CN107995832A - A kind of intensive cooling circuit board - Google Patents
A kind of intensive cooling circuit board Download PDFInfo
- Publication number
- CN107995832A CN107995832A CN201711303593.9A CN201711303593A CN107995832A CN 107995832 A CN107995832 A CN 107995832A CN 201711303593 A CN201711303593 A CN 201711303593A CN 107995832 A CN107995832 A CN 107995832A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- electronic component
- reserve tank
- micro pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000012530 fluid Substances 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 239000000110 cooling liquid Substances 0.000 description 8
- 230000013011 mating Effects 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to heat dissipation for circuit board technical field, specially a kind of intensive cooling circuit board, including circuit board housing, electronic component and circuit board；Further include the circulation fluid cooling mechanism in circuit board housing；Circulation fluid cooling mechanism includes liquid reserve tank, micro pump, hose, heat-conducting plate and substrate；Heat-conducting plate arranges that heat-conducting plate has several through holes the end face for closing on micro pump is uniformly distributed along the length direction of circuit board housing；Liquid reserve tank is arranged on one end of heat-conducting plate；After hose passes through all through holes, one end is connected with the water outlet of liquid reserve tank；Micro pump is arranged on the water inlet of liquid reserve tank, and the liquid outlet of micro pump can be connected with liquid reserve tank, and the inlet of micro pump can be connected with the other end of hose；Substrate is arranged on the surface of heat-conducting plate, and substrate is equipped with several grooves, the another side of electronic component is installed in groove, it can realize that each electronic component being capable of Homogeneouslly-radiating on circuit board.
Description
Technical field
The present invention relates to heat dissipation for circuit board technical field, is specially a kind of intensive cooling circuit board.
Background technology
For electronic equipment, when work, can all produce certain heat, so that equipment internal temperature rises rapidly,
If not in time distributed the heat, heating that equipment will continue, device will fail because of overheat, electronic equipment
Unfailing performance will decline, therefore carry out good radiating treatment to circuit board and be very important.
In the heat dissipation of existing wiring board, typically directly dried heat sink and radiated by fan, due to circuit
Each electronic component produces the degree difference of heat on plate, and heat dissipation is uneven, causes electronic component to be damaged, especially circuit board powers on
It is more difficult to reach heat dissipation effect in the case that subcomponent is more.
The content of the invention
The present invention provides a kind of intensive cooling circuit board, it can realize that each electronic component being capable of Homogeneouslly-radiating on circuit board.
To realize above-mentioned technical purpose, the technical solution that the present invention takes is a kind of intensive cooling circuit board, including circuit
Plate housing, electronic component and circuit board；The one side of electronic component is installed on circuit board, and circuit board is arranged on circuit board housing
In；Further include the circulation fluid cooling mechanism in circuit board housing；Circulation fluid cooling mechanism include liquid reserve tank, micro pump,
Hose, heat-conducting plate and substrate；Liquid reserve tank is arranged on one end of heat-conducting plate；Length direction arrangement of the heat-conducting plate along circuit board housing,
Heat-conducting plate has several through holes the end face for closing on micro pump is uniformly distributed；After hose passes through all through holes, one end and liquid storage
The water outlet connection of case；Micro pump is arranged on the water inlet of liquid reserve tank, and the liquid outlet of micro pump can be connected with liquid reserve tank, micro-
The inlet of type water pump can be connected with the other end of hose；Substrate be arranged on heat-conducting plate surface, substrate be equipped with several grooves,
The another side of electronic component is installed in groove.
As the improved technical solution of the present invention, cooling pad is further included, cooling pad is arranged in groove, and electronic component is installed on
On cooling pad.
As the improved technical solution of the present invention, fixed plate is further included, circuit board housing is arranged in fixed plate.
As the improved technical solution of the present invention, fixed plate is equipped with threaded hole in edge.
As the improved technical solution of the present invention, positioning pin is further included, circuit board is installed on substrate by positioning pin.
As the improved technical solution of the present invention, the upper surface of positioning pin is fixedly connected with rubber cushion.
As the improved technical solution of the present invention, further include and fold shape heat sink, fold shape heat sink and be arranged on circuit board,
And it is oppositely arranged with electronic component.
As the improved technical solution of the present invention, air blast cooling mechanism is further included, air blast cooling mechanism includes motor, center
Axis, blade and ventilating opening；Motor is arranged in circuit board housing, and positioned at the one end in circuit board shell length direction；Central shaft
Drive connection motor can simultaneously rotate under the drive of motor, and the axis of central shaft is arranged along the length direction of circuit board housing；Leaf
Piece is arranged on central shaft；Ventilating opening is arranged on the end face of the circuit board shell length direction other end.
Beneficial effect
Compared with prior art, a kind of intensive cooling circuit board of the invention, by the mating connection of liquid storage cylinder and hose, will store up
Liquid in sap cavity is spread in heat-conducting plate by the hose to spiral, the heat that circuit board produces is dissipated by liquid flowing
Heat, electronic component and aluminum base plate contact area by the mating connection of groove and electronic component, can be increased, imitate heat dissipation
Circuit board upper surface heat more preferably, by folding the mating connection of shape heat sink and circuit board, can be carried out acceleration heat dissipation by fruit,
Make the more efficient of heat dissipation.
In addition, the intensive cooling circuit board of the application can also dissipate circulation fluid cooling mechanism with Blast mechanism and folded form
Hot plate is combined, and realizes heat quick heat radiating on circuit board.
Brief description of the drawings
The structure diagram of the intensive cooling circuit board of Fig. 1 the application；
Fig. 2 is the right view of Fig. 1；
In figure：1 circuit board housing, 2 heat-conducting plates, 3 through holes, 4 liquid reserve tanks, 5 water inlet pipes, 6 outlet pipes, 7 hoses, 8 micro pumps, 9
Water inlet, 10 substrates, 11 grooves, 12 positioning pins, 13 circuit boards, 14 are folded in shape heat sink, 15 electronic components, 16 motors, 17
Mandrel, 18 blades, 19 ventilating openings, 20 fixed plates, 21 threaded holes, 22 cooling pads.
Embodiment
To make the purpose of the embodiment of the present application and technical solution clearer, below in conjunction with the embodiment of the present application to this Shen
Technical solution please is clearly and completely described.Obviously, described embodiment is the part of the embodiment of the application, and
The embodiment being not all of.Based on described embodiments herein, those of ordinary skill in the art are without creative labor
All other embodiments obtained on the premise of dynamic, shall fall in the protection scope of this application.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein（Including technology art
Language and scientific terminology）With the identical meaning of the general understanding with the those of ordinary skill in the application fields.Should also
Understand, those terms such as defined in the general dictionary, which should be understood that, to be had and the meaning in the context of the prior art
The consistent meaning of justice, and unless defined as here, will not be with idealizing or the implication of overly formal be explained.
The implication of " inside and outside " described herein referred to relative to equipment itself, the side inside sensing equipment
To be interior, on the contrary is outer, rather than the specific restriction of the equipment mechanism to the application.
The implication of " connection " described herein can be between component to be directly connected to can also pass through between component
Other components are indirectly connected with.
A kind of intensive cooling circuit board as shown in Figure 1, including circuit board housing 1, electronic component 15 and circuit board 13；
The one side of electronic component 15 is installed on circuit board 13, and circuit board 13 is arranged in circuit board housing 1；Further include and be arranged on circuit board shell
Circulation fluid cooling mechanism in body 1；Circulation fluid cooling mechanism includes liquid reserve tank 4, micro pump 8, hose 7, heat-conducting plate 2 and base
Plate 10；Liquid reserve tank 4 is fixed on one end of heat-conducting plate 2；Heat-conducting plate 2 arranges that heat-conducting plate 2 exists along the length direction of circuit board housing 1
Uniformly distributed there are several through holes 3 in the end face for closing on micro pump 8；Hose 7 passes through its both ends and liquid storage respectively after all through holes 3
Case 4 connects；When hose 7 passes through through hole 3 at the same time, the madial wall of the lateral wall and through hole 3 of hose 7 socket-connects, in the spacing of through hole 3
Bottom hose 7 is distributed in 2 inside turn of heat-conducting plate；When water cooling liquid recycle stream is dynamic in present hose 7 in fact, the heat on circuit board 13 also can
Uniformly taken away；Substrate 10 be arranged on heat-conducting plate 2 surface, substrate 10 be equipped with several grooves 11, electronic component 15 it is another
Simultaneously it is installed in groove 11；Soft copy is radiated indirectly by substrate 10 during heat dissipation, it avoids 15 excessive temperature differentials of electronic component, is
Ensure the conductivity of heat that substrate 10 has had, this application involves substrate 10 be aluminum base plate；
Specific liquid reserve tank 4 is equipped with water inlet pipe 5 and outlet pipe 6；One end of hose 7 is connected with the water inlet pipe 5 of liquid reserve tank 4, in detail
Carefully, micro pump 8 is arranged at the water inlet 9 of liquid reserve tank 4, and the inlet of micro pump 8 can be connected with water inlet pipe 5, water inlet pipe 5
Connected with one end of hose 7；The liquid outlet of micro pump 8 is communicated in liquid reserve tank 4, and outlet pipe 6 can connect with the other end of hose 7
It is logical；Liquid in liquid reserve tank 4 is water cooling liquid, and water cooling liquid can play the role of heat transfer, and water cooling liquid will fill in liquid reserve tank 4
Foot, water cooling liquid will cover the liquid outlet and outlet pipe 6 of micro pump 8, by the mating connection of micro pump 8 and hose 7, will store up
Liquid in liquid case 4 is spread in heat-conducting plate 2 by the hose 7 to spiral, the heat that circuit board 13 produces is flowed by liquid
Radiate, can be by electronic component 15 and 10 contact surface of aluminum base plate by the mating connection of groove 11 and electronic component 15
Product increase, makes better heat-radiation effect, can be by circuit board 13 by folding the mating connection of shape heat sink 14 and circuit board 13
Surface heat carries out acceleration heat dissipation, makes the more efficient of heat dissipation.
In order to facilitate the fixation of circuit board 13, positioning pin 12 is equipped with four angles of substrate 10, circuit board 13 passes through positioning
Pin 12 is installed on substrate 10, and above, circuit board 13 is that the one side with electronic component 15 is installed on substrate 10 to synthesis here；
And radiate for convenience, the another side of circuit board 13, which is equipped with, folds shape heat sink 14, folds shape heat sink 14 and is mounted directly circuit
On plate 13, and it is oppositely arranged with electronic component 15.
As the improved technical solution of the present invention, cooling pad 22 is further included, cooling pad 22 is arranged in groove 11, electronic component
15 are installed on cooling pad 22.Specifically, cooling pad 22 can be fixed on to the lower surface of electronic component 15, the following table of cooling pad 22
Face and the bottom surface of groove 11 fit, and realize that the heat for producing electronic component 15 is quickly delivered on aluminum base plate 10, make biography
Heat is more rapidly.
As the improved technical solution of the present invention, fixed plate 20 is further included, circuit board housing 1 is arranged in fixed plate 20, Gu
Fixed board 20 is equipped with threaded hole 21 in edge；It is embodied in：The corner of 1 lower surface of circuit board housing has been respectively fixedly connected with solid
Fixed board 20, the upper surface of the fixed plate 20 offer threaded hole 21, facilitate the fixation of circuit board housing 1.
The upper surface of the positioning pin 12 is fixedly connected with rubber cushion, and circuit board 13 contacts generation with positioning pin 12 in order to prevent
Collision, plays the role of protection circuit plates 13.
As the improved technical solution of the present invention, further include air blast cooling mechanism, air blast cooling mechanism include motor 16, in
Mandrel 17, blade 18 and ventilating opening 19；Motor 16 is arranged in circuit board housing 1, and positioned at 1 length direction of circuit board housing
One end；17 drive connection motor 16 of central shaft can simultaneously rotate under the drive of motor 16, and the axis of central shaft 17 is along circuit board shell
The length direction arrangement of body 1；Blade 18 is arranged on central shaft 17；Ventilating opening 19 is arranged on the 1 length direction other end of circuit board housing
End face on.
Operation principle：Micro pump 8 and motor 16 are powered by circuit board 13 in working status, and then micro pump 8 is logical
Cross water inlet pipe 5 to twitch, water cooling liquid is extracted into hose 7 from outlet pipe 6 by hose 7, is then followed the water cooling liquid in liquid reserve tank 4
Lottery of lotteries moves, and the cold liquid band of flowing water walks the heat of electronic component 15 on circuit board 13 in hose 7, is transmitted heat, and then
Reach heat dissipation effect, the contact with groove 11 of electronic component 15 can increase heat dissipation effect, and folding shape heat sink 14 can be by electricity
The heat that plate 13 upper end water cooling liquid circulation in road can not be taken away quickly is spread, can be by electricity by rotation of the motor 16 with movable vane piece 18
Air in road plate housing 1 circulates, and makes the air themperature in circuit board housing 1 uniform, and ventilating opening 19 is by circuit board housing 1
Air release, reach heat dissipation maximize.
It is obvious to a person skilled in the art that the application is not limited to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit herein or essential characteristic, the application can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and scope of the present application is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the application.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical solution, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (8)
1. a kind of intensive cooling circuit board, including circuit board housing, electronic component and circuit board；The one side installation of electronic component
In on circuit board, circuit board is arranged in circuit board housing；It is characterized in that, the circulation fluid further included in circuit board housing dissipates
Heat engine structure；Circulation fluid cooling mechanism includes liquid reserve tank, micro pump, hose, heat-conducting plate and substrate；Heat-conducting plate is along circuit board shell
The length direction arrangement of body, heat-conducting plate have several through holes the end face for closing on micro pump is uniformly distributed；Liquid reserve tank is arranged on and leads
One end of hot plate；After hose passes through all through holes, one end is connected with the water outlet of liquid reserve tank；Micro pump be arranged on liquid reserve tank into
At the mouth of a river, the liquid outlet of micro pump can be connected with liquid reserve tank, and the inlet of micro pump can be connected with the other end of hose；Base
Plate is arranged on the surface of heat-conducting plate, and substrate is equipped with several grooves, the another side of electronic component is installed in groove.
2. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include cooling pad, cooling pad is set
In groove, electronic component is installed on cooling pad.
3. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include fixed plate, circuit board shell
Body is arranged in fixed plate.
4. a kind of intensive cooling circuit board according to claim 3, it is characterised in that fixed plate is equipped with screw thread in edge
Hole.
5. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include positioning pin, circuit board leads to
Positioning pin is crossed to be installed on substrate.
6. a kind of intensive cooling circuit board according to claim 5, it is characterised in that the upper surface of positioning pin is fixedly connected
There is rubber cushion.
A kind of 7. intensive cooling circuit board according to claim 1, it is characterised in that further include and fold shape heat sink, folding
Folded shape heat sink is arranged on circuit board, and is oppositely arranged with electronic component.
8. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include air blast cooling mechanism, drum
Wind cooling mechanism includes motor, central shaft, blade and ventilating opening；Motor is arranged in circuit board housing, and is located at circuit board shell
The one end in body length direction；Central shaft driven connection motor can simultaneously rotate under the drive of motor, and the axis of central shaft is along circuit
The length direction arrangement of plate housing；Blade is arranged on central shaft；Ventilating opening is arranged on the end of the circuit board shell length direction other end
On face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711303593.9A CN107995832A (en) | 2017-12-11 | 2017-12-11 | A kind of intensive cooling circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711303593.9A CN107995832A (en) | 2017-12-11 | 2017-12-11 | A kind of intensive cooling circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995832A true CN107995832A (en) | 2018-05-04 |
Family
ID=62037106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711303593.9A Pending CN107995832A (en) | 2017-12-11 | 2017-12-11 | A kind of intensive cooling circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN107995832A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762459A (en) * | 2018-05-31 | 2018-11-06 | 郑州秉茂达电子科技有限公司 | A kind of computer power supply |
| CN111587028A (en) * | 2019-02-18 | 2020-08-25 | 成都立心天地电子科技有限公司 | Digital circuit control system |
| CN111800938A (en) * | 2020-07-29 | 2020-10-20 | 东莞权利得工业设计有限公司 | PCB substrate with heat dissipation structure and working method thereof |
| CN111902033A (en) * | 2020-09-09 | 2020-11-06 | 南京工业职业技术大学 | Unmanned aerial vehicle with circuit board heat radiation structure |
| CN115182888A (en) * | 2022-08-15 | 2022-10-14 | 常州市东南电器电机有限公司 | Electronic water pump with water-proof and shock-absorbing structure |
| CN115580979A (en) * | 2022-12-08 | 2023-01-06 | 扬州创客自动化设备有限公司 | Heat dissipation equipment for testing electronic components |
Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040190250A1 (en) * | 2003-03-31 | 2004-09-30 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| CN1980562A (en) * | 2006-12-07 | 2007-06-13 | 华南理工大学 | Liquid-cooling type electronic-device radiator |
| US20080024981A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
| US20080024978A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
| CN101203115A (en) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Liquid cooling dissipating heat system and heat absorbing element thereof |
| CN101336061A (en) * | 2007-06-29 | 2008-12-31 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101415310A (en) * | 2007-10-19 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN201601938U (en) * | 2009-12-30 | 2010-10-06 | 上海研祥智能科技有限公司 | Radiating device and circuit board thereof |
| US20120033385A1 (en) * | 2009-04-16 | 2012-02-09 | Molex Incorporated | Cooling device, electronic substrate and electronic device |
| US20130329367A1 (en) * | 2012-06-07 | 2013-12-12 | Askey Computer Corp. | Electronic device having heat-dissipating structure |
| CN203537659U (en) * | 2013-09-30 | 2014-04-09 | 虞小生 | Circuit board having water-cooling function |
| US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
| CN203871967U (en) * | 2014-04-05 | 2014-10-08 | 湖北华恩机车科技有限公司 | Heat radiation structure of brushless direct current motor |
| CN104144591A (en) * | 2013-05-09 | 2014-11-12 | 鸿富锦精密工业（深圳）有限公司 | Cooling device and server cabinet with the same |
| CN204065990U (en) * | 2014-07-03 | 2014-12-31 | 佳木斯大学 | Heating radiator |
| CN204794749U (en) * | 2015-07-21 | 2015-11-18 | 开县正品诚赢科技发展有限责任公司 | Inverters |
| CN205303618U (en) * | 2015-11-28 | 2016-06-08 | 重庆永重重工有限公司 | Heat radiator for electric motor car battery module |
| US20160309618A1 (en) * | 2015-04-17 | 2016-10-20 | Cooler Master Co., Ltd. | Liquid cooling heat dissipation structure and method of manufacturing the same |
| CN205720980U (en) * | 2016-04-29 | 2016-11-23 | 深圳市晶联讯电子有限公司 | A kind of LCDs cooling system |
| US20170042066A1 (en) * | 2015-08-05 | 2017-02-09 | Tdk Corporation | Electronic circuit device and heat sink structure for the same |
| CN206517668U (en) * | 2017-02-21 | 2017-09-22 | 广州市宏亿电子有限公司 | A kind of radiator structure of right angle setting on circuit boards |
| CN207604118U (en) * | 2017-12-11 | 2018-07-10 | 南京邮电大学 | A kind of intensive cooling circuit board |
-
2017
- 2017-12-11 CN CN201711303593.9A patent/CN107995832A/en active Pending
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040190250A1 (en) * | 2003-03-31 | 2004-09-30 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US20080024981A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
| US20080024978A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
| CN1980562A (en) * | 2006-12-07 | 2007-06-13 | 华南理工大学 | Liquid-cooling type electronic-device radiator |
| CN101203115A (en) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Liquid cooling dissipating heat system and heat absorbing element thereof |
| CN101336061A (en) * | 2007-06-29 | 2008-12-31 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101415310A (en) * | 2007-10-19 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Radiating device |
| US20120033385A1 (en) * | 2009-04-16 | 2012-02-09 | Molex Incorporated | Cooling device, electronic substrate and electronic device |
| CN201601938U (en) * | 2009-12-30 | 2010-10-06 | 上海研祥智能科技有限公司 | Radiating device and circuit board thereof |
| US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
| US20130329367A1 (en) * | 2012-06-07 | 2013-12-12 | Askey Computer Corp. | Electronic device having heat-dissipating structure |
| CN104144591A (en) * | 2013-05-09 | 2014-11-12 | 鸿富锦精密工业（深圳）有限公司 | Cooling device and server cabinet with the same |
| CN203537659U (en) * | 2013-09-30 | 2014-04-09 | 虞小生 | Circuit board having water-cooling function |
| CN203871967U (en) * | 2014-04-05 | 2014-10-08 | 湖北华恩机车科技有限公司 | Heat radiation structure of brushless direct current motor |
| CN204065990U (en) * | 2014-07-03 | 2014-12-31 | 佳木斯大学 | Heating radiator |
| US20160309618A1 (en) * | 2015-04-17 | 2016-10-20 | Cooler Master Co., Ltd. | Liquid cooling heat dissipation structure and method of manufacturing the same |
| CN204794749U (en) * | 2015-07-21 | 2015-11-18 | 开县正品诚赢科技发展有限责任公司 | Inverters |
| US20170042066A1 (en) * | 2015-08-05 | 2017-02-09 | Tdk Corporation | Electronic circuit device and heat sink structure for the same |
| CN205303618U (en) * | 2015-11-28 | 2016-06-08 | 重庆永重重工有限公司 | Heat radiator for electric motor car battery module |
| CN205720980U (en) * | 2016-04-29 | 2016-11-23 | 深圳市晶联讯电子有限公司 | A kind of LCDs cooling system |
| CN206517668U (en) * | 2017-02-21 | 2017-09-22 | 广州市宏亿电子有限公司 | A kind of radiator structure of right angle setting on circuit boards |
| CN207604118U (en) * | 2017-12-11 | 2018-07-10 | 南京邮电大学 | A kind of intensive cooling circuit board |
Non-Patent Citations (2)
| Title |
|---|
| 何伟: "《电子设备散热特性分析与仿真方法研究》", 《中国优秀硕士学位论文全文数据库 信息科技辑》, no. 01, pages 135 - 1 * |
| 李庆友;王文;周根明;: "电子元器件散热方法研究", 电子器件, no. 04, pages 93941 * |
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| CN111587028A (en) * | 2019-02-18 | 2020-08-25 | 成都立心天地电子科技有限公司 | Digital circuit control system |
| CN111587028B (en) * | 2019-02-18 | 2024-03-15 | 湖南硕特电子科技有限公司 | Digital circuit control system |
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