JP2004134423A5

JP2004134423A5 -

Info

Publication number: JP2004134423A5
Application number: JP2002294458A
Authority: JP
Filing date: 2002-10-08
Publication date: 2005-09-15
Anticipated expiration: 2022-10-08

Claims

In an electronic device cooling apparatus that cools an electronic component that is a heating element with a coolant,
A cooling liquid suction port, a cooling liquid discharge port, a centrifugal pump that sucks the cooling liquid from the suction port and discharges the cooling liquid to the discharge port, and a rotary drive unit that drives the centrifugal pump, and is integrated with the casing A formed cooling module;
A heat exchanger connected between the discharge port and the suction port of the cooling module, for radiating the heat absorption of the coolant into the air and cooling the coolant;
A cooling fluid circulation channel that connects the cooling module and the heat exchanger so that the cooling fluid circulates;
A centrifugal pump of the cooling module is provided opposite to an upper portion of the electronic component, and heat generated from the electronic component is absorbed into a coolant flowing through the centrifugal pump from a heat-receiving surface thermally connected to the electronic component. electronics cooling apparatus characterized by cooling the components.

A cooling module that cools an electronic component that is a heating element with a coolant;
A heat exchanger that dissipates heat of the heat generating element that has absorbed heat from the coolant into the air;
A cooling module for an electronic device cooling device including a cooling liquid circulation channel that connects the cooling liquid module and the heat exchanger so that the cooling liquid circulates,
The cooling module includes a heat conduction part that is in thermal contact with an upper part of an electronic component that is a heating element, and an impeller that has a plurality of flow paths having high thermal conductivity and is provided in the vicinity of the heat conduction part. And a rotation drive unit that rotates the impeller so that the coolant rotates by rotating the impeller with the axial direction of the rotation shaft of the impeller as a vertical direction of the heat conduction unit, and the heat conduction unit and the blade The car and the rotational drive unit are formed integrally with the casing,
The cooling liquid is discharged from the central part of the impeller toward a peripheral part, and absorbs heat generated by the heating element from the heat conducting part .

The cooling module according to claim 2, wherein
The impeller has an open surface on the side of the heat conducting portion provided in the vicinity, and a plurality of flow paths of the impeller are formed between the heat conducting portion,
The cooling module , wherein the cooling liquid absorbs heat generated by the heating element directly from the heat conducting portion .

In an electronic device cooling apparatus having a heat conducting part that is in thermal contact with an electronic component that is a heating element, a liquid driving part that circulates a cooling liquid, and a heat radiating part that radiates heat by circulating the cooling liquid,
The liquid driving unit is a contact heat exchange type pump having the heat conducting unit,
A pump casing made of a material having high thermal conductivity, a liquid suction side flow path and a liquid discharge side flow path connected to the casing, and a plurality of flow paths built in the pump casing. An impeller, and a rotational drive source that rotationally drives the impeller, and the impeller having the plurality of flow paths is rotated by the rotational drive source so that the coolant is discharged from the flow path on the suction side. No configuration to circulate to the flow path on the liquid side,
The heat conducting unit and the liquid driving unit are laminated and configured integrally with the casing,
The impeller of the liquid driving unit is disposed in proximity to the cooled surface of the heat conducting unit,
The flow path on the liquid absorption side is installed between the heat conducting unit and the rotation drive source,
An electronic device cooling apparatus, wherein the surface to be cooled of the heat conducting unit is cooled by circulation of a cooling liquid by rotation of the impeller.

In an electronic device cooling apparatus having a heat conducting part that is in thermal contact with an electronic component that is a heating element, a liquid driving part that circulates a cooling liquid, and a heat radiating part that radiates heat by circulating the cooling liquid,
The liquid driving unit is a contact heat exchange type pump having the heat conducting unit,
Pump casing made of a material with high thermal conductivity and liquid absorption connected to the casing Side flow path and discharge liquid side flow path, an impeller having a plurality of flow paths built in the casing of the pump, and a rotational drive source for rotationally driving the impeller, the rotational drive source By rotating the impeller having the plurality of flow passages to circulate the cooling liquid from the liquid suction side flow passage to the liquid discharge side flow passage,
The heat conducting unit and the liquid driving unit are laminated and configured integrally with the casing,
The impeller of the liquid driving unit is disposed in proximity to the cooled surface of the heat conducting unit,
Connecting the flow path on the liquid absorption side to the center of the impeller of the casing;
An electronic device cooling apparatus, wherein the surface to be cooled of the heat conducting unit is cooled by discharging a coolant from a central part of the impeller to a peripheral part by rotation of the impeller.