CN204065990U - Heating radiator - Google Patents
Heating radiator Download PDFInfo
- Publication number
- CN204065990U CN204065990U CN201420363307.3U CN201420363307U CN204065990U CN 204065990 U CN204065990 U CN 204065990U CN 201420363307 U CN201420363307 U CN 201420363307U CN 204065990 U CN204065990 U CN 204065990U
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- Prior art keywords
- heat
- liquid cooling
- cooling case
- conducting plate
- mozzle
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Abstract
The utility model provides a kind of heating radiator, and described heating radiator comprises heat-conducting plate, mozzle, liquid cooling case, ebullator, fan and motor, described heat-conducting plate fit described microprocessor arrange, described liquid cooling case is arranged on the top of described heat-conducting plate; The left and right sides of the lower end of described liquid cooling case opens inlet and liquid outlet respectively; Inlet described in described mozzle one termination, and in the middle part of it, spiral winding is on the outside surface of described heat-conducting plate, the other end then accesses described liquid outlet; Described ebullator is arranged on the inwall of described liquid cooling case; Described motor drives described rotor carry out clockwise or be rotated counterclockwise, and drives described liquid coolant to carry out shuttling movement in described mozzle simultaneously; Described fan is arranged on the top of described liquid cooling case.The utility model adopts water-cooled and the air-cooled mode combined, and quickly and efficiently computer-internal part is run the heat produced and takes computing machine outside out of, to meet the service requirement of microprocessor.
Description
Technical field
The utility model relates to microprocessor heat technical field, particularly relates to a kind ofly to utilize the air-cooled heating radiator dispelled the heat that combines with water-cooled.
Background technology
The design of first calculated machine radiator structure, except utilizing the fan of power supply unit itself and assisting main frame heat radiation, not other relevant heat dissipation design; But along with the progress that computer system is maked rapid progress, the speed speed that is more and more fast, data access of each item raises successively, and then disperse more heat energy, thus, also the temperature of computer system is relatively made to remain high, therefore must there is suitable heat abstractor in computer system, just can guarantee that computer system keeps stable running.
In order to ensure the stable running of computer system, the computer components that can produce heat in computer system are generally all combined with the design of heat sinking function, wherein directly can use heating radiator for the element that the evolution of heat is lower, the higher element (as microprocessor) of the evolution of heat then can coordinate fan implement heat radiation by heating radiator, by heating radiator by after the derivation of the heat of generation, the air-flow that recycling fan produces is by the heat absorption on heating radiator and take away.
But because microprocessor travelling speed is towards more and more faster future development, its volume also becomes more and more less, weight is more and more thinner, therefore, traditional this heating radiator can not meet its efficient cooling requirements, need to work out a kind of novel heating radiator, to realize effectively dispelling the heat to microprocessor, make it meet growing microprocessor operating rate requirement.
Utility model content
Technical solutions of the utility model are as follows: a kind of heating radiator, described heating radiator comprises heat-conducting plate, mozzle, liquid cooling case, ebullator, fan and motor, described heat-conducting plate fit described microprocessor arrange, described liquid cooling case is arranged on the top of described heat-conducting plate, and liquid coolant is equipped with in its inside, the height of described liquid coolant is 1/2 ~ 3/4 of described liquid cooling case height, and the left and right sides of the lower end of described liquid cooling case opens inlet and liquid outlet respectively; Inlet described in described mozzle one termination, and in the middle part of it, spiral winding is on the outside surface of described heat-conducting plate, the other end then accesses described liquid outlet, and described mozzle is fixedly fitted on described heat-conducting plate; Described ebullator comprises rotating shaft, rotor, and coupling shaft, and described rotating shaft is fixedly installed on the inwall of described liquid cooling case, and the center of described rotor has mounting hole, and described rotor is twisted solid in described rotating shaft by described mounting hole spiral; Described coupling shaft one end is connected with described rotating shaft, and the other end extends to outside described liquid cooling case; Described motor is installed on the other end that described coupling shaft extends outside described liquid cooling case, and described motor drives described rotating shaft to drive described rotor carry out clockwise or be rotated counterclockwise, and drives described liquid coolant to carry out shuttling movement in described mozzle simultaneously; Described fan is arranged on the top of described liquid cooling case, and is arranged on the outside of described microprocessor.
Further, described mozzle, one deck sealing material layer is all wrapped up in the outside of liquid cooling case and heat-conducting plate, for avoiding leaking outside of liquid coolant.
Further, the inwall of described mounting hole is provided with internal thread, in the outer surface of upper of described rotating shaft, correspondence is provided with external thread, described rotor is twisted solid in described rotating shaft by the described internal thread spiral of described mounting hole, the installation of certain rotor, except single screw connects, also can adopt other feasible fixed installation modes.
Further; described fan is outside equipped with housing; described fan arranges in described housing; and described housing is Openworks shape; housing is used as the protective of fan, makes to isolate between liquid cooling case and fan, protects on the one hand to fan itself; on the other hand also avoid producing with liquid cooling case in the rotary course of fan rubbing, and then protective effect to a certain degree is also risen to liquid cooling case.
Further, multiple heat radiator is also provided with between described liquid cooling case and described housing, the two ends of described heat radiator are separately fixed on described liquid cooling case and described housing, utilize the heat dispersion of heat radiator, rapidly the heat in liquid cooling case is spread out of, and take heat out of computing machine outside by fan; And the setting of heat radiator, also make to form heat flow passage between liquid cooling case and the housing of fan, being convenient to heat outwards derives fast.
The beneficial effects of the utility model:
(1), the utility model provides a kind of heating radiator for microprocessor heat, this heating radiator adopts water-cooled and the air-cooled mode combined, quickly and efficiently computer-internal part is run the heat produced and take computing machine outside out of, to meet the service requirement of microprocessor;
(2), the utility model also adds heat radiator between air-cooled and water-cooled, to accelerate the circulation of heat, improves the heat dispersion of microprocessor further.
(3), the water-cooled casing set up and fan be all arranged on outside computing machine by the utility model, do not take the usage space in computing machine, thus while the heat dispersion ensureing microprocessor, can realize again the Miniaturization Design of computing machine.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below.
Fig. 1 is the structural representation of a kind of heating radiator of the utility model;
Fig. 2 is the structural representation of the utility model liquid cooling case;
Fig. 3 is the structural representation of the utility model ebullator;
Fig. 4 is the structural representation of the utility model mozzle;
Fig. 5 is the structural representation of the utility model fan;
Fig. 6 is the structural representation arranging heat radiator between the utility model liquid cooling case and blower-casting.
Reference numeral: 1, heat-conducting plate, 2, liquid cooling case, 21, liquid coolant, 22, air cavity, 23, inlet, 24, liquid outlet, 3, mozzle, 4, ebullator, 41, rotating shaft, 42, rotor, 43, coupling shaft, 44, mounting hole, 5, fan, 51, housing, 6, motor, 7, heat radiator, 8, heat flow passage.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provides a kind of heating radiator, and it adopts the air-cooled mode adding water-cooled and combine, to realize the efficiently radiates heat of computer run.
As shown in Figure 1, the utility model provides a kind of heating radiator, is mainly used in the heat radiation calculating machine inner microprocessor.It comprises heat-conducting plate 1, liquid cooling case 2, mozzle 3, ebullator 4, fan 5, motor 6 and heat radiator 7, it is inner that heat-conducting plate 1 is arranged on computing machine (not shown), and laminating microprocessor (not shown) is arranged, and runs for receiving microprocessor the heat produced.The thickness setting of heat-conducting plate 1 is determined according to the setting of the concrete computing machine volume of design, and its material can adopt copper or aluminium etc.
As shown in Figure 2, liquid cooling case 2 is arranged on the top of heat-conducting plate 1, and liquid coolant 21 is equipped with in its inside, to be passed to outside computing machine by the heat on heat-conducting plate 1 distribute for the mode of realization water-cooled.
The height of liquid coolant 21 is 1/2 ~ 3/4 of liquid cooling case 2 whole height, and air cavity 22 is left on the top of liquid cooling case 2, and liquid coolant can adopt the condensed fluid etc. of general water or general automobile.
The left and right sides of the lower end of liquid cooling case 2 opens inlet 23 and liquid outlet 24 respectively, for connecting with mozzle 3, the liquid coolant in liquid cooling case 2 is entered in mozzle 3.
In order to realize liquid coolant 21 at mozzle 3 and liquid cooling case 2 internal circulation flow, the utility model is provided with ebullator 4 in liquid cooling case 2.As shown in Figure 3, ebullator 4 comprises rotating shaft 41, rotor 42, and coupling shaft 43, and rotating shaft 41 is fixedly installed on the inwall of liquid cooling case 2, for turning axle and the installation shaft of rotor 42.During enforcement, rotating shaft 41 is vertically fixed on the internal face on rear side of liquid cooling case 2.Rotor 42 is fixedly mounted in rotating shaft 41, during enforcement, mounting hole 44 is offered at the center of rotor 42, rotor 42 is fixed in rotating shaft 41 by mounting hole 43, in the embodiment of the present invention, mounting hole 44 internal face arranges internal thread, and correspondence arranges external thread on the outside surface on rotating shaft 41 top, rotor 42 is tightened in rotating shaft 41 by internal and external threads cooperation, realizes and being fixedly connected with between rotating shaft 41.
Coupling shaft 43 is for realizing the connection between motor 6 and rotating shaft 41, coupling shaft 43 one end is connected with rotating shaft 41, the other end extends to outside liquid cooling case 2 and is connected with motor 6, motor 6 drive shaft 41 rotor driven 42 rotates clockwise or counterclockwise, drives described liquid coolant 21 to carry out shuttling movement in described mozzle 3 simultaneously.
In addition in order to not affect the designer trends of computing machine volume miniaturization, liquid cooling case 2 is arranged on outside computing machine by the utility model, as being arranged on the bottom of computer case.
As shown in Figure 4, mozzle 3 spiral winding is on the outside surface of heat-conducting plate 1, and mozzle 3 is fixedly fitted on described heat-conducting plate 1, for taking away the heat on heat-conducting plate 1.The inlet 23 of mozzle 3 one termination liquid cooling case 2, the other end then accesses liquid outlet 24, and liquid coolant 21 flow in mozzle 3 from inlet 23, and mozzle 3 fully contacts with heat-conducting plate 1, be back in liquid cooling case 2 by liquid outlet 24, thus realize the circulation cooling of mozzle 3.During enforcement, mozzle 3 is soft material preferably.
The utility model combines air-cooled mode and dispels the heat to microprocessor on the mode basis of water-cooled, as shown in Figure 5, fan 5 is arranged on the top of liquid cooling case 2, for by the heat on liquid cooling case 2 in time to distributing, maintain the temperature of liquid cooling case 2 outside surface.Fan 5 is outside equipped with housing 51; fan 5 arranges in housing 51; and housing 51 is Openworks shape; housing 51 is used as the protective of fan 5; make to isolate between liquid cooling case 2 and fan 5; on the one hand fan 5 is protected itself, also avoid producing with liquid cooling case 2 in the rotary course of fan 5 rubbing on the other hand, and then protective effect to a certain degree is also risen to liquid cooling case 2.During enforcement, fan 5 can adopt the fan structure generally with multiple blade.
In addition, mozzle 3, one deck sealing material layer (not shown) is all wrapped up in the outside of liquid cooling case 2 and heat-conducting plate 1, for avoiding leaking outside of liquid coolant 21.
Preferably, as shown in Figure 6, multiple heat radiator 7 is also provided with between liquid cooling case 2 and housing 51, the two ends of heat radiator 7 are separately fixed at liquid cooling case 2 with on housing 51, utilize the heat dispersion of heat radiator 7, rapidly the heat in liquid cooling case 2 is spread out of, and take heat out of computing machine outside by fan 5; And the setting of heat radiator 7, also make to form heat flow passage 8 between the housing 51 of liquid cooling case 2 and fan 5, being convenient to heat outwards derives fast.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (5)
1. a heating radiator, for the heat radiation of microprocessor, it is characterized in that, described heating radiator comprises heat-conducting plate (1), mozzle (3), liquid cooling case (2), ebullator (4), fan (5) and motor (6), described heat-conducting plate (1) is arranged on computer-internal, and described microprocessor of fitting is arranged; Described liquid cooling case (2) is arranged on outside computing machine, and be arranged on the top of described heat-conducting plate (1), liquid coolant (21) is equipped with in its inside, the height of described liquid coolant (21) is 1/2 ~ 3/4 of described liquid cooling case (2) height, and the left and right sides of the lower end of described liquid cooling case (2) opens inlet (23) and liquid outlet (24) respectively; Inlet (23) described in described mozzle (3) termination, and in the middle part of it spiral winding on the outside surface of described heat-conducting plate (1), the other end then accesses described liquid outlet (24), and described mozzle (3) is fixedly fitted on described heat-conducting plate (1); Described ebullator (4) comprises rotating shaft (41), rotor (42), and coupling shaft (43), described rotating shaft (41) is fixedly installed on the inwall of described liquid cooling case (2), the center of described rotor (42) has mounting hole (44), and described rotor (42) is twisted solid in described rotating shaft (41) by described mounting hole (44) spiral; Described coupling shaft (41) one end is connected with described rotating shaft (41), and the other end extends to described liquid cooling case (2) outward; Described motor (6) is installed to described coupling shaft (43) and extends on described liquid cooling case (2) other end outward, described motor (6) drives described rotating shaft (41) to drive described rotor (42) carry out clockwise or be rotated counterclockwise, and drives described liquid coolant (21) to carry out shuttling movement in described mozzle simultaneously; Described fan (5) is arranged on the top of described liquid cooling case (2), and is arranged on the outside of described microprocessor.
2. heating radiator according to claim 1, is characterized in that, described mozzle (3), and one deck sealing material layer is all wrapped up in the outside of liquid cooling case (2) and heat-conducting plate (1).
3. heating radiator according to claim 1, it is characterized in that, the inwall of described mounting hole (44) is provided with internal thread, in the outer surface of upper of described rotating shaft (41), correspondence is provided with external thread, and described rotor (41) is twisted solid in described rotating shaft (41) by the described internal thread spiral of described mounting hole (44).
4. heating radiator according to claim 1, it is characterized in that, described fan (5) is outside equipped with housing (51), and described fan (5) is arranged in described housing (51), and described housing (51) is Openworks shape.
5. heating radiator according to claim 4, it is characterized in that, also be provided with multiple heat radiator (7) between described liquid cooling case (2) and described housing (51), the two ends of described heat radiator (7) are separately fixed at described liquid cooling case (2) with on described housing (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420363307.3U CN204065990U (en) | 2014-07-03 | 2014-07-03 | Heating radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420363307.3U CN204065990U (en) | 2014-07-03 | 2014-07-03 | Heating radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204065990U true CN204065990U (en) | 2014-12-31 |
Family
ID=52207454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420363307.3U Expired - Fee Related CN204065990U (en) | 2014-07-03 | 2014-07-03 | Heating radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204065990U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995832A (en) * | 2017-12-11 | 2018-05-04 | 南京邮电大学 | A kind of intensive cooling circuit board |
| CN109977064A (en) * | 2017-12-28 | 2019-07-05 | 江苏省质量和标准化研究院 | A kind of food safety trace back information inquiry terminal equipment |
| CN110867303A (en) * | 2019-11-29 | 2020-03-06 | 魏洋洋 | Thermal power uses high-efficient heat dissipation type potential device |
-
2014
- 2014-07-03 CN CN201420363307.3U patent/CN204065990U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995832A (en) * | 2017-12-11 | 2018-05-04 | 南京邮电大学 | A kind of intensive cooling circuit board |
| CN109977064A (en) * | 2017-12-28 | 2019-07-05 | 江苏省质量和标准化研究院 | A kind of food safety trace back information inquiry terminal equipment |
| CN110867303A (en) * | 2019-11-29 | 2020-03-06 | 魏洋洋 | Thermal power uses high-efficient heat dissipation type potential device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20150703 |
|
| EXPY | Termination of patent right or utility model |