CN207604118U - A kind of intensive cooling circuit board - Google Patents
A kind of intensive cooling circuit board Download PDFInfo
- Publication number
- CN207604118U CN207604118U CN201721706762.9U CN201721706762U CN207604118U CN 207604118 U CN207604118 U CN 207604118U CN 201721706762 U CN201721706762 U CN 201721706762U CN 207604118 U CN207604118 U CN 207604118U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- reserve tank
- electronic component
- micro pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to heat dissipation for circuit board technical field, specially a kind of intensive cooling circuit board, including circuit board housing, electronic component and circuit board；Further include the circulation fluid cooling mechanism in circuit board housing；Circulation fluid cooling mechanism includes liquid reserve tank, micro pump, hose, heat-conducting plate and substrate；Heat-conducting plate arranges that heat-conducting plate has several through-holes the end face for closing on micro pump is uniformly distributed along the length direction of circuit board housing；Liquid reserve tank is set on one end of heat-conducting plate；After hose passes through all through-holes, one end is connected with the water outlet of liquid reserve tank；Micro pump is set on the water inlet of liquid reserve tank, and the liquid outlet of micro pump can be connected with liquid reserve tank, and the inlet of micro pump can be connected with the other end of hose；Substrate is set on the surface of heat-conducting plate, and substrate is equipped with several grooves, the another side of electronic component is installed in groove, can realize that each electronic component being capable of Homogeneouslly-radiating on circuit board.
Description
Technical field
The utility model is related to heat dissipation for circuit board technical field, specially a kind of intensive cooling circuit board.
Background technology
For electronic equipment, when work, can all generate certain heat, so as to which equipment internal temperature be made to rise rapidly,
If not in time distributed the heat, heating that equipment will continue, device will fail due to overheat, electronic equipment
Unfailing performance will decline, therefore carry out good radiating treatment to circuit board and be very important.
In the heat dissipation of existing wiring board, typically directly dried heat sink and radiated by fan, due to circuit
Each electronic component generates the degree difference of heat on plate, and heat dissipation is uneven, electronic component is caused to be damaged, especially circuit board powers on
It is more difficult to reach heat dissipation effect in the case that subcomponent is more.
Utility model content
The utility model provides a kind of intensive cooling circuit board, can realize that each electronic component can uniformly dissipate on circuit board
Heat.
To realize the above-mentioned technical purpose, the technical solution that the utility model is taken is a kind of intensive cooling circuit board, including
Circuit board housing, electronic component and circuit board；Electronic component is installed on circuit board on one side, and circuit board is set on circuit board shell
In body；Further include the circulation fluid cooling mechanism in circuit board housing；Circulation fluid cooling mechanism includes liquid reserve tank, Miniature water
Pump, hose, heat-conducting plate and substrate；Liquid reserve tank is set on one end of heat-conducting plate；Length direction cloth of the heat-conducting plate along circuit board housing
It puts, heat-conducting plate has several through-holes the end face for closing on micro pump is uniformly distributed；After hose passes through all through-holes, one end and storage
The water outlet connection of liquid case；Micro pump is set on the water inlet of liquid reserve tank, and the liquid outlet of micro pump can be connected with liquid reserve tank,
The inlet of micro pump can be connected with the other end of hose；Substrate is set on the surface of heat-conducting plate, and it is recessed that substrate is equipped with several
Slot, electronic component another side be installed in groove.
As the improved technical solution of the utility model, cooling pad is further included, cooling pad is set in groove, electronic component peace
Loaded on cooling pad.
As the improved technical solution of the utility model, fixed plate is further included, circuit board housing is set in fixed plate.
As the improved technical solution of the utility model, fixed plate is equipped with threaded hole in edge.
As the improved technical solution of the utility model, positioning pin is further included, circuit board is installed on substrate by positioning pin
On.
As the improved technical solution of the utility model, the upper surface of positioning pin is fixedly connected with rubber cushion.
It as the improved technical solution of the utility model, further includes and folds shape cooling fin, fold shape cooling fin and be set on circuit
On plate, and it is oppositely arranged with electronic component.
As the improved technical solution of the utility model, further include air blast cooling mechanism, air blast cooling mechanism include motor,
Central shaft, blade and ventilation opening；Motor is set in circuit board housing, and positioned at the one end in circuit board shell length direction；In
Spindle drive connection motor can simultaneously rotate under the drive of motor, the length direction cloth of the axis of central shaft along circuit board housing
It puts；Blade is set on central shaft；Ventilation opening is set on the end face of the circuit board shell length direction other end.
Advantageous effect
Compared with prior art, a kind of intensive cooling circuit board of the utility model, passes through the cooperation of liquid storage cylinder and hose
Connection, the liquid in liquid storage cylinder is spread to by the hose to spiral in heat-conducting plate, and the heat that circuit board generates is made to pass through liquid
Flowing is radiated, and by the mating connection of groove and electronic component, can be increased electronic component and aluminum base plate contact area
Greatly, make better heat-radiation effect, by folding the mating connection of shape cooling fin and circuit board, can by circuit board upper surface heat into
Row accelerates heat dissipation, makes the more efficient of heat dissipation.
In addition, the intensive cooling circuit board of the application can also dissipate circulation fluid cooling mechanism with Blast mechanism and folded form
Hot plate is combined, and realizes heat rapid cooling on circuit board.
Description of the drawings
The structure diagram of the intensive cooling circuit board of Fig. 1 the application；
Fig. 2 is the right view of Fig. 1；
In figure：1 circuit board housing, 2 heat-conducting plates, 3 through-holes, 4 liquid reserve tanks, 5 water inlet pipes, 6 outlet pipes, 7 hoses, 8 Miniature waters
Pump, 9 water inlets, 10 substrates, 11 grooves, 12 positioning pins, 13 circuit boards, 14 fold shape cooling fins, 15 electronic components, 16 motors,
17 central shafts, 18 blades, 19 ventilation openings, 20 fixed plates, 21 threaded holes, 22 cooling pads.
Specific embodiment
Purpose and technical solution to make the embodiment of the present application is clearer, below in conjunction with the embodiment of the present application to this Shen
Technical solution please is clearly and completely described.Obviously, described embodiment is the part of the embodiment of the application, and
The embodiment being not all of.Based on described embodiments herein, those of ordinary skill in the art are without creative labor
All other embodiments obtained under the premise of dynamic, shall fall in the protection scope of this application.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein（Including technology art
Language and scientific terminology）With the identical meaning of the general understanding with the those of ordinary skill in the application fields.Should also
Understand, those terms such as defined in the general dictionary, which should be understood that, to be had and the meaning in the context of the prior art
The consistent meaning of justice, and unless defined as here, will not be with idealizing or the meaning of too formal be explained.
The meaning of " inside and outside " described herein referred to relative to equipment itself, the side inside sensing equipment
To be interior, on the contrary is the specific restriction of equipment mechanism outer rather than to the application.
The meaning of " connection " described herein can be between component to be directly connected to can also pass through between component
Other components are indirectly connected with.
A kind of intensive cooling circuit board as shown in Figure 1, including circuit board housing 1, electronic component 15 and circuit board 13；
Electronic component 15 is installed on one side on circuit board 13, and circuit board 13 is set in circuit board housing 1；It further includes set on circuit board shell
Circulation fluid cooling mechanism in body 1；Circulation fluid cooling mechanism includes liquid reserve tank 4, micro pump 8, hose 7, heat-conducting plate 2 and base
Plate 10；Liquid reserve tank 4 is fixed on one end of heat-conducting plate 2；Heat-conducting plate 2 arranges that heat-conducting plate 2 exists along the length direction of circuit board housing 1
Uniformly distributed there are several through-holes 3 in the end face for closing on micro pump 8；Hose 7 passes through its both ends and liquid storage respectively after all through-holes 3
Case 4 connects；When hose 7 passes through through-hole 3 simultaneously, the madial wall of the lateral wall and through-hole 3 of hose 7 socket-connects, in the limiting of through-hole 3
Bottom hose 7 is distributed in 2 inside turn of heat-conducting plate；When water cooling liquid recycle stream is dynamic in present hose 7 in fact, the heat on circuit board 13 also can
Uniformly taken away；Substrate 10 be set on heat-conducting plate 2 surface, substrate 10 be equipped with several grooves 11, electronic component 15 it is another
It is installed on one side in groove 11；Soft copy is radiated indirectly by substrate 10 during heat dissipation, is avoided 15 excessive temperature differentials of electronic component, is
Ensure the conductivity of heat that substrate 10 has had, this application involves substrate 10 be aluminum base plate；
Specific liquid reserve tank 4 is equipped with water inlet pipe 5 and outlet pipe 6；One end of hose 7 and the water inlet pipe 5 of liquid reserve tank 4 connect
Logical, in detail, micro pump 8 is set at the water inlet 9 of liquid reserve tank 4, and the inlet of micro pump 8 can be connected with water inlet pipe 5, into
Water pipe 5 is connected with one end of hose 7；The liquid outlet of micro pump 8 is communicated in liquid reserve tank 4, and outlet pipe 6 can be another with hose 7
End connection；Liquid in liquid reserve tank 4 is water cooling liquid, and water cooling liquid can play the role of heat transfer, and water cooling liquid in liquid reserve tank 4
Will abundance, water cooling liquid will cover the liquid outlet of micro pump 8 and outlet pipe 6, by the mating connection of micro pump 8 and hose 7,
Liquid in liquid reserve tank 4 is spread to by the hose 7 to spiral in heat-conducting plate 2, the heat that circuit board 13 generates is made to pass through liquid
Flowing is radiated, and by the mating connection of groove 11 and electronic component 15, can be connect electronic component 15 and aluminum base plate 10
Contacting surface product increase, makes better heat-radiation effect, can be by circuit board by folding the mating connection of shape cooling fin 14 and circuit board 13
13 upper surface heats carry out acceleration heat dissipation, make the more efficient of heat dissipation.
In order to facilitate the fixation of circuit board 13, positioning pin 12 is equipped at four angles of substrate 10, circuit board 13 passes through positioning
Pin 12 is installed on substrate 10, and above, circuit board 13 is being installed on one side on substrate 10 with electronic component 15 to synthesis here；
And radiate for convenience, the another side of circuit board 13, which is equipped with, folds shape cooling fin 14, folds shape cooling fin 14 and is mounted directly circuit
On plate 13, and it is oppositely arranged with electronic component 15.
As the improved technical solution of the utility model, cooling pad 22 is further included, cooling pad 22 is set in groove 11, electronics
Element 15 is installed on cooling pad 22.Specifically, cooling pad 22 can be fixed on to the lower surface of electronic component 15, cooling pad 22
Lower surface and the bottom surface of groove 11 fit, and realize that the heat for generating electronic component 15 is quickly transmitted on aluminum base plate 10,
Make heat transfer more rapidly.
As the improved technical solution of the utility model, fixed plate 20 is further included, circuit board housing 1 is set on fixed plate 20
On, fixed plate 20 is equipped with threaded hole 21 in edge；It is embodied in：The quadrangle of 1 lower surface of circuit board housing is fixed respectively to be connected
Fixed plate 20 is connected to, the upper surface of the fixed plate 20 offers threaded hole 21, facilitates the fixation of circuit board housing 1.
The upper surface of the positioning pin 12 is fixedly connected with rubber cushion, and circuit board 13 contacts generation with positioning pin 12 in order to prevent
Collision, plays the role of protection circuit plates 13.
As the improved technical solution of the utility model, air blast cooling mechanism is further included, air blast cooling mechanism includes motor
16th, central shaft 17, blade 18 and ventilation opening 19；Motor 16 is set in circuit board housing 1, and positioned at 1 length of circuit board housing
The one end in direction；17 drive connection motor 16 of central shaft can simultaneously rotate under the drive of motor 16, the axis edge electricity of central shaft 17
The length direction arrangement of road plate housing 1；Blade 18 is set on central shaft 17；Ventilation opening 19 is set on 1 length direction of circuit board housing
On the end face of the other end.
Operation principle：Micro pump 8 and motor 16 are powered by circuit board 13 in working condition, and then micro pump 8 is logical
It crosses water inlet pipe 5 to twitch, water cooling liquid from outlet pipe 6 is extracted by hose 7 in hose 7, is then followed the water cooling liquid in liquid reserve tank 4
Lottery of lotteries moves, and the cold liquid band of flowing water walks the heat of electronic component 15 on circuit board 13 in hose 7, is transmitted heat, and then
Reach heat dissipation effect, the contact with groove 11 of electronic component 15 can increase heat dissipation effect, and folding shape cooling fin 14 can will be electric
The heat that plate 13 upper end water cooling liquid cycle in road can not be taken away quickly is spread, can will be electric by rotation of the motor 16 with movable vane piece 18
Air in road plate housing 1 circulates, and makes the air themperature in circuit board housing 1 uniform, and ventilation opening 19 is by circuit board housing 1
Air release, reach heat dissipation maximize.
It is obvious to a person skilled in the art that the application is not limited to the details of above-mentioned exemplary embodiment, Er Qie
In the case of without departing substantially from spirit herein or essential characteristic, the application can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and scope of the present application is by appended power
Profit requirement rather than above description limit, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included in the application.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in each embodiment can also be properly combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (8)
1. a kind of intensive cooling circuit board, including circuit board housing, electronic component and circuit board；The one side installation of electronic component
In on circuit board, circuit board is set in circuit board housing；It is characterized in that, the circulation fluid further included in circuit board housing dissipates
Heat engine structure；Circulation fluid cooling mechanism includes liquid reserve tank, micro pump, hose, heat-conducting plate and substrate；Heat-conducting plate is along circuit board shell
The length direction arrangement of body, heat-conducting plate have several through-holes the end face for closing on micro pump is uniformly distributed；Liquid reserve tank is set on and leads
One end of hot plate；After hose passes through all through-holes, one end is connected with the water outlet of liquid reserve tank；Micro pump be set on liquid reserve tank into
At the mouth of a river, the liquid outlet of micro pump can be connected with liquid reserve tank, and the inlet of micro pump can be connected with the other end of hose；Base
Plate is set on the surface of heat-conducting plate, and substrate is equipped with several grooves, the another side of electronic component is installed in groove.
2. a kind of intensive cooling circuit board according to claim 1, which is characterized in that further include cooling pad, cooling pad is set
In groove, electronic component is installed on cooling pad.
3. a kind of intensive cooling circuit board according to claim 1, which is characterized in that further include fixed plate, circuit board shell
Body is set in fixed plate.
4. a kind of intensive cooling circuit board according to claim 3, which is characterized in that fixed plate is equipped with screw thread in edge
Hole.
5. a kind of intensive cooling circuit board according to claim 1, which is characterized in that further include positioning pin, circuit board leads to
Positioning pin is crossed to be installed on substrate.
6. a kind of intensive cooling circuit board according to claim 5, which is characterized in that the upper surface of positioning pin is fixedly connected
There is rubber cushion.
7. a kind of intensive cooling circuit board according to claim 1, which is characterized in that it further includes and folds shape cooling fin, folding
Folded shape cooling fin is set on circuit board, and be oppositely arranged with electronic component.
8. a kind of intensive cooling circuit board according to claim 1, which is characterized in that further include air blast cooling mechanism, drum
Wind cooling mechanism includes motor, central shaft, blade and ventilation opening；Motor is set in circuit board housing, and positioned at circuit board shell
The one end in body length direction；Central shaft driven connection motor can simultaneously rotate under the drive of motor, and the axis of central shaft is along circuit
The length direction arrangement of plate housing；Blade is set on central shaft；Ventilation opening is set on the end of the circuit board shell length direction other end
On face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721706762.9U CN207604118U (en) | 2017-12-11 | 2017-12-11 | A kind of intensive cooling circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721706762.9U CN207604118U (en) | 2017-12-11 | 2017-12-11 | A kind of intensive cooling circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207604118U true CN207604118U (en) | 2018-07-10 |
Family
ID=62764859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721706762.9U Active CN207604118U (en) | 2017-12-11 | 2017-12-11 | A kind of intensive cooling circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207604118U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995832A (en) * | 2017-12-11 | 2018-05-04 | 南京邮电大学 | A kind of intensive cooling circuit board |
| CN109152281A (en) * | 2018-07-27 | 2019-01-04 | 安徽安为科技有限公司 | Locomotive information service terminal heat-conducting radiator |
| CN109644553A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| CN114679876A (en) * | 2022-03-17 | 2022-06-28 | 联想(北京)有限公司 | Electronic device |
| CN114679876B (en) * | 2022-03-17 | 2024-05-28 | 联想(北京)有限公司 | Electronic equipment |
-
2017
- 2017-12-11 CN CN201721706762.9U patent/CN207604118U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995832A (en) * | 2017-12-11 | 2018-05-04 | 南京邮电大学 | A kind of intensive cooling circuit board |
| CN109152281A (en) * | 2018-07-27 | 2019-01-04 | 安徽安为科技有限公司 | Locomotive information service terminal heat-conducting radiator |
| CN109644553A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| CN109644553B (en) * | 2018-10-31 | 2021-10-08 | 北京比特大陆科技有限公司 | Circuit board and super computing device |
| CN114679876A (en) * | 2022-03-17 | 2022-06-28 | 联想(北京)有限公司 | Electronic device |
| CN114679876B (en) * | 2022-03-17 | 2024-05-28 | 联想(北京)有限公司 | Electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107995832A (en) | A kind of intensive cooling circuit board | |
| CN207604118U (en) | A kind of intensive cooling circuit board | |
| US6763880B1 (en) | Liquid cooled radiation module for servers | |
| US6894899B2 (en) | Integrated fluid cooling system for electronic components | |
| US9301421B2 (en) | Closed loop liquid cooling system for electronic packages | |
| CN101742833B (en) | Electronic device | |
| KR20180074764A (en) | Clothes dryer | |
| RU2019120560A (en) | HEAT EXCHANGE DEVICES AND METHODS FOR FACILITATION OF CONVECTIVE HEAT EXCHANGE WITH A HEAT SOURCE OR A COLD SOURCE | |
| CN207974973U (en) | A kind of electronic water pump to be radiated using itself fluid media (medium) | |
| CN207663388U (en) | A kind of high-availability computer CPU water-cooling heat radiating devices | |
| JP4397114B2 (en) | Electronic equipment cooling device | |
| WO2018176535A1 (en) | Novel mechanical pump liquid-cooling heat-dissipation system | |
| CN208239965U (en) | A kind of computer case radiating device | |
| CN206961062U (en) | Semiconductor refrigerating notebook PC radiator | |
| CN203433456U (en) | Water-cooling heat dissipation device for notebook computer | |
| JP6081186B2 (en) | Liquid cooling device | |
| KR101897931B1 (en) | System for cooling a processor in electronic device | |
| CN207438658U (en) | Heating unit | |
| CN219122649U (en) | Computer radiator capable of effectively preventing deformation | |
| CN215447499U (en) | Heat dissipation device for light bath machine | |
| RU2605930C2 (en) | Device for air cooling of radioelectronic devices | |
| CN218181456U (en) | Host for offline storage of complex heterogeneous distributed system | |
| CN219612446U (en) | Embedded electric control board with self-radiating function for special air conditioner | |
| CN101295202A (en) | Water-cooling type radiator | |
| CN207728524U (en) | A kind of high-efficiency radiator of air compressor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 226000 No. 33 Xinkang Road, Gangzhao District, Nantong City, Jiangsu Province Co-patentee after: Nanjing University of Posts and Telecommunications Nantong Institute Limited Patentee after: Nanjing Post & Telecommunication Univ. Address before: Yuen Road Ya Dong Qixia District of Nanjing City, Jiangsu province 210023 New District No. 9 Co-patentee before: Nanjing University of Posts and Telecommunications Nantong Institute Limited Patentee before: Nanjing Post & Telecommunication Univ. |
|
| CP02 | Change in the address of a patent holder |