WO2018214291A1

WO2018214291A1 - Heat dissipation system and projection device

Info

Publication number: WO2018214291A1
Application number: PCT/CN2017/096516
Authority: WO
Inventors: 谭亮; 李屹
Original assignee: 深圳市光峰光电技术有限公司
Priority date: 2017-05-24
Filing date: 2017-08-09
Publication date: 2018-11-29
Also published as: CN207123699U

Abstract

A heat dissipation system and a projection device. The heat dissipation system comprises a shell having an accommodating space and at least two heat sources accommodated in the shell; the shell comprises a top surface, a bottom surface, and side walls connecting the top surface and the bottom surface; the side walls comprise a pair of first side walls arranged in a first direction perpendicular to the bottom surface and a pair of second side walls arranged in a second direction perpendicular to the bottom surface; the two first side walls are respectively provided with a first air inlet (101) and an air outlet (103); a first air channel is formed between the first air inlet (101) and the air outlet (103); the shell is further provided thereon with a second air inlet (102) facing the first air channel; the air intake direction of the second air inlet (102) is different from that of the first air inlet (101); a second air channel is formed between the second air inlet (102) and the air outlet (103); the airflow flowing through the first air channel passes through at least one heat source, and the airflow flowing through the second air channel passes through at least another heat source; the airflows of the first air channel and the second air channel are converged and then flow towards the air outlet (103); the second air inlet (102) is located on any one of the top surface, the bottom surface, or the second side wall. By means of the system overall layout, heat dissipation elements are reasonably placed, the temperature of the system components is reduced, and the purpose of efficient heat dissipation is achieved.

Description

Cooling system and projection equipment

Technical field

The utility model relates to the field of mechanical heat dissipation, in particular to a heat dissipation system and a projection device with a heat dissipation system.

Background technique

At present, the market demand for consumer electronic products is as small as possible, the better the performance, the better the components are integrated.

technical problem

Good performance and limited volume will inevitably lead to more concentrated heat, which will be a big challenge for system cooling, and need to improve heat dissipation efficiency in a limited volume.

Therefore, it is necessary to provide a new heat dissipation system to solve the above problems.

Technical solution

The utility model provides a heat dissipation system and a projection device, which utilizes the overall layout of the system, reasonably places the heat dissipation components, reduces the temperature of the system components, and achieves efficient heat dissipation.

A technical solution adopted by the present invention is to provide a heat dissipation system including a housing having a receiving space and at least two heat sources housed in the housing, the housing including a top surface, a bottom surface, and the top surface and a sidewall of the bottom surface, wherein the sidewall includes a pair of first sidewalls disposed along a first direction perpendicular to the bottom surface and a pair of second sidewalls along a second direction perpendicular to the bottom surface, a first air inlet and an air outlet are respectively disposed on the first side wall, a first air passage is formed between the first air inlet and the air outlet, and the housing is further provided with the first air passage facing a second air inlet, the second air inlet is different from the air inlet direction of the first air inlet, and the airflow flowing through the first air passage passes through at least one heat source, and the airflow flowing through the second air passage After the at least one other heat source, the second air inlet and the air outlet form a second air duct, and the first air duct and the second air duct merge and flow to the air outlet, the second air inlet Located on the top surface, the bottom surface or the second side wall Italian one.

Preferably, the heat dissipation system includes a first fan and a second fan at a first air inlet and a third fan disposed opposite to the second fan, the first fan and the second fan being disposed in parallel, The third fan is disposed in series with the second fan, the first air passage is formed between the first fan and the air outlet, and the second air duct is formed with the second air inlet The second fan, the third fan, and the air outlet form a third air passage between the air outlets.

Preferably, the heat source includes a first heat source and a second heat source, the first heat source is located at a center of the casing, and the first heat source is respectively associated with the first air inlet and the second air in three directions The tuyere and the air outlet are oppositely disposed, the second heat source is located between the third fan and the air outlet, and the first air duct and the second air duct are from the first heat source from the The air outlet is discharged, and the second air passage is discharged from the air outlet through the second heat source.

Preferably, the housing further includes a main board and a power component, and the main board and the power component are disposed between the first air inlet and the first heat source.

Preferably, the heat dissipation system further includes a third heat source between the first heat source and the air outlet, and the airflow of the first air passage sequentially passes through the power component, the first heat source, and the third heat source. The air outlet is discharged.

Preferably, the heat dissipation system further includes a fourth heat source located at the second air inlet, and the air flow of the second air channel sequentially passes through the fourth heat source, the first heat source, and the third heat source The air outlet is discharged. Preferably, the airflow of the third air passage is sequentially discharged from the air outlet through the power supply assembly, the third fan, and the second heat source.

Preferably, the fourth heat source is provided with an air hood, and the air hood cooperates with the second air inlet to guide the flow of the gas.

Preferably, the fourth heat source is a DMD chip, and the second heat source is an excitation light source.

Another technical solution adopted by the present invention is to provide a projection apparatus including the heat dissipation system as described above.

Beneficial effect

The utility model has the beneficial effects that the heat dissipation system and the projection device are provided separately from the prior art, and the first air inlet and the air outlet are respectively disposed on the two first side walls of the casing, and the first a first air passage is formed between the air inlet and the air outlet, and further a second air inlet facing the first air passage is provided, and the second air inlet and the air outlet form a second air passage, and flows through the first air passage The airflow of one air passage passes through at least one heat source, and the airflow flowing through the second air passage passes through at least another heat source. Such a structure utilizes the overall layout of the system to reasonably place the heat dissipating components, and the two air ducts are respectively different through the air inlet direction. Flow through different heat sources to reduce the temperature of system components and achieve efficient heat dissipation. In products with strict requirements on the appearance and appearance of the system, the heat dissipation efficiency can be improved to slow down the aging process of components and improve product life. At the same time, due to the improved heat dissipation effect, the product can be more integrated, the product size is reduced, the user comfort is improved, and the product competitiveness is improved.

DRAWINGS

1 is a schematic structural view of a projection apparatus of the present invention;

2 is a schematic diagram of the principle of the heat dissipation system of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Specifically, as shown in FIG. 1 , the present invention is described with an example of a projection device as an electronic product, including a housing having a receiving space, a heat source housed in the housing, a main board 401, and a power supply assembly.

The housing includes a top surface, a bottom surface, and side walls connecting the top surface and the bottom surface. The side wall includes a pair of first side walls disposed in a first direction perpendicular to the bottom surface and a pair of second side walls along a second direction perpendicular to the bottom surface. Specifically, in the embodiment, the housing of the projection device has a regular cubic structure, the sidewall is perpendicular to the top surface and the bottom surface, and the sidewall has four sides. The two first sidewalls are parallel to each other, and the second sidewalls are parallel to each other. A side wall and a second side wall are disposed perpendicular to each other, and the first direction and the second direction are perpendicular to each other.

A first air inlet 101 and an air outlet 103 are respectively disposed on the two first side walls, and a first air passage in the second direction is formed between the first air inlet 101 and the air outlet 103. The housing further includes a second air inlet 102 located beside the first air passage, and the second air inlet 102 is different from the air inlet direction of the first air inlet 101. The second air inlet 102 may be located on any of the top, bottom or second side walls of the housing. Specifically, in the embodiment, the second air inlet 102 is disposed on the second side wall. The first air inlet 101 enters the air in the first direction, the second air inlet 102 enters the air in the second direction, and the air inlet direction of the first air inlet 101 is perpendicular to the air inlet direction of the second air inlet 102. The first air duct and the second air duct meet at the air outlet 103, thereby achieving ventilation and cooling of various positions inside the casing.

Further, the heat dissipation system further includes a fan system for promoting gas circulation, specifically including a first fan 201 and a second fan 202 disposed at the first air inlet 101 and a third fan 203 disposed opposite to the second fan 202. As shown in FIG. 1, the first fan 201 and the second fan 202 are disposed in parallel, and the third fan 203 and the second fan 202 are disposed in series. The first air passage is formed between the first fan 201 and the air outlet 103 of the first air inlet 101, and the second air passage is formed between the second air inlet 102 and the air outlet 103. Further, the second fan 202, the third fan 203, and the air outlet 103 of the first air inlet 101 form a third air passage.

In the present embodiment, the heat source includes a first heat source 301, a second heat source 302, a third heat source 303, and a fourth heat source 304. The first heat source 301 is located at the center of the casing, and the first heat source 301 is disposed opposite to the first air inlet 101, the second air inlet 102, and the air outlet 103 in three directions, and the second heat source 302 is located at the third fan 203. The third heat source 303 is located between the first heat source 301 and the air outlet 103; the main board 401 and the power component are disposed between the first air inlet 101 and the first heat source 301. The airflow of the first air passage is sequentially discharged from the air outlet 103 through the main board 401, the power source assembly, the first heat source 301, and the third heat source 303; the air flow of the second air passage sequentially passes through the fourth heat source 304, the first heat source 301, and the third heat source. 303 is discharged from the air outlet 103; the airflow of the third air passage is sequentially discharged from the air outlet 103 via the main board 401, the power supply unit, the third fan 203, and the second heat source 302. The fan system is set to promote the flow of gas inside the projection device, thereby improving the heat dissipation effect. The third fan 203 is located between the power component and the second heat source 302 to accelerate the airflow to the second heat source 302 to improve the heat dissipation efficiency of the main heat source. Specifically, in this embodiment, the power component is integrated on the motherboard 401; the fourth heat source 304 is located on the motherboard. In this embodiment, the main board is PCBA.

Referring to FIG. 1 and FIG. 2, after the gas entering the first air inlet 101 passes through the main board 401, a small amount of gas is discharged from the second air inlet 102 to the outside of the system, and most of the air volume is divided into two parts, and a part of the air is passed through the third air passage. The main board 401 and the second heat source 302 are discharged outside the system through the air outlet 103; the other part of the air volume is mixed as a first air duct and a second air duct formed by the gas entering from the second air inlet 102 through the third heat source 303 and the first heat source 301. After that, it is discharged outside the system through the air outlet 103.

Further, the fourth heat source 304 is further provided with an air hood for cooperating with the second air inlet 102 to guide the flow of the gas.

In the present embodiment, the first heat source 301 is a color wheel, the second heat source 302 is a light machine housing, the excitation light source is fixed in the light machine housing, the third heat source 303 is a light valve, and the fourth heat source 304 is a DMD chip. The second heat source 302, that is, the excitation light source is the main heat source, and the other is the secondary heat source.

The excitation light source as the second heat source 302 acts on the color wheel as the first heat source 301 through the optical relay assembly to generate a fluorescent laser light. The excitation light source is located in the optical machine housing, and the heat generated by the excitation of the color wheel is transmitted to the color. On the wheel housing, the light valve modulates the light beam incident thereon and exits through the lens assembly. The heat source is arranged correspondingly from the upstream to the downstream of the air duct according to the heat from small to large.

The utility model has the beneficial effects that the utility model provides a heat dissipation system and a projection device, which utilizes the overall layout of the system, reasonably places the heat dissipation components, reduces the temperature of the system components, and achieves efficient heat dissipation. In products with stricter requirements on the appearance and appearance of the system, the heat dissipation efficiency can be improved to slow down the aging process of components and improve the life of the products. At the same time, due to more integration, the product size is reduced, the user's comfort is improved, and the product competitiveness is improved.

The above description is only an embodiment of the present invention, and thus does not limit the scope of the patent of the present invention, and the equivalent structure or equivalent flow transformation made by using the specification and the drawings of the present invention, or directly or indirectly applied to other The related technical fields are all included in the scope of patent protection of the present invention.

Claims

A heat dissipation system comprising a housing having a receiving space and at least two heat sources housed in the housing, the housing including a top surface, a bottom surface, and side walls connecting the top surface and the bottom surface The sidewall includes a pair of first sidewalls disposed along a first direction perpendicular to the bottom surface and a pair of second sidewalls along a second direction perpendicular to the bottom surface, the first sidewalls a first air inlet and an air outlet are respectively disposed, a first air passage is formed between the first air inlet and the air outlet, and a second air inlet facing the first air passage is further disposed on the housing. The second air inlet is different from the air inlet direction of the first air inlet, the second air inlet and the air outlet form a second air passage, and the airflow flowing through the first air passage passes through at least one a heat source, the airflow flowing through the second air passage passes through at least another heat source, the first air passage and the second air passage merge and flow to the air outlet, and the second air inlet is located at the top surface Any one of the bottom surface or the second side wall.

The heat dissipation system according to claim 1, wherein the heat dissipation system comprises a first fan and a second fan at a first air inlet and a third fan disposed opposite to the second fan, The first fan and the second fan are disposed in parallel, the third fan is disposed in series with the second fan, and the first air passage is formed between the first fan and the air outlet, The second air duct is formed between the second air inlet and the air outlet, and the second fan, the third fan and the air outlet form a third air passage.

The heat dissipation system according to claim 2, wherein the heat source comprises a first heat source and a second heat source, the first heat source is located in a center of the casing, and the first heat source is respectively in three directions The first air inlet is disposed opposite to the first air inlet, the second air inlet, and the air outlet, and the second heat source is located between the third fan and the air outlet, the first air duct and the The airflow of the second air duct is discharged from the air outlet through the first heat source, and the airflow of the third air duct is discharged from the air outlet through the second heat source.

The heat dissipation system according to claim 3, wherein the housing further comprises a main board and a power component, and the main board and the power component are disposed between the first air inlet and the first heat source.

The heat dissipation system according to claim 4, wherein the heat dissipation system further comprises a third heat source between the first heat source and the air outlet, and the air flow of the first air passage passes sequentially The power component, the first heat source, and the third heat source are discharged from the air outlet.

The heat dissipation system according to claim 4, wherein the heat dissipation system further comprises a fourth heat source located at the second air inlet, and the air flow of the second air channel sequentially passes through the fourth heat source The first heat source and the third heat source are discharged from the air outlet.

The heat dissipation system according to claim 4, wherein the air flow of the third air passage is sequentially discharged from the air outlet through the power source assembly, the third fan, and the second heat source.

The heat dissipation system according to claim 6, wherein the fourth heat source is provided with an air hood, and the air hood cooperates with the second air inlet to guide the flow of the gas.

9. The heat dissipation system of claim 8, wherein the fourth heat source is a DMD chip and the second heat source is an excitation light source.

A projection apparatus comprising the heat dissipation system according to any one of claims 1 to 9.