CN109451709A - A kind of radiator structure using hot simulation analysis method design communication equipment - Google Patents
A kind of radiator structure using hot simulation analysis method design communication equipment Download PDFInfo
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- CN109451709A CN109451709A CN201811496682.4A CN201811496682A CN109451709A CN 109451709 A CN109451709 A CN 109451709A CN 201811496682 A CN201811496682 A CN 201811496682A CN 109451709 A CN109451709 A CN 109451709A
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- plate
- optical module
- radiator
- radiating area
- main pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of radiator structures using hot simulation analysis method design communication equipment.Main PCB plate is mounted in cabinet, partition is arranged on main PCB plate will be divided into lower radiating area and upper radiating area in cabinet, according to the heating device distribution and the estimation of power consumption on main PCB plate in upper radiating area and lower radiating area, the power consumption of lower radiating area is less than the power consumption of upper radiating area, the component I of four fans is installed on four air outlets I that upper radiating area corresponds to left plate, the component II that two fans are installed on two air outlets II of left plate is corresponded in lower radiating area, the component II of component I and two fan of four fans respectively sucks cold wind from the air inlet I and air inlet II of cabinet right side plate, the heat that heating device surface on main PCB plate and sub- pcb board is generated, it is discharged by four air outlet I and two air outlets II of left plate.Cooling system structure design is carried out using hot simulation analysis method, provides the heat dissipation foundation of science for the production of real equipment.
Description
Technical field
The present invention relates to radiator structure technical fields, relate more specifically to a kind of design using hot simulation analysis method and lead to
Believe the radiator structure of equipment.
Background technique
Currently, when especially case system internal power consumption is larger, system radiating air duct is in machine for general communication machine box
The left and right sides of case increases fan component, and side fan component takes cold wind inside machine 3 casees to, into each board region PCB, respectively
The heat that pcb board card generates is discharged by the fan component of the other side, for a lower height of equipment, such as 1U equipment, if
System power dissipation is larger, it may be necessary to increase fan in cabinet left and right side plates, the noise that will lead to system in this way is larger, cost
Increase, blindly increase more fans also may not be able to very good solution problems of excessive heat, fan increases, system it is reliable
Property can reduce, and space layout is restricted.
In the prior art, by way of increasing fan component at left and right sides of cabinet, by the heat of internal system generation
It takes away, when pcb board power consumption is higher, how reasonably to carry out casing structure layout and be distributed fan component, effectively by chip
The heat of upper generation is taken away and is particularly important, therefore, it is necessary to carry out the topology layout of cabinet inside by heat dissipation design means,
Maximize the utilization rate of cooling system.
Summary of the invention
The object of the present invention is to how reasonably to carry out the layout of casing structure, reduce the temperature of internal system at
Hot simulation analysis in view of the problems of the existing technology is utilized the present invention provides a kind of for problem to be solved of the present invention
Method designs the radiator structure of communication equipment, this radiator structure carries out the heat radiation structure design of cabinet by simulation analysis means,
The layout for reasonably carrying out cabinet inside structure space, guarantees that the Flow Field Distribution of internal system is uniform, i.e., according to function inside equipment
Distribution situation is consumed, is radiated using subregion, heat dissipation wind channel is to enter the wind on the right side of cabinet, and cold wind generates heat after passing through pcb board, leads to
Two groups of fan components for crossing left side take away heat.
To achieve the above object, used technical solution is the present invention: a kind of designed using hot simulation analysis method is led to
Believe that the radiator structure of equipment, including cabinet, cabinet are made of left plate, right side plate, front panel, rear panel, bottom plate and upper cover plate,
It is characterized by also including main PCB plate, sub- pcb board, the component I of fan, the component II of fan, QSFP optical module heating device,
SFP optical module heating device；
The bottom plate and upper cover plate be it is rectangular-shaped, left plate, right side plate, front panel and rear panel are oblong-shaped；
SFP optical module cage hole there are two being set on the front panel；
The rear panel is equipped with QSFP optical module cage hole；
Horizontal interval is equipped with two groups of air outlets on the left plate, that is, four air outlet I and two air outlets II；
Horizontal interval is equipped with two groups of air inlets on the right side plate, that is, air inlet I and air inlet II, air inlet I and air inlet II
It is made of several air inlet holes；
The main PCB plate is mounted on the bottom plate in cabinet, on main PCB plate be arranged partition by the space layout of cabinet inside into
Row subregion is divided into the lower radiating area between front panel to partition and the upper radiating area between rear panel to partition, dissipates upper
On main PCB plate in hot-zone, main heating device include two fpga chips, I, ZYNQ chip, five power supply chips and
Two groups of QSFP optical module cages with radiator, every group of QSFP optical module cage with radiator is by four horizontally arranged cage holes
It constitutes, two groups of QSFP optical module cages with radiator stretch out outside the QSFP optical module cage hole of rear panel, radiate in two groups of bands
In the cage hole of the QSFP optical module cage of device, it is inserted into 1 QSFP optical module heating device respectively, totally 8 QSFP optical module fevers
Device；
Copper radiator is set on the fpga chip I, aluminium radiator II is set on the ZYNQ chip, is not provided on power supply chip
Radiator；
On the main PCB plate in lower radiating area, main heating device includes a fpga chip II and power supply chip, institute
Setting aluminium radiator I on fpga chip II is stated, is not provided with radiator on power supply chip；
Two sub- pcb boards are installed at the left and right position above the main PCB plate at case front panel, two sub- pcb boards are flat
Six groups of SFP optical module cages with radiator are respectively set in the obverse and reverse sides on main PCB plate, the sub- pcb board in row, and every group
SFP optical module cage with radiator is made of four horizontally arranged cage holes；
12 groups of SFP optical module cages with radiator stretch out outside two SFP optical module cage holes of front panel, in 12 groups of bands
In the cage hole of the SFP optical module cage of radiator, it is inserted into 1 SFP optical module heating device respectively, totally 48 SFP optical module hairs
Thermal device；
It is lower to dissipate according to the heating device distribution and the estimation of power consumption on main PCB plate in main PCB plate in upper radiating area and lower radiating area
The power consumption of hot-zone is less than the power consumption of upper radiating area, and four fans are installed on four air outlets I that upper radiating area corresponds to left plate
Component I, lower radiating area correspond on two air outlets II of left plate install two fans component II, the component of four fans
The component II of I and two fan respectively sucks cold wind from the air inlet I and air inlet II of cabinet right side plate, by main PCB plate and
The heat that heating device surface generates on sub- pcb board is discharged by four air outlet I and two air outlets II of left plate；
After test, cabinet inside peak flow rate (PFR) is 9.64m/s, and heat-generating components inside maximum temperature is 78.10C, plane Z=11mm
When ZYNQ chip vicinity flow velocity be 1.98m/s, corresponding flow field temperature be 32.70C；Z is by bottom plate to the plane tested
Highly.
The medicine have the advantages that
(1), heat spreader structures are arranged on each heat source to be transmitted to the heat that heating device generates on radiator in time.
(2), using air draught heat dissipation design, cold wind can be made to flow uniformly through each heat source region, makes the flow field of cabinet inside
It is evenly distributed.
(3), cabinet inside is divided into radiating area and lower radiating area, is radiated using subregion, utilizes the work of two groups of fan components
It is discharged with by heat, the utilization efficiency of fan can be improved.
(4), according to the distribution of the power consumption inside equipment, the present invention carries out cooling system structure using hot simulation analysis method
Design, can before real equipment produces pre- measurement equipment problems of excessive heat, for real equipment production provide it is scientific
Radiate foundation, can satisfy radiating requirements, overcomes the prior art and a large amount of fan cooling is needed to cause system noise biggish
Problem occurs, and reduces costs；Importantly, the chip in equipment is enable to work, not damage within the scope of suitable temperature
It is bad, it ensure that communication equipment normal work in use.
Detailed description of the invention
Fig. 1 is the radiator structure schematic layout pattern of communication equipment of the present invention；
Fig. 2 is the A-A broken section structural schematic diagram of Fig. 1 structure；
Fig. 3 is the left plate structural schematic diagram of Fig. 1；
Fig. 4 is the right side plate structural schematic diagram of Fig. 1；
Fig. 5 is the front-panel structure schematic diagram of Fig. 1；
Fig. 6 is the rear panel structure schematic diagram of Fig. 1；
Fig. 7 is the inside flow velocity cloud charts of first embodiment of the invention；
Fig. 8 is the interior temperature distribution cloud atlas of first embodiment of the invention；
Fig. 9 is the inside flow velocity cloud charts of second embodiment of the invention；
Figure 10 is the interior temperature distribution cloud atlas of second embodiment of the invention.
Specific embodiment
In order to more clearly from illustrate the technical solution in the present invention, with reference to the accompanying drawing on communication equipment of the invention
Radiator structure be further illustrated.
Such as Fig. 1 to Fig. 6, embodiment 1, a kind of radiator structure using hot simulation analysis method design communication equipment, including
Cabinet, cabinet are made of left plate 1, right side plate 2, front panel 3, rear panel 4, bottom plate 5 and upper cover plate, further include main PCB plate 6,
Sub- pcb board 7, the component I 8 of fan, the component II 9 of fan, QSFP optical module heating device 10, SFP optical module heating device 11；
Bottom plate 5 and upper cover plate be it is rectangular-shaped, left plate 1, right side plate 2, front panel 3 and rear panel 4 are oblong-shaped；
SFP optical module cage hole there are two being set on plate 3 in front；
QSFP optical module cage hole is equipped on plate 4 below；
Horizontal interval is equipped with two groups of air outlets on left plate 1, that is, four air outlets, I 1-1 and two II 1-2 of air outlet；
On right side plate 2 horizontal interval be equipped with two groups of air inlets, that is, I 2-1 of air inlet and air inlet II 2-2, I 2-1 of air inlet and
II 2-2 of air inlet is made of several air inlet holes,
Left plate 1 and right side plate 2 use sheet metal component, are formed by bending, welding procedure, front panel 3 and rear panel 4 are all made of aluminium
Alloy profile forms, and the length of left plate 1 and right side plate 2 is 380mm, height 42mm.
Main PCB plate 6 is mounted on the bottom plate 5 in cabinet, and partition 12 is arranged on main PCB plate 6 by the space of cabinet inside
Layout carries out subregion, is divided into from front panel 3 to the lower radiating area 13 partition 12 and from rear panel 4 to upper partition 12
Radiating area 14, on the main PCB plate 6 in upper radiating area 14, main heating device includes two I 6-1 of fpga chip, one
The QSFP optical module cage 6-4 of ZYNQ chip 6-3, five power supply chip 6-5 and two groups with radiator, every group with radiator
QSFP optical module cage 6-4 is made of four horizontally arranged cage holes, and two groups of QSFP optical module cage 6-4 with radiator stretch out
Outside the QSFP optical module cage hole of rear panel 4, in the cage hole of two groups of QSFP optical module cage 6-4 with radiator, insert respectively
Enter 1 QSFP optical module heating device 10, totally 8 QSFP optical module heating devices 10；
Copper radiator 6-1-1 is set on I 6-1 of fpga chip, II 6-3-1 of aluminium radiator, power supply are set on ZYNQ chip 6-3
Radiator is not provided on chip 6-5；
On the main PCB plate 6 in lower radiating area 13, main heating device includes II 6-2 and power supply of a fpga chip
I 6-2-1 of aluminium radiator is set on chip 6-5, II 6-2 of fpga chip, is not provided with radiator on power supply chip 6-5；
Two sub- pcb boards 7, two sub- PCB are installed at the left and right position above the main PCB plate 6 at case front panel 3
Plate 7 is parallel to main PCB plate 6, the obverse and reverse sides on sub- pcb board 7, and six groups of SFP optical module cages with radiator are respectively set
7-1, every group of SFP optical module cage 7-1 with radiator are made of four horizontally arranged cage holes；
12 groups of SFP optical module cage 7-1 with radiator stretch out outside two SFP optical module cage holes of front panel 3,12
In cage hole of the group with the SFP optical module cage 7-1 of radiator, it is inserted into 1 SFP optical module heating device 11 respectively, totally 48 SFP
Optical module heating device 11；
According on main PCB plate 6 in main PCB plate 6 in upper radiating area 14 and lower radiating area 13 heating device distribution and power consumption estimate
It calculates, the power consumption of lower radiating area 13 is less than the power consumption of upper radiating area 14, in four air outlets I of the corresponding left plate 1 of upper radiating area 14
The component I 8 that four fans are installed on 1-1 installs two wind on corresponding 1 two II 1-2 of air outlet of left plate of lower radiating area 13
The component II 9 of the component II 9 of fan, the component I 8 of four fans and two fans is respectively by cold wind from the air inlet of cabinet right side plate 2
I 2-1 of mouth and II 2-2 of air inlet sucking, the heat that heating device surface on main PCB plate 6 and sub- pcb board 7 is generated pass through left side
Four air outlets, I 1-1 and two II 1-2 of air outlet discharge of plate 1；
As shown in Figure 7, Figure 8, it can be seen that internal from cloud charts, cabinet inside peak flow rate (PFR) is 9.64m/s, inner heat
Device maximum temperature is 78.10The flow velocity of the vicinity ZYNQ chip 6-3 is 1.98m/s, corresponding flow field when C, plane Z=11mm
Temperature is 32.70C；Z is by bottom plate 5 to the level tested.
Embodiment 2, three fans of installation on the bottom plate 5 of corresponding 1 two II 1-2 of air outlet of left plate of lower radiating area 13
Component II 9, other layouts are identical as the layout of embodiment 1, can be seen that internal highest stream from Fig. 8, Figure 10 cloud charts result
Speed is 9.67m/s, and heat-generating components inside maximum temperature is 76.60The flow velocity of the vicinity ZYNQ chip 6-3 when C, plane Z=11mm
For 2.2m/s, corresponding flow field temperature is 32.10C.Comparative example 1, it can be seen that lower radiating area 13 increases by one in embodiment 2
The contribution that a fan does system radiating is little.
It is in summary only a specific embodiment of the invention, designer can be according to the enlightenment of examples detailed above not inclined
It optimizes or improves under technical solution.
Claims (2)
1. a kind of radiator structure using hot simulation analysis method design communication equipment, including cabinet, cabinet by left plate (1),
Right side plate (2), front panel (3), rear panel (4), bottom plate (5) and upper cover plate composition, it is characterised in that: further include main PCB plate
(6), sub- pcb board (7), the component I (8) of fan, the component II (9) of fan, QSFP optical module heating device (10), SFP optical mode
Block heating device (11)；
The bottom plate (5) and upper cover plate be it is rectangular-shaped, left plate (1), right side plate (2), front panel (3) and rear panel (4) are equal
For oblong-shaped；
SFP optical module cage hole there are two being set on the front panel (3)；
The rear panel (4) is equipped with QSFP optical module cage hole；
Horizontal interval is equipped with two groups of air outlets on the left plate (1), that is, four air outlets I (1-1) and two air outlets II
(1-2)；
Horizontal interval is equipped with two groups of air inlets on the right side plate (2), that is, air inlet I (2-1) and air inlet II (2-2), air inlet
I (2-1) of mouth and air inlet II (2-2) are made of several air inlet holes；
The main PCB plate (6) is mounted on the bottom plate in cabinet (5), and partition (12) are arranged on main PCB plate (6) will be in cabinet
The space layout in portion carries out subregion, is divided into from front panel (3) to the lower radiating area (13) partition (12) and from rear panel (4)
To the upper radiating area (14) between partition (12), on the main PCB plate (6) in upper radiating area (14), main heating device packet
Include two fpga chips I (6-1), a ZYNQ chip (6-3), five power supply chips (6-5) and two groups of QSFP with radiator
Optical module cage (6-4), every group of QSFP optical module cage (6-4) with radiator are made of four horizontally arranged cage holes, and two
QSFP optical module cage (6-4) of the group with radiator stretches out outside the QSFP optical module cage hole of rear panel (4), radiates in two groups of bands
In the cage hole of the QSFP optical module cage (6-4) of device, it is inserted into 1 QSFP optical module heating device (10) respectively, totally 8 QSFP light
Module heating device (10)；
Copper radiator (6-1-1) is set on the fpga chip I (6-1), aluminium radiator II is set on the ZYNQ chip (6-3)
(6-3-1) is not provided with radiator on power supply chip (6-5)；
On the main PCB plate (6) in lower radiating area (13), main heating device includes a fpga chip II (6-2) and one
Aluminium radiator I (6-2-1) is arranged on the fpga chip II (6-2) in a power supply chip (6-5), does not set on power supply chip (6-5)
Set radiator；
Two sub- pcb boards (7) of installation at the left and right position above the main PCB plate (6) at case front panel (3), two
Sub- pcb board (7) is parallel to main PCB plate (6), and the obverse and reverse sides on the sub- pcb board (7) are respectively set six groups with radiator
SFP optical module cage (7-1), every group of SFP optical module cage (7-1) with radiator are made of four horizontally arranged cage holes；
12 groups of SFP optical module cages (7-1) with radiator stretch out outside two SFP optical module cage holes of front panel (3),
In the cage hole of 12 groups of SFP optical module cages (7-1) with radiator, it is inserted into 1 SFP optical module heating device (11) respectively,
Totally 48 SFP optical module heating devices (11)；
According on the interior main PCB plate (6) of upper radiating area (14) and the interior main PCB plate (6) of lower radiating area (13) heating device distribution and
The estimation of power consumption, the power consumption of lower radiating area (13) are less than the power consumption of upper radiating area (14), in upper radiating area (14) corresponding left plate
(1) component I (8) that four fans are installed on four air outlets I (1-1), in lower radiating area (13) corresponding left plate (1) two
The component II (9) of two fans, the component II of the component I (8) of four fans and two fans are installed on air outlet II (1-2)
(9) cold wind is sucked from the air inlet I (2-1) and air inlet II (2-2) of cabinet right side plate (2) respectively, by main PCB plate (6) and
The heat that heating device surface generates on sub- pcb board (7), passes through four air outlets I (1-1) of left plate (1) and two outlet air
Mouth II (1-2) discharge；
After test, cabinet inside peak flow rate (PFR) is 9.64m/s, and heat-generating components inside maximum temperature is 78.10When C, plane Z=11mm
The flow velocity of the vicinity ZYNQ chip (6-3) is 1.98m/s, and corresponding flow field temperature is 32.70C；Z is by bottom plate (5) to testing
Level.
2. a kind of radiator structure using hot simulation analysis method design communication equipment according to claim 1, feature
Be: the left plate (1) and right side plate (2) are formed using sheet metal component by bending, welding procedure, front panel (3) and back
Plate (4) is all made of aluminium alloy extrusions and forms, left side plate length 380mm, height 42mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811496682.4A CN109451709A (en) | 2018-12-07 | 2018-12-07 | A kind of radiator structure using hot simulation analysis method design communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811496682.4A CN109451709A (en) | 2018-12-07 | 2018-12-07 | A kind of radiator structure using hot simulation analysis method design communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109451709A true CN109451709A (en) | 2019-03-08 |
Family
ID=65556402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811496682.4A Withdrawn CN109451709A (en) | 2018-12-07 | 2018-12-07 | A kind of radiator structure using hot simulation analysis method design communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109451709A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112329361A (en) * | 2020-11-18 | 2021-02-05 | 天津光电通信技术有限公司 | Method for analyzing influence of air filter screen on system heat dissipation function based on thermal simulation |
-
2018
- 2018-12-07 CN CN201811496682.4A patent/CN109451709A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112329361A (en) * | 2020-11-18 | 2021-02-05 | 天津光电通信技术有限公司 | Method for analyzing influence of air filter screen on system heat dissipation function based on thermal simulation |
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Application publication date: 20190308 |