CN202502450U - Synthetic jet flow heat dissipation device used for CPU - Google Patents
Synthetic jet flow heat dissipation device used for CPU Download PDFInfo
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- CN202502450U CN202502450U CN2011205688912U CN201120568891U CN202502450U CN 202502450 U CN202502450 U CN 202502450U CN 2011205688912 U CN2011205688912 U CN 2011205688912U CN 201120568891 U CN201120568891 U CN 201120568891U CN 202502450 U CN202502450 U CN 202502450U
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- heat
- cpu
- flow
- synthesizing jet
- heat dissipation
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Abstract
The utility model discloses a synthetic jet flow heat dissipation device used for a CPU. The synthetic jet flow heat dissipation device comprises a pedestal. An upper side of the pedestal is provided with a heat collector. A lower side of the heat collector is contacted with the CPU. The upper side of the heat collector is provided with a cooling fin. A bottom of the cooling fin is connected with the upper part of the heat collector. The upper side of the cooling fin is provided with a plurality of radiating fins. A plurality of synthetic jet flow devices are arranged among the radiating fins. The synthetic jet flow devices comprise cavities. The upper sides of the cavities are provided with nozzles and the lower sides of the cavities are fixed with vibrating diaphragms. The lower sides of the vibrating diaphragms are provided with piezoelectric patches. The synthetic jet flow heat dissipation device of the utility model has the following characteristics that: a design is reasonable; a structure is simple; usage is convenient; a volume is small; an installation space is saved; heat dissipation efficiency is high; there is no noise in a heat dissipation process; reliability is high; a suitable scope is wide; production cost is low; and the device is easy to popularize.
Description
Technical field
The utility model belongs to and relates to a kind of heat abstractor, is specifically related to the synthesizing jet-flow heat abstractor of a kind of CPU of being used for.
Background technology
The continuous progress of Along with computer technology, the data processing performance of computer CPU is also increasingly high, and the thermal value of CPU has increased significantly with comparing in the past, and the heat radiation cooling problem of CPU also just becomes increasingly conspicuous.The fast development of integrated circuit technique causes device heat flow density on every side increasing, and the heat flow density that CPU produces in its operational process has reached 60-100W/cm
2, because the reliability of electron device work is very responsive to temperature, electron device 1 ℃ of every increase on 70-80 ℃ of level, reliability will descend 5%, and higher temperature levels becomes restriction electron device bottleneck of performance day by day.Along with improving constantly of CPU integrated circuit density, the travelling speed of microprocessor is more and more faster, and function integrated in monolithic chip is also more and more; The energy that chip need consume is also more; This can produce increasing heat when just meaning processor work, if untimely the shedding of heat that chip produces, with life-span that influences electron device and functional reliability; Too high for the temperature of avoiding cpu chip, on chip, install heating radiator usually additional.
The heat sink arrangement of CPU employing at present mainly is through fan or the pump housing equipment heat on the heat radiator to be dispelled the heat with the mode of forced convertion, and this radiating mode is an active heat removal, and radiating efficiency is high.But for the processor of long-term work, the fan radiating effect is undesirable, and fan also can send noise in the process of heat radiation; If equipment such as fan break down; The heat of CPU can't effectively shed, and the result will badly influence the performance of CPU, even burns out CPU.
The utility model content
The purpose of the utility model is to overcome above-mentioned deficiency of the prior art, and the synthesizing jet-flow heat abstractor of a kind of CPU of being used for is provided, and it is reasonable in design, and is simple in structure; Easy to use, volume is little, saves installing space; Radiating efficiency is high, heat radiation process noiseless, and reliability is high; Applied widely, production cost is low, is convenient to promote the use of.
For realizing above-mentioned purpose, the technical scheme that the utility model adopts is: the synthesizing jet-flow heat abstractor of a kind of CPU of being used for comprises base; It is characterized in that: said base upside is provided with heat collector, and said heat collector downside contacts with CPU, and said heat collector upside is provided with heat radiator; Said heat radiator bottom is connected with said heat collector top, and said heat radiator upside is provided with a plurality of radiating fins, is provided with a plurality of synthesizing jet-flow devices between the said radiating fin; Said synthesizing jet-flow device comprises cavity; Said cavity upside spout, said cavity downside is fixed with vibrating diaphragm, and said vibrating diaphragm downside is provided with piezoelectric patches.
Be provided with heat-conducting cream between said heat radiator bottom and the said heat collector top.
Said heat radiator middle part is a column structure, is platy structure around the said heat radiator.
The synthesizing jet-flow device level of middle side part is installed on the said heat radiator, and the synthesizing jet-flow device side around the said heat radiator upside is to installation.
The utility model compared with prior art has the following advantages:
(1) this synthesizing jet-flow heat abstractor that is used for CPU is reasonable in design, simple in structure, only needs this device of energising can accomplish heat radiation automatically, uses very easy.
(2) this synthesizing jet-flow heat abstractor volume that is used for CPU is little, in light weight, saves installing space.
(3) this synthesizing jet-flow heat-diffusing efficiency of heat abstractor that is used for CPU is very high, and the heat radiation process can not produce noise.
(4) this synthesizing jet-flow heat abstractor reliability that is used for CPU is high, applied widely, can be widely used in multiple place.
(5) these a lot of parts of synthesizing jet-flow heat abstractor that are used for CPU all are convenient to produce, buy very much, thereby its production cost is very low, is convenient to promote the use of.
Through accompanying drawing and embodiment, the utility model is done further detailed description below.
Description of drawings
Fig. 1 is the front view of the utility model.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation of the utility model synthesizing jet-flow device.
Description of reference numerals:
The 1-heat collector; The 2-heat radiator; The 3-radiating fin;
4-synthesizing jet-flow device; The 4-1-cavity; The 4-2-spout;
The 4-3-vibrating diaphragm; The 4-4-piezoelectric patches; The 5-base;
6-CPU。
Embodiment
Like Fig. 1-a kind of synthesizing jet-flow heat abstractor that is used for CPU shown in Figure 3; Comprise base 5; Said base 5 upsides are provided with heat collector 1, and said heat collector 1 downside contacts with CPU6, and said heat collector 1 upside is provided with heat radiator 2; Said heat radiator 2 bottoms are connected with said heat collector 1 top, are provided with heat-conducting cream between said heat radiator 2 bottoms and said heat collector 1 top.Said heat radiator 2 upsides are provided with a plurality of radiating fins 3; Be provided with a plurality of synthesizing jet-flow devices 4 between the said radiating fin 3; Said synthesizing jet-flow device 4 comprises cavity 4-1; Said cavity 4-1 upside spout 4-2, said cavity 4-1 downside is fixed with vibrating diaphragm 4-3, and said vibrating diaphragm 4-3 downside is provided with piezoelectric patches 4-4.
As shown in Figure 2, said heat radiator 2 middle parts are column structure, are platy structure around the said heat radiator 2.
As shown in Figure 2, synthesizing jet-flow device 4 levels of middle side part are installed on the said heat radiator 2, and synthesizing jet-flow device 4 side direction around said heat radiator 2 upsides are installed.
The course of work that the utility model is used for the synthesizing jet-flow heat abstractor of CPU is: at first this synthesizing jet-flow heat abstractor that is used for CPU is installed in CPU6, in CPU6 when work, produce heat, through the heat collector that joins with CPU6 1 heat conducted; The temperature of CPU6 is reduced, and heat collector 1 conducts heat to heat radiator 2, and heat radiator 2 passes to heat on the radiating fin 3; Be installed in combining jet device 4 between the radiating fin 3 under the effect of voltage, piezoelectric patches 4-4 drives vibrating diaphragm 4-3 vibration, causes that the periodicity of air-flow at spout 4-2 place sucks and launches; Thereby formed jet; Drive the air flow between the radiating fin 3, jet air is as shown in Figure 3, and wherein the spout 4-2 of middle synthesizing jet-flow device 4 upwards; Air is last current downflow; Synthesizing jet-flow device 4 side direction around the heat radiator 2 are installed, and air-spray dispels the heat heat to peripheral direction, thereby quicken radiating effect.
The above; It only is the preferred embodiment of the utility model; Be not that the utility model is done any restriction; Every according to the utility model technical spirit to any simple modification, change and equivalent structure transformation that above embodiment did, all still belong in the protection domain of the utility model technical scheme.
Claims (4)
1. synthesizing jet-flow heat abstractor that is used for CPU; Comprise base (5), it is characterized in that: said base (5) upside is provided with heat collector (1), and said heat collector (1) downside contacts with CPU (6); Said heat collector (1) upside is provided with heat radiator (2); Said heat radiator (2) bottom is connected with said heat collector (1) top, and said heat radiator (2) upside is provided with a plurality of radiating fins (3), is provided with a plurality of synthesizing jet-flow devices (4) between the said radiating fin (3); Said synthesizing jet-flow device (4) comprises cavity (4-1); Said cavity (4-1) upside spout (4-2), said cavity (4-1) downside is fixed with vibrating diaphragm (4-3), and said vibrating diaphragm (4-3) downside is provided with piezoelectric patches (4-4).
2. according to the described a kind of synthesizing jet-flow heat abstractor that is used for CPU of claim 1, it is characterized in that: be provided with heat-conducting cream between said heat radiator (2) bottom and said heat collector (1) top.
3. according to the described a kind of synthesizing jet-flow heat abstractor that is used for CPU of claim 1, it is characterized in that: said heat radiator (2) middle part is column structure, and said heat radiator (2) is platy structure all around.
4. according to the described a kind of synthesizing jet-flow heat abstractor that is used for CPU of claim 1, it is characterized in that: said heat radiator (2) is gone up synthesizing jet-flow device (4) level of middle side part and is installed, and synthesizing jet-flow device (4) side direction around said heat radiator (2) upside is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205688912U CN202502450U (en) | 2011-12-24 | 2011-12-24 | Synthetic jet flow heat dissipation device used for CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205688912U CN202502450U (en) | 2011-12-24 | 2011-12-24 | Synthetic jet flow heat dissipation device used for CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202502450U true CN202502450U (en) | 2012-10-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205688912U Expired - Fee Related CN202502450U (en) | 2011-12-24 | 2011-12-24 | Synthetic jet flow heat dissipation device used for CPU |
Country Status (1)
| Country | Link |
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| CN (1) | CN202502450U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017099677A1 (en) * | 2015-12-09 | 2017-06-15 | Ozyegin Universitesi | Heat sink cooling with preferred synthetic jet cooling devices |
-
2011
- 2011-12-24 CN CN2011205688912U patent/CN202502450U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017099677A1 (en) * | 2015-12-09 | 2017-06-15 | Ozyegin Universitesi | Heat sink cooling with preferred synthetic jet cooling devices |
| US10629514B2 (en) | 2015-12-09 | 2020-04-21 | Ozyegin Universitesi | Heat sink cooling with preferred synthetic jet cooling devices |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121024 Termination date: 20141224 |
|
| EXPY | Termination of patent right or utility model |