CN111426891A - Cooling and heating device for electronic equipment test and control method thereof - Google Patents
Cooling and heating device for electronic equipment test and control method thereof Download PDFInfo
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- CN111426891A CN111426891A CN201911136910.1A CN201911136910A CN111426891A CN 111426891 A CN111426891 A CN 111426891A CN 201911136910 A CN201911136910 A CN 201911136910A CN 111426891 A CN111426891 A CN 111426891A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The invention provides a cooling and heating device for testing electronic equipment, which comprises a supporting plate, wherein a working plate and a semiconductor refrigerator are fixed on the supporting plate, an electronic test element is placed on the working plate, the semiconductor refrigerator is connected with a control module, the control module is connected with a temperature sensor, the temperature sensor is arranged close to the electronic test element, the semiconductor refrigerator is tightly attached to the working plate and used for heating or cooling the working plate, and a fan is arranged on the supporting plate and used for dissipating heat of the semiconductor refrigerator. The invention can heat and cool the electronic element at the same time, the heat exchange effect is good, the cooling and heating capability is strong, meanwhile, the invention can circularly cool and heat the electronic testing element, the change situation of the actual working temperature can be well simulated, and the test of the electronic device is more accurate.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a cooling and heating device for electronic equipment testing and a control method thereof.
Background
Under common conditions, before the electronic components leave a factory, a heating aging test needs to be carried out, the electronic components are heated for a certain time under the designed boundary conditions, and the photoelectric stability and other performances of the electronic components are observed. However, since the electronic components are not always in a high temperature condition, and sometimes need to be applied in a cold condition, and even under a condition with a large temperature change, it is necessary to heat the electronic components and cool the electronic components.
In the electronic component market, heating tests often use electrical heating, i.e. direct conversion by the electrothermal effect. The cooling of electronic equipment is from the first generation natural cooling to the second generation convective heat transfer, and as the integration rate of electronic equipment is higher and the size is smaller and smaller, the heat dissipation of electronic products faces more and more challenges, so that new and new technologies and methods, such as heat pipe technology, thermoelectric refrigeration technology and the like, are emerging continuously at present.
Electronic product testing devices generally need to be performed in a certain space, such as by placing electronic products in a pluggable drawer, and have small size and limited height and width. Large cooling and heating equipment is not suitable under such conditions, and compression-type refrigeration systems, for example, are not practical to use under such conditions. Cooling directly by water cooling requires safety considerations. The temperature cannot be reduced to be very low and the heating cannot be realized directly through the heat pipe radiator and the fan; due to space constraints, semiconductor refrigerators are used and heat cannot be removed completely.
Disclosure of Invention
The invention solves the problem that the electronic element can not be heated and cooled simultaneously in the prior art, and provides a cooling and heating device for electronic equipment test, which organically combines a semiconductor refrigerator and a heat pipe combined radiator, and simultaneously, the semiconductor refrigerator also has a heating function, thereby being capable of cooling and heating.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a cooling and heating device for electronic equipment test, includes the backup pad, the backup pad is fixed with work board and semiconductor cooler, electronic test element has been placed on the work board, semiconductor cooler is connected with control module, control module is connected with temperature sensor, temperature sensor is close to the setting of electronic test element, and the work board is hugged closely to the semiconductor cooler, heats or cools off the work board, and the backup pad is equipped with the fan, the fan dispels the heat to the semiconductor cooler.
The semiconductor refrigerator has a heating or cooling function, and under the conventional condition, the pasting surface at the lower part of the cooling platform is a refrigerating surface which can cool the cooling device to below 1 ℃; when the device needs to be heated, the switching of the positive and negative electrodes of the connecting wire can be completed. The interior of the semiconductor refrigerator is composed of an upper substrate, a lower substrate, P, N materials, a copper sheet and solder paste. The heating and refrigerating device can monitor the temperature and is suitable for testing the heating or cooling device by the temperature sensor. When the temperature reaches the set value, the temperature control is completed by adjusting the input power.
Preferably, the support plate is provided with a front panel, a guide plate and a heat insulation plate, the front panel is provided with fan holes, the fans are arranged on the corresponding fan hole positions, the heat insulation plate is provided with installation through holes, the semiconductor refrigerator is embedded and fixed in the installation through holes, the front panel, the guide plate and the heat insulation plate are sequentially connected and fixed and form an air channel with the lower portion of the support plate, and a heat dissipation module is arranged in the air channel and is tightly attached to the semiconductor refrigerator. The air guide plate can reduce air volume loss, so that the fluid is completely used for heat exchange as much as possible, and the heat exchange effect is improved. The heat insulation plate reduces direct heat exchange between the refrigerating surface and the heating surface of the semiconductor refrigerator, and reduces heat exchange between the heating surface and the lower radiator.
Preferably, the heat dissipation module comprises a heat sink and a heat pipe, and the heat pipe is partially fixed in the heat sink. The heat pipe is embedded into the radiator with the fixed groove and then is fixed through mechanical stress pressing, or is directly inserted into the radiator to be integrally cast, so that the heat pipe is partially fixed in the radiator. Because the vacuum tube is arranged in the heat pipe, and the two-phase heat exchange medium is injected, the heat exchange can be obviously enhanced, and the heat can be better taken away or absorbed.
Preferably, heat-conducting silicone grease is arranged between the radiator and the semiconductor refrigerator, and heat-conducting silicone grease is arranged between the semiconductor refrigerator and the working plate. Reduce thermal contact resistance and enhance heat exchange effect.
Preferably, the fan is a four-wire fan or a three-wire fan, and blows air or sucks air from the air duct. The fan is used for carrying out forced convection heat dissipation, the fan can be a four-wire fan, and one wire is used for frequency conversion control of the rotating speed of the fan; the three-wire fan completes the air quantity regulation of the fan by regulating current or voltage. Because thermoelectric refrigeration needs to remove heat in time to achieve a good refrigeration effect, direct convection gas generated by a fan can effectively take away heat on the surface of a radiator and a heat pipe of the heat pipe radiator.
Preferably, the guide plate is made of a corresponding material according to the wind direction set by the fan, and when the fan is set to blow wind in the air duct, the guide plate is made of a plastic material; when the fan is arranged to absorb air in the air duct, the guide plate is made of metal.
When the fan is arranged to blow air into the air channel, the air firstly passes through the guide plate and then passes through the radiating module, so that the guide plate only plays a role of guiding, the whole weight of the device can be reduced by selecting plastic materials, and meanwhile, the production cost is saved; when the fan sets up to the air uptake in the wind channel, gaseous earlier through heat dissipation module again through the guide plate, flows out from front panel fan hole at last, and heat dissipation module's heat is also taken to the guide plate this moment, therefore the guide plate also need dispel the heat, chooses for use metal material can be fine to the guide plate heat dissipation, further reinforcing radiating effect.
A method for controlling a cooling and heating apparatus for electronic device testing, the cooling and heating apparatus for electronic device testing comprising the steps of:
when the heating is required to be carried out,
s1: the control module firstly sends out an instruction to start the fan;
s2: the control module sends a heating instruction to the semiconductor refrigerator, the anode and the cathode of the circuit are switched, a heating mode is started, and the heating function H starts to work;
s3: the temperature sensor detects the temperature of the electronic test element at any moment and feeds a temperature signal back to the control module;
s4: when the temperature does not reach the set heating temperature, the control module adopts frequency conversion or improves the input power to increase the rotating speed of the fan;
s5: when the temperature reaches the set heating temperature, the control module carries out a heat preservation mode according to the set time, wherein the heat preservation mode refers to the mode that the control module controls the rotating speed of the fan to enable the measured temperature to be consistent with the set heating temperature.
The rotating speed of the fan is increased, namely the air inlet amount is increased, the heat exchange amount of the heat pipe and the radiator is increased, the cold quantity taken away is increased, the heat quantity rises immediately, the temperature of the heating surface rises, and vice versa. In addition, another way of increasing the heating capacity is to find the maximum heating efficiency point by finding the maximum adjustment current and voltage, and continuously approach the highest point to increase the heating capacity.
Preferably, the method further comprises, when cooling of the electronic test element is required, performing the steps of:
and SA: the control module sends out an instruction to start the fan;
SB: the control module sends a refrigeration instruction to the semiconductor refrigerator, a refrigeration mode is started, and a cooling function C starts to work;
SC: the temperature sensor detects the temperature of the electronic test element at any moment and feeds a temperature signal back to the control module;
SD: when the cooling temperature is higher, the control module sends a refrigeration signal to the fan, and the rotating speed of the fan is increased;
and SE: when the temperature reaches the set heating temperature, the control module carries out a heat preservation mode according to the set time, wherein the heat preservation mode refers to the control module controlling the rotating speed of the fan to enable the temperature preservation to be consistent with the set heating temperature.
Preferably, the method further comprises cyclically cooling and heating the electronic test element. The circulating cooling and heating control module controls the device to perform uninterrupted and alternate heating and cooling according to a set instruction. Under some environment, the working temperature of the electronic equipment is alternately cold and hot, the device can circularly cool and heat the electronic test element, and the change condition of the actual working temperature can be well simulated, so that the test on the electronic equipment is more accurate.
The invention has the following beneficial effects: the semiconductor cooler and the heat pipe combined radiator are organically combined, so that the heating and cooling tests of the electronic test element can be realized; the air quantity loss can be reduced by arranging the guide plate, so that the fluid is completely used for heat exchange as much as possible, and the heat exchange effect is improved; the heat insulation plate is arranged, so that the direct heat exchange between the refrigerating surface and the heating surface of the semiconductor refrigerator is reduced, and the heat exchange between the heating surface and the lower radiator is reduced, so that the cooling effect and the heating capacity are enhanced; the device can circularly cool and heat the electronic test element, can well simulate the change condition of the actual working temperature, and enables the test of the electronic equipment to be more accurate.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective exploded view of the present invention;
fig. 3 is a control schematic of the present invention.
Among them are:
1. the device comprises a support plate 2, a working plate 3, a heat insulation plate 4, a radiator 5, a flow guide plate 6, an electronic test element 7, a fan 8, a semiconductor refrigerator 9, a heat pipe 10, a front panel 11, a temperature sensor 12, a control module H, heating C and cooling.
Detailed Description
Example (b):
this embodiment provides a cooling and heating device for electronic equipment test, refer to fig. 1 and fig. 2, including backup pad 1, be fixed with work board 2 and semiconductor cooler 8 in the backup pad, electronic test element 6 has been placed on the work board, semiconductor cooler 8 is connected with control module 12, control module 12 is connected with temperature sensor 11, temperature sensor 11 is close to electronic test element 6 and sets up, the work board is hugged closely to the semiconductor cooler, heat or cool off the work board, backup pad 1 is equipped with fan 7, fan 7 dispels the heat to semiconductor cooler 8. .
The semiconductor refrigerator has a heating or cooling function, and under the conventional condition, the pasting surface at the lower part of the working plate is a refrigerating surface which can cool the cooling device to below 1 ℃; when the device needs to be heated, the switching of the positive and negative electrodes of the connecting wire can be completed. The interior of the semiconductor refrigerator is composed of an upper substrate, a lower substrate, P, N materials, a copper sheet and solder paste. The heating and cooling devices may be temperature monitored using temperature sensor testing to monitor the temperature of the heating or cooling device. When the temperature reaches the set value, the temperature control is completed by adjusting the input power.
The supporting plate 1 is connected with the front panel 10, the guide plate 5 and the heat insulation plate 3, the front panel is provided with a fan hole, the fan is arranged on the position corresponding to the fan hole, the heat insulation plate is provided with an installation through hole, the semiconductor refrigerator is embedded and fixed in the installation through hole, the front panel, the guide plate and the heat insulation plate are sequentially connected and fixed, an air channel is formed with the lower portion of the supporting plate, a heat dissipation module is arranged in the air channel, and the heat dissipation module is tightly attached. The air guide plate can reduce air volume loss, so that the fluid is completely used for heat exchange as much as possible, and the heat exchange effect is improved. The heat insulation plate reduces direct heat exchange between the refrigerating surface and the heating surface of the semiconductor refrigerator, and reduces heat exchange between the working plate and the lower radiator due to air convection.
The heat dissipation module comprises a heat sink 4 and a heat pipe 9, and the heat pipe is partially fixed in the heat sink. The heat pipe is embedded into the radiator with the fixed groove and then is fixed through mechanical stress pressing, or is directly inserted into the radiator to be integrally cast, so that the heat pipe is partially fixed in the radiator. Because the vacuum tube is arranged in the heat pipe, and the two-phase heat exchange medium is injected, the heat exchange can be obviously enhanced, and the heat can be better taken away or absorbed.
And heat-conducting silicone grease is arranged between the radiator and the semiconductor refrigerator 8, and between the semiconductor refrigerator and the working plate, the heat-conducting silicone grease is arranged, so that the contact thermal resistance is reduced, and the heat exchange effect is enhanced.
The fan is a four-wire fan or a three-wire fan, blows air or sucks air from the air duct, and is used for forced convection heat dissipation. The fan may be a four wire fan, wherein one wire is used for variable frequency control of the fan speed. The three-wire fan completes the air quantity regulation of the fan by regulating current or voltage. Because thermoelectric refrigeration needs to remove heat in time to achieve a good refrigeration effect, direct convection gas generated by a fan can effectively take away heat on the surface of a radiator and a heat pipe of the heat pipe radiator.
The guide plate 5 is made of corresponding materials according to the wind direction set by the fan 7, and when the fan 7 blows air into the air duct, the guide plate 5 is made of plastic materials; when the fan 7 is arranged to suck air in the air duct, the guide plate 5 is made of metal. When the fan 7 is arranged to blow air into the air channel, the air firstly passes through the guide plate and then passes through the heat dissipation module, so that the guide plate only plays a role of guiding, the whole weight of the device can be reduced by selecting a plastic material, and meanwhile, the production cost is saved; when fan 7 sets up to the air uptake in the wind channel, gaseous earlier through heat dissipation module again through the guide plate, flow out from front panel fan hole at last, the heat of heat dissipation module this moment also is taken the guide plate, therefore the guide plate also need dispel the heat, chooses for use metal material can be fine to the guide plate heat dissipation, further reinforcing radiating effect.
A control method of a cooling and heating apparatus for electronic device testing using the above-mentioned one, comprising the steps of:
when the heating is required to be carried out,
s1: the control module firstly sends out an instruction to start the fan;
s2: the control module sends a heating instruction to the semiconductor refrigerator, the anode and the cathode of the circuit are switched, a heating mode is started, and the heating function H starts to work;
s3: the temperature sensor detects the temperature of the electronic test element at any moment and feeds a temperature signal back to the control module;
s4: when the temperature does not reach the set heating temperature, the control module adopts frequency conversion or improves the input power to increase the rotating speed of the fan;
s5: when the temperature reaches the set heating temperature, the control module carries out a heat preservation mode according to the set time, and the heat preservation mode refers to the control module controlling the rotating speed of the fan to enable the measured temperature to be consistent with the set heating temperature.
The rotating speed of the fan is increased, namely the air inlet amount is increased, the heat exchange amount of the heat pipe and the radiator is increased, the cold quantity taken away is increased, the heat quantity rises immediately, the temperature of the heating surface rises, and vice versa. In addition, another way of increasing the heating capacity is to find the maximum heating efficiency point by finding the maximum adjustment current and voltage, and continuously approach the highest point to increase the heating capacity.
The method further comprises, when cooling of the electronic test element is required, performing the steps of:
and SA: the control module sends out an instruction to start the fan;
SB: the control module sends a refrigeration instruction to the semiconductor refrigerator, a refrigeration mode is started, and a cooling function C starts to work;
SC: the temperature sensor detects the temperature of the electronic test element at any moment and feeds a temperature signal back to the control module;
SD: when the cooling temperature is higher, the control module sends a refrigeration signal to the fan, and the rotating speed of the fan is increased;
and SE: when the temperature reaches the set heating temperature, the control module carries out a heat preservation mode according to the set time, and the heat preservation mode refers to the control module controlling the rotating speed of the fan to enable the temperature preservation to be consistent with the set heating temperature.
The method also includes cyclically cooling and heating the electronic test element. The circulating cooling and heating control module controls the device to perform uninterrupted and alternate heating and cooling according to a set instruction. Under some environment, the working temperature of the electronic equipment is alternately cold and hot, the device can circularly cool and heat the electronic test element, and the change condition of the actual working temperature can be well simulated, so that the test on the electronic equipment is more accurate.
The electronic product testing element can be placed right above the heating or cooling device, the stacking height of the electronic test product, the refrigerating sheet, the radiator and the like is not higher than the depth of the testing container, and the container on the shelf can be smoothly drawn out.
The fan causes air to flow, entering through the front panel openings and exiting from the rear. The rear part of the device is a whole opening, and air flows through a heat dissipation module consisting of a heat pipe 9 and a radiator 4. The fan 7 is fixed outside the support plate, the height of the fan is the same as that of the front panel, but the channel of the radiator is lower, so that the flow guide treatment is needed, the flow guide plate 5 is arranged, and the lower part of the flow guide plate 5 and the inside of the support plate 1 form a cavity, so that the flowing fluid can completely pass through the radiator. An electronic test element 6 is placed on the work plate 2. The fan 7 is an axial fan, and air can flow into or out of the container.
In order to more clearly illustrate the internal structure, fig. 2 shows a discrete diagram of the semiconductor cooling and heating device. The semiconductor cooler 8 and the heat insulation board 3 are placed between the working board 2 and the radiator 4, wherein the contact surfaces between the radiator 4 and the semiconductor cooler 8 and between the semiconductor cooler 8 and the working board 2 need to be coated with heat-conducting silicone grease, so that the contact heat resistance is reduced. The thermoelectric refrigerating sheet is just placed in the middle of the heat insulating plate, so that the energy loss caused by direct heat exchange between the hot surface and the cold surface in the working process of the refrigerator can be reduced.
There are many manufacturing methods between the heat sink 4 and the heat pipe 9, the heat pipe can be put on the pre-grooved heat sink, and the heat pipe can be manufactured by mechanical stress compaction, or the heat pipe can be directly inserted into the heat sink for integral casting.
When the work plate 2 is fastened down, the upper part still has enough space for the electronic test element to be tested, and the combined height between them is still smaller than the inner depth of the device. The front panel 10 is provided with fan holes, and the rear part of the device is not provided with a shielding plate, so that fluid can freely enter and exit from the lower part. The guide plate 5 guides the fluid flowing in or out by the fan 7 into a channel formed by fins at the bottom of the radiator 4, and the heat pipe also has good heat exchange effect in a closed cavity formed by the guide plate 5 and the support plate 1.
Fig. 3 is a control schematic diagram of the semiconductor cooling and heating apparatus. When the electronic test component 6 needs to be subjected to a heating test, the control module 12 firstly sends an instruction, turns on the fan 7, and then sends a refrigerating signal to the semiconductor refrigerator 8 to perform circuit anode-cathode conversion, and at this time, the heating function H starts to work. The temperature sensor 11 constantly detects the temperature of the heating device and feeds back a temperature signal to the control module 12. When the temperature does not reach the set heating temperature, the control module sends an acceleration instruction to the fan 7, the input power is improved by adopting frequency conversion, at the moment, the air inlet volume is increased, the heat exchange volume of the heat pipe 9 and the radiator 4 is increased, the heat rises immediately, the temperature of the heating surface rises, and vice versa. In addition, another way of increasing the heating capacity is to find the maximum heating efficiency point by finding the maximum adjustment current and voltage, and continuously approach the highest point to increase the heating capacity.
Similarly, when the electronic test component 6 needs to be cooled, the control module 12 sends an instruction to start the fan 6, and then the semiconductor refrigerator 8 starts the cooling mode, so that the cooling function C starts to work. Under normal operating conditions, when the cooling temperature is higher, the signal that temperature sensor 11 gathered is transmitted to control module 12, sends refrigeration and gives fan 7, and the fan speed increases this moment, and the heat transfer volume of radiator 4 and heat pipe 9 increases, and the refrigeration volume increases, and the cooling effect reinforcing.
The invention has the following advantages: the semiconductor cooler and the heat pipe combined radiator are organically combined, so that the heating and cooling tests of the electronic test element can be realized; the air quantity loss can be reduced by arranging the guide plate, so that the fluid is completely used for heat exchange as much as possible, and the heat exchange effect is improved; the heat insulation plate is arranged, so that the direct heat exchange between the refrigerating surface and the heating surface of the semiconductor refrigerator is reduced, and the heat exchange between the heating surface and the lower radiator is reduced, so that the cooling effect and the heating capacity are enhanced; the device can circularly cool and heat the electronic test element, can well simulate the change condition of the actual working temperature, and enables the test of the electronic equipment to be more accurate.
Claims (9)
1. The utility model provides a cooling and heating device for electronic equipment test, includes backup pad (1), characterized by, backup pad (1) is fixed with working plate (2) and semiconductor refrigerator (8), electronic test component (6) have been placed on working plate (2), semiconductor refrigerator (8) are connected with control module (12), control module (12) are connected with temperature sensor (11), temperature sensor (11) are close to electronic test component (6) and set up, and working plate (2) are hugged closely in semiconductor refrigerator (8), heat or cool off working plate (2), and backup pad (1) is equipped with fan (7), fan (7) dispel the heat to semiconductor refrigerator (8).
2. The cooling and heating device for electronic equipment testing of claim 1, characterized in that, the supporting plate (1) is provided with a front panel (10), a flow guide plate (5) and a heat insulation plate (3), the front panel (10) is provided with a fan hole, the fan (7) is arranged on the corresponding fan hole, the heat insulation plate (3) is provided with a mounting through hole, the semiconductor refrigerator (8) is embedded and fixed in the mounting through hole, the front panel (10), the flow guide plate (5) and the heat insulation plate (3) are sequentially connected and fixed and form an air channel with the lower part of the supporting plate (1), a heat dissipation module is arranged in the air channel, and the heat dissipation module is tightly attached to the semiconductor refrigerator (8).
3. A cooling and heating device for electronic equipment testing according to claim 2, wherein said heat sink module comprises a heat sink (4) and a heat pipe (9), said heat pipe (9) being partially fixed within said heat sink (4).
4. A cooling and heating apparatus for electronic device testing according to claim 3, wherein a heat conductive silicone grease is provided between the heat sink (4) and the semiconductor cooler (8), and a heat conductive silicone grease is provided between the semiconductor cooler (8) and the work plate (2).
5. A cooling and heating device for testing of electronic equipment according to claim 2, 3 or 4, characterized in that the fan (7) is a four-wire fan or a three-wire fan.
6. The cooling and heating device for the electronic equipment test as claimed in claim 5, wherein the deflector (5) is made of a corresponding material according to the wind direction set by the fan (7), and when the fan (7) is set to blow wind into the wind channel, the deflector (5) is made of a plastic material; when the fan (7) is arranged to absorb air in the air duct, the guide plate (5) is made of metal.
7. A control method of a cooling and heating apparatus for electronic device testing using the cooling and heating apparatus for electronic device testing of claim 1, comprising the steps of:
when the heating is required to be carried out,
s1: the control module firstly sends out an instruction to start the fan;
s2: the control module sends a heating instruction to the semiconductor refrigerator, the anode and the cathode of the circuit are switched, a heating mode is started, and the heating function H starts to work;
s3: the temperature sensor detects the temperature of the electronic test element at any moment and feeds a temperature signal back to the control module;
s4: when the temperature does not reach the set heating temperature, the control module adopts frequency conversion or improves the input power to increase the rotating speed of the fan;
s5: when the temperature reaches the set heating temperature, the control module carries out a heat preservation mode according to the set time, wherein the heat preservation mode refers to the mode that the control module controls the rotating speed of the fan to enable the measured temperature to be consistent with the set heating temperature.
8. The method of claim 7, further comprising, when cooling of the electronic test element is desired,
and SA: the control module sends out an instruction to start the fan;
SB: the control module sends a refrigeration instruction to the semiconductor refrigerator, a refrigeration mode is started, and a cooling function C starts to work;
SC: the temperature sensor detects the temperature of the electronic test element at any moment and feeds a temperature signal back to the control module;
SD: when the cooling temperature is higher, the control module sends a refrigeration signal to the fan, and the rotating speed of the fan is increased;
and SE: when the temperature reaches the set heating temperature, the control module carries out a heat preservation mode according to the set time, wherein the heat preservation mode refers to the control module controlling the rotating speed of the fan to enable the temperature preservation to be consistent with the set heating temperature.
9. The method of claim 8, further comprising cyclically cooling and heating the electronic test element.
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| CN201911136910.1A CN111426891B (en) | 2019-11-19 | 2019-11-19 | Cooling and heating device for electronic equipment test and control method thereof |
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| CN201911136910.1A CN111426891B (en) | 2019-11-19 | 2019-11-19 | Cooling and heating device for electronic equipment test and control method thereof |
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| CN111426891B CN111426891B (en) | 2022-08-12 |
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| CN112718550A (en) * | 2020-12-11 | 2021-04-30 | 杭州长川科技股份有限公司 | Test sorting device applied to test electronic elements |
| CN112859955A (en) * | 2021-01-22 | 2021-05-28 | 维沃移动通信有限公司 | Temperature control device and temperature control method thereof |
| CN114171473A (en) * | 2022-01-06 | 2022-03-11 | 珠海格力电器股份有限公司 | Power device, control method thereof, frequency conversion system and air conditioning equipment |
| WO2023001104A1 (en) * | 2021-07-20 | 2023-01-26 | 长春捷翼汽车零部件有限公司 | Cable having cooling function, current transmission device, and electric vehicle |
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