In order to achieve stronger heat dissipation capability, a larger temperature control unit is required. In the prior art, the temperature control unit is generally arranged on the top of the cabinet as a whole, and the heat dissipation capability is improved by increasing the height of the temperature control unit. However, when the internal electronic equipment consumes a lot of heat, this method requires a large increase in the height of the temperature control unit, resulting in a large increase in the overall volume of the cabinet, which affects the compactness of the cabinet (that is, the heat dissipation capacity per unit volume of the cabinet).
发明内容Contents of the invention
有鉴于此,本发明实施例提供了一种具有热交换的装置,能够降低该装置的整体高度和在电子设备热耗增大时该装置需要增加的高度。In view of this, an embodiment of the present invention provides a device with heat exchange, which can reduce the overall height of the device and the height of the device that needs to be increased when the heat consumption of electronic equipment increases.
第一方面,提供了一种具有热交换的装置,该装置包括机柜200,该机柜200内设有电子设备201、内循环风扇202和第一换热器203,其中,该内循环风扇202设置于该电子设备201的上方,该第一换热器203设置于该机柜200的侧壁的门上;在该内循环风扇202与该第一换热器203之间设置有导风结构件204,该内循环风扇202使得该机柜200内的空气通过该导风结构件204流经该第一换热器203;该机柜200外顶部设有第二换热器205和外循环风扇206,其中,该第一换热器203与该第二换热器205通过导管207连接并含有连通的传热工质,该导管207使得该传热工质在该第一换热器203和该第二换热器205之间循环流动,实现热交换。In the first aspect, a device with heat exchange is provided, the device includes a cabinet 200, the cabinet 200 is provided with electronic equipment 201, an internal circulation fan 202 and a first heat exchanger 203, wherein the internal circulation fan 202 is set Above the electronic equipment 201, the first heat exchanger 203 is arranged on the door of the side wall of the cabinet 200; an air guide structure 204 is arranged between the internal circulation fan 202 and the first heat exchanger 203 , the internal circulation fan 202 makes the air in the cabinet 200 flow through the first heat exchanger 203 through the air guide structure 204; the outer top of the cabinet 200 is provided with a second heat exchanger 205 and an external circulation fan 206, wherein , the first heat exchanger 203 is connected to the second heat exchanger 205 through a conduit 207 and contains a communicating heat transfer medium, and the conduit 207 makes the heat transfer medium flow between the first heat exchanger 203 and the second heat exchanger Circulating flow among the heat exchangers 205 realizes heat exchange.
在第一方面的第一种可能的实现方式中,该机柜200顶部设置有通孔,该导管207通过该通孔连接该第一换热器203与该第二换热器205。In a first possible implementation manner of the first aspect, a through hole is disposed on the top of the cabinet 200, and the conduit 207 connects the first heat exchanger 203 and the second heat exchanger 205 through the through hole.
结合第一方面的上述可能的实现方式,在第一方面的第二种可能的实现方式中,该第一换热器203设置于距该电子设备201距离最大的侧壁的门上。With reference to the above possible implementation manner of the first aspect, in a second possible implementation manner of the first aspect, the first heat exchanger 203 is arranged on the door of the side wall with the largest distance from the electronic device 201 .
结合第一方面的上述可能的实现方式,在第一方面的第三种可能的实现方式中,该第一换热器203用于将流经的热空气转换为冷空气,该第一换热器203包括蒸发器。In combination with the above possible implementation of the first aspect, in a third possible implementation of the first aspect, the first heat exchanger 203 is used to convert the passing hot air into cold air, and the first heat exchanger 203 The device 203 includes an evaporator.
结合第一方面的上述可能的实现方式,在第一方面的第四种可能的实现方式中,该第二换热器205用于将流经的冷空气转换为热空气,该第二换热器205包括冷凝器。In combination with the above possible implementation of the first aspect, in a fourth possible implementation of the first aspect, the second heat exchanger 205 is used to convert the passing cold air into hot air, and the second heat exchanger 205 The vessel 205 includes a condenser.
结合第一方面的上述可能的实现方式,在第一方面的第五种可能的实现方式中,该机柜200外顶部还设有液冷泵或空调压缩机208,该液冷泵或空调压缩机208用于制冷。In combination with the above-mentioned possible implementation manners of the first aspect, in a fifth possible implementation manner of the first aspect, a liquid cooling pump or an air conditioning compressor 208 is further provided on the outer top of the cabinet 200, and the liquid cooling pump or air conditioning compressor 208 208 for refrigeration.
结合第一方面的上述可能的实现方式,在第一方面的第六种可能的实现方式中,该第一换热器203或该第二换热器205包括翅片,该翅片为板翅式、管翅式或套片式。In combination with the above possible implementation of the first aspect, in a sixth possible implementation of the first aspect, the first heat exchanger 203 or the second heat exchanger 205 includes fins, and the fins are plate fins type, tube-fin type or shroud type.
结合第一方面的上述可能的实现方式,在第一方面的第七种可能的实现方式中,该传热工质为氨、丙酮或四氟乙烷R134A。With reference to the above possible implementation manners of the first aspect, in a seventh possible implementation manner of the first aspect, the heat transfer working medium is ammonia, acetone or tetrafluoroethane R134A.
本发明实施例提供的具有热交换的装置,通过将温控单元分散设置于机柜的不同位置,充分利用现有技术没有有效利用的机柜内部空间,能够降低该装置整体的高度,从而减小该装置的体积,同时能够降低电子设备热耗增大时该装置需要增加的整体高度,以满足机柜不断演进的散热需求。The device with heat exchange provided by the embodiment of the present invention can reduce the overall height of the device by distributing the temperature control units at different positions of the cabinet, making full use of the internal space of the cabinet that is not effectively used in the prior art, thereby reducing the At the same time, it can reduce the overall height of the device when the heat consumption of electronic equipment increases, so as to meet the ever-evolving heat dissipation requirements of the cabinet.
附图说明Description of drawings
为了更清楚地说明本发明实施例的技术方案,下面将对本发明实施例中所需要使用的附图作简单地介绍,显而易见地,下面所描述的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required in the embodiments of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.
图1为现有技术中具有热交换的装置的工作原理图;Fig. 1 is the working principle diagram of the device with heat exchange in the prior art;
图2为本发明实施例提供的具有热交换的装置的工作原理图;Fig. 2 is the working principle diagram of the device with heat exchange provided by the embodiment of the present invention;
图3为本发明实施例提供的另一具有热交换的装置的工作原理图。Fig. 3 is a working principle diagram of another device with heat exchange provided by the embodiment of the present invention.
附图标记:Reference signs:
200-机柜200-cabinet
201-电子设备201 - Electronic equipment
202-内循环风扇202-Internal circulation fan
203-第一换热器203-First heat exchanger
204-导风结构件204-wind guide structure
205-第二换热器205-Second heat exchanger
206-外循环风扇206-External circulation fan
207-导管207-catheter
具体实施方式detailed description
现在参照附图描述的多个实施例,其中使用相同的附图标记指示本文中的相同元件。在下面的描述中,为了便于解释,给出了大量具体细节,以便提供对一个或多个实施例的全面理解。然而,很明显,也可以不用这些具体细节来实现所述实施例。在其它例子中,以方框图形式给出公知结构和设备,以便于描述一个或多个实施例。The various embodiments are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements herein. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that the described embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明的一部分实施例,而不是全部实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都应属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
现有技术中,具有热交换的装置包括机柜和换热器,该换热器设置于机柜的顶部,机柜内部只包括电子设备。如图1所示,该装置包括机柜100、安装在机柜100内的电子设备101,该装置还包括安装在该机柜100顶部的相互隔离的冷空气空间和热空气空间,冷空气空间与外界连通,热空气空间与该机柜100连通,该冷空气空间内部设有冷凝器102和外循环风扇104,该热空气空间内部设有蒸发器103和内循环风扇105,在该冷凝器102和该蒸发器103之间设置有连通的传热工质。In the prior art, a device with heat exchange includes a cabinet and a heat exchanger, the heat exchanger is arranged on the top of the cabinet, and the interior of the cabinet only includes electronic equipment. As shown in Figure 1, the device includes a cabinet 100, electronic equipment 101 installed in the cabinet 100, the device also includes a cold air space and a hot air space installed on the top of the cabinet 100, the cold air space communicates with the outside world , the hot air space communicates with the cabinet 100, the cold air space is provided with a condenser 102 and an external circulation fan 104, the hot air space is provided with an evaporator 103 and an internal circulation fan 105, and the condenser 102 and the evaporator A communicating heat transfer medium is provided between the devices 103 .
当电子设备101工作时,该电子设备101产生的热空气在内循环风扇105的带动下流入热空气空间,同时,该装置外的冷空气在外循环风扇104的带动下流入冷空气空间。这样,在热空气空间中的热空气通过该蒸发器103时,蒸发器103中的传热工质吸收绝大部分热空气带来的热量,被吸收热量的热空气通过热空气空间的出风口排入机柜100内(如图中的箭头N所示),位于蒸发器103内的部分传热工质气化迅速膨胀而升压,推动传热工质流向冷凝器102;在冷空气空间中的冷空气通过冷凝器102时,冷凝器102内的传热工质遇到冷空气放热降温,气泡收缩,气体冷凝成液体,压力下降,所释放的热量以及极小部分冷空气由冷空气空间的出风口排出到外部环境(如图中的箭头W所示)。When the electronic device 101 is working, the hot air generated by the electronic device 101 flows into the hot air space driven by the internal circulation fan 105 , and at the same time, the cold air outside the device flows into the cold air space driven by the external circulation fan 104 . In this way, when the hot air in the hot air space passes through the evaporator 103, the heat transfer medium in the evaporator 103 absorbs most of the heat brought by the hot air, and the hot air that has absorbed heat passes through the air outlet of the hot air space Discharged into the cabinet 100 (as shown by the arrow N in the figure), part of the heat transfer working medium in the evaporator 103 gasifies and expands rapidly to increase the pressure, pushing the heat transfer working medium to flow to the condenser 102; in the cold air space When the cold air passes through the condenser 102, the heat transfer medium in the condenser 102 encounters the cold air to release heat and cool down, the bubbles shrink, the gas condenses into liquid, the pressure drops, the released heat and a very small part of the cold air are released by the cold air The air outlet of the space is discharged to the external environment (shown by arrow W in the figure).
由以上可以看出,温控单元,即上述换热器,是作为一个整体设置于机柜的顶部。当电子设备101热耗很大时,不得不大大增加该温控单元的高度来满足该机柜100的散热能力,这会导致该装置的整体体积增大很多,影响机柜的紧凑度(即机柜的单位体积散热能力)。It can be seen from the above that the temperature control unit, that is, the above-mentioned heat exchanger, is arranged on the top of the cabinet as a whole. When the heat consumption of the electronic equipment 101 is very large, the height of the temperature control unit has to be greatly increased to meet the heat dissipation capacity of the cabinet 100, which will cause the overall volume of the device to increase a lot and affect the compactness of the cabinet (that is, the size of the cabinet). cooling capacity per unit volume).
下面结合图2至图3,对本发明实施例提供的具有热交换的装置进行详细说明。The device with heat exchange provided by the embodiment of the present invention will be described in detail below with reference to FIG. 2 to FIG. 3 .
图2为本发明实施例提供的具有热交换的装置的工作原理图。如图2所示,该装置包括机柜200,该机柜200内设有电子设备201、内循环风扇202和第一换热器203,其中,该内循环风扇202设置于该电子设备201的上方,该第一换热器203设置于该机柜200的侧壁的门上;在该内循环风扇202与该第一换热器203之间设置有导风结构件204,该内循环风扇202使得该机柜200内的空气通过该导风结构件204流经该第一换热器203;Fig. 2 is a working principle diagram of the device with heat exchange provided by the embodiment of the present invention. As shown in Figure 2, the device includes a cabinet 200, the cabinet 200 is provided with electronic equipment 201, an internal circulation fan 202 and a first heat exchanger 203, wherein the internal circulation fan 202 is arranged above the electronic equipment 201, The first heat exchanger 203 is arranged on the door of the side wall of the cabinet 200; an air guide structure 204 is arranged between the internal circulation fan 202 and the first heat exchanger 203, and the internal circulation fan 202 makes the The air in the cabinet 200 flows through the first heat exchanger 203 through the air guiding structure 204;
该机柜200外顶部设有第二换热器205和外循环风扇206,其中,该第一换热器203与该第二换热器205通过导管207连接并设置有连通的传热工质,该导管207使得该传热工质在该第一换热器203和该第二换热器205之间循环流动,实现热交换。The outer top of the cabinet 200 is provided with a second heat exchanger 205 and an external circulation fan 206, wherein the first heat exchanger 203 and the second heat exchanger 205 are connected through a conduit 207 and provided with a communicating heat transfer medium, The conduit 207 makes the heat transfer fluid circulate between the first heat exchanger 203 and the second heat exchanger 205 to realize heat exchange.
具体而言,在本发明实施例中,当电子设备201工作时,该电子设备201产生的热空气在内循环风扇202的带动下通过导风结构件204流经第一换热器203,同时,该装置外的冷空气在外循环风扇206的带动下流经第二换热器205。这样,在热空气通过第一换热器203时,该第一换热器203中的传热工质吸收绝大部分热空气带来的热量,被吸收热量的热空气再排入机柜200内(如图中的箭头N2所示)。由于该第一换热器203与该第二换热器205通过导管207连接,因此,位于第一换热器203内的部分传热工质气化迅速膨胀而升压,推动传热工质流向第二换热器205。外界的冷空气通过第二换热器205时,第二换热器205内的传热工质遇到冷空气放热降温,气泡收缩,气体冷凝成液体,压力下降,所释放的热量以及极小部分冷空气会排出到外部环境(如图中的箭头W2所示)。由于两端压差,以及气/液栓分布的随机性和局部传热的不均匀性导致在相邻管内压力不平衡,驱动传热工质在第一换热器203和该第二换热器205之间循环流动,实现热量由一端到另一端的传递。Specifically, in the embodiment of the present invention, when the electronic device 201 is working, the hot air generated by the electronic device 201 flows through the first heat exchanger 203 through the air guide structure 204 driven by the internal circulation fan 202, and at the same time , the cold air outside the device flows through the second heat exchanger 205 driven by the external circulation fan 206 . In this way, when the hot air passes through the first heat exchanger 203, the heat transfer medium in the first heat exchanger 203 absorbs most of the heat brought by the hot air, and the hot air that has absorbed heat is discharged into the cabinet 200 (As shown by arrow N2 in the figure). Since the first heat exchanger 203 and the second heat exchanger 205 are connected through the conduit 207, part of the heat transfer working fluid in the first heat exchanger 203 gasifies and expands rapidly to increase the pressure, pushing the heat transfer working fluid Flow to the second heat exchanger 205. When the cold air from the outside passes through the second heat exchanger 205, the heat transfer medium in the second heat exchanger 205 encounters the cold air to release heat and cool down, the bubbles shrink, the gas condenses into liquid, the pressure drops, the released heat and extreme A small part of the cold air will be exhausted to the external environment (shown by arrow W2 in the figure). Due to the pressure difference between the two ends, the randomness of gas/liquid plug distribution and the non-uniformity of local heat transfer, the pressure in the adjacent tubes is unbalanced, and the heat transfer working fluid is driven between the first heat exchanger 203 and the second heat exchanger. The circulating flow between the devices 205 realizes the transfer of heat from one end to the other end.
应理解,目前通信机柜的布局都是将内循环风扇202设置在电子设备201的上方,如图2所示,这样的布局有两个优点:一方面,由于热空气自然上升,冷空气自然沉降的原理,内循环风扇202放置在电子设备201上方更利于将热空气及时送至第一换热器203处;另一方面,将电子设备201放置在下方可以便于电子设备201的安装和维护。It should be understood that the current layout of the communication cabinet is to arrange the internal circulation fan 202 above the electronic equipment 201, as shown in Figure 2, this layout has two advantages: on the one hand, due to the natural rise of the hot air, the cold air naturally sinks According to the principle, placing the internal circulation fan 202 above the electronic device 201 is more conducive to sending hot air to the first heat exchanger 203 in time; on the other hand, placing the electronic device 201 below can facilitate the installation and maintenance of the electronic device 201 .
还应理解,图2中只示出了外循环风扇206位于第二换热器205右侧的情形,可选地,外循环风扇206还可位于第二换热器205的左侧,本发明实施例对此不作限定。It should also be understood that in FIG. 2 only the situation where the external circulation fan 206 is located on the right side of the second heat exchanger 205 is shown. Optionally, the external circulation fan 206 can also be located on the left side of the second heat exchanger 205. The embodiment does not limit this.
现有技术中,假设机柜的高度为L,蒸发器的高度为M,冷凝器的高度为N,那么该装置的整体高度为L+M+N,而本发明实施例利用了现有技术没有利用的机柜内部空间,例如机柜内部的门沿部分,将蒸发器和内循环风扇放置到了机柜内部,在本发明实施例中,机柜的高度为L(内部已经包括蒸发器,即本发明中的第一换热器),冷凝器的高度为N,因此,本发明实施例的装置的整体高度为L+N,与现有技术相比降低了装置的整体高度。此外,在电子设备热耗不断增大时,现有技术需要增大温控单元的高度,即增大高度M+N,本发明只需要增大高度M,因此,本发明还能够降低电子设备热耗增大时该装置需要增加的整体高度。In the prior art, assuming that the height of the cabinet is L, the height of the evaporator is M, and the height of the condenser is N, then the overall height of the device is L+M+N, and the embodiment of the present invention utilizes the existing technology without The internal space of the cabinet is utilized, such as the door edge part inside the cabinet, and the evaporator and the internal circulation fan are placed inside the cabinet. In the embodiment of the present invention, the height of the cabinet is L (the evaporator is already included inside, that is, the evaporator in the present invention The first heat exchanger), the height of the condenser is N, therefore, the overall height of the device in the embodiment of the present invention is L+N, which reduces the overall height of the device compared with the prior art. In addition, when the heat consumption of electronic equipment continues to increase, the existing technology needs to increase the height of the temperature control unit, that is, increase the height M+N, and the present invention only needs to increase the height M, so the present invention can also reduce the temperature of the electronic equipment. The device requires increased overall height as heat loss increases.
本发明实施例提供的具有热交换的装置,通过将温控单元分散设置于机柜的不同位置,充分利用现有技术没有有效利用的机柜内部空间,能够降低该装置整体的高度,从而减小该装置的体积,同时能够降低电子设备热耗增大时该装置需要增加的整体高度,以满足机柜不断演进的散热需求。The device with heat exchange provided by the embodiment of the present invention can reduce the overall height of the device by distributing the temperature control units in different positions of the cabinet, making full use of the internal space of the cabinet that is not effectively used in the prior art, thereby reducing the At the same time, it can reduce the overall height of the device when the heat consumption of electronic equipment increases, so as to meet the ever-evolving heat dissipation requirements of the cabinet.
作为一个可选实施例,该机柜200顶部设置有通孔,该导管207通过该通孔连接该第一换热器203与该第二换热器205。As an optional embodiment, a through hole is disposed on the top of the cabinet 200, and the conduit 207 connects the first heat exchanger 203 and the second heat exchanger 205 through the through hole.
作为一个可选实施例,该第一换热器203设置于距该电子设备201距离最大的侧壁的门上。As an optional embodiment, the first heat exchanger 203 is arranged on the door of the side wall with the largest distance from the electronic device 201 .
具体地,该第一换热器203可以设置于该机柜的任一侧壁的门上,若该机柜200只有一个门,那么该第一换热器必然设置于这个门上,若该机柜200有至少两个门,那么可以将该第一换热器203设置于距该电子设备201距离最大的侧壁的门上。Specifically, the first heat exchanger 203 can be arranged on the door of any side wall of the cabinet. If the cabinet 200 has only one door, the first heat exchanger must be arranged on the door. If the cabinet 200 If there are at least two doors, then the first heat exchanger 203 can be arranged on the door of the side wall with the largest distance from the electronic device 201 .
应理解,将该第一换热器203设置于机柜200的侧壁的门上,可以实现开门便于对机柜200中的电子设备201进行维护,关门后内循环风扇202与该第一换热器203密闭通风。It should be understood that the first heat exchanger 203 is arranged on the door of the side wall of the cabinet 200, so that the door can be opened to facilitate the maintenance of the electronic equipment 201 in the cabinet 200. After the door is closed, the internal circulation fan 202 and the first heat exchanger 203 closed and ventilated.
作为一个可选实施例,该第一换热器203用于将流经的热空气转换为冷空气,该第一换热器203包括蒸发器。As an optional embodiment, the first heat exchanger 203 is used to convert the passing hot air into cold air, and the first heat exchanger 203 includes an evaporator.
应理解,该第一换热器包括但不限于蒸发器,任何可以将流经的热空气转换为冷空气的装置都可以作为该第一换热器,本发明实施例对此不作限定。It should be understood that the first heat exchanger includes but is not limited to an evaporator, and any device capable of converting passing hot air into cold air can be used as the first heat exchanger, which is not limited in this embodiment of the present invention.
作为一个可选实施例,该第二换热器205用于将流经的冷空气转换为热空气,该第二换热器205包括冷凝器。As an optional embodiment, the second heat exchanger 205 is used to convert the passing cold air into hot air, and the second heat exchanger 205 includes a condenser.
应理解,该第二换热器包括但不限于冷凝器,任何可以将流经的冷空气转换为热空气的装置都可以作为该第二换热器,本发明实施例对此不作限定。It should be understood that the second heat exchanger includes but is not limited to a condenser, and any device capable of converting passing cold air into hot air can be used as the second heat exchanger, which is not limited in this embodiment of the present invention.
作为一个可选实施例,如图3所示,该机柜200外顶部还设有液冷泵或空调压缩机208,用于制冷。As an optional embodiment, as shown in FIG. 3 , a liquid cooling pump or an air conditioner compressor 208 is further provided on the outer top of the cabinet 200 for cooling.
具体而言,可以将液冷泵或空调压缩机208设置于该机柜200的外顶部,通过液冷泵或空调压缩机208,替代重力作用,驱动散热扁管内的传热工质在第一换热器203和该第二换热器205之间流动。Specifically, the liquid cooling pump or the air conditioner compressor 208 can be arranged on the outer top of the cabinet 200, and the liquid cooling pump or the air conditioner compressor 208 can replace the action of gravity to drive the heat transfer working fluid in the heat dissipation flat tube in the first exchange. between the heat exchanger 203 and the second heat exchanger 205 .
应理解,图3中只示出了液冷泵或空调压缩机208处于第二换热器205下方的情形,可选地,该液冷泵或空调压缩机208还可设于第二换热器205的上方,或者根据该液冷泵或空调压缩机208以及第二换热器205的大小合理放置,本发明实施例对此不作限定。It should be understood that in FIG. 3 only the situation where the liquid-cooled pump or air-conditioning compressor 208 is located below the second heat exchanger 205 is shown. Optionally, the liquid-cooled pump or air-conditioning compressor 208 can also be located at Above the heat exchanger 205, or placed reasonably according to the size of the liquid cooling pump or air conditioner compressor 208 and the second heat exchanger 205, which is not limited in this embodiment of the present invention.
在本发明实施例中,通过在原有方案的基础上添加液冷泵或空调压缩机,能够使机柜内温度低于外界温度,实现快速制冷,大大提高该装置的散热能力,满足机柜不断演进的散热需求。In the embodiment of the present invention, by adding a liquid-cooled pump or an air-conditioning compressor on the basis of the original solution, the temperature inside the cabinet can be lower than the outside temperature, realizing rapid cooling, greatly improving the heat dissipation capacity of the device, and satisfying the continuous evolution of the cabinet. Cooling requirements.
作为一个可选实施例,该第一换热器203或该第二换热器205包括翅片,该翅片为板翅式、管翅式或套片式。应理解,该第一换热器203可以是蒸发器,第二换热器205可以是冷凝器。As an optional embodiment, the first heat exchanger 203 or the second heat exchanger 205 includes fins, and the fins are plate-fin, tube-fin or sleeve-fin. It should be understood that the first heat exchanger 203 may be an evaporator, and the second heat exchanger 205 may be a condenser.
具体而言,该第一换热器203和/或第二换热器205可以包括:翅片和散热扁管,该翅片设置于相邻的两个散热扁管之间,大大增加了有效换热面积。该散热扁管内部填充有传热工质,该传热工质可以为氨、丙酮或四氟乙烷R134A等等。Specifically, the first heat exchanger 203 and/or the second heat exchanger 205 may include: fins and heat dissipation flat tubes, the fins are arranged between two adjacent heat dissipation flat tubes, greatly increasing the effective heat transfer area. The heat-transfer working medium is filled inside the heat-dissipating flat tube, and the heat-transfer working medium can be ammonia, acetone or tetrafluoroethane R134A and the like.
本发明实施例提供的具有热交换的装置,通过将温控单元分散设置于机柜的不同位置,充分利用现有技术没有有效利用的机柜内部空间,能够降低该装置整体的高度,从而减小该装置的体积,同时能够降低电子设备热耗增大时该装置需要增加的整体高度,以满足机柜不断演进的散热需求。The device with heat exchange provided by the embodiment of the present invention can reduce the overall height of the device by distributing the temperature control units at different positions of the cabinet, making full use of the internal space of the cabinet that is not effectively used in the prior art, thereby reducing the At the same time, it can reduce the overall height of the device when the heat consumption of electronic equipment increases, so as to meet the ever-evolving heat dissipation requirements of the cabinet.
应理解,本发明实施例的技术方案可以应用于各种需要散热的机柜,例如,户外通讯机柜、服务器机柜、配线机柜,本发明实施例对此不作限定。It should be understood that the technical solutions of the embodiments of the present invention may be applied to various cabinets requiring heat dissipation, for example, outdoor communication cabinets, server cabinets, and wiring cabinets, which are not limited in the embodiments of the present invention.
本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。The term "and/or" in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到各种等效的修改或替换,这些修改或替换都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can easily think of various equivalents within the technical scope disclosed in the present invention. Modifications or replacements shall all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610051956.3A CN105658033A (en) | 2016-01-26 | 2016-01-26 | Device with heat exchange |
| PCT/CN2016/091912 WO2017128659A1 (en) | 2016-01-26 | 2016-07-27 | Device with heat exchange function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610051956.3A CN105658033A (en) | 2016-01-26 | 2016-01-26 | Device with heat exchange |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105658033A true CN105658033A (en) | 2016-06-08 |
Family
ID=56487180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610051956.3A Pending CN105658033A (en) | 2016-01-26 | 2016-01-26 | Device with heat exchange |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105658033A (en) |
| WO (1) | WO2017128659A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163242A (en) * | 2016-08-31 | 2016-11-23 | 杭州华为数字技术有限公司 | A kind of rack heat-exchange system and server |
| WO2017128659A1 (en) * | 2016-01-26 | 2017-08-03 | 华为技术有限公司 | Device with heat exchange function |
| CN113747763A (en) * | 2021-09-08 | 2021-12-03 | 广东电网有限责任公司 | Heat dissipation system for substation exchange cabinet |
| CN114554779A (en) * | 2020-11-24 | 2022-05-27 | 华为技术有限公司 | Heat dissipation device and vehicle |
| CN114698332A (en) * | 2020-12-31 | 2022-07-01 | 致茂电子(苏州)有限公司 | Heat dissipation rack |
| WO2023044740A1 (en) * | 2021-09-24 | 2023-03-30 | 华为数字能源技术有限公司 | Machine box, energy storage system and data system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111929240A (en) * | 2020-07-28 | 2020-11-13 | 合肥富煌君达高科信息技术有限公司 | Immersion type high-precision measuring system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006055776A2 (en) * | 2004-11-18 | 2006-05-26 | Industrial Origami, Llc | A heat dissipation assembly and method for cooling heat-generating components in an electrical device |
| US20080156030A1 (en) * | 2006-12-28 | 2008-07-03 | Whirlpool Corporation | Hybrid multi-evaporator central cooling system for modular kitchen |
| CN201289187Y (en) * | 2008-08-26 | 2009-08-12 | 许红飞 | Heat exchanger |
| CN101959388A (en) * | 2009-07-17 | 2011-01-26 | 阿尔西制冷工程技术(北京)有限公司 | Telecommunication machine cabinet with refrigerating agent for circular heat exchange and cooling method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009112621A (en) * | 2007-11-08 | 2009-05-28 | Aruze Corp | Game machine |
| CN104422017A (en) * | 2013-08-19 | 2015-03-18 | 江苏香江科技股份有限公司 | Active heat pipe back plate cooling system |
| CN204071404U (en) * | 2014-09-16 | 2015-01-07 | 湖南大学 | A new type of refrigerated showcase |
| CN204157206U (en) * | 2014-09-29 | 2015-02-11 | 中国移动通信集团广东有限公司 | A kind of heat pipe outer circulation type secondary refrigerant loop server cabinet cooling system |
| CN105658033A (en) * | 2016-01-26 | 2016-06-08 | 华为技术有限公司 | Device with heat exchange |
-
2016
- 2016-01-26 CN CN201610051956.3A patent/CN105658033A/en active Pending
- 2016-07-27 WO PCT/CN2016/091912 patent/WO2017128659A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006055776A2 (en) * | 2004-11-18 | 2006-05-26 | Industrial Origami, Llc | A heat dissipation assembly and method for cooling heat-generating components in an electrical device |
| US20080156030A1 (en) * | 2006-12-28 | 2008-07-03 | Whirlpool Corporation | Hybrid multi-evaporator central cooling system for modular kitchen |
| CN201289187Y (en) * | 2008-08-26 | 2009-08-12 | 许红飞 | Heat exchanger |
| CN101959388A (en) * | 2009-07-17 | 2011-01-26 | 阿尔西制冷工程技术(北京)有限公司 | Telecommunication machine cabinet with refrigerating agent for circular heat exchange and cooling method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017128659A1 (en) * | 2016-01-26 | 2017-08-03 | 华为技术有限公司 | Device with heat exchange function |
| CN106163242A (en) * | 2016-08-31 | 2016-11-23 | 杭州华为数字技术有限公司 | A kind of rack heat-exchange system and server |
| CN106163242B (en) * | 2016-08-31 | 2019-05-28 | 杭州华为数字技术有限公司 | A cabinet heat exchange system and server |
| CN114554779A (en) * | 2020-11-24 | 2022-05-27 | 华为技术有限公司 | Heat dissipation device and vehicle |
| WO2022110692A1 (en) * | 2020-11-24 | 2022-06-02 | 华为技术有限公司 | Heat dissipation device and vehicle |
| CN114698332A (en) * | 2020-12-31 | 2022-07-01 | 致茂电子(苏州)有限公司 | Heat dissipation rack |
| CN113747763A (en) * | 2021-09-08 | 2021-12-03 | 广东电网有限责任公司 | Heat dissipation system for substation exchange cabinet |
| CN113747763B (en) * | 2021-09-08 | 2023-12-19 | 广东电网有限责任公司 | A cooling system for substation switching cabinets |
| WO2023044740A1 (en) * | 2021-09-24 | 2023-03-30 | 华为数字能源技术有限公司 | Machine box, energy storage system and data system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017128659A1 (en) | 2017-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107743354B (en) | Refrigerating system of data center machine room and data center | |
| CN105658033A (en) | Device with heat exchange | |
| US8437129B2 (en) | Server cabinet | |
| Nadjahi et al. | A review of thermal management and innovative cooling strategies for data center | |
| CN103081581B (en) | For the system of cooling electronic device | |
| EP2677848B1 (en) | Heat exchanger and cabinet | |
| CN102548357A (en) | data room | |
| CN102098902A (en) | Heat dissipation device, heat dissipation method for communication device and communication device | |
| CN107145205A (en) | Laptop radiating system based on flat board loop circuit heat pipe | |
| CN210519317U (en) | Thermoelectric cooling device for high-density server cabinet | |
| TWI655895B (en) | Cabinet cooling system | |
| US20210274683A1 (en) | Server, server rack and data centre | |
| CN115066157A (en) | Liquid cooling heat dissipation system and data center | |
| CN102143671A (en) | Radiating method and device | |
| CN105746008A (en) | Electronic apparatus enclosure device and electronic apparatus cooling system | |
| EP3927127B1 (en) | Electrical device using cooling device | |
| CN212064728U (en) | Heat exchange system | |
| CN114828588B (en) | A two-phase flow dual-circulation multi-mode data center cabinet cooling system | |
| CN104699206A (en) | Cooling cabinet of data center | |
| CN221748782U (en) | Air conditioning system for data center | |
| CN104582419A (en) | Heat exchanger for communication cabinet | |
| CN114786410A (en) | Integrated cooling cabinet compatible with air cooling server and liquid cooling server | |
| US12408300B2 (en) | Cooling system | |
| CN104320957A (en) | Cooling system for electronic equipment | |
| US20070227170A1 (en) | Cooling system for computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160608 |
|
| RJ01 | Rejection of invention patent application after publication |