CN203643932U - Novel cooling fin - Google Patents

Abstract

The new heat sink disclosed by the utility model comprises a rectangular heat dissipation bottom plate and several fins arranged on the heat dissipation bottom plate. The fins are cylindrical structures, and the fins located in the center of the heat dissipation bottom plate are perpendicular to the heat dissipation bottom plate. The rest of the fins diverge to the periphery of the heat dissipation base plate; the heat sink is arranged on the motherboard processor or the north and south chips that need heat dissipation, and the heat sink is facing the chassis fan horizontally, and the wind blown from the chassis fan just passes through The heat sink takes away heat from the heat sink. The new heat sink is designed in the form of divergent or inclined fins, which increases the gap between the fins, optimizes air convection, improves the heat dissipation efficiency of the system, and at the same time reduces the speed of the system fan, reducing the heat dissipation of the system Power consumption, making the system operation noise is greatly reduced.

Description

A new heat sink

technical field

The utility model relates to a radiator, in particular to a novel radiator.

Background technique

With the increasing speed of computer technology, more and more heat is generated by components such as boards and chips inside the chassis during the working process, which puts forward higher heat dissipation requirements for the heat dissipation equipment used to dissipate heat for various components inside the chassis. , the existing heat sink can no longer meet the current heat dissipation requirements. As shown in Figure 1, the existing heat sink 1 includes a heat dissipation bottom plate 3 and a number of heat dissipation fins 4 arranged on the bottom plate. They are all arranged vertically on the heat dissipation bottom plate, so that many heat dissipation fins are closely arranged together with very limited spacing, which seriously affects the heat dissipation effect. If you want to use the original heat sink to ensure the ideal heat dissipation effect, you need to increase the speed of the fan in the chassis, which increases the performance requirements of the fan and increases power consumption.

Utility model content

The utility model provides a novel heat sink with simple structure aiming at the deficiencies of the prior art.

The utility model discloses a new heat sink. The technical solution adopted to solve the technical problem is as follows: it includes a new heat sink, a processor on the chassis main board or a north-south chip and a chassis fan. Above the motherboard processor or the north and south chips, the heat sink is facing the chassis fan horizontally, and the wind blown from the chassis fan just takes away the heat of the heat sink through the heat sink, and the heat sink includes a rectangular heat dissipation bottom plate And several fins arranged on the heat dissipation bottom plate, the fins are cylindrical structures, the fins located in the center of the heat dissipation bottom plate are perpendicular to the heat dissipation bottom plate, and the rest of the fins are arranged obliquely on the heat dissipation bottom plate.

Further, the fins are inclined toward the periphery of the heat dissipation bottom plate.

Further, from the central position of the heat dissipation bottom plate to the periphery thereof, the inclination of the fins gradually decreases.

Further, the fins are elongated and cylindrical, and all the fins have the same length.

The beneficial effect of the novel heat sink disclosed by the utility model is: the novel heat sink is designed in the form that the fins are inclined to the surroundings, so that the gap between the fins increases, the air convection is optimized, and the heat dissipation efficiency of the system is improved At the same time, the speed of the system fan is reduced, the heat dissipation power consumption of the system is reduced, and the operating noise of the system is greatly reduced.

Description of drawings

Accompanying drawing 1 is the schematic diagram of described existing radiator;

Accompanying drawing 2 is the schematic diagram of described novel radiator;

Notes on drawings: 1. Existing heat sink; 2. New heat sink; 3. Heat dissipation bottom plate; 4. Fins.

Detailed ways

The novel cooling fin disclosed in the utility model will be described in further detail below in conjunction with the accompanying drawings.

The structure of the new heat sink disclosed by the utility model is shown in Figure 2. The new heat sink 2 includes a heat dissipation bottom plate 3 and several fins 4 arranged on the heat dissipation bottom plate. The heat dissipation bottom plate is a rectangular heat dissipation bottom plate , the fin is a cylindrical structure. In order to improve the heat dissipation performance of the finned heat sink, the fins are not all vertically arranged on the heat dissipation bottom plate, and the several fins are inclined to the surroundings of the heat dissipation bottom plate. The new heat sink looks as a whole , the fins on the heat dissipation bottom plate are outwardly divergent structures.

Embodiment: The selected embodiment of the heat sink described in the utility model is as follows: its optimized design is shown in Figure 2, and the novel heat sink is made up of a square heat dissipation bottom plate and several fins arranged on the square heat dissipation bottom plate. The fins are elongated cylindrical structures of equal length. In the original fin heat sink, the cylindrical fins are vertically arranged on the heat dissipation base plate, so that the distance between the fins is small, which affects the heat dissipation effect. In this embodiment, in order to enhance the air convection between the fins and improve the heat dissipation effect of the heat sink, only the fins located in the center of the heat dissipation bottom plate are perpendicular to the heat dissipation bottom plate, and the rest of the fins have different degrees of inclination on the heat dissipation bottom plate , that is, there are acute angles of different sizes between the rest of the fins and the heat dissipation base plate. Further, the fins are inclined towards the periphery of the heat dissipation bottom plate, and from the central position of the heat dissipation bottom plate to its periphery, the inclination of the fins gradually decreases, that is, the fins are from the center of the heat dissipation bottom plate to the periphery The acute angle with the heat dissipation bottom plate gradually decreases.

Using the heat sink described in the utility model, it is fixed on the parts that need to dissipate heat on the main board, such as above the processor, the south bridge chip or the north bridge chip. It is designed to be inclined to all sides, so that the air blown from the chassis fan passes through the heat sink. The unique structure of the heat sink can optimize air convection and increase the heat dissipation efficiency by 30%. The fin heat sink is designed as a cylindrical fin, and the heat dissipation surface area of each fin still adopts the original size, which is the largest heat dissipation area compared with the plate type and strip fins. It is conducive to the flow of air, that is, to increase air circulation, and to improve the heat dissipation performance of the components on the motherboard and the system. In this way, under the condition that the size of the heat dissipation bottom plate remains unchanged and the effective contact area of the heat dissipation fin remains unchanged, the heat dissipation effect of the fin heat sink is improved. At the same time, the finned heat sink of the utility model adopts the structural design of fins diverging to the surroundings, which also reduces the heat dissipation requirements of the processor, south bridge chip or north bridge chip on the system from the side, reduces the system fan speed, and reduces the system temperature. Heat dissipation power consumption, while making the system operating noise is greatly reduced.

Except technical characterictic described in the utility model, be the known technology of those skilled in the art.

Claims (4)

1. A new type of heat sink, comprising a rectangular heat dissipation base plate and some fins arranged on the heat dissipation base plate, characterized in that the fin positioned at the central position of the heat dissipation base plate is perpendicular to the heat dissipation base plate, and all the other fins are arranged obliquely on the heat sink. 2 . The novel heat sink according to claim 1 , wherein the fins are inclined toward the periphery of the heat dissipation bottom plate. 3 . 3 . The novel heat sink according to claim 2 , wherein the inclination of the fins gradually decreases from the central position of the heat dissipation bottom plate to its periphery. 4 . 4. The novel heat sink according to claim 1, characterized in that, the fins are elongated cylindrical structures, and all the fins have the same length.

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