CN104049689A - Method for preparing portable three-temperature worktable of laptop - Google Patents
Method for preparing portable three-temperature worktable of laptop Download PDFInfo
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- CN104049689A CN104049689A CN201410239417.3A CN201410239417A CN104049689A CN 104049689 A CN104049689 A CN 104049689A CN 201410239417 A CN201410239417 A CN 201410239417A CN 104049689 A CN104049689 A CN 104049689A
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- semiconductor cooler
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Abstract
The invention relates to a method for preparing a portable cold, hot and normal temperature three-temperature worktable of a laptop by using a semiconductor refrigerator. The portable cold, hot and normal temperature three-temperature worktable of the laptop made by the method can be used in occasions with supercooled or overheated ambient temperature, the portable three-temperature worktable is a portable miniaturized worktable capable of providing the refrigeration cooling, normal temperature cooling and heating functions for the laptop and ensuring the safe and effective work of the laptop, and can also be called as laptop three-temperature worktable.
Description
Technical field
The present invention relates to use semiconductor cooler to prepare that portable laptop computer portable is hot and cold, a kind of manufacture method of three warm worktable of normal temperature, the portable laptop computer portable three warm worktable hot and cold, normal temperature of preparation are used in surrounding enviroment temperature overheating or excessively cold occasion in this way, for portable notebook computer provides refrigeration radiating, normal temperature heat radiation and the heat supply of heating, guarantee the portable microminiature worktable of the safe and effective work of portable notebook computer, also can be referred to as the warm worktable of portable notebook computer three.
Technical background
Current portable notebook computer has been requisite basic tool in human lives, can for work and amusement, very universal.
But, in any computer product, the electron device of computer-internal, such as the electronic devices and components such as CPU, power supply unit are by the length evolution of heat along with the working time, and wherein the working temperature of CPU is particularly important.Because the heat that CPU produces is at work greater than other components and parts, if and the excess Temperature of CPU, by the travelling speed of the CPU that directly declines, cause the work efficiency of computing machine along with the time lengthening of work, temperature constantly raises, operation efficiency sharply declines, and causes computing machine to work and even damage when serious.This situation is for the good desk-top computer of the larger heat radiation of casing, and situation will be better than portable notebook computer far away.For portable notebook computer, the most reasons that cause portable notebook computer to produce fault be all because cooling system bad (service time is long, internal dust too much or fan damage) due to.This situation is particularly outstanding hot summer or the too high time performance of environment temperature.
Another situation is that surrounding enviroment temperature is too low, in the time that the temperature of peripheral temperature is spent lower than 10, the duty of the electronic product of common grade also easily declines, for portable notebook computer, at the lower environment of temperature, the startup of computer tends to go wrong.In this case, the condition that electronic product can normally be worked is to heat up.
The inventor wishes exactly by the present invention, for portable notebook computer provides a portable work bench that can heat up and lower the temperature.
Summary of the invention
There is at present the cooling product of some portable notebook computers, namely adopt the small-sized worktable of electric fan cooling.For desktop computer, the inventor also sees water-cooling CPU heat radiator, also (main publicity is cooling two temperature that conductor refrigeration components and parts are installed at the power supply position of desk-top computer, because the condition of work of desk-top computer is generally superior to portable notebook computer) product, but do not see the portable notebook computer refrigeration work platform that uses semiconductor cooler.
Semiconductor cooler is to utilize the Peltier effect of semiconductor material to make.So-called Peltier effect, while referring to the galvanic couple forming by two kinds of semiconductor materials when DC current, its one end heat absorption, the phenomenon of one end heat release.Although the efficiency far of semiconductor cooler is lower than the efficiency of the cold-producing medium of use compressor operating, but freeze and heat two kinds of effects as long as simple polarity of exchanging electric current just can obtain due to semiconductor cooler, and because its volume is little, noiseless, friction, be widely used at present in the electronic product of high power consumption as the devices that two temperature are provided to electronic equipment, and many two temperature products that operational temperature conditions is provided for electronic product that have also been born thus.
This widespread use situation according to semiconductor cooler in electronic product, using semiconductor cooler should be natural thing for portable notebook computer provides two warm conditions.But the inventor retrieves and pertinent literature is retrieved existing like product, do not find that there is the portable two warm semiconductor work table that are similar to use semiconductor cooler of the present invention.The inventor analyzes its reason, may be to think for most people, current portable notebook computer develops to low-power consumption, the current technology of utilizing built-in exhaust fan heat radiation can meet the heat radiation requirement of portable notebook computer, and the power dissipation ratio of semiconductor cooler assembly is larger, the power supply that is difficult to use portable notebook computer self provides sufficient power supply for semiconductor cooler, etc. factor.Portable notebook computer volume is very little in addition, except exhaust outlet, is all wrapped up by the very low UPS of coefficient of heat conductivity (engineering plastics), even if use external semiconductor cooler, is also difficult to or heat cold to laptop computer delivered inside.But when seeing a lot of laptop computers during the broiling summer, the inventor damages because of the high temperature that the course of work produces, be difficult to the phenomenon starting because surrounding enviroment temperature is too low in cold winter, carry cold or heat problem if sound out can solve semi-conductive powerup issue and solve to portable notebook computer, semiconductor cooler can be just the worthy companion for portable notebook computer.
First design of the present invention is exactly to use a sheet metal (Fig. 1), and the floorage of its area and portable notebook computer fuselage matches, and portrays a lot of groove (Fig. 1-1) in a side of sheet metal, and these grooves communicate.Fig. 1-2 is the projection of groove, Fig. 1-3rd, the vent port that sheet metal and exhaust fan are linked up, Fig. 1-4th, the screw hole (not having penetrating) of fixing cooling fins, Fig. 1-5th, worktable leg, Fig. 1-6th, under sheet metal, folding part is divided, and is for attractive in appearance, Fig. 1-7th, lower broken line.
At the back side of sheet metal by a side of heat-conducting silicone grease and semiconductor cooler be bonded together (Fig. 2-1), first another side of semiconductor cooler is to be connected (Fig. 2-2) with metal fin by heat-conducting silicone grease, then metal fin is connected (Fig. 2-3) with miniature exhaust fan, and this has just formed the two temperature refrigerating and heating systems that common semiconductor cooler is core.The place of semiconductor cooler is not installed at sheet metal, sticky note has insulation material (Fig. 2-4), be used for hindering temperature (insulation), Fig. 2-5th, semiconductor cooler, Fig. 2-6th, the bossing of sheet metal, Fig. 2-7th, the recessed part of sheet metal, Fig. 2-8th, under sheet metal, folding part is divided, Fig. 2-9th, the power supply lead wire of semiconductor cooler, Fig. 2-10th, metal heat sink, Fig. 2-11st, radiator fan.
In the time that portable notebook computer is placed on sheet metal (Fig. 3), use two securing members (Fig. 3-1) by together with the bottom of portable notebook computer and sheet metal pressing close to tightly.Like this, two temperature worktable of the portable notebook computer of a portable semiconductor refrigerator formation have just been made.Fig. 3-2nd in Fig. 3, notebook laptop computer, Fig. 3-3rd, worktable metal decking, Fig. 3-4th, worktable leg, Fig. 3-5th, the outer cover of semiconductor cooler, heat radiator, fan component, Fig. 3-6th, power supply, is laptop computer and worktable power supply.
The profoundness of cold/two temperature of heat that this Portable hand laptop workbench provides is just: in the time of semiconductor cooler energising work, the one side of being close to sheet metal can freeze or heat, first this cold or thermal source is stored in sheet metal, and the outshot that passes through sheet metal opposite side groove is owing to passing cold or conducting heat to base plate with the non-metallic floor close contact of laptop computer, although the coefficient of heat conductivity of the non-metallic floor of laptop computer is very poor, but still there is certain coefficient of heat conductivity, or the bottom panel that passes through laptop computer of the low-temperature receiver of sheet metal or thermal source part can be transmitted to the inside of laptop computer.It is jointly to consist of annular airflow of exhaust fan formation and the original cooling system of laptop computer on heat radiator (Fig. 2-2) that this two warm worktable is carried topmost passage cold or heat to laptop computer.In the time that exhaust fan is worked, on the one hand the cold or heat being gathered on heat radiator is spread towards periphery, the air-flow being nearly affixed in laptop computer undercut by the air vent (Fig. 1-2) on sheet metal around semiconductor cooler is on the other hand extracted out, and new air-flow enters from the surrounding ditch notch of sheet metal and notebook computer faying face, thereby form an air circulation.The air newly entering exchanges with cold or the heat of sheet metal the temperature that improves or reduce air in groove.On the other hand, self exhaust system of laptop computer is got rid of the heat in laptop computer by the air draft of laptop computer self.The exhaust system that it should be noted that laptop computer is generally to enter fresh air from the air inlet of laptop computer bottom, and discharges the hot gas of computer inside from the exhaust outlet of laptop computer side.Like this due to the air-flow in metal sheet groove can with sheet metal in cold or heat exchange and self obtain cold or heat, laptop computer bottom air inlet mouth just can obtain with sheet metal and carry out the fresh gas flow after cold or heat interchange, thereby provides cold air or the hot gas different from surrounding enviroment temperature for portable notebook computer.This cold/flux map that use double-lined arrow curve that the state of thermal current exchange can indicate by Fig. 4 represents further shows.Fig. 4-1st, the air hole of worktable, Fig. 4-2nd, the body of portable notebook computer, Fig. 4-3 are three temperature (hot and cold, normal temperature) worktable.
The good metal materials of multiple coefficient of heat conductivity such as that the sheet metal of above-mentioned statement can be selected is copper, stainless steel, ordinary steel, alloy aluminum, aluminium, titanium alloy.In order to ensure the wind-guiding ability of groove, the degree of depth of groove should not be shallower than 0.5mm, preferably reach 2mm (if certainly do not mind better cooling or intensification effect, groove is more shallow also to be allowed), therefore, more than the thickness of sheet metal is preferably generally selected thickness 1mm, be preferably in sheet metal more than 4mm.
Blocked up sheet metal certainly will produce excessive weight, if therefore preparation technology's license, also can select thickness to be less than the following thinner sheet metal of 1mm, be pressed into the groove of convex-concave, then being partially filled or pasting nonmetallic materials and reinforce of the non-installation semiconductor cooler of a side to sheet metal thin and that be pressed into groove, will be better thereby form doubling plate, because the doubling plate of this technique not only has good coefficient of heat conductivity, and cost also can decline with deadweight.
If less demanding to heat-transfer effect, sheet metal also can not have emboss pit, because also can there be the exchange of certain hot and cold air in small gap, sheet metal just can be further thin like this, the opposite side of sheet metal can use plastics that coefficient of heat conductivity is little etc. to have intensity also to have the sheet material of heat insulation effect and metal sheet to be sticked together, and can further reduce like this cost of worktable.
The topology layout of portraying groove and adopted square field on sheet metal shown in Fig. 1 of the present invention, in fact the layout of groove can adopt curve and disorderly ditch trench pattern, as long as groove is identical mutually, if different, just can not carry out the cold and hot exchange of good air-flow.Ditch trench pattern the present invention for arbitrary curve can not enumerate, but all will contain within the scope of the present invention.
Insulation material shown in Fig. 2-4 has important effect in the present invention.Because the cooling/heating of semiconductor cooler is to be closely bonded together by face of semiconductor cooler and sheet metal, its objective is the cold of this face or heat are transmitted on sheet metal, then conduct to portable notebook computer by sheet metal.It should be noted that, semiconductor cooler itself is very thin, generally only has 0.5mm left and right, to form very large temperature contrast with the temperature of the one side of being close to sheet metal at the another side of semiconductor cooler, and the alleviation that to be heat radiator by being bonded together with it and fan spread the heat of this part or cold and ambient air.Spread to surrounding enviroment in the process of link in this temperature difference, also can discharge contrary energy (heat or cold) to sheet metal, if do not have heat-insulation layer to protect partition, certainly will reduce semiconductor cooler to the cold of sheet metal transmission or the effect of heat.Therefore on sheet metal, coating or adhesive insulating layer are necessary.
Heat preserving and insulating material can select to be coated with rubber or silicon rubber, also can be coated with the heat-barrier material that other thermal conductivity coefficients are as far as possible little, and this class heat-barrier material is a lot of at present, and this instructions will not enumerate.The thermal insulation thermal insulation boards such as all right bond plastic, engineering plastics.No matter be coating thermofin or bonding thermal insulation board, the vulnerability of heat-insulation layer is had to high requirement, because be portable work bench, heat-barrier material easily destroys, and is obviously disadvantageous, therefore should select the material of durable not cracky as heat-barrier material.
Due to the plane sizes difference of portable notebook computer, power consumption difference, the semiconductor cooler worktable that therefore needs configuration to adapt to.Fig. 2, Fig. 5, Fig. 6 have represented that respectively three kinds of differences provide the worktable of cold and hot amount, have configured respectively 1,2,3 semiconductor cooler.Obviously the worktable that configuring semiconductor refrigerator is many has more been given cold or the heat that can provide more powerful.Fig. 5-1 and Fig. 6-1st, the outer cover of semiconductor cooler, heat radiator, fan component, Fig. 5-2 and Fig. 6-2nd, the heat-insulation layer of worktable, Fig. 5-3 and Fig. 6-3rd, the lower folding part of the sheet metal of worktable is divided, Fig. 5-4 and Fig. 6-4th, worktable leg, Fig. 5-5 and Fig. 6-5th, fixture, for making the body of portable notebook computer and the close contact above of worktable metal decking.
Another main points of the present invention are the powerup issues that solve semiconductor cooler.As everyone knows, portable notebook computer carries portable power device, if will very inconvenient for worktable increases a power supply device concerning user again.Solution is exactly that the power supply that laptop computer is carried is discarded, and worktable provides one both can power to self, also can be to the dual power supply device (Fig. 7-1) of portable notebook computer power supply.Here power requirement and the plug state of unique portable notebook computer that needs the different listing brands of will understanding exactly of investigation, design operational dual power supply device according to different portable notebook computers, and do not use mutually.Fig. 7-2nd, notebook laptop computer, Fig. 7-3 are three temperature (hot and cold, normal temperature) worktable.
Certainly, if do not consider that user is convenient, only providing to the single supply system of worktable power supply and be also fine, is also a part of the present invention.
With worktable be equipped with mutually dual power supply device in requirement below the Circuits System of semiconductor cooler and radiator fan power supply should meet:
Fig. 8 is the worktable that only uses a semiconductor cooler, for the worktable that only uses a semiconductor cooler, should there is respectively the control respectively to the exchange of semiconductor cooler polarity and fan, corresponding namely [refrigeration] (requiring fan and semiconductor cooler synchronous working), [heating] (requires after the direct current supply exchange polarity of semiconductor cooler, semiconductor cooler is synchronoused working with fan), [normal temperature] (requires only to power to fan, semiconductor cooler is not powered) three temperature (refrigeration, heat, normal temperature) function of holding office respectively, so that user is own choice for use according to circumstances.
Fig. 9 is the worktable that uses two semiconductor coolers, for the worktable that uses two semiconductor coolers, except possessing the control function of semiconductor cooler of one of above-mentioned use, the function that also should be able to control respectively two semiconductor coolers, thus realize weak cold/heat (a semiconductor cooler job), the state of cold/heat (two semiconductor coolers are worked simultaneously) by force.
Figure 10 is the worktable that uses three semiconductor coolers, for the worktable that uses three semiconductor coolers, except possessing the control function of semiconductor cooler of one of above-mentioned use, the function that also should be able to control respectively three semiconductor coolers, thereby realize weak cold/heat (a semiconductor cooler job), the state of cold/heat (two semiconductor coolers are worked simultaneously), the more by force state of cold/heat (three semiconductor coolers are worked simultaneously) by force.
Brief description of the drawings
Accompanying drawing one of the present invention has 10 width, and the description of the drawings is in conjunction with statement of the present invention, and sake of clarity in summary of the invention for saving space, just repeats no more herein.
Embodiment
The present invention has been described in detail in detail above, and obviously, those skilled in the art can do many improvement and variation and not deviate from the present invention's spirit scope knowing after the present invention.
Embodiments of the invention have been embodied in instructions and Figure of description 1,2,3,4,5,6,7, just repeat no more herein.If the structure that the inventor is explained in this instructions and Figure of description changes, and the basic structure principle to refrigerating/heating and power supply control program are not carried out material alterations, all belonging to is only the imitation change of simple profile, all should be included in scope of the present invention.
Claims (9)
1. for the manufacture of a kind of method of the portable three warm miniature worktable of portable notebook computer, the portable three warm miniature worktable that it is characterized in that the notebook computer of preparing are in this way made up of sheet metal, semiconductor cooler, metal heat sink, exhaust fan, fixture and power supply
Wherein sheet metal can use the sheet metals such as copper coin, copper plate, aluminium sheet, aluminium alloy plate, titanium alloy sheet, long-pending the approaching of plane body bottom surface long-pending and portable notebook computer of sheet metal matches, there is the convex-concave groove spreading all in a side of sheet metal, opposite side except with the part of semiconductor cooler bonding, there is the heat-insulation layer of bonding
Wherein semiconductor cooler is the flaky semiconductor refrigerator that utilizes the arbitrary shape that the Peltier effect of semiconductor material makes, and the one side phase adhesion with sheet metal by heat-conducting silicone grease, and opposite side is bonding by the plane of heat-conducting silicone grease and metal heat sink,
Wherein metal heat sink can adopt the heating radiator of the metal material of the conventional any shape being suitable for of semiconductor cooler,
Wherein exhaust fan can adopt and the exhaust fan of the conventional matching used suitable shape of semiconductor cooler, and exhaust fan is fixed on to the side that metal heat sink does not contact with semiconductor cooler.
2. according to claim 1, this worktable has cooling, heat supply, three kinds of temperature functions of normal temperature heat extraction, and for portable notebook computer provides, refrigeration cool-down dispels the heat, normal temperature dispels the heat and three warm selection functions of the heat supply of heating.
3. according to claim 1, the thickness of sheet metal should be more than 1mm, more than the degree of depth of the groove on sheet metal should be greater than 0.5mm.
4. according to claim 3, but sheet metal is also can used thickness 1mm following be stamped into the sheet metal of emboss pit, and with there being certain nonmetallic materials bonding composite board, also can use the metal sheet that there is no emboss pit bonding with nonmetallic materials.
5. according to claim 3, the one side of sheet metal and semiconductor cooler homonymy has heat-insulation layer, and heat-insulation layer can be the material that the coefficient of heat conductivity such as rubber, plastics is little.
6. according to claim 1, power supply should be both can be to the semiconductor cooler of worktable, fan power supply, the double power-supply system that also can power to portable notebook computer.
7. according to claim 6, can control respectively the power supply of semiconductor cooler, fan, also can control the polarity of semiconductor cooler, to realize selections hot and cold, three kinds of temperature of normal temperature.
8. according to claim 5, power supply also can a single supply system to worktable power supply.
9. according to claim 1, on the portable minisize worktable for portable notebook computer of the present invention, there is fixture, with so that the facial close contact of the bottom of notebook computer and worktable, to ensure effective conduction of hot and cold amount.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410239417.3A CN104049689A (en) | 2014-05-27 | 2014-05-27 | Method for preparing portable three-temperature worktable of laptop |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410239417.3A CN104049689A (en) | 2014-05-27 | 2014-05-27 | Method for preparing portable three-temperature worktable of laptop |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325388A (en) * | 2016-08-22 | 2017-01-11 | 太仓市微贯机电有限公司 | Host lower cover with performance of high heat dissipation for notebook computer |
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| CN201259654Y (en) * | 2008-09-03 | 2009-06-17 | 夏金喜 | Notebook computer heat radiator |
| CN101980101A (en) * | 2010-11-09 | 2011-02-23 | 上海理工大学 | Semiconductor refrigerating cooling pad for laptop |
| CN202257426U (en) * | 2011-10-13 | 2012-05-30 | 中国农业大学 | Semi-conductor refrigeration notebook computer radiator |
| CN204215337U (en) * | 2014-05-27 | 2015-03-18 | 李思思 | A kind of portable three warm miniature worktable for portable notebook computer |
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2014
- 2014-05-27 CN CN201410239417.3A patent/CN104049689A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6362959B2 (en) * | 1998-11-12 | 2002-03-26 | Compaq Computer Corporation | Docking station with thermoelectric heat dissipation system for docked portable computer |
| CN201259654Y (en) * | 2008-09-03 | 2009-06-17 | 夏金喜 | Notebook computer heat radiator |
| CN101980101A (en) * | 2010-11-09 | 2011-02-23 | 上海理工大学 | Semiconductor refrigerating cooling pad for laptop |
| CN202257426U (en) * | 2011-10-13 | 2012-05-30 | 中国农业大学 | Semi-conductor refrigeration notebook computer radiator |
| CN204215337U (en) * | 2014-05-27 | 2015-03-18 | 李思思 | A kind of portable three warm miniature worktable for portable notebook computer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325388A (en) * | 2016-08-22 | 2017-01-11 | 太仓市微贯机电有限公司 | Host lower cover with performance of high heat dissipation for notebook computer |
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Application publication date: 20140917 |