CN106090843A - A kind of LED heat abstractor - Google Patents
A kind of LED heat abstractor Download PDFInfo
- Publication number
- CN106090843A CN106090843A CN201610478796.0A CN201610478796A CN106090843A CN 106090843 A CN106090843 A CN 106090843A CN 201610478796 A CN201610478796 A CN 201610478796A CN 106090843 A CN106090843 A CN 106090843A
- Authority
- CN
- China
- Prior art keywords
- heat
- cavity volume
- substrate
- conducting plate
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED heat abstractor, including substrate and heat-conducting plate, described multiple heat-conducting plates constitute heat-conducting plate group, and described multiple heat-conducting plates are disposed in an evenly spaced relation in the both sides of described substrate, form air exchange passage between every adjacent two panels heat-conducting plate;Being provided with cavity volume in described substrate, described cavity volume is built with cooling freezing liquid;Being provided with multiple division board in described cavity volume, described cavity volume is divided into multiple region by described division board.Present configuration is simple, and good heat dissipation effect is suitable to popularization and application.
Description
Technical field
The present invention relates to a kind of heat abstractor, especially relate to a kind of LED heat abstractor.
Background technology
Along with the popularization and application of LED, having the biggest contribution for energy-conserving and environment-protective, existing LED lamp generally comprises LED
Light source, heat transfer sheet and radiator, LED light source includes aluminium base and the LED illuminating circuit being laid on the front of aluminium base, heat transfer
Sheet is fixedly installed on aluminium base, and the back side laminating of the bottom surface of heat transfer sheet and aluminium base, radiator includes heat-radiating substrate and heat conduction
The end face laminating of plate group, the bottom surface of heat-radiating substrate and heat transfer sheet, heat-conducting plate group is by multiple end faces being disposed on heat-radiating substrate
On heat-conducting plate composition, form the air exchange passage of radiator between every adjacent two panels heat-conducting plate.When LED light source luminescence,
The heat that LED produces is delivered on heat transfer sheet by aluminium base, and heat transfer sheet transfers heat on the heat-radiating substrate of radiator again,
Being then transferred in heat-conducting plate group, the air exchange passage finally by radiator is delivered in air, thus reaches LED light
Source carries out the purpose of radiating and cooling.
Upper and lower air communication channel it is formed without so that the heat of radiator is difficult in the heat-radiating substrate of above-mentioned LED lamp
Dissipating, radiating effect is very poor, thus causes LED light source still to work in high temperature environments, reduces the use longevity of LED light source
Life, is further improved.
Summary of the invention
The technical problem to be solved is to provide one can form upper and lower air communication channel, good heat dissipation effect
LED heat abstractor.
The present invention solves the technical scheme that above-mentioned technical problem used: a kind of LED heat abstractor, including substrate
And heat-conducting plate, described multiple heat-conducting plates constitute heat-conducting plate group, and described multiple heat-conducting plates are disposed in an evenly spaced relation in described base
The both sides of plate, form air exchange passage between every adjacent two panels heat-conducting plate, when heat transmission is to described air exchange passage
Time middle, after the air heat absorption in air exchange passage, density reduces and lifts off air exchange passage, under air exchange passage
The air that the temperature of side is relatively low enters in air exchange passage, goes round and begins again.
Be provided with cavity volume in described substrate, described cavity volume built with cooling freezing liquid, described cooling freezing liquid
Evaporating temperature is 50 degree, and when freezing liquid heating temperature of lowering the temperature is increased to evaporating temperature, described cooling freezing liquid becomes gas
Rising, described gas transfers heat to the side of described substrate, and the side of described substrate transfers heat to described
Heat-conducting plate, now, the temperature of described gas is reduced to below evaporating temperature and becomes liquid and fall back to bottom described cavity volume, week
And renew.
Being provided with multiple division board in described cavity volume, described cavity volume is divided into multiple region by described division board.
Beneficial effect:
Compared with prior art, it is an advantage of the current invention that to include that substrate and heat-conducting plate, described multiple heat-conducting plates are constituted
Heat-conducting plate group, multiple heat-conducting plates are disposed in an evenly spaced relation in the both sides of substrate, form air exchange between every adjacent two panels heat-conducting plate
Passage, the arragement direction of heat-conducting plate is vertical with the short transverse of substrate, and the bottom of heat-conducting plate exceeds bottom one segment distance of substrate,
When in heat transmission to air exchange passage, after the air heat absorption in air exchange passage, density reduces and lifts off air
Interchange channel, the relatively low air of temperature below air exchange passage enters in air exchange passage, goes round and begins again, up/down perforation
Air exchange passage make the air near heat-conducting plate circulate, improve the effect of heat radiation;
When being provided with cavity volume in substrate, cavity volume is built with cooling freezing liquid, and the evaporating temperature of cooling freezing liquid is 50 degree, fall
When temperature freezing liquid heating temperature is increased to evaporating temperature, cooling freezing liquid becomes gas and rises, and gas transfers heat to substrate
Side, the side of substrate transfers heat to heat-conducting plate, and now, the temperature of gas is reduced to below evaporating temperature and becomes liquid and return
Fall bottom cavity volume, go round and begin again, improve the heat-transfer effect of radiator, reduce the temperature difference between LED light source and heat-conducting plate;
When being provided with multiple division board in cavity volume, cavity volume is divided into multiple region, such setting by division board, even if dissipating
Hot device tilts, and cooling freezing liquid also will not flow to one end that substrate is relatively low, causes radiator heat-dissipation effect uneven;
Present configuration is simple, and good heat dissipation effect is suitable to popularization and application.
Accompanying drawing explanation
Fig. 1 is the one embodiment of the invention Longitudinal cross section schematic along substrate.
Detailed description of the invention
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
Embodiment: as it is shown in figure 1, a kind of LED heat abstractor, including substrate 2 and heat-conducting plate group, heat-conducting plate group is by many
Individual heat-conducting plate 3 forms, and multiple heat-conducting plates 3 are disposed on the both sides of substrate 2, forms air between every adjacent two panels heat-conducting plate 3
Interchange channel 1, when in heat transmission to air exchange passage 1, after the air heat absorption in air exchange passage 1, density reduces also
Lifting off air exchange passage 1, the relatively low air of temperature below air exchange passage 1 enters in air exchange passage 1, week
And renew, the air exchange passage 1 of up/down perforation makes the air near heat-conducting plate circulate, and improves the effect of heat radiation.
In the present embodiment, being provided with cavity volume 5 in substrate 2, cavity volume 5 is built with cooling freezing liquid, the evaporation of cooling freezing liquid
Temperature is 50 degree, and when freezing liquid heating temperature of lowering the temperature is increased to evaporating temperature, cooling freezing liquid becomes gas and rises, and gas passes
Passing the heat side to substrate 2, the side of substrate 2 transfers heat to heat-conducting plate, the temperature of the air in air exchange passage 1
Raising, now, the temperature of gas is reduced under evaporating temperature become liquid and falls back to, bottom cavity volume 5, go round and begin again, and improves scattered
The heat-transfer effect of hot device, reduces the temperature difference between LED light source and heat-conducting plate.
In the present embodiment, being provided with multiple division board 4 in cavity volume 5, cavity volume 5 is divided into multiple region by division board 4, each
Forming relatively independent space, such setting in individual region, even if radiator tilts, cooling freezing liquid also will not flow to substrate
2 relatively low one end, cause radiator heat-dissipation effect uneven.
Desirable embodiment according to the present invention is enlightenment above, and by above-mentioned description, related personnel is the most permissible
In the range of without departing from this invention technological thought, carry out various change and amendment.The technical scope of this invention
The content being not limited in description, it is necessary to determine technical scope according to right.
Claims (2)
1. a LED heat abstractor, it is characterised in that include that substrate and heat-conducting plate, described multiple heat-conducting plates are constituted and lead
Hot plate group, described multiple heat-conducting plates are disposed in an evenly spaced relation in the both sides of described substrate, shape between every adjacent two panels heat-conducting plate
Become air exchange passage;Being provided with cavity volume in described substrate, described cavity volume is built with cooling freezing liquid.
A kind of LED heat abstractor the most according to claim 1, it is characterised in that be provided with many in described cavity volume
Individual division board, described cavity volume is divided into multiple region by described division board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610478796.0A CN106090843A (en) | 2016-06-24 | 2016-06-24 | A kind of LED heat abstractor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610478796.0A CN106090843A (en) | 2016-06-24 | 2016-06-24 | A kind of LED heat abstractor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106090843A true CN106090843A (en) | 2016-11-09 |
Family
ID=57253676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610478796.0A Withdrawn CN106090843A (en) | 2016-06-24 | 2016-06-24 | A kind of LED heat abstractor |
Country Status (1)
Country | Link |
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CN (1) | CN106090843A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050173096A1 (en) * | 2004-02-05 | 2005-08-11 | Wincomm Corporation | Heat dissipating device |
CN102404972A (en) * | 2010-09-09 | 2012-04-04 | 鸿富锦精密工业(深圳)有限公司 | Radiating device |
CN103453500A (en) * | 2013-09-22 | 2013-12-18 | 陈云芽 | LED radiator |
CN203674263U (en) * | 2013-12-26 | 2014-06-25 | 广东卓耐普智能技术股份有限公司 | Integrated LED light source |
CN204164723U (en) * | 2014-09-03 | 2015-02-18 | 上海柏宜照明电子有限公司 | LED intelligent lamp |
-
2016
- 2016-06-24 CN CN201610478796.0A patent/CN106090843A/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050173096A1 (en) * | 2004-02-05 | 2005-08-11 | Wincomm Corporation | Heat dissipating device |
CN102404972A (en) * | 2010-09-09 | 2012-04-04 | 鸿富锦精密工业(深圳)有限公司 | Radiating device |
CN103453500A (en) * | 2013-09-22 | 2013-12-18 | 陈云芽 | LED radiator |
CN203674263U (en) * | 2013-12-26 | 2014-06-25 | 广东卓耐普智能技术股份有限公司 | Integrated LED light source |
CN204164723U (en) * | 2014-09-03 | 2015-02-18 | 上海柏宜照明电子有限公司 | LED intelligent lamp |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161109 |
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WW01 | Invention patent application withdrawn after publication |