CN113923962A - Electronic equipment cooling system and electronic equipment - Google Patents
Electronic equipment cooling system and electronic equipment Download PDFInfo
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- CN113923962A CN113923962A CN202111536072.4A CN202111536072A CN113923962A CN 113923962 A CN113923962 A CN 113923962A CN 202111536072 A CN202111536072 A CN 202111536072A CN 113923962 A CN113923962 A CN 113923962A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic equipment heat dissipation system and electronic equipment, and relates to the technical field of heat dissipation. The electronic equipment heat dissipation system comprises a fan assembly and an air duct; the air outlet of the fan assembly comprises a first air outlet area and a second air outlet area; the air duct is provided with an air duct air inlet and an air duct air outlet; cooling air generated by the first air outlet area is used for dissipating heat of electronic components in the first area on the PCB; and cooling air generated in the second air outlet area enters the air channel from the air inlet of the air channel and is blown out from the air outlet of the air channel after passing through the air channel, and the cooling air blown out from the air outlet of the air channel is used for dissipating heat of the electronic components in the second area on the PCB. According to the invention, the air outlet of the fan assembly is divided into the first air outlet area and the second air outlet area, the cooling air in the first air outlet area is used for dissipating heat of the electronic components in the main path in the first area on the PCB, and the cooling air in the second air outlet area is brought to the second area through the air duct to dissipate heat of other electronic components which cannot be cooled.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation system for an electronic device and an electronic device.
Background
Electronic equipment (such as BBU (baseband processing unit) of communication equipment, server, etc.) adopting an active air-cooling heat dissipation mode generally needs to be additionally provided with an auxiliary air duct structure in order to enable the outlet air of a fan assembly to be more effectively blown to key electronic components needing heat dissipation. Generally, the air duct is mostly installed on the PCB, so the shape of the air duct needs to be coordinated with the layout of the PCB, and the air duct occupies a larger area of the PCB. In addition, the main path of the air duct is usually in a one-way one-inlet one-outlet air guiding form, so that only electronic components located in the main path can be cooled, and electronic components which cannot be arranged in the main path cannot be effectively cooled and dissipated by air.
Thus, the conventional air duct has three main disadvantages: (1) the PCB is usually arranged on a PCB, occupies the area of the PCB and influences the layout of electronic components; (2) the single-channel ventilation is adopted, heat is accumulated downstream, and the temperature of the downstream electronic component is influenced by the upstream heat; (3) the heat dissipation can be carried out only on the electronic components in the main path of the air duct, and if the electronic components cannot be distributed in the air duct, the electronic components cannot be cooled by air.
Disclosure of Invention
In view of the shortcomings of the prior art, it is an object of the present invention to provide a heat dissipation system for electronic devices and an electronic device, which are at least used to solve one of the technical problems or shortcomings.
According to a first aspect of the present invention, there is provided an electronic device heat dissipation system, comprising a fan assembly and an air duct;
the air outlet of the fan assembly comprises a first air outlet area and a second air outlet area;
the air duct is provided with an air duct air inlet and an air duct air outlet;
cooling air generated by the first air outlet area is used for dissipating heat of electronic components in the first area on the PCB;
and cooling air generated in the second air outlet area enters the air channel from the air inlet of the air channel and is blown out from the air outlet of the air channel after passing through the air channel, and the cooling air blown out from the air outlet of the air channel is used for dissipating heat of the electronic components in the second area on the PCB.
According to the electronic equipment heat dissipation system, the air outlet of the fan assembly is divided into the first air outlet area and the second air outlet area, cooling air in the first air outlet area dissipates heat for electronic components in the first area on the PCB inside the electronic equipment, namely, electronic components in the main circuit, and cooling air in the second air outlet area is brought to the second area through the air duct to dissipate heat for electronic components in the second area, namely, other electronic components which cannot be cooled.
In some embodiments, the second region comprises a third region and/or a fourth region;
the third area is positioned at the left side and/or the right side of the first area;
the fourth area is located on the rear side of the first area. When the third area is located on the left side and/or the right side of the first area, the third area is located outside the main airflow of the fan assembly, and at this time, the cooling air of the fan assembly received by the electronic component in the third area is limited or cannot be received by the electronic component in the third area, so that the heat dissipation effect of the fan assembly on the electronic component in the third area is poor or no; when the fourth area is located on the rear side of the first area, the fourth area is located on the downstream of the first area, when the fan assembly dissipates heat of the electronic components in the first area, heat is accumulated downstream, and the temperature of the electronic components located in the downstream fourth area is affected by the upstream heat, so that the fan assembly has poor or no heat dissipation effect on the electronic components in the fourth area; therefore, the cooling air in the second air outlet area of the fan assembly is directly taken to the third area and the fourth area through the air channel, and the electronic components in the third area and the fourth area are directly cooled, so that the technical problem is solved.
In some embodiments, the air duct comprises a first air duct and a second air duct; the air duct air outlet comprises a first air duct air outlet of a first air duct and a second air duct air outlet of a second air duct;
the first air duct air outlet corresponds to the third area, and the first air duct is used for bringing cooling air generated by the second air outlet area to the third area to dissipate heat of the electronic components in the third area;
the second air duct air outlet corresponds to the fourth area, and the second air duct is used for bringing cooling air generated by the second air outlet area to the fourth area to dissipate heat of the electronic components in the fourth area. Therefore, the cooling air in the second air outlet area is directly taken to the third area through the first air duct to dissipate heat of the electronic component in the third area, and the cooling air in the second air outlet area is directly taken to the fourth area through the second air duct to dissipate heat of the electronic component in the fourth area.
In some embodiments, the first air duct and the second air duct share the same air duct inlet. Therefore, the air inlet volume ratio of the first air duct and the second air duct can be adjusted by designing the size ratio of the first air duct and the second air duct to the air inlet of the air duct.
In some embodiments, the first air duct outlet is provided with an air outlet adjusting assembly for adjusting the size of the air outlet of the first air duct outlet. From this, the size that accessible wind gap adjusting part adjusted first wind channel air outlet is suitable for the electronic components of different volumes.
In some embodiments, the second air duct is arranged to be gradually narrowed from the air inlet of the second air duct to the air outlet of the second air duct; the second air duct is located above the electronic component in the first area, and the air outlet of the second air duct is bent downwards. Therefore, in one direction, the second air channel which is arranged to be gradually narrowed increases the airflow speed of the outlet, and the washing effect on small electronic components can be more obvious by bending the second air channel downwards; on the other hand, because the second air duct outlet is located below the first area, in order to prevent the outlet air of the first area from being blocked, the second air duct outlet must be narrowed so as to leave the largest outlet air area.
According to a second aspect of the present invention, there is provided an electronic device including the electronic device heat dissipation system described in any one of the above.
In some embodiments, the electronic device includes a PCB, a fan assembly mounting notch is formed in one side of the PCB, the fan assembly is located in the fan assembly mounting notch, and the first air outlet area corresponds to the electronic component in the first area and the second air outlet area is located above the electronic component in the first area. From this, it is spacing to fan unit to come through the fan unit installation breach of PCB board to make the regional direct alignment of first air-out first region, directly dispel the heat to the electronic components in the first region, guarantee simultaneously that the second air-out is regional to be located the top of the electronic components in the first region, avoid occupying the space of PCB board.
In some embodiments, the electronic device includes a lower case and an upper case cover mounted on the lower case, the PCB and the fan assembly are mounted in the lower case, the lower case is provided with a lower case air inlet and a lower case air outlet, the lower case air inlet corresponds to the air inlet of the fan assembly, and the lower case air outlet corresponds to the first region. Therefore, the lower box air outlet corresponds to the first area, and the electronic equipment is discharged in the shortest path after cooling air of the first air outlet area cools the electronic components in the first area.
In some embodiments, the air duct is fixed to a side wall of the lower case or the upper case cover. Therefore, the air duct is fixed with the side wall of the lower box body or the upper box cover to avoid occupying the space of the PCB.
Compared with the prior art, the electronic equipment heat dissipation system and the electronic equipment have the advantages that the air outlet of the fan assembly is divided into the first air outlet area and the second air outlet area, cooling air in the first air outlet area dissipates heat for electronic components in the first area on the PCB inside the electronic equipment, namely, electronic components in the main circuit, and cooling air in the second air outlet area is brought to the second area through the air duct to dissipate heat for electronic components in the second area, namely, other electronic components which cannot be cooled.
Drawings
Fig. 1 is a schematic view of an overall structure of a first view of a heat dissipation system of an electronic device according to an embodiment of the invention;
fig. 2 is a schematic view of an overall structure of a second view angle of a heat dissipation system of an electronic device according to an embodiment of the invention;
fig. 3 is a schematic view of an overall structure of a third view angle of a heat dissipation system of an electronic device according to an embodiment of the invention;
FIG. 4 is an exploded view of an electronic device according to an embodiment of the present invention;
FIG. 5 is a schematic view of an overall structure of an electronic device according to an embodiment of the present invention when an upper case cover is opened;
fig. 6 is a schematic view of an overall structure of a hidden upper case cover of an electronic device according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an air duct and an upper case cover of an electronic device according to an embodiment of the present invention.
The reference numbers illustrate: the fan assembly 100, the first air outlet area 110, the second air outlet area 120, the air duct 200, the air duct air inlet 210 and the air duct air outlet 220, the first air duct 230, the first air duct air outlet 231, the air outlet adjusting assembly 232, the second air duct 240, the second air duct air outlet 241, the PCB 300, the first area 310, the second area 320, the third area 321, the fourth area 322, the fan assembly mounting notch 400, the lower box 500, the lower box air inlet 510, the lower box air outlet 520 and the upper box cover 600.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
In accordance with a first aspect of the present invention, FIGS. 1-3 schematically illustrate an electronic device heat dissipation system in accordance with an embodiment of the present invention. As shown in fig. 1-3, the heat dissipation system of the electronic device includes a fan assembly 100 and an air duct 200; the air outlet of the fan assembly 100 includes a first air outlet area 110 and a second air outlet area 120; the air duct 200 is provided with an air duct inlet 210 and an air duct outlet 220; the cooling air generated by the first air outlet area 110 is used for dissipating heat of the electronic components in the first area 310 on the PCB 300; the cooling air generated in the second air outlet area 120 enters the air duct 200 from the air duct inlet 210, and is blown out from the air duct outlet 220 after passing through the air duct 200, and the cooling air blown out from the air duct outlet 220 is used for dissipating heat of the electronic components in the second area 320 on the PCB 300. The air outlet of the fan assembly 100 is divided into a first air outlet area 110 and a second air outlet area 120, wherein the cooling air in the first air outlet area 110 dissipates heat to the electronic components in the first area 310 on the PCB 300 inside the electronic device, that is, dissipates heat to the electronic components in the main circuit, and the cooling air in the second air outlet area 120 is brought to the second area 320 through the air duct 200 to dissipate heat to the electronic components in the second area 320, that is, dissipate heat to other electronic components which cannot be cooled.
The fan assembly 100 may be a single fan, or a fan stack of multiple fans.
The electronic components in the first area 310 of the PCB 300 are mainly large-volume electronic components like a CPU (central processing unit) and are also a main heat generating source of the PCB, and the electronic components in the second area 320 mainly include large-volume electronic components (such as power bricks) located outside the main airflow of the fan assembly 100 and small-volume heat-sensitive electronic components (such as crystal oscillators, DDR and the like) located downstream of the CPU; now, the area where the large-volume electronic component (such as a power brick) is located outside the main airflow of the fan assembly 100 is defined as a third area 321, at this time, the cooling air of the fan assembly 100 received by the electronic component in the third area 321 is limited or cannot be received by the electronic component, so that the fan assembly 100 has a poor or no heat dissipation effect on the electronic component in the third area 321; the area of the small-volume heat-sensitive electronic component (such as a crystal oscillator, DDR, etc.) located downstream of the CPU is defined as a fourth area 322, when the fan assembly 100 dissipates heat to the electronic component in the first area 310, heat is accumulated downstream, and the temperature of the electronic component located in the downstream fourth area 322 is affected by the upstream heat, so that the fan assembly 100 has poor or no heat dissipation effect on the electronic component in the fourth area 322; generally, the third area 321 is located at the left and/or right side of the first area 310, and the fourth area 322 is located at the rear side of the first area 310.
For better illustration, in the present embodiment, taking the third area 321 located at the left side of the first area 310 and the fourth area 322 located at the rear side of the first area 310 as an example, the corresponding air duct 200 includes two branch air ducts, i.e., a first air duct 230 and a second air duct 240, and the air duct outlet 220 includes a first air duct outlet 231 of the first air duct 230 and a second air duct outlet 241 of the second air duct 240; the first air duct outlet 231 corresponds to the third area 321, and the first air duct 230 is used for bringing the cooling air of the second air outlet area 120 to the third area 321 to dissipate heat of the electronic components in the third area 321, so as to form a bypass air guiding type air duct design; the second air duct outlet 241 corresponds to the fourth area 322, and the second air duct 240 is used for bringing the cooling air of the second air outlet area 120 to the fourth area 322 to dissipate heat of the electronic components in the fourth area 322, so as to form a crossing air duct design. Therefore, the cooling air in the second air outlet region 120 is directly taken to the third region 321 through the first air duct 230 to dissipate heat of the electronic components in the third region 321, and the cooling air in the second air outlet region 120 is directly taken to the fourth region 322 through the second air duct 240 to dissipate heat of the electronic components in the fourth region 322. By adopting the design of the divided air channel, more targeted heat dissipation can be realized, the utilization efficiency of the outlet air of the fan assembly 100 is higher, so that the rotating speed of the fan in the fan assembly 100 at the same environmental temperature can be reduced, the service life of the fan is prolonged, the noise can be reduced, the comfort of the running environment of equipment is improved, and the competitiveness of products is enhanced; the targeted heat dissipation of the bypass type air channel can effectively reduce the temperature of electronic components and improve the reliability of equipment.
The first air duct 230 and the second air duct 240 share the same air duct inlet 210. Therefore, the ratio of the air intake of the first air duct 230 and the second air duct 240 can be adjusted by designing the size ratio of the first air duct 230 and the second air duct 240 to the air inlet 210 of the air duct.
The first air duct outlet 231 is provided with an air opening adjusting assembly 232 for adjusting the size of the air opening of the first air duct outlet 231. Because the volume and the heat dissipation area (usually, the upper surface is a heat dissipation surface) of the large-volume electronic component (such as a power brick) positioned outside the main airflow of the fan assembly 100 are large, the width of the general air outlet and the electronic component can be equal; in addition, due to different heights of the electronic components, the size of the first air duct air outlet 231 can be adjusted through the air opening adjusting assembly 232, so that the air opening can be conveniently adjusted in the height direction, and different device heights can be matched. The air opening adjustment assembly 232 may be in the form of a roller door or an air conditioning blade at an air outlet of an air conditioner.
The second air duct 240 is arranged from the air inlet of the second air duct 240 to the second air duct air outlet 241 in a gradually narrowing manner; the second air duct 240 is located above the electronic component in the first area 110, and the second air duct air outlet 241 is bent downward. Therefore, in one direction, the second air duct 240 which is arranged to be gradually narrowed increases the flow velocity of the air flow at the outlet, and the washing effect on small electronic components can be more obvious by bending the second air duct downwards; on the other hand, since the second duct outlet 241 is located below the first region 110, in order to prevent the air outlet of the first region 110 from being blocked, the second duct outlet 241 must be narrowed to have the largest air outlet area.
In other embodiments, the first air duct 230 and the second air duct 240 do not share the same air inlet 210, and the first air duct 230 and the second air duct 240 individually use their air outlets, i.e., they are equivalent to two independent air ducts.
In other embodiments, the area where the air duct 200 dissipates heat may be single or multiple, and the number of the branch air ducts of the corresponding air duct 200 is also single or multiple. The air duct form is more flexible, and the heat dissipation of electronic components at any position can be realized, so that the complexity of the layout is reduced.
Figures 4-7 schematically show electrons according to one embodiment of the invention, according to a second aspect of the invention. As shown in fig. 4-7, the electronic device includes the electronic device heat dissipation system of any of the above.
The electronic device comprises a PCB 300, a fan assembly installation notch 400 is formed in one side of the PCB 300, the fan assembly 100 is located in the fan assembly installation notch 400, and the first air outlet area 110 corresponds to electronic components in the first area 310 and the second air outlet area 120 is located above the electronic components in the first area 310. From this, fan assembly 100 is spacing through fan assembly installation breach 400 of PCB board to make first air-out region 110 directly aim at first region 310, directly dispel the heat to the electronic components in first region 310, guarantee that second air-out region 120 is located the top of the electronic components in first region 310 simultaneously, avoid occupying the space of PCB board.
The electronic device further comprises a lower box 500 and an upper box cover 600 mounted on the lower box 500, the PCB 300 and the fan assembly 100 are mounted in the lower box 500 (the fan assembly 100 can adopt a conventional mounting form of a 1U server), the lower box 500 is provided with a lower box air inlet 510 and a lower box air outlet 520, the lower box air inlet 510 corresponds to an air inlet of the fan assembly 100, and the lower box air outlet 520 corresponds to the first region 310. Thus, as shown in fig. 6, lower case outlet 520 corresponds to first region 310, and thus ensures that the cooling air in first outlet region 110 cools the electronic components in first region 310 and then discharges the electronic components through the shortest route.
The lower case intake 510 and the lower case exhaust 520 may be installed with dust screens to prevent dust from entering the inside of the electronic device.
As shown in fig. 7, the air duct 200 is fixed to the upper case cover 600; the upper box cover 600 is a sheet metal part, the air duct 200 can be a sheet metal part or a plastic part, the air duct 200 and the upper box cover 600 are bonded into a whole, the specific bonding form is not limited, and the air duct can be welded (aiming at the sheet metal air duct) or bonded with strong glue (aiming at the plastic air duct) and any other feasible connection form. Accordingly, the problem of occupying the space of the PCB 300 is solved by fixing the duct 200 to the upper case cover 600. Compared with the air duct design in the background technology, the air duct design integrated with the box cover can effectively reduce the occupied board area, and the size of the PCB can be smaller, so that the product cost is reduced in an auxiliary manner. Of course, the air duct 200 and the upper case cover 600 may be movably connected to each other so that the air duct 200 can be removed.
In this embodiment, the air duct 200 is fixed to the upper case cover 600, the fan assembly 100 and the PCB 300 are installed in the lower case 500, the air duct 200 is separated from the fan assembly, and the upper case cover 600 and the air duct 200 are separate structural members and are directly locked to the lower case 500 in use. The air duct 200 of the present embodiment functions as a bypass air inducing function, and the fan assembly inside the cabinet is mainly used to dissipate heat of the CPU with large heat consumption in the first area 310, however, since electronic components at other positions in the box body also need to dissipate heat, a portion of the outlet air of the fan assembly 100 (i.e., the second outlet air area 120) is guided to the electronic components that need to be additionally enhanced in heat dissipation (i.e., the electronic components in the third area and the fourth area), as shown in fig. 3, it can be seen that the inlet end of the wind tunnel 200 contains only a portion (about 1/2) of the outlet area of the fan assembly 100, that is, the air duct 200 only guides the 1/2 airflow to other areas for heat dissipation (arrows in the air duct), the air discharged from the other 1/2 area of the fan assembly 100 still normally dissipates heat to the CPU (arrow below the air duct in the figure). If the air duct design of the embodiment is not available, the fan assembly in the drawing only blows air to the CPU, and only the CPU can be cooled. The air inducing form of the air duct effectively solves the problem of heat dissipation of bypass electronic components and heat sensitive electronic components downstream of the CPU of box type electronic equipment (such as communication products), and has universality and no precedent.
In other embodiments, the air duct 200 is fixed to a sidewall of the lower case 500. Accordingly, the space occupied by the PCB board can be also prevented by fixing the duct 200 to the side wall of the lower case 500. Of course, in order to remove the air duct 200, the air duct 200 may be movably connected to the sidewall of the lower case 500.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (10)
1. An electronic device heat dissipation system, comprising:
the air outlet of the fan assembly comprises a first air outlet area and a second air outlet area;
the air duct is provided with an air duct air inlet and an air duct air outlet;
cooling air generated by the first air outlet area is used for dissipating heat of electronic components in the first area on the PCB;
and cooling air generated in the second air outlet area enters the air channel from the air channel air inlet and is blown out from the air channel air outlet after passing through the air channel, and the cooling air blown out from the air channel air outlet is used for dissipating heat of electronic components in the second area on the PCB.
2. The electronic device heat dissipation system of claim 1, wherein the second region comprises a third region and/or a fourth region;
the third area is positioned at the left side and/or the right side of the first area;
the fourth region is located at a rear side of the first region.
3. The electronic device heat dissipation system of claim 2, wherein the air duct comprises a first air duct and a second air duct; the air duct air outlet comprises a first air duct air outlet of the first air duct and a second air duct air outlet of the second air duct;
the first air duct air outlet corresponds to the third area, and the first air duct is used for bringing cooling air generated by the second air outlet area to the third area to dissipate heat of the electronic component in the third area;
the second air duct air outlet corresponds to the fourth area, and the second air duct is used for bringing cooling air generated by the second air outlet area to the fourth area to dissipate heat of electronic components in the fourth area.
4. The heat dissipation system of claim 3, wherein the first air duct and the second air duct share the same air duct inlet.
5. The electronic device cooling system according to claim 3, wherein the first air duct outlet is provided with an air outlet adjusting component for adjusting the size of the air outlet of the first air duct outlet.
6. The heat dissipation system of claim 3, wherein the second air duct is gradually narrowed from the air inlet of the second air duct to the air outlet of the second air duct; the second air duct is located above the electronic component in the first area, and the air outlet of the second air duct is bent downwards.
7. An electronic device comprising the electronic device heat dissipation system of any of claims 1-6.
8. The electronic device according to claim 7, comprising the PCB, wherein a fan assembly mounting notch is formed in one side of the PCB, the fan assembly is located in the fan assembly mounting notch, and the first air outlet area corresponds to the electronic component in the first area and the second air outlet area is located above the electronic component in the first area.
9. The electronic device of claim 7, comprising a lower housing and an upper housing cover mounted on the lower housing, wherein the PCB board and the fan assembly are mounted in the lower housing, the lower housing defines a lower housing inlet and a lower housing outlet, the lower housing inlet corresponds to the fan assembly inlet, and the lower housing outlet corresponds to the first region.
10. The electronic device of claim 9, wherein the air duct is fixed to a side wall of the lower case or the upper case cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111536072.4A CN113923962A (en) | 2021-12-16 | 2021-12-16 | Electronic equipment cooling system and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111536072.4A CN113923962A (en) | 2021-12-16 | 2021-12-16 | Electronic equipment cooling system and electronic equipment |
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| CN113923962A true CN113923962A (en) | 2022-01-11 |
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| CN202111536072.4A Pending CN113923962A (en) | 2021-12-16 | 2021-12-16 | Electronic equipment cooling system and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023232935A1 (en) * | 2022-06-03 | 2023-12-07 | Lenze Se | Frequency converter kit |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220111 |
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| RJ01 | Rejection of invention patent application after publication |