CN207164691U - Heat exchange device and equipment with heat exchange device - Google Patents

Abstract

A heat exchange device and equipment having the heat exchange device, wherein a heat transfer medium is filled in a pipe unit, and the heat transfer medium flows to a heat absorber through a steam or gas pressurizer, a heat dissipation device and a throttling device. The heat absorber is provided with a heat absorption surface, which can contact a heat source, and the heat transfer medium flowing through the heat absorber will take away the heat of the heat source through the heat absorption surface; and the heat exchange device can be set in an equipment, and the equipment has at least one power supply unit and at least one working unit. When the working unit is in operation, it will form the heat source. The working unit contacts the heat absorption surface of the heat absorber, directly absorbs heat, and can perform an effective heat exchange cycle to achieve a heat dissipation effect.

Description

Heat exchange device and equipment with heat exchange device

technical field

The utility model relates to a heat exchanging device, which is applicable to equipment with the heat exchanging device, such as the heat dissipation of a computer host, but the equipment with the heat exchanging device is not limited to be used only in the computer host.

Background technique

Press, the early heat dissipation system, such as the heat dissipation system installed on a CPU (central processing unit, central processing unit) of a computer and other heat sources on a chip, is usually equipped with a fin with heat dissipation and heat conduction functions on the top. fins (or heat dissipation fins), through which the heat source is guided out to complete a heat dissipation process, but the advancement of technology has reduced the contact area of the heat source, and the increase in the instruction cycle has further caused the entire heat source to generate heat In addition to the poor efficiency, because the main casing of the computer is semi-closed, it is not easy to dissipate heat. After a long time of use, the internal dust will reduce the heat dissipation effect, so now there are More cooling system improvements.

At present, the industry has developed two heat dissipation methods. First, please refer to FIG. 1 for the first heat dissipation method. It is a liquid cooling system 40, which is directly connected to a central processing unit 51 in a computer host 50. After a pipeline system 41 imports a liquid with a lower temperature from the liquid cooling system 40 to a heat conducting part 42 in contact with the central processing unit 51, the liquid will absorb the heat generated by the central processing unit 51 so that The temperature of the liquid rises; then, the liquid is exported to a heat dissipation end 43 through the pipeline system 41, and the liquid in the heat dissipation end 43 is radiated through a cooling fan 44 to lower the temperature of the liquid, and then Then, the liquid is sent to the liquid cooling system 40 and the heat conduction part 42 again through the pipeline system 41 to generate an internal circulation and achieve heat dissipation effect on the CPU 51 .

However, in the cooling mechanism of the liquid cooling system 40, the circulation of its flow will be limited by the internal space of the main computer 50, so the flow distance is usually very short, and the circuit is fixed. In addition to the limited installation position, Too short circulation will make the liquid in the heat dissipation end 43 unable to effectively remove the heat. Therefore, under long-term use, the liquid flowing into the heat conduction part 42 will gradually heat up, and then the central processing unit 51 cannot be effectively dissipated. effect.

Or, for the second heat dissipation method, please refer to the fan cooling system shown in FIG. Each is provided with a cooling fan 44, and at the same time, a row of fans 64 is arranged on the host unit 60, through which the cooling fan 44 can guide the heat generated by the central processing unit 51 and the graphics processing unit 62, And the hot air is exhausted from the host unit 60 through the exhaust fan 64 to achieve a heat removal effect.

Carry out the heat dissipation mechanism in the mode of the heat dissipation fan 44, the heat dissipation fan 44 and the exhaust fan 64 need to keep running during the power-on process of the host unit 60 in order to produce a good heat dissipation effect, but the heat dissipation fan 44 and the exhaust fan 64 are in operation. 64 will consume a large amount of electricity, and the operation of the cooling fan 44 and the exhaust fan 64 will also produce noise, and after a long period of use, the temperature of the central processing unit 51 and the graphics processing unit 62 will increase; in addition, the The cooling fan 44 generates air flow to take away the heat. The cooling fan 44 installed on the central processing unit 51 and the graphics processing unit 62 cannot directly perform an effective heat dissipation on the peripheral computing chips, so the overall cooling effect is limited.

Utility model content

The technical problem solved by the utility model is to provide a heat exchange device and a device with the heat exchange device.

The technical means adopted in the utility model are as follows.

The main purpose of the utility model is to provide a heat exchange device for rapid and effective cooling and a device with the heat exchange device. The heat exchange device at least includes: a pipeline unit, which can be filled with a heat transfer unit Medium; a steam or gas pressurizer, the steam or gas pressurizer is connected to the pipeline unit; a heat sink, the steam or gas pressurizer is connected to the heat dissipation device through the pipeline unit; a throttling device , the cooling device is connected to the throttling device by the pipeline unit; a heat absorber, the throttling device is connected to the heat absorber by the pipeline unit, and the heat absorber is connected to the steam or gas pressurizer Connected with the pipeline unit, the heat absorber is provided with a heat absorbing surface; a control unit is connected with the steam or gas pressurizer, the cooling device, the throttling device and the heat absorber in signal connection.

The above-mentioned heat exchange device, wherein the heat exchange device further includes a housing, the steam or gas pressurizer, the heat dissipation device, the throttling device and the control unit are installed inside the housing, and the The heat sink is arranged outside the casing.

The above-mentioned heat exchange device, wherein the heat dissipation device is constituted by a finned radiator, a fan or a water-cooled heat dissipation device.

The above-mentioned heat exchange device, wherein the throttling device is a capillary tube, a temperature-sensitive expansion valve, an electronic expansion valve or an orifice restrictor plate.

The equipment with a heat exchange device at least includes: a device and the heat exchange device as described above, wherein at least one working unit is arranged inside the equipment; the heat absorber is in contact with the working unit.

In another embodiment, the equipment with a heat exchange device at least includes: a device and a heat exchange device; wherein, the heat exchange device at least includes: a pipeline unit, which can be filled with A heat transfer medium; a steam or gas pressurizer, the steam or gas pressurizer is connected to the pipeline unit; a heat dissipation device, the steam or gas pressurizer is connected to the heat dissipation device through the pipeline unit; A throttling device, the cooling device is connected to the throttling device by the pipeline unit; a plurality of heat absorbers, the throttling device is connected to the heat absorber by the pipeline unit, and the heat absorber is connected to the steam or The gas pressurizer is connected with the pipeline unit, and each heat absorber is provided with a heat absorbing surface; a control unit is connected with the steam or gas pressurizer, the cooling device, the throttling device and the heat absorber Signal connection; wherein, at least one working unit is arranged inside the device; the heat-absorbing surface is in contact with the working unit.

The above-mentioned equipment with heat exchange device, wherein, a plurality of the heat absorbers are connected by the pipeline unit.

The equipment with the heat exchange device as described above, wherein a plurality of the heat absorbers are connected in series with the pipeline unit.

The above-mentioned equipment with heat exchange device, wherein a plurality of the heat absorbers are sequentially connected in series with the pipeline unit.

The above equipment with heat exchange device, wherein the plurality of working units have a plurality of wafers, and the heat absorbing surface is in contact with the wafers.

The above equipment with heat exchange device, wherein the plurality of heat absorbing surfaces are in contact with the corresponding wafers.

The above-mentioned equipment with the heat exchange device, wherein each of the heat-absorbing surfaces is in contact with each of the corresponding wafers.

The above-mentioned equipment with heat exchange device, wherein the chip is a central processing unit or a graphics processing unit.

The above equipment with heat exchange device, wherein the equipment is further provided with at least one power supply unit, and the power supply unit is electrically connected to the working unit.

The above-mentioned equipment with a heat exchange device, wherein the power supply unit is electrically connected to the heat exchange device.

The above-mentioned equipment with heat exchange device, wherein, the working unit is further provided with a temperature sensor between the heat absorbing surface and the working unit, and is in contact with the heat absorber and the working unit.

In the equipment with the heat exchange device as described above, the working unit is also provided with a pulse width modulation speed regulating device, and the control unit is signally connected to the pulse width modulation speed regulating device.

The technical effect produced by the utility model: the heat exchange device and the equipment with the heat exchange device provided by the utility model, the heat absorber of the heat exchange device can directly contact with a heat source to produce the effect of direct cooling and heat dissipation , thus improving the cooling effect. Moreover, after the heat transfer medium is circulated, the temperature of the heat transfer medium can be kept at a low temperature in the heat absorber, so even if it is used for a long time, its cooling effect will not be lost. At the same time, in the equipment with heat exchange device, the working unit can directly contact with the heat absorber, so as to achieve direct and effective heat dissipation effect, and the installation of the heat exchange device in the equipment will not increase the volume, and Because the heat sink provides direct and continuous heat dissipation, the operating temperature of the working unit can be within a preferred temperature, thereby avoiding sluggishness or damage caused by overheating.

Description of drawings

Figure 1 is a schematic diagram of a conventional liquid cooling system.

Fig. 2 is a schematic diagram of a conventional fan cooling system.

Fig. 3 is a three-dimensional appearance view of the heat exchange device of the present invention.

FIG. 4 is an exploded perspective view of the first embodiment of the equipment with heat exchange device of the present invention.

FIG. 5 is a schematic diagram of a second embodiment of the equipment with heat exchange device of the present invention.

FIG. 6 is a three-dimensional appearance view of the second embodiment of the equipment with heat exchange device of the present invention.

Description of figure number:

The utility model

10 heat exchange device

11 piping unit

12 Steam or gas pressurizers

13 Heat sink

131 finned radiator

132 fans

14 throttling device

15 heat sink

151 heat absorbing surface

16 control unit

20 housing

30 devices

31 shell

32 power supply unit

33 work units

331 motherboard

3311 CPU

3312 Temperature Sensor

3313 pulse width modulation speed control device

3321 Graphics Processor

H heat source

Accustomed to know

40 liquid cooling system

41 piping system

42 heat conduction part

43 Heat sink

44 cooling fan

50 host computer

51 CPU

60 host unit

62 GPUs

64 Exhaust fans.

Detailed ways

Please refer to Figure 3 for the utility model, which is a three-dimensional appearance view of the heat exchange device of the present invention. The so-called "heat exchange" refers to the ability to exchange heat and cold. The heat exchange device 10 includes: a A pipeline unit 11, which can be filled with a heat-transfer medium (not shown in the figure), the heat-transfer medium is a substance that can be converted between gaseous and liquid states, such as a refrigerant or water.

A steam or gas pressurizer 12, the steam or gas pressurizer 12 is connected with the pipeline unit 11, the steam or gas pressurizer 12 can compress the heat transfer medium in the pipeline unit 11 to high temperature and high pressure gaseous state; the vapor or gas pressurizer 12 may be a compressor.

A heat dissipation device 13, the heat dissipation device 13 is connected with the pipeline unit 11, and connected behind the steam or gas pressurizer 12, that is, the steam or gas pressurizer 12 and the heat dissipation device 13 are connected by the pipeline The unit 11 is connected; the cooling device 13 includes a finned radiator 131 and a fan 132, after the heat transfer medium flows into the finned radiator 131, it can cool down through the fan 132, and then the The heat transfer medium in the pipeline unit 11 is converted into a low-temperature and high-pressure liquid state; for example, the heat sink 13 can be the finned heat sink 131, the fan 132 or a water-cooled heat sink; the water-cooled heat sink is A tank filled with water, and the finned radiator 131 or the pipeline unit 11 is soaked into the tank filled with water to form the water-cooled heat dissipation device, so as to achieve the effect of heat dissipation.

A throttling device 14, the throttling device 14 is connected with the pipeline unit 11, and is connected behind the heat dissipation device 13, that is, the heat dissipation device 13 and the throttling device 14 are connected with the pipeline unit 11; The throttling device 14 is a capillary tube, a temperature-sensitive expansion valve, an electronic expansion valve or an orifice restriction plate (oriface). The throttling device 14 can convert the heat transfer medium in the pipeline unit 11 into a low temperature A gaseous state at low pressure.

A heat absorber 15, the heat absorber 15 is connected with the pipeline unit 11, the heat absorber 15 is arranged between the throttling device 14 and the steam or gas pressurizer 12, that is, the throttling device 14 The heat absorber 15 is connected with the pipeline unit 11, and the heat absorber 15 is connected with the steam or gas pressurizer 12 with the pipeline unit 11; the heat absorber 15 is provided with a heat absorbing surface 151, The heat-absorbing surface 151 can be in contact with a heat source H and exchange heat and cold with the heat source H. Generally speaking, the heat source H transfers heat to the heat-absorbing surface 151 so that the temperature of the heat source H can be reduced or maintained at a certain level. temperature; and the low-temperature and low-pressure gaseous heat transfer medium flowing through the heat absorber 15 will pass through the heat-absorbing surface 151 and take away the heat transferred from the heat source H to the heat-absorbing surface 151, and convert it into low-pressure and high-temperature The gaseous heat transfer medium flows through the pipeline unit 11 to the steam or gas pressurizer 12 to complete a circulation loop.

A control unit 16, which is connected with the steam or gas pressurizer 12, the cooling device 13, the throttling device 14 and the heat sink 15 and can provide power and control the steam or gas pressurizer 12, the Operation of the cooling device 13 , the throttling device 14 and the heat sink 15 .

A housing 20, the steam or gas pressurizer 12, the cooling device 13, the throttling device 14 and the control unit 16 are installed inside the housing 20, and the heat absorber 15 is located in the housing 20 external.

Please refer to FIG. 3, the housing 20 can accommodate the heat exchange device 10 as a whole to facilitate portability and installation. The heat source H is in contact with the heat source H. In this embodiment, the heat source H is a chip such as a central processing unit. The heat-absorbing surface 151 can exchange heat with the low-temperature and low-pressure gaseous heat transfer medium filled in the pipeline unit 11, so as to Absorb the heat generated by the heat source H, and convert the heat transfer medium into a high-temperature and low-pressure gaseous state; then, the heat transfer medium is transported to the steam or gas pressurizer 12 through the pipeline unit 11 and passed through the steam or gas After pressurized by the pressurizer 12 to form the high-temperature and high-pressure gaseous heat transfer medium, the finned radiator 131 introduced into the heat sink 13 is transported through the pipeline unit 11 again, and after being cooled by the exhaust heat of the fan 132, the tube The heat transfer medium in the circuit unit 11 will be converted into a low-temperature and high-pressure liquid heat transfer medium; then, through the capillary tube of the throttling device 14, it will be converted into a low-temperature and low-pressure gaseous heat transfer medium, so that the heat transfer medium introduced into the suction The heat transfer medium of the heater 15 is in a state of low temperature and low pressure to complete the circulation loop. This circulation loop can ensure that the temperature of the heat transfer medium of the heat-absorbing surface 151 can effectively dissipate heat to the heat source H; therefore, it can still ensure that the operation of the central processing unit is still at an appropriate operating temperature under long-term operation. Inside.

Please also refer to FIG. 4 , which is an exploded three-dimensional view of the first embodiment of the equipment with heat exchange device of the present invention. The heat exchange device is the same as the previous embodiment, so it will not be described again. Wherein, the heat exchange device 10 is directly installed in a device 30, and the device can be a computer host, a container or a building. In this embodiment, the device 30 is the computer host. The device 30 has a casing 31. In this embodiment, the casing 31 is a computer casing. The inside of the casing 31 or the inside of the device 30 has a power supply unit 32 and a working unit 33. The working unit 33 is A main board 331, on which a central processing unit 3311 (in this embodiment, the heat source) is provided, and the heat exchange device 10 is provided with the heat sink 15 relative to the working unit 33, wherein the heat absorption The surface 151 is in contact with the CPU 3311 . At the same time, the power supply unit 32 can directly supply power to the heat exchange device 10, so that the heat exchange device 10 does not need an additional power supply; generally speaking, the heat sink 15 has a small active area, so the steam or gas The power consumption of the pressurizer 12 is not large, so the heat exchange device 10 directly uses the power of the power supply unit 32 without affecting the performance and stability of the working unit 33 . At the same time, the motherboard 331 of the working unit 33 is further provided with a temperature sensor 3312 between the heat sink 15 and the central processing unit 3311, and the temperature sensor 3312 is clamped between the heat sink 15 and the CPU. Between the CPUs 3311 and in contact with the heat absorbing surface 151 . The main board 331 is provided with a pulse width modulation (PWM, Pulse Width Modulation) speed regulating device 3313 , and the control unit 16 is connected to the pulse width modulation speed regulating device 3313 to control the operation state of the heat exchange device 10 . When the working unit 33 just started, its temperature was lower than a threshold, so the control unit 16 would not start the steam or the gas pressurizer 12 and the fan 132; The temperature of the CPU 3311 will increase, so the temperature sensor 3312 will perceive that the temperature of the CPU 3311 has increased; when the temperature sensor 3312 senses that the temperature of the CPU 3311 is equal to or exceeds the threshold, then the The pulse width modulation speed control device 3313 notifies the control unit 16 with a signal, and the control unit 16 will drive the steam or gas pressurizer 12 and the fan 132 to operate so that the heat medium circulates in the circulation loop Cool down. Then when the temperature drop is completed, for example, when the temperature sensor 3312 senses that the temperature of the central processing unit 3311 is lower than the threshold value, the pulse width modulation speed regulating device 3313 notifies the control unit 16 with another signal, and the control unit 16, the operation of the heat exchange device 10 can be slowed down or stopped. Therefore, the heat exchanging device 10 can be operated again when needed, so energy loss can be reduced and excessive heat dissipation of the heat absorber 15 can be avoided, resulting in frosting or low temperature of the central processing unit 3311 and the working unit 33 situation.

Please refer to FIG. 5 and FIG. 6 together, which is the second embodiment of the equipment with the heat exchange device of the present invention. The heat exchange device 10 is roughly the same as the previous embodiment, so it will not be repeated. Wherein, the interior of the equipment 30 has a plurality of the working units 33, the heat exchange device 10 of this embodiment has a plurality of the heat absorbers 15, and the plurality of the heat absorbers 15 are connected by the pipeline unit 11 to complete the Circulation loop, preferably a plurality of the heat absorbers 15 are connected in series with the pipeline unit 11 to complete the circulation loop, preferably a plurality of the heat absorbers 15 are sequentially connected in series with the pipeline unit 11 to complete the circulation loop circulation loop; the heat absorbing surface 151 of the heat absorber 15 is in contact with the central processing unit 3311 (the heat source in this embodiment), preferably the heat absorbing surface 151 is in contact with the corresponding central processing unit 3311 (in this embodiment) In this embodiment, it is the heat source) in contact, and preferably each of the heat-absorbing surfaces 151 is in contact with each of the corresponding central processing units 3311 (in this embodiment, the heat source).

In the embodiment shown in Fig. 5 and Fig. 6, the inside of the device 30 has two working units 33, the two working units 33 are respectively the motherboard 331 and a display adapter 332, and the motherboard 331 is provided with the The central processing unit 3311, the display adapter 332 is provided with a graphics processor 3321, and the heat exchange device 10 is provided with two heat sinks 15 connected in series with the pipeline unit 11 relative to the two working units 33 ; Wherein, the two heat sinks 15 are in contact with the central processing unit 3311 and the graphics processing unit 3321 through their respective heat absorbing surfaces 151 .

Of course, the equipment 30 can also be provided with a plurality of the power supply units 32 , so as to switch to supply power to the plurality of the working units 33 or the heat exchange device 10 according to the demand of power distribution.

Claims (18)

1. a kind of heat-exchanger rig, it is characterised in that comprise at least：

One pipe-line cell (11)；

One steam or gas pressure applicator (12), the steam or gas pressure applicator (12) are connected with the pipe-line cell (11)；

One heat abstractor (13), the steam or gas pressure applicator (12) are connected with the heat abstractor (13) with the pipe-line cell (11) Connect；

One throttling arrangement (14), the heat abstractor (13) are connected with the throttling arrangement (14) with the pipe-line cell (11)；

One heat dump (15), the throttling arrangement (14) is connected with the heat dump (15) with the pipe-line cell (11), and the heat dump (15) it is connected with the steam or gas pressure applicator (12) with the pipe-line cell (11), the heat dump (15) is provided with a heat-absorbent surface (151)；

One control unit (16), its with the steam or gas pressure applicator (12), the heat abstractor (13), the throttling arrangement (14) and Heat dump (15) signal connects；

One housing (20), the inside of the housing (20) are equiped with the steam or gas pressure applicator (12), the heat abstractor (13), are somebody's turn to do Throttling arrangement (14) and the control unit (16), and the heat dump (15) is located at the outside of the housing (20).

2. heat-exchanger rig as claimed in claim 1, it is characterised in that the heat abstractor (13) is fin type radiating row (131), a fan (132) or a water-cooling heat radiating device are formed.

3. heat-exchanger rig as claimed in claim 1 or 2, it is characterised in that the throttling arrangement (14) is a capillary, a temperature-sensitive Formula expansion valve, an electronic expansion valve or a discharge orifice current limiting plate.

4. a kind of equipment with heat-exchanger rig, it is characterised in that including at least having：

One equipment (30) and a heat-exchanger rig (10)；

Wherein, the heat-exchanger rig (10) is comprised at least and had：

One pipe-line cell (11)；

One steam or gas pressure applicator (12), the steam or gas pressure applicator (12) are connected with the pipe-line cell (11)；

One heat abstractor (13), the steam or gas pressure applicator (12) are connected with the heat abstractor (13) with the pipe-line cell (11) Connect；

One throttling arrangement (14), the heat abstractor (13) are connected with the throttling arrangement (14) with the pipe-line cell (11)；

One heat dump (15), the throttling arrangement (14) is connected with the heat dump (15) with the pipe-line cell (11), and the heat dump (15) it is connected with the steam or gas pressure applicator (12) with the pipe-line cell (11), the heat dump (15) is provided with a heat-absorbent surface (151)；

One control unit (16), its with the steam or gas pressure applicator (12), the heat abstractor (13), the throttling arrangement (14) and Heat dump (15) signal connects；

Wherein, the equipment (30) is internally provided with an at least working cell (33)；The heat-absorbent surface (151) and the working cell (33) contact.

5. there is the equipment of heat-exchanger rig as claimed in claim 4, it is characterised in that the heat-absorbent surface (151) and the job note One contact wafers of first (33).

6. there is the equipment of heat-exchanger rig as claimed in claim 5, it is characterised in that the chip is a central processing unit Or a graphics processor (3321) (3311).

7. a kind of equipment with heat-exchanger rig, it is characterised in that including at least having：

One equipment (30) and a heat-exchanger rig (10)；

Wherein, the heat-exchanger rig (10) is comprised at least and had：

One pipe-line cell (11)；

One steam or gas pressure applicator (12), the steam or gas pressure applicator (12) are connected with the pipe-line cell (11)；

One heat abstractor (13), the steam or gas pressure applicator (12) are connected with the heat abstractor (13) with the pipe-line cell (11) Connect；

One throttling arrangement (14), the heat abstractor (13) are connected with the throttling arrangement (14) with the pipe-line cell (11)；

A plurality of heat dumps (15), the throttling arrangement (14) is connected with the heat dump (15) with the pipe-line cell (11), and the suction Hot device (15) is connected with the steam or gas pressure applicator (12) with the pipe-line cell (11), and each heat dump (15) is provided with one and inhaled Hot face (151)；

One control unit (16), its with the steam or gas pressure applicator (12), the heat abstractor (13), the throttling arrangement (14) and Heat dump (15) signal connects；

Wherein, the equipment (30) is internally provided with least a plurality of working cells (33)；The heat-absorbent surface (151) and the job note First (33) contact.

8. there is the equipment of heat-exchanger rig as claimed in claim 7, it is characterised in that a plurality of heat dumps (15) are with the pipe Road unit (11) connects.

9. there is the equipment of heat-exchanger rig as claimed in claim 7, it is characterised in that a plurality of heat dumps (15) are with the pipe Road unit (11) is contacted.

10. there is the equipment of heat-exchanger rig as claimed in claim 7, it is characterised in that a plurality of heat dumps (15) are with this Pipe-line cell (11) is sequentially contacted.

11. there is the equipment of heat-exchanger rig as claimed in claim 7, it is characterised in that a plurality of working cell (33) tools There are a plurality of chips, the heat-absorbent surface (151) and the contact wafers.

12. as claimed in claim 11 have heat-exchanger rig equipment, it is characterised in that a plurality of heat-absorbent surfaces (151) with The corresponding contact wafers.

13. as claimed in claim 11 have heat-exchanger rig equipment, it is characterised in that each heat-absorbent surface (151) with it is right The each contact wafers answered.

14. the equipment with heat-exchanger rig as described in claim 11 to 13 is any, it is characterised in that the chip is a center Processor (3311) or a graphics processor (3321).

15. the equipment with heat-exchanger rig as described in claim 4 to 13 is any, it is characterised in that the equipment (30) is set There is an at least power supply unit (32), the power supply unit (32) is electrically connected with the working cell (33).

16. there is the equipment of heat-exchanger rig as claimed in claim 15, it is characterised in that the power supply unit (32) and the heat exchange Device (10) is electrically connected with.

17. there is the equipment of heat-exchanger rig as claimed in claim 15, it is characterised in that the working cell (33) is equipped with one Temperature sensor (3312) between the heat-absorbent surface (151) and the working cell (33), and with the heat dump (15) and the work Unit (33) contacts.

18. there is the equipment of heat-exchanger rig as claimed in claim 15, it is characterised in that the working cell (33) and provided with one Pulse width modulation arrangements for speed regulation (3313), control unit (16) signal connect the pulse width modulation arrangements for speed regulation (3313)。