CN201846538U - Radiating case - Google Patents

Radiating case Download PDF

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CN201846538U
CN201846538U CN2010205114114U CN201020511411U CN201846538U CN 201846538 U CN201846538 U CN 201846538U CN 2010205114114 U CN2010205114114 U CN 2010205114114U CN 201020511411 U CN201020511411 U CN 201020511411U CN 201846538 U CN201846538 U CN 201846538U
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air
air inlet
cabinet
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air outlet
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赵立军
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Vertiv Tech Co Ltd
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Emerson Network Power Co Ltd
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Abstract

本实用新型公开了一种散热机箱,包括侧板、顶板和底板,所述机箱内设有将高发热器件和低发热器件分隔开的隔板,在隔板一侧对应高发热器件的机箱壁面上设置有第一进风口和出风口,在隔板另一侧低发热器件对应的机箱壁面上对应设置第二进风口,在靠近出风口的隔板上开有通风孔。本实用新型提供一种结构简单、节省能源、同时实现高发热器件和低发热器件独立散热、节省散热机箱内空间和机箱面积占用、合理分配两个风道中的风量的散热机箱。

Figure 201020511411

The utility model discloses a cooling case, which comprises a side plate, a top plate and a bottom plate. The case is provided with a partition separating high-heat generating devices and low-heat generating devices. One side of the partition corresponds to the case of high-heat generating devices. A first air inlet and an air outlet are arranged on the wall, and a second air inlet is correspondingly arranged on the wall of the chassis corresponding to the low-heating device on the other side of the partition, and a ventilation hole is opened on the partition near the air outlet. The utility model provides a cooling case with simple structure, energy saving, independent heat dissipation of high-heating components and low-heating components, saving space in the cooling case and area occupation of the case, and rationally distributing air volume in two air ducts.

Figure 201020511411

Description

一种散热机箱 A heat sink

技术领域technical field

本实用新型涉及一种机箱,尤其涉及一种散热机箱。The utility model relates to a cabinet, in particular to a cooling cabinet.

背景技术Background technique

随着电子科学技术的不断发展,电子产品应用于社会各个领域,电子产品中,功率模块的应用越来越广泛,并且功率密度也越来越高,因此,功率模块的散热要求也逐步提高,尤其是功率较高的模块,这些模块中含有电解电容器、IGBT、二极管等器件,如果这些器件长期工作在温度较高的环境,电解电容器的使用寿命大大减少,甚至会烤干电解电容器内的电解液,造成模块工作异常或引发安全事故,另外IGBT和二极管也会因为高温导致故障,因此好的散热不仅可延长模块和其周围元器件的使用寿命,还可使整个产品散热均匀,减少事故的发生。With the continuous development of electronic science and technology, electronic products are used in various fields of society. In electronic products, power modules are more and more widely used, and the power density is also higher and higher. Therefore, the heat dissipation requirements of power modules are also gradually increasing. Especially for modules with high power, these modules contain electrolytic capacitors, IGBTs, diodes and other devices. If these devices work in a high temperature environment for a long time, the service life of electrolytic capacitors will be greatly reduced, and even the electrolytic capacitors will dry out. In addition, IGBT and diodes will also fail due to high temperature. Therefore, good heat dissipation can not only prolong the service life of the module and its surrounding components, but also make the entire product radiate evenly and reduce the risk of accidents. occur.

目前,功率模块的散热有以下几种方式:第一种方式为高发热器件和低发热器件各自单独进风,单独出风,最大限度地实现模块的散热,但此种方式需要给低发热器件设计单独的风道,需要占用散热机箱内空间和散热机箱侧板面积,无法再布置其他器件。第二种方式是通过布局来使进风先通过低发热器件再通过高发热器件,该方式只有一个风道,为满足高发热器件的散热需求,对风道内的风速要求较高,而低发热器件较低风速即可满足,造成能源浪费,并且低发热器件的热量被风带到后面的器件,也会对后面的器件加热,降温效果不理想,也会相应增加能耗。At present, there are several methods for heat dissipation of power modules: The first method is that the high-heat generating devices and low-heat generating Designing a separate air duct requires the space inside the cooling case and the area of the side panel of the cooling case, making it impossible to arrange other components. The second method is to make the air intake pass through the low-heating device first and then through the high-heating device through the layout. This method has only one air duct. Devices can be satisfied with a low wind speed, resulting in energy waste, and the heat of low-heating devices is carried by the wind to the devices behind, which will also heat the devices behind, the cooling effect is not ideal, and energy consumption will be increased accordingly.

实用新型内容Utility model content

本实用新型要解决的技术问题在于,针对现有技术中设置两个独立进出风口和两个独立风道造成占用散热机箱内空间和散热机箱侧板面积、不利于器件布置的缺陷,以及设置一个风道要提高风速增加能耗的缺陷,提供一种结构简单、节省能源、同时实现高发热器件和低发热器件独立散热、节省散热机箱内空间和机箱面积占用、合理分配两个风道中的风量的散热机箱。The technical problem to be solved by the utility model is to solve the defect that two independent air inlets and outlets and two independent air ducts are set in the prior art to occupy the inner space of the heat dissipation chassis and the side plate area of the heat dissipation chassis, which is not conducive to the arrangement of devices, and to set a The defect that the air duct needs to increase the wind speed and increase energy consumption provides a simple structure, saves energy, realizes independent heat dissipation of high-heating components and low-heating components at the same time, saves space in the cooling case and occupies the area of the case, and reasonably distributes the air volume in the two air ducts cooling case.

本实用新型解决其技术问题所采用的技术方案是:一种散热机箱,包括侧板、顶板和底板,所述机箱内设有将高发热器件和低发热器件分隔开的隔板,在隔板一侧对应高发热器件的机箱壁面上设置有第一进风口和出风口,在隔板另一侧对应低发热器件的机箱壁面上设置第二进风口,在靠近出风口的隔板上开有通风孔。The technical solution adopted by the utility model to solve the technical problem is: a heat dissipation cabinet, including a side plate, a top plate and a bottom plate, the partition plate separating the high-heat generating device and the low-heat generating device is arranged in the cabinet. A first air inlet and an air outlet are provided on the chassis wall corresponding to high-heating components on one side of the board, and a second air inlet is provided on the chassis wall corresponding to low-heating components on the other side of the partition. There are ventilation holes.

所述第一进风口和第二进风口在机箱的同一个侧板上。The first air inlet and the second air inlet are on the same side panel of the chassis.

所述第一进风口和出风口分别位于机箱内高发热器件的两侧,第一进风口和出风口之间形成的风道为高发热器件的设置空间。The first air inlet and the air outlet are respectively located on both sides of the high heat generating device in the chassis, and the air duct formed between the first air inlet and the air outlet is the installation space of the high heat generating device.

所述第二进风口和通风孔分别位于机箱内低发热器件的两侧,在第二进风口和通风孔之间形成的风道为低发热器件的设置空间。The second air inlet and the ventilation hole are respectively located on both sides of the low-heat generating device in the chassis, and the air duct formed between the second air inlet and the ventilation hole is the installation space of the low-heat generating device.

所述第一进风口为在机箱侧板上开设的正对高发热器件的无遮挡的进风洞。The first air inlet is an unshielded air inlet tunnel opened on the side panel of the case facing the high heat generating device.

所述出风口设置在与第一进风口正对的机箱壁面上,并且所述出风口由间隔设置的多个出风孔组成。The air outlet is arranged on the wall of the cabinet facing the first air inlet, and the air outlet is composed of a plurality of air outlet holes arranged at intervals.

所述出风孔为间隔并排排列的长孔。The air outlet holes are long holes arranged side by side at intervals.

所述第二进风口是在机箱侧板上设置的一组透风孔。The second air inlet is a group of ventilation holes arranged on the side plate of the chassis.

所述透风孔为间隔并排排列的长孔。The ventilation holes are long holes arranged side by side at intervals.

所述通风孔为间隔并排排列的长孔。The ventilation holes are long holes arranged side by side at intervals.

本实用新型采用在机箱内设置隔板将高发热器件和低发热器件隔开,使二者风道独立,并且机箱上分设两个进风口,用于分别对高发热器件和低发热器件进行散热,而出风口只设置一个,只是在靠近出风口的隔板上开有通风孔,低发热器件产生的热量由通风孔送出至出风口,即在出风口处将两个风道合并,不用对应低发热器件开设出风口,节省了机箱内的空间和机箱面积,可用于布置其他器件,并且由于通风孔设置靠近出风口,则低发热器件所在风道的热风不会折回到高发热器件所在风道中,不会使其热量对其他器件二次加热,也不影响高发热器件的散热,因此能耗低,相应节省了能源。另外,由于风道合并是通过隔板上的通风孔实现的,通风孔相应增加了低发热器件风道中的风阻,使得更多风进入高发热器件进行散热,合理分配两个风道中的风量,提高了整体的散热效果,避免了能源浪费。The utility model adopts a partition board in the case to separate the high-heat generating device and the low-heat generating device, so that the two air passages are independent, and two air inlets are separately arranged on the case to dissipate heat for the high-heat generating device and the low-heat generating device respectively. , and there is only one air outlet, but there is a ventilation hole on the partition near the air outlet, and the heat generated by the low-heating device is sent out to the air outlet through the air outlet, that is, the two air ducts are combined at the air outlet, without corresponding Air outlets are set up for low-heating components, which saves space and area in the chassis, and can be used to arrange other components. Since the ventilation holes are set close to the air outlets, the hot air in the air duct where the low-heating components are located will not return to the airflow where the high-heating components are located. In the channel, the heat will not reheat other devices, and will not affect the heat dissipation of high-heating devices, so the energy consumption is low, and energy is saved accordingly. In addition, since the combination of air ducts is realized through the ventilation holes on the partition, the ventilation holes correspondingly increase the wind resistance in the air ducts of low-heat generating devices, so that more air enters the high-heat generating devices for heat dissipation, and the air volume in the two air ducts is reasonably distributed. The overall heat dissipation effect is improved, and energy waste is avoided.

附图说明Description of drawings

下面将结合附图及实施例对本实用新型作进一步说明,附图中:The utility model will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

图1是本实用新型实施例外观立体图;Fig. 1 is the perspective view of the appearance of the utility model embodiment;

图2是本实用新型实施例的结构示意图。Fig. 2 is a schematic structural view of an embodiment of the utility model.

具体实施方式Detailed ways

以下以一款功率模块的机箱为例,来详细说明本实用新型。The utility model will be described in detail below by taking a case of a power module as an example.

如图1、2所示,一种散热机箱,包括侧板、顶板11和底板13,所述侧板包括第一侧板10,第二侧板(图中未示出)、第三侧板12、第四侧板14,对整机采用抽风的方式散热。所述机箱内设有将高发热器件和低发热器件分隔开的隔板4,在隔板4一侧对应高发热器件的机箱壁面上设置第一进风口1和出风口3,在隔板4另一侧对应低发热器件的机箱壁面上设置第二进风口2,在靠近出风口3的隔板4上开有通风孔5。本实施例中,功率模块的高发热器件为设置在机箱上部的IGBT(图中未示出)和二极管(图中未示出),低发热器件为设置在机箱下部的电解电容器6,因此通过隔板4将IGBT、二极管与电解电容器6隔开,隔板4水平设置或倾斜设置,将机箱分隔成两个空间,两个空间只通过隔板4上设置的通风孔5联通,本实施例的隔板4水平设置。IGBT连接有对其进行散热的散热器7。As shown in Figures 1 and 2, a heat dissipation cabinet includes a side plate, a top plate 11 and a bottom plate 13, and the side plate includes a first side plate 10, a second side plate (not shown), and a third side plate 12. The fourth side plate 14 is used to dissipate heat from the whole machine by drawing air. The cabinet is provided with a partition 4 that separates the high-heat generating device and the low-heat generating device, and a first air inlet 1 and an air outlet 3 are arranged on the cabinet wall surface corresponding to the high-heat generating device on one side of the partition 4. 4 A second air inlet 2 is provided on the wall of the chassis corresponding to the low-heat generating device on the other side, and a ventilation hole 5 is opened on the partition 4 near the air outlet 3. In this embodiment, the high heat generation device of the power module is the IGBT (not shown in the figure) and the diode (not shown in the figure) arranged on the upper part of the chassis, and the low heat generation device is the electrolytic capacitor 6 arranged on the lower part of the chassis, so through The partition 4 separates the IGBT, the diode and the electrolytic capacitor 6, and the partition 4 is arranged horizontally or inclined to separate the chassis into two spaces, and the two spaces are only communicated through the ventilation holes 5 provided on the partition 4. In this embodiment The partitions are set horizontally with 4 levels. The IGBT is connected to a heat sink 7 for dissipating heat.

除了上述高发热器件设置机箱内上部、低发热器件设置在机箱内下部的结构外,高发热器件和低发热器件可以交换设置,隔板在二者之间水平设置或倾斜设置;或者高发热器件和低发热器件分别在机箱内左右设置,隔板在二者之间竖直设置或倾斜设置。同时,各风口亦根据发热器件的布置而相应调整,保证发热器件足够的散热能力。In addition to the above-mentioned structure in which the high-heat-generating components are arranged in the upper part of the chassis and the low-heat-generating components are arranged in the lower part of the chassis, the high-heat-generating components and low-heat-generating components can be exchanged, and the partition is set horizontally or obliquely between them; or the high-heat-generating components and the low-heat-generating device are respectively arranged on the left and right in the case, and the partition is arranged vertically or obliquely between the two. At the same time, each tuyere is also adjusted accordingly according to the arrangement of the heating device to ensure sufficient heat dissipation capacity of the heating device.

所述第一进风口1和第二进风口2设置在机箱的同一个侧板即第一侧板10上,并分设在隔板4两侧。第一进风口1和第二进风口2还可设置在机箱的任意侧板上,设置依据是根据实际高发热器件的位置设置。第一进风口1和出风口3可以分别间隔设置在高发热器件所在空间对应机箱的任意位置,但为了获得较高的散热效率,避免能源浪费,则第一进风口1和出风口3应间隔较远,流动的风尽可能流经全部高发热器件,因此,优选所述第一进风口1和出风口3分别位于机箱内高发热器件的两侧,第一进风口1和出风口3之间形成的风道为高发热器件的设置空间,高发热器件位于流动的风中,能及时将热量带走,提高散热效率。本实施例中,第一进风口1和第二进风口2设置的第一侧板10为机箱的前面板,IGBT和二极管产生的热量较多,使得散热器7相应需要发出的热量也较多,则要求进入该风道的风量要大,风速要快,因此,所述第一进风口1为在机箱第一侧板10上开设的正对散热器7的无遮挡的进风洞,进风洞面积大,进风量相对较高,并且进风洞为一洞口,无任何遮挡,则风速相对较高。第一进风口除了可以为上述进风洞外,还可以为其他形状、数量和结构,只需该进风口可以满足高发热器件散热所需要的风量即可。The first air inlet 1 and the second air inlet 2 are arranged on the same side panel of the cabinet, that is, the first side panel 10 , and are arranged on both sides of the partition 4 . The first air inlet 1 and the second air inlet 2 can also be arranged on any side plate of the chassis, and the setting basis is based on the actual location of high-heating components. The first air inlet 1 and the air outlet 3 can be arranged at intervals at any position of the chassis corresponding to the space where the high heat generating device is located, but in order to obtain higher heat dissipation efficiency and avoid energy waste, the first air inlet 1 and the air outlet 3 should be spaced apart Farther away, the flowing wind flows through all the high-heating components as much as possible. Therefore, it is preferable that the first air inlet 1 and the air outlet 3 are respectively located on both sides of the high-heating components in the chassis, between the first air inlet 1 and the air outlet 3. The air duct formed between them is the setting space for high-heat-generating devices. The high-heat-generating devices are located in the flowing wind, which can take away the heat in time and improve the heat dissipation efficiency. In this embodiment, the first side plate 10 provided with the first air inlet 1 and the second air inlet 2 is the front panel of the chassis, and the heat generated by the IGBT and the diode is more, so that the radiator 7 needs to emit more heat correspondingly. , then it is required that the air volume entering the air duct should be large and the wind speed should be fast. Therefore, the first air inlet 1 is an unobstructed air inlet tunnel facing the radiator 7 opened on the first side plate 10 of the chassis. The area of the wind tunnel is large, the air intake volume is relatively high, and the wind inlet tunnel is a hole without any shelter, so the wind speed is relatively high. In addition to the above-mentioned air inlet tunnel, the first air inlet can also have other shapes, numbers and structures, as long as the air inlet can meet the air volume required for heat dissipation of high-heat-generating devices.

所述出风口3设置在与第一进风口1相对的机箱壁面上,即与第一进风口1相对的侧板即第三侧板12上,本实施例的出风口3所在第三侧板12为机箱的后面板。所述出风口3的形状、数量和结构亦可根据实际情况进行改变,例如:形状为圆形、多边形、无规则形状等,结构可以是直接的开口,也可以在开口处设置有导风板、遮网等,但是出风口3必须要满足发热器件散热所需要的流通风量。本实施例中出风口3是由间隔设置的多个出风孔组成,所述出风孔为间隔并排排列的水平长孔。间隔设置出风孔,相对于第一进风口1增加了进风的风阻,从而调节进入低发热器件的风量少于进入高发热器件的风量,合理分配风量,满足不均衡散热的要求。The air outlet 3 is arranged on the cabinet wall surface opposite to the first air inlet 1, that is, on the side plate opposite to the first air inlet 1, that is, on the third side plate 12, where the air outlet 3 of this embodiment is located on the third side plate 12 is the rear panel of the cabinet. The shape, quantity and structure of the air outlet 3 can also be changed according to the actual situation, for example: the shape is circular, polygonal, irregular, etc. The structure can be a direct opening, or a wind deflector can be arranged at the opening , shading nets, etc., but the air outlet 3 must meet the air flow required for heat dissipation of the heating element. In this embodiment, the air outlet 3 is composed of a plurality of air outlet holes arranged at intervals, and the air outlet holes are horizontal long holes arranged side by side at intervals. The air outlets are arranged at intervals, which increases the wind resistance of the air inlet compared with the first air inlet 1, thereby adjusting the air volume entering the low heat generating device to be less than that entering the high heat generating device, and reasonably distributing the air volume to meet the requirements of unbalanced heat dissipation.

第二进风口2和通风孔5可以分别间隔设置在低发热器件所在空间对应机箱的任意位置,但为了获得较高的散热效率,避免能源浪费,则第二进风口2和通风孔5应间隔较远,流动的风尽可能流经全部低发热器件,因此,优选所述第二进风口2和通风孔5分别位于机箱内低发热器件的两侧,在第二进风口2和通风孔5之间形成的风道为低发热器件的设置空间。所述第二进风口2的形状、数量和结构可根据实际情况而改变,例如:形状为圆形、多边形、无规则形状等,结构可以是直接开口、开口处设置导风板或者遮网等,只需该第二进风口2可以满足低发热器件散热所需要的进风量即可。本实施例中第二进风口2是在机箱第一侧板10上设置的一组透风孔,所述透风孔为间隔并排排列的长孔,透风孔并排设置两列。The second air inlet 2 and the ventilation hole 5 can be arranged at intervals at any position of the chassis corresponding to the space where the low-heat generating device is located, but in order to obtain higher heat dissipation efficiency and avoid energy waste, the second air inlet 2 and the ventilation hole 5 should be spaced apart. Farther away, the flowing wind flows through all low-heat generating devices as much as possible. Therefore, preferably the second air inlet 2 and the ventilation hole 5 are respectively located on both sides of the low-heat generating device in the chassis, and at the second air inlet 2 and the ventilation hole 5 The air duct formed between them is the setting space for low heat generating devices. The shape, quantity and structure of the second air inlet 2 can be changed according to the actual situation, for example: the shape is circular, polygonal, irregular, etc., and the structure can be a direct opening, a wind deflector or a screen at the opening, etc. , as long as the second air inlet 2 can meet the air intake required for heat dissipation of the low heat generating device. In this embodiment, the second air inlet 2 is a group of ventilation holes provided on the first side plate 10 of the chassis. The ventilation holes are long holes arranged side by side at intervals, and two rows of ventilation holes are arranged side by side.

在靠近出风口3的隔板4上开有通风孔5,就将低发热器件所在的风道与出风口3联通,将带有热量的风从出风口3被抽出。所述通风孔5的形状、数量和结构不限,例如:形状为圆形、多边形、无规则形状等,结构可以是在开口处设置有导风板、遮网等,只需该通风孔5可以满足低发热器件散热所需要的流通风量即可。本实施例中通风孔5为间隔并排排列的长孔。本实施例中低发热器件为电解电容器6,电解电容器6散热出风经中间隔板4开设的通风孔5与散热器7出风口3共用。由于电容器件的散热较小,较小的风流量即可满足散热要求,经过隔板4上的通风孔5,通过电解电容器6所在风道的风阻较大,在总出风量不变的前提下,通过高发热器件--散热器7的风流量变大,因此,隔板4和通风孔5的设置,合理分配了风量,改善了高发热器件的散热效果。而且,此设计节省了常规设计中后面板低发热器件出风口后面的空间,该空间可以用于设置例如旁路单元等器件,并且旁路单元器件的设置不再阻挡电解电容器6的出风风道。Ventilation holes 5 are provided on the partition plate 4 close to the air outlet 3, and the air duct where the low-heat generating device is located is communicated with the air outlet 3, and the wind with heat is drawn out from the air outlet 3. The shape, quantity and structure of the ventilation hole 5 are not limited, for example: the shape is circular, polygonal, irregular shape, etc., and the structure can be provided with a wind deflector, a screen, etc. at the opening, as long as the ventilation hole 5 It is sufficient to meet the air flow required for heat dissipation of the low-heat-generating device. In this embodiment, the ventilation holes 5 are long holes arranged side by side at intervals. In this embodiment, the low heat generation device is an electrolytic capacitor 6, and the air outlet 5 of the electrolytic capacitor 6 is shared with the air outlet 3 of the radiator 7 through the air vent 5 opened by the middle partition plate 4. Due to the small heat dissipation of the capacitor device, a small air flow can meet the heat dissipation requirements. After passing through the ventilation holes 5 on the partition 4, the wind resistance passing through the air duct where the electrolytic capacitor 6 is located is relatively large. Under the premise that the total air volume remains unchanged , the air flow through the high heat generating device--the radiator 7 becomes larger, therefore, the setting of the partition plate 4 and the ventilation hole 5 reasonably distributes the air flow, and improves the heat dissipation effect of the high heat generating device. Moreover, this design saves the space behind the air outlet of the low-heating device on the rear panel in the conventional design, and this space can be used to set devices such as bypass units, and the setting of the bypass unit devices no longer blocks the air outlet of the electrolytic capacitor 6. road.

Claims (10)

1. cooling cabinet, comprise side plate, top board and base plate, it is characterized in that, be provided with in the described cabinet high heater members and the separated dividing plate of low heater members, on the cabinet wall of the corresponding high heater members of dividing plate one side, first air inlet and air outlet are set, on the cabinet wall of the corresponding low heater members of dividing plate opposite side, second air inlet is set, is having ventilation hole near on the dividing plate of air outlet.
2. cooling cabinet according to claim 1 is characterized in that, described first air inlet and second air inlet are separately positioned on the same side plate of cabinet.
3. cooling cabinet according to claim 2 is characterized in that, described first air inlet and air outlet lay respectively at the both sides of high heater members in the cabinet, and the air channel that forms between first air inlet and the air outlet is the space that is provided with of high heater members.
4. cooling cabinet according to claim 2 is characterized in that, described second air inlet and ventilation hole lay respectively at the both sides of low heater members in the cabinet, and the air channel that forms between second air inlet and ventilation hole is the space that is provided with of low heater members.
5. according to any described cooling cabinet of claim 1~4, it is characterized in that the unscreened air intake hole over against high heater members of described first air inlet on cabinet side board, offering.
6. according to any described cooling cabinet of claim 1~4, it is characterized in that described air outlet is made up of a plurality of exhaust vents that are provided with at interval.
7. cooling cabinet according to claim 6 is characterized in that, the slotted hole of described exhaust vent for being arranged side by side at interval.
8. according to any described cooling cabinet of claim 1~4, it is characterized in that described second air inlet is the one group of air-permeating hole that is provided with on cabinet side board.
9. cooling cabinet according to claim 8 is characterized in that, the slotted hole of described air-permeating hole for being arranged side by side at interval.
10. according to any described cooling cabinet of claim 1~4, it is characterized in that the slotted hole of described ventilation hole for being arranged side by side at interval.
CN2010205114114U 2010-08-31 2010-08-31 Radiating case Expired - Lifetime CN201846538U (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104918455A (en) * 2014-03-14 2015-09-16 欧姆龙株式会社 Electronic equipment
CN104918456A (en) * 2014-03-14 2015-09-16 欧姆龙株式会社 Electronic equipment
CN107172869A (en) * 2017-07-18 2017-09-15 北京英博电气股份有限公司 Heat abstractor and cooling system
CN107911640A (en) * 2017-11-24 2018-04-13 浙江大华技术股份有限公司 A kind of hard disk video recorder
WO2018214291A1 (en) * 2017-05-24 2018-11-29 深圳市光峰光电技术有限公司 Heat dissipation system and projection device
WO2019242697A1 (en) * 2018-06-20 2019-12-26 东莞市李群自动化技术有限公司 Integrated radiator having temperature gradient
CN113655860A (en) * 2021-07-30 2021-11-16 中国长城科技集团股份有限公司 Heat dissipation machine case and server

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104918455A (en) * 2014-03-14 2015-09-16 欧姆龙株式会社 Electronic equipment
CN104918456A (en) * 2014-03-14 2015-09-16 欧姆龙株式会社 Electronic equipment
CN104918455B (en) * 2014-03-14 2017-10-24 欧姆龙株式会社 Electronic equipment
CN104918456B (en) * 2014-03-14 2018-08-17 欧姆龙株式会社 Electronic equipment
WO2018214291A1 (en) * 2017-05-24 2018-11-29 深圳市光峰光电技术有限公司 Heat dissipation system and projection device
CN107172869A (en) * 2017-07-18 2017-09-15 北京英博电气股份有限公司 Heat abstractor and cooling system
CN107911640A (en) * 2017-11-24 2018-04-13 浙江大华技术股份有限公司 A kind of hard disk video recorder
WO2019242697A1 (en) * 2018-06-20 2019-12-26 东莞市李群自动化技术有限公司 Integrated radiator having temperature gradient
US12002728B2 (en) 2018-06-20 2024-06-04 Qkm Technology (Dong Guan) Co., Ltd Integrated radiator having temperature gradient
CN113655860A (en) * 2021-07-30 2021-11-16 中国长城科技集团股份有限公司 Heat dissipation machine case and server

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Granted publication date: 20110525