CN114679876A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN114679876A CN114679876A CN202210262670.5A CN202210262670A CN114679876A CN 114679876 A CN114679876 A CN 114679876A CN 202210262670 A CN202210262670 A CN 202210262670A CN 114679876 A CN114679876 A CN 114679876A
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- Prior art keywords
- mounting structure
- heat dissipation
- expansion card
- card module
- mounting
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 238000009434 installation Methods 0.000 claims abstract description 18
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 4
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1435—Expandable constructions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses an electronic device. The electronic equipment comprises a body, a first connecting piece and a second connecting piece, wherein the body is provided with a shell, and a mounting plate is arranged in the shell; a plurality of electronic components disposed on the mounting board; the active heat dissipation element is used for increasing the flow velocity of gas in the shell and is arranged at the upstream position relative to the flow direction of the heat dissipation gas of the electronic element so as to dissipate heat generated by the work of the electronic element; the first mounting structure is arranged on the mounting plate and used for detachably mounting the adjusting assembly; the second mounting structure is arranged on the mounting plate and used for detachably mounting the expansion card module; the active heat dissipation element, the electronic element, the first installation structure and the second installation structure are arranged on the same side of the installation plate, the first installation structure is located between the active heat dissipation element and the second installation structure, if the expansion card module is installed on the second installation structure, the first installation structure is provided with the adjusting assembly, and the adjusting assembly is used for enabling gas flowing through the expansion card module to flow through the adjusting assembly more evenly before the gas flows through the adjusting assembly.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to electronic equipment.
Background
At present, an electronic device such as a server is provided with an expansion card module, the heat dissipation uniformity of the expansion card module is poor, the heat test effect is reduced, the times of testing are more during heat test, and the heat test period is prolonged.
Therefore, how to improve the thermal testing effect of the electronic device and shorten the thermal testing period is a technical problem that needs to be solved by those skilled in the art.
Content of application
In view of the above, an object of the present application is to provide an electronic device, including:
the body is provided with a shell, and a mounting plate is arranged in the shell;
a plurality of electronic components disposed on the mounting board;
the active heat dissipation element is used for increasing the flow velocity of gas in the shell and is arranged at the upstream position relative to the flow direction of the heat dissipation gas of the electronic element so as to dissipate heat generated by the work of the electronic element;
the first mounting structure is arranged on the mounting plate and is used for detachably mounting the adjusting assembly;
the second mounting structure is arranged on the mounting plate and used for detachably mounting the expansion card module;
the active heat dissipation element, the electronic element, the first mounting structure and the second mounting structure are arranged on the same side of the mounting plate, the first mounting structure is located between the active heat dissipation element and the second mounting structure, if the second mounting structure is provided with the expansion card module, the first mounting structure is provided with the adjusting assembly, and the adjusting assembly is used for enabling gas flowing through the expansion card module to flow through the adjusting assembly more uniformly before flowing through the adjusting assembly.
Preferably, in the electronic device, a flow guide member is further included, and the flow guide member has at least a first flow guide channel and a second flow guide channel; at least part of the electronic element is positioned in the first drainage channel; the first mounting structure is located between the second drainage channel and the second mounting structure;
and a part of the air flow accelerated by the active heat dissipation element passes through the second flow guide channel to dissipate heat of the expansion card module.
Preferably, in the electronic device, a distance between the adjusting component and the expansion card module is smaller than a distance between the adjusting component and the active heat dissipation element.
Preferably, in the electronic device, the adjusting assembly includes a rotating member that can rotate based on the airflow accelerated by the active heat dissipating element.
Preferably, in the electronic device, the rotating member is mounted on a first rotating shaft, the rotating member rotates around the first rotating shaft based on flowing gas, one end of the first rotating shaft faces the active heat dissipation element, and the other end of the first rotating shaft faces the expansion card module.
Preferably, in the electronic device, the expansion card module includes a plurality of sub-modules, and the plurality of sub-modules are arranged layer by layer in a direction perpendicular to a plane of the mounting plate;
The first rotating shaft is installed on the installation plate through a supporting rod with adjustable height.
Preferably, in the electronic device, the rotating member is mounted on a second rotating shaft, the rotating member rotates around the second rotating shaft based on the flowing gas, and an extending direction of the second rotating shaft intersects with a connecting line direction of the first mounting structure and the second mounting structure.
Preferably, in the above electronic apparatus, the number of the rotating members is plural; the distance between the adjacent rotating members becomes gradually smaller in a direction from the mounting plate toward the adjusting assembly.
Preferably, in the electronic device, there are a plurality of the adjusting members arranged in sequence in the first direction; the first direction intersects a direction of a line connecting the first mounting structure and the second mounting structure.
Preferably, in the electronic device, a passive heat dissipation element is further included; the second mounting structure is in thermal contact with the passive heat dissipation element; the passive heat dissipation element is used for conducting heat generated by the expansion card module to one side of the shell, which faces away from the expansion card module.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device detachably mounted with an adjustment assembly according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of an adjusting assembly according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of another adjustment assembly provided in an embodiment of the present application;
FIG. 4 is a partial schematic view of an adjustment assembly mounted on a housing according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of another adjustment assembly provided in the embodiment of the present application and mounted on a housing.
Wherein 100 is a housing, 200 is an adjusting component, 201 is a rotating component, 202 is a first rotating shaft, 203 is a supporting rod, 204 is a second rotating shaft, 300 is an expansion card module, and 400 is a guiding component.
Detailed Description
In view of the above, the core of the present application is to provide an electronic device to improve a thermal testing effect of the electronic device and shorten a thermal testing period.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 to 5, an embodiment of the present application discloses an electronic device, which includes a body, an electronic component, an active heat dissipation component, a first mounting structure, and a second mounting structure.
The body is provided with a shell, and a mounting plate is arranged in the shell; the number of the electronic elements is multiple, and the electronic elements are arranged on the mounting plate; the active heat dissipation element is used for increasing the flow velocity of gas in the shell and is arranged at the upstream position relative to the flow direction of the heat dissipation gas of the electronic element so as to dissipate heat generated by the work of the electronic element; the first mounting structure and the second mounting structure are arranged on the mounting plate, the first mounting structure is used for detachably mounting the adjusting assembly, and the second mounting structure is used for detachably mounting the expansion card module; the active heat dissipation element, the electronic element, the first installation structure and the second installation structure are arranged on the same side of the installation plate, the first installation structure is located between the active heat dissipation element and the second installation structure, if the expansion card module is installed on the second installation structure, the first installation structure is provided with the adjusting assembly, and the adjusting assembly is used for enabling gas flowing through the expansion card module to flow more uniformly before flowing through the adjusting assembly.
When the electronic equipment provided by the application is used, the flow velocity of gas in the shell is increased through the active heat dissipation element, so that the electronic element arranged at the downstream position of the active heat dissipation element dissipates heat, if the expansion card module is arranged on the second mounting structure, the first mounting structure is provided with the adjusting component, because the adjusting component is used for enabling the gas flowing through the expansion card module to flow more uniformly before the gas flows through the adjusting component, the active heat dissipation element, the electronic element, the first mounting structure and the second mounting structure are arranged on the same side of the mounting plate, and the first mounting structure is arranged between the active heat dissipation element and the second mounting structure, the airflow after heat dissipation of the electronic element sequentially flows through the adjusting component and the expansion card module, the gas flowing through the expansion card module is enabled to flow more uniformly before the adjusting component through the adjusting component, and the surplus airflow after heat dissipation of the active heat dissipation element on the electronic element is effectively utilized, the heat dissipation efficiency of the expansion card module is improved, the heat dissipation uniformity of the expansion card module is improved, the heat test effect is improved, the times of testing required during heat test are reduced, and the heat test period is shortened; if the expansion card module is not installed in the second installation structure, the adjustment component is not installed in the first installation structure, namely the adjustment component is an optional module, and the flexibility of electronic equipment configuration is improved.
It should be noted that, the more balanced air flow adjusted by the adjusting component means that two parameters of the air flow are more balanced than those before adjustment, and the two parameters are the air volume and the inlet air temperature of the expansion card module respectively.
In addition, the adjusting assembly and the first mounting structure, and the expansion card module and the second mounting structure can be connected through a bolt connection, a buckle connection or a key connection, and the like, and the detachable connection mode can be realized.
Furthermore, the electronic equipment also comprises a flow guide piece, wherein the flow guide piece is at least provided with a first flow guide channel and a second flow guide channel so as to gather and accelerate airflow and improve the heat dissipation effect; at least part of the electronic elements are positioned in the first flow guide channel, so that part of the accelerated airflow of the active heat dissipation element passes through the first flow guide channel, and the part of the accelerated airflow is gathered through the first flow guide channel, so that the heat dissipation effect of the electronic elements is improved; first mounting structure is located between second drainage channel and the second mounting structure, and the air current partly after initiative radiating element accelerates passes through second drainage channel, dispels the heat to the expansion card module to gather together partly accelerated air current through second drainage channel, adjust the accelerated air current after gathering together through adjusting part, make the gas of expansion card module of flowing through flow through relatively more balanced before the adjusting part, make the heat dissipation homogeneity of expansion card module promote to promote hot test effect, the number of times of required test when reducing hot test shortens hot test cycle.
It should be understood that the first diversion channel and the second diversion channel can be made into a rectangular parallelepiped shape, a conical shape or a cylindrical shape, and the like, and any shape that can meet the use requirement is included in the protection scope of the present application.
Moreover, the number of the first drainage channels and the number of the second drainage channels are not specifically limited, in practical application, the number of the drainage channels can be adaptively increased according to other factors such as actual heat dissipation requirements and total arrangement requirements, and the number of the drainage channels which can meet the use requirements belongs to the protection range of the application.
In addition, the distance between the adjusting assembly and the expansion card module is not particularly limited, and all distances that can meet the use requirements are within the protection scope of the application; optionally, the distance between the adjusting assembly and the expansion card module provided by the embodiment of the application is smaller than the distance between the adjusting assembly and the active heat dissipation element, so that the adjusting assembly is closer to the expansion card module, and the improvement of the heat dissipation uniformity of the expansion card module is facilitated.
The specific structural form of the adjusting assembly is not limited in the application, and any structure capable of meeting the use requirement is within the protection scope of the application; optionally, the present application provides two specific embodiments.
As shown in fig. 1, 2, 4 and 5, in one embodiment of the present application, the adjustment assembly includes a rotating member that is capable of rotating based on the accelerated airflow from the active heat dissipation element to improve airflow equalization.
The rotating part can be a spoiler, a fan blade or a rotating plate with a spoiler structure and other types of parts, and any type of part which can meet the use requirement belongs to the protection scope of the application; optionally, the rotating member provided in the embodiments of the present application is a fan blade.
Furthermore, the rotating part is installed on the first rotating shaft, the rotating part rotates around the first rotating shaft based on flowing gas, one end of the first rotating shaft faces the active heat dissipation element, the other end of the first rotating shaft faces the expansion card module, namely, the active heat dissipation element is arranged at one end of the rotating axis of the rotating part, and the other end of the rotating shaft faces the expansion card module, so that the rotating part is supported through the first rotating shaft, dynamic adjustment is conducted on accelerated airflow through rotation of the rotating part, and relatively balanced airflow is output.
It should be noted that the first rotating shaft may be directly disposed on an existing structure of the electronic device, so as to support the first rotating shaft through the existing structure, or may be supported by an additional supporting member, as long as the operating requirement can be met; optionally, the first rotating shaft provided by the present application is mounted on the mounting plate by a support rod.
In addition, the height of above-mentioned bracing piece should not be too high, prevents the high height of bracing piece too high, leads to the height that highly is higher than second drainage channel of a rotation piece, leads to the air current after accelerating to flow through the below of a rotation piece behind the second drainage channel, and the rotation piece can't rotate based on the air current after initiative radiating element accelerates.
In a specific embodiment of the application, the expansion card module comprises a plurality of sub-modules, and the sub-modules are arranged layer by layer in a direction perpendicular to a plane where the mounting plate is located; the height of above-mentioned bracing piece can be adjusted to through the height of adjusting the bracing piece, adjust the height that rotates the piece, make the position that rotates between second drainage channel's air current lowest position and air current highest position, thereby make to rotate the piece and can rotate based on the air current of outflow in the second drainage channel.
It should be understood that the supporting rod may be a hydraulic lifting rod, an electric lifting rod, or a pneumatic lifting rod, and the like, as long as the type can meet the use requirement, and the invention is within the scope of the present application.
In addition, in practical use, the above embodiment can increase the airflow equalization area by increasing the specification and size of the rotating member; the adjusting assemblies can also be sequentially arranged in the first direction, the first direction is intersected in the connecting line direction of the first mounting structure and the second mounting structure, namely the airflow balance area is increased by increasing the number of the adjusting assemblies, and the setting mode which can meet the use requirement belongs to the protection scope of the application.
Furthermore, the bottom of the supporting rod is provided with a connecting piece used for being connected with the mounting plate, screw holes are reserved in the mounting plate and the connecting piece, and the connecting piece is detachably mounted on the mounting plate through a thumb screw so as to achieve the tool-free mounting function.
In another embodiment of the present application, as shown in fig. 3, the rotating member is mounted on the second rotating shaft, the rotating member can rotate around the second rotating shaft based on the flowing gas, and the extending direction of the second rotating shaft intersects with the connecting direction of the first mounting structure and the second mounting structure, so as to dynamically adjust the gas flow by the rotation of the rotating member, and output a relatively balanced gas flow.
Further, in this embodiment, the number of the rotating members is plural, and the rotating axes of the plural rotating members are distributed in parallel in a direction from the mounting plate toward the adjusting assembly, so as to increase the airflow adjustment in the height direction of the expansion card module.
And in the direction from the mounting plate to the adjusting component, the distance between the adjacent rotating components gradually decreases, so that the gradually increased air flow in the direction from the mounting plate to the adjusting component is adjusted to be relatively balanced, the air flow flowing through the expansion card module is relatively balanced, and the thermal testing effect is improved.
In addition, the electronic equipment provided by the application further comprises a passive heat dissipation element; the second mounting structure is in thermal contact with the passive heat dissipation element so as to conduct heat generated by the expansion card module to one side of the shell, which is far away from the expansion card module, through the passive heat dissipation element, so that heat dissipation is accelerated, and the heat dissipation effect is further improved.
The terms "first" and "second," and the like in the description and claims of the present application and the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not set forth for a listed step or element but may include steps or elements not listed.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An electronic device, comprising:
the body is provided with a shell, and a mounting plate is arranged in the shell;
a plurality of electronic components disposed on the mounting board;
the active heat dissipation element is used for increasing the flow velocity of gas in the shell and is arranged at the upstream position relative to the flow direction of the heat dissipation gas of the electronic element so as to dissipate heat generated by the work of the electronic element;
the first mounting structure is arranged on the mounting plate and is used for detachably mounting the adjusting assembly;
the second mounting structure is arranged on the mounting plate and used for detachably mounting the expansion card module;
the active heat dissipation element, the electronic element, the first mounting structure and the second mounting structure are arranged on the same side of the mounting plate, the first mounting structure is located between the active heat dissipation element and the second mounting structure, if the second mounting structure is provided with the expansion card module, the first mounting structure is provided with the adjusting assembly, and the adjusting assembly is used for enabling gas flowing through the expansion card module to flow through the adjusting assembly more uniformly before flowing through the adjusting assembly.
2. The electronic device of claim 1, further comprising a flow guide having at least a first flow guide channel and a second flow guide channel; at least part of the electronic element is positioned in the first drainage channel; the first mounting structure is located between the second drainage channel and the second mounting structure;
And a part of the air flow accelerated by the active heat dissipation element passes through the second flow guide channel to dissipate heat of the expansion card module.
3. The electronic device of claim 1, wherein a distance between the adjustment component and the expansion card module is less than a distance between the adjustment component and the active heat dissipation element.
4. The electronic device of claim 1, the adjustment assembly comprising a rotating member that is rotatable based on the airflow accelerated by the active heat dissipating element.
5. The electronic device of claim 4, wherein the rotating member is mounted on a first rotating shaft, the rotating member rotates around the first rotating shaft based on flowing gas, one end of the first rotating shaft faces the active heat dissipation element, and the other end of the first rotating shaft faces the expansion card module.
6. The electronic device of claim 5, wherein the expansion card module comprises a plurality of sub-modules, and the plurality of sub-modules are arranged layer by layer in a direction perpendicular to the plane of the mounting plate;
the first rotating shaft is installed on the installation plate through a supporting rod with adjustable height.
7. The electronic device according to claim 4, wherein the rotating member is mounted on a second rotating shaft, the rotating member rotates around the second rotating shaft based on the flowing gas, and an extending direction of the second rotating shaft intersects a connecting direction of the first mounting structure and the second mounting structure.
8. The electronic device according to claim 7, wherein the number of the rotation pieces is plural; the distance between the adjacent rotating members becomes gradually smaller in a direction from the mounting plate toward the adjusting assembly.
9. The electronic device of claim 1, having a plurality of said regulating members arranged in sequence in a first direction; the first direction intersects a direction of a line connecting the first mounting structure and the second mounting structure.
10. The electronic device of any of claims 1-9, further comprising a passive heat dissipating element; the second mounting structure is in thermal contact with the passive heat dissipation element; the passive heat dissipation element is used for conducting heat generated by the expansion card module to one side of the shell, which faces away from the expansion card module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210262670.5A CN114679876B (en) | 2022-03-17 | 2022-03-17 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210262670.5A CN114679876B (en) | 2022-03-17 | 2022-03-17 | Electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN114679876A true CN114679876A (en) | 2022-06-28 |
| CN114679876B CN114679876B (en) | 2024-05-28 |
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| CN202210262670.5A Active CN114679876B (en) | 2022-03-17 | 2022-03-17 | Electronic equipment |
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