CN101512354A - Apparatus and method for managing thermally induced motion of a probe card assembly - Google Patents
Apparatus and method for managing thermally induced motion of a probe card assembly Download PDFInfo
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- CN101512354A CN101512354A CNA2006800127133A CN200680012713A CN101512354A CN 101512354 A CN101512354 A CN 101512354A CN A2006800127133 A CNA2006800127133 A CN A2006800127133A CN 200680012713 A CN200680012713 A CN 200680012713A CN 101512354 A CN101512354 A CN 101512354A
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Abstract
A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
Description
Background technology
Figure 1A illustrates the exemplary prior art detection system that is used to test the wafer (not shown) on coming of new semiconductor crystal wafer 112 or other electron device.The detection system of Figure 1A comprises measuring head 104 and check-out console 102 (illustrating so that the partial view of check-out console 102 inside to be provided to analyse and observe part 126).Wafer (not shown) for measuring semiconductor wafer 112 places wafer 112 on the translational table 106 shown in Figure 1A, and transfer table 106 makes the terminals on the wafer (not shown) of wafer 112 contact with the probe 124 of probe card assembly 108.Therefore, setting up brief electrical between the wafer (not shown) of probe 124 and wafer 112 to be tested is connected.
Usually, cable 110 or other communicator are connected the tester (not shown) with measuring head 104.Electric connector 114 is electrically connected measuring head 114 with probe card assembly 108.Probe card assembly 108 shown in Figure 1A comprises the distributing board 120 that 122 electrical connection can be provided from connector 114 to probe substrate, and probe substrate can be provided to the electrical connection of probe 124.
Therefore, cable 110, probe 104 and electric connector 114 provide power path between tester (not shown) and probe card assembly 108, and probe card assembly 108 extends to probe 124 with these power paths.Therefore, when the terminals (not shown) of wafer (not shown) on probe 124 and the wafer 112 contacted, cable 110, measuring head 104, electric connector 114 and probe card assembly 108 provided a plurality of power paths between tester (not shown) and wafer (not shown).The tester (not shown) writes test data by these power paths to the wafer (not shown), and turns back to tester (not shown) in response to the response data that this test data produces by these power paths by the wafer (not shown).
Usually the wafer (not shown) of test wafer 112 is favourable on specified temp or temperature range.For this reason, heating element or cooling element (not shown) can be included in other position in the platform 106 or in the check-out console 102 so that heat or cool wafers 112 in test process.And the wafer (not shown) of wafer 112 can produce heat.Thisly can cause wafer 112 and probe substrate 122 to expand or shrink from heating/cooling element (not shown) or from the heating of wafer (not shown) operation or cooling, thereby change the position of terminals (not shown) on probe 124 and the wafer 112, this can cause general the departing between probe 124 and the terminals (not shown) on the plane of level that be in Figure 1A.(this horizontal plane is designated as on the direction of " x, y " in Figure 1A and is called " x, y " hereinafter and moves.In Figure 1A, the direction level that is designated as " x " is across paper, is designated as the direction level turnover paper of " y ", and the direction that is designated as " z " is a vertical direction.These directions are relatively and for simplicity, and can not be considered to be restrictive.) this if " x, y " depart from and become excessive, then probe 124 no longer can contact with all terminals (not shown).
Use heating element or cooling element (not shown) to come heating or cool wafers 112 in test process, and/or the heat that is produced when tested by the wafer of wafer 112 also can cause thermal gradient between the side (hereinafter probe card assembly oriented wafer 112 1 sides are called " front side " or " wafer side ") of probe card assembly 108 oriented wafers 112 and probe card assembly opposition side (hereinafter the opposition side of probe card assembly is called " rear side " or " tester side ").This thermal gradient can cause probe card assembly 108 crooked or distortions.If this bending is towards wafer 112, then probe card assembly 108 may be with excessive defeating to wafer 112, and damage wafer 112 or probe card assembly 108.If this bending deviates from wafer 112, the then contact of the terminals (not shown) on partly or entirely can move in the probe 124 (generally in vertical direction) the Cheng Buyu wafer 112 for Figure 1A.If probe 124 does not contact with the terminals (not shown), then the wafer (not shown) on the wafer 112 will be failed because of error detector.(towards or deviate from moving in Figure 1A of wafer 112 and be designated as " z " direction, and be called " z " hereinafter and move.)
Usually, follow closely in the check-out console with heating (or cooling) platform 106 and install after the probe card assembly 108, probe card assembly 108 will carry out thermoinduction and move.Move and to stop and the position of probe card assembly 108 just can be stablized after only reaching sufficient temperature balance between the front side of probe card assembly 108 and rear side.Certainly, to need not be the desirable balance that front side temperature and the rear side temperature of probe card assembly 108 accurately equates for this balance; On the contrary, front side temperature or rear side temperature only need enough near making the structure of probe card assembly 108 can resist hot moving.Reach this temperature balance or be commonly referred to " heat balance time " or " hot dipping time (thermalsoak time) " near the required time of balance.
Usually, probe substrate 122 directly appends on the distributing board 120, and the latter appends to again on the test head plate 121 on the check-out console 102.Shown in Figure 1B, test head plate 121 forms the perforate 132 that is suitable for probe substrate 122 (illustrating) as Figure 1A in check-out console 102.Test head plate 121 can comprise the hole 134 that is used for probe card assembly 108 is fixed to the bolt on the test head plate 121.(clamping or other technology except bolt also can be used for probe card assembly 108 is appended to test head plate 121.) distributing board 120 makes by thermoinduction " x, y " and " z " are moved responsive especially printed circuit board material usually.The improvement technology that the thermoinduction of offsetting probe card assembly moves (comprising that " x, y " moves and " z " moves) and reduces heat balance time is desirable.
Summary of the invention
According to some embodiment of probe card assembly, probe card assembly can directly be appended to a metal reinforcing plates, and this metal reinforcing plates is configured to probe card assembly is appended to check-out console.Wiring substrate can be provided to the electrical connection of probe assembly.Wiring substrate can append to stiffening plate make wiring substrate relatively stiffening plate expand and shrink.Stiffening plate can have physical strength and/or the rigidity bigger than distribution substrate, and therefore comparable wiring substrate moves thermoinduction and/or is out of shape more insensitive.Stiffening plate also can have the thermal expansivity lower than distribution substrate.
According to some embodiment of probe card assembly, truss-frame structure can be appended to stiffening plate with further reinforcement and/or just changed stiffening plate opposing thermoinduction and moved.Can comprise governor motion to regulate the orientation and/or the shape of stiffening plate with respect to truss-frame structure.
According to some embodiment of probe card assembly, can be to the additional pillar construction of truss-frame structure.When probe card assembly was appended to check-out console, the clip on the measuring head can be clamped pillar construction, added measuring head intensity so that further strengthen probe card assembly opposing thermoinduction and move to truss-frame structure.
According to some embodiment of probe card assembly, can heat radiator be set so that heat is transferred to the rear side of probe card assembly from the probe card assembly front side.Except heat radiator or replace, can use fan or heat pump.
According to some embodiment of probe card assembly, the temperature control device can be set with at test electronic device heating and/or cooling probe assembly in the probe assembly.Like this, thermoinduction expansion or the contraction that the probe assembly is inflatable or electron device is mated in contraction.
Description of drawings
Figure 1A illustrates the side view of exemplary prior art check-out console, measuring head and probe card assembly.Cut-open view provides the partial interior view of check-out console.
Figure 1B is illustrated in the check-out console of Figure 1A under the situation that does not have probe card assembly and the stereographic map of measuring head.
Fig. 2 A illustrates the vertical view of the exemplary probe card assemblies of some embodiment according to the present invention.
Fig. 2 B illustrates the upward view of the probe card assembly of Fig. 2 A.
Fig. 2 C illustrates the cross-sectional side view of the probe card assembly of Fig. 2 A.
Fig. 3 A illustrates the distributing board of probe card assembly of Fig. 2 A of some embodiment according to the present invention.
Fig. 3 B illustrates the stiffening plate of probe card assembly of Fig. 2 A of some embodiment according to the present invention.
Fig. 4 is the wiring substrate of Fig. 2 A of some embodiment according to the present invention and the synoptic diagram of probe assembly.
Fig. 5 A illustrates an exemplary probe assembly and exemplary the adding/governor motion of some embodiment according to the present invention.
Fig. 5 B illustrates the exemplary arrangement of additional/governor motion on the space convertor of probe assembly of Fig. 5 A of some embodiment according to the present invention.
Fig. 6 is the simplified block diagram that another exemplary probe card assemblies of some embodiment according to the present invention is shown.
Fig. 7 A illustrates the truss-frame structure of the probe card assembly of Fig. 6 of some embodiment according to the present invention and the vertical view of stiffening plate.
Fig. 7 B illustrates the truss-frame structure of the probe card assembly of Fig. 6 of some embodiment according to the present invention and the cross-sectional side view of stiffening plate.
Fig. 8 illustrates the truss-frame structure that is used for relative Fig. 7 A of some embodiment according to the present invention and regulates the block diagram of the system of stiffening plate orientation automatically.
Fig. 9 A illustrates the another exemplary probe card assemblies of some embodiment according to the present invention.This probe card assembly is illustrated as being installed in the exemplary check-out console of some embodiment according to the present invention.
Fig. 9 B illustrates the pillar construction of Fig. 9 A and the detailed view of clip.
Figure 10 A illustrates the vertical view of an exemplary probe card assemblies again of some embodiment according to the present invention.
Figure 10 B illustrates the upward view of the probe card assembly of Figure 10 A.
Figure 10 C illustrates the cross-sectional side view of the probe card assembly of Figure 10 A.
Figure 11 A illustrates the vertical view of another exemplary probe card assemblies of some embodiment according to the present invention.
Figure 11 B illustrates the upward view of the probe card assembly of Figure 11 A.
Figure 11 C illustrates the cross-sectional side view of the probe card assembly of Figure 11 A.
Figure 12 A illustrates the vertical view of the another exemplary probe card assemblies of some embodiment according to the present invention.
Figure 12 B illustrates the cross-sectional side view of the probe card assembly of Figure 12 A.
Figure 13 A, 13B and 13C illustrate an exemplary probe card assemblies again of some embodiment according to the present invention and have the part side view of the platform of wafer to be tested.
Figure 14 illustrates an exemplary probe assembly that can use with the probe card assembly of Figure 13 A, 13B and 13C of some embodiment according to the present invention.
Figure 15 illustrates the example process of aiming at of the process monitoring that is used for testing wafer on a temperature range of some embodiment according to the present invention and correcting probe and wafer terminals.
Figure 16 illustrates the example system that can realize Figure 15 process on its of according to the present invention some embodiment.
Figure 17 illustrates exemplary check-out console, probe card assembly and the wafer that Figure 16 monitor example is shown of some embodiment according to the present invention.
Figure 18 illustrates an exemplary probe assembly of some embodiment according to the present invention.
Figure 19 illustrates the exemplary probe card assemblies from the combination of features of other probe card assembly described herein of illustrating of according to the present invention some embodiment.
Embodiment
This instructions is described illustrative embodiments of the present invention and application.Yet the present invention is not limited to these illustrative embodiments and application, the perhaps mode of illustrative embodiments and application operating or the mode of description in this article.
Fig. 2 A, 2B, 2C, 3A and 3B illustrate the exemplary probe card assemblies 200 that opposing " z " direction heat moves that is configured to of according to the present invention some embodiment.(, move and to comprise mobile, distortion, bending, warpage etc. as employed in this article.) Fig. 2 A is the vertical view of probe card assembly 200, Fig. 2 B is its upward view and Fig. 2 C is its cross-sectional side view.(in Fig. 2 A and 2B, " x " direction be level across paper, " y " direction is vertical in paper, and " z " is though direction is illustrated as the turnover-paper of crooked a little being perpendicular to-promptly; In Fig. 2 C, " x " direction be level across paper, " y " is though direction is illustrated as the turnover-paper of crooked a little being perpendicular to-promptly, and " z " direction is vertical in paper.These directions only provide unrestricted for illustrating and describing purpose.) Fig. 3 A only illustrates the vertical view of wiring substrate 204, and Fig. 3 B only illustrates the vertical view of stiffening plate 202.Though the check-out console 102 and the measuring head 104 that are not limited to Figure 1A and 1B use, check-out console and measuring head 104 that the exemplary probe card assemblies 200 shown in Fig. 2 A, 2B and the 2C can be used for Figure 1A and 1B replace probe card assembly 108.
Shown in Fig. 2 A, 2B and 2C, probe card assembly 200 can comprise stiffening plate 202, wiring substrate 204 and probe assembly 222.Shown in Fig. 2 B and 2C, probe assembly 222 can comprise a plurality of probes 224, but probe 124 shown in these probe image patterns 1A equally is configured to contact with terminals (not shown) on the semiconductor wafer (not shown) to be tested.Probe 224 (or probe described herein any) can be flexible conductive structure.Probe 224 can be flexible conductive structure.Suitably the non-limiting example of probe 224 comprises the composite structure that is formed by the heart yearn that joins the conductive terminal (not shown) on the probe assembly (for example as probe assembly 222) to, be coated with on this heart yearn as U.S. Patent No. 5,476,211, U.S. Patent No. 5,917,707 and U.S. Patent No. 6,336,269 described resilient materials.Probe 224 can also be the structure that etching forms, such as U.S. Patent No. 5,994,152, U.S. Patent No. 6,033, and 935, U.S. Patent No. 6,255,126, U.S. Patent No. 6,945, and 827, U.S. Patent Publication No.2001/0044225 and the disclosed spring element of U.S. Patent Publication No.2004/0016119.Other non-limiting example of probe 224 is in U.S. Patent No. 6,827, and 584, open among U.S. Patent No. 6,640,432, U.S. Patent No. 6,441,315 and the U.S. Patent Publication No.2001/0012739.Other non-limiting example of probe 224 comprises power spring pin, projection, column, press-working spring (stamped spring), pin, camber beam etc.
Wafer (not shown) to be tested can right and wrong be singly got the wafer of semiconductor crystal wafer (for example wafer 112 of image pattern 1A), is singly got wafer (for example supporting in the carrier (not shown)), the wafer that forms multi-chip module or any other configuration of wafer to be tested.As can be seen, wiring substrate 204 can be provided to the power path of probe assembly 222, and stiffening plate 202 can provide mechanical stability to probe assembly 222.
Shown in Fig. 2 A, 2B and 2C, thereby wiring substrate 204 can comprise the measuring head connector 208 that can be used for holding electric connector 114 and be electrically connected with measuring head 104 (with reference to Figure 1A).Measuring head connector 208 can be a zero-force connector or be used to engage spring pad from the spring needle of measuring head 104 for example.(synoptic diagram of wiring substrate 204 and probe assembly 222 is shown) as shown in Figure 4, power path 402 can be configured to pass wiring substrate 204 and arrive electrical connection 404, and it also can be connected to power path 406 and pass probe assembly 222 to tat probe 224.Wiring substrate 204 and probe assembly 222 provide a plurality of power paths thus with being electrically connected 404 between measuring head connector 208 and probe 224.
Referring again to Fig. 2 A, 2B and 2C, wiring substrate 204 can provide the ability of power path as mentioned above (Fig. 4 402) at it and select.For example, wiring substrate 204 can be a printed circuit board material, this printed circuit board material can comprise the multi-layer insulation (not shown) as known in the art, and the conductive trace (not shown) can be formed with the through hole (not shown) with the interconnection of the trace (not shown) on the different layers on these insulation material layers.
Fig. 5 A illustrates an example of the complicated probe assembly 222 that can use with the probe card assembly shown in Fig. 2 A, 2B and the 2C 200.In Fig. 5 A, probe assembly 222 can comprise two space convertors 518 and two inserts 520.Each space convertor 518 can mechanically append to stiffening plate 202 (only illustrating with partial view among Fig. 5 A) by differential screw assemblies 502 (following description in further detail).Each space convertor can comprise the probe 224 that is used for contact measured examination electron device (not shown).Insert 520 can provide between wiring substrate 204 and space convertor 518 and be electrically connected.Each insert 520 can comprise distributing board (for example being made by printed circuit board material) and the power spring element 512 and 508 that extends from insert 520 both sides, and the power path 510 (for example conductive through hole) that passes insert 520 provides between wiring substrate 204 and space convertor 518 and is electrically connected.For example, power spring element 512 can be similar to probe 224 with 508.
Get back to Fig. 2 A, 2B and 2C probe card assembly 200 discussion and with reference to the mechanical function that can provide by stiffening plate 202, shown in Fig. 2 A, 2B and 2C, machanical fastener 216 can mechanically append to stiffening plate 202 with probe assembly 222.Shown in Fig. 2 C, machanical fastener 216 passes the hole 242 in the wiring substrate 204.Therefore, probe assembly 222 does not directly append to wiring substrate 204.Like this, wiring substrate 204 also can separate from probe assembly 222 calorifics.
In Fig. 5 A, the machanical fastener that probe assembly 222 (insert 510 among Fig. 5 A and space convertor 518) is fixed in stiffening plate 202 can be a differential screw assemblies 502.Each differential screw assemblies 502 can comprise the screw (or bolt) 504 that is screwed in the nut 506, and nut 506 itself is screwed in the stiffening plate 202.Therefore, sidecar has screw thread holding screw 504 in the nut, and nut 506 outsides also car have screw thread to make nut 506 can be screwed in the stiffening plate 202.Shown in Fig. 5 A, screw 504 passes hole 242 in the wiring substrate 204 and the hole 514 in the insert 520.Screw 504 is screwed into the threaded column 516 that is additional to space convertor 518.The hole 242 of passing wiring substrate 204 can comprise exceptional space, and this exceptional space makes wiring substrate 204 can move (for example expand and shrink) relative to stiffening plate 202 and probe assembly 222 as described below.
By a nut 506 of one of adjusting part 502, the part that corresponding threaded column 516 on the space convertor 518 is added pulls to stiffening plate 202 or pushes away stiffening plate 202.By using a plurality of this differential screw assemblies 502 that is additional to space convertor 518 different pieces separately, the planar orientation of space convertor 518 relative stiffening plates 202 can be regulated.
Fig. 5 B illustrates an exemplary space convertor 518 that can add nine threaded columns 516.Fig. 5 B also illustrates nine screws 504 that are screwed into nine nuts 506 and nine columns 516.(for the purpose of clear and simple declaration, such as other element of stiffening plate 202 not shown in Fig. 5 B.Yet as mentioned above and shown in Fig. 5 A, nut 506 is screwed in the stiffening plate 202.) rotating nut 506 on first direction, the zone that corresponding threaded column 516 on the space convertor 518 is added pulls to stiffening plate 202.On the contrary, rotating nut 506 in the opposite direction, and the zone that threaded column 516 on the space convertor 518 is added pushes away stiffening plate 202.With what become apparent be the planar orientation of 224 additional surfaces 540 of probe even shape stiffening plate 202 and changing relatively all on the space convertor 518.The corresponding spacing of the spacing of screw 502 and nut 506 internal threads and nut 506 externally threaded spacings can be selected to and allow the position of column 516 relative stiffening plates 202 to carry out fine tuning.
Because shown in Fig. 2 C, the stiffening plate 202 of probe card assembly is affixed to a plate 121 of check-out console 102, and probe 224 (can be arranged to two-dimensional array) can be affixed to space convertor 518 (forming the part of probe assembly 222 shown in Fig. 2 C), so with respect to stiffening plate 202 planar orientation of the mutually correct plates 121 in probe 222 tips of having regulated the planar orientation of space convertors 518 or shape adjustment, thereby when probe card assembly 200 was additional to plate 121, the tip was can wafer terminals (not shown) to be tested relatively flattened.
The quantity of the differential screw assemblies 502 shown in Fig. 5 A and 5B and position only are exemplary.Can use more or less this assembly 502, and these assemblies 502 can be configured to be different from the pattern that is orientated shown in orientation shown in Fig. 5 A and Fig. 5 B.The quantity and spacing of column 516 can be selected by the mode of any amount.For example, but the quantity and spacing using system block mold of column 516 and finite element analysis are selected to carry out sensitivity study.In addition, do not need to use differential screw assemblies 502.In fact, can use other mechanism that probe assembly 222 is fixed to stiffening plate 202.For example, the slit nut differential screw assemblies can be used to replace screw assembly 502.Slit nut can allow the preload screw thread, and this can prevent backlash.As another example, some in the screw assembly 502 can by space convertor 518 can be pushed away stiffening plate 202, but the assembly that space convertor 518 can not be pulled to stiffening plate 202 substitutes.
Return the discussion of the probe card assembly 200 of Fig. 2 A, 2B and 2C once more, shown in Fig. 2 C, in probe card assembly 200, stiffening plate 202-but not wiring substrate 204-can be configured to the be fixed to test head plate 121 (referring to Figure 1B) of check-out console 102.In the exemplary probe card assemblies shown in Fig. 2 A, 2B, the 2C 200, strengthen structure 202 and can comprise radial arm 210.As in Fig. 2 B and 2C best as seen, stiffening plate 202 also can comprise and is arranged on the thin slice in the groove 302 226 in the wiring substrate 204.The hole 206 and 228 of passing radial arm 210 and thin slice 226 is corresponding to the hole 134 in the test head plate 121 (referring to Figure 1B), and probe card assembly 200 can by pass in radial arm 210 and the thin slice 226 hole 206 and 228 and the bolt 142 that passes the through hole 134 of test head plate 121 append to test head plate 121 (referring to Figure 1B).(in Fig. 2 C, test head plate 121 is shown in broken lines the same with the bolt/nut that is used for probe card assembly 200 is bolted to test head plate 121.)
Therefore, it is evident that: because stiffening plate 202 is bolted to test head plate 121 and probe assembly 222 is affixed to stiffening plate 202, so stiffening plate 202 can provide mechanical stability to probe assembly 222.Stiffening plate 202 can be selected at its intensity and the mobile ability of opposing heat.For example, stiffening plate 202 (with thin slice 226) can comprise usually bigger and to the metal (for example aluminium) that moves, bending, warpage etc. have stronger opposing than distribution substrate 204 (for example as mentioned above, wiring substrate 204 is made by printed circuit board material usually) intensity.Other non-limiting example of making the material of stiffening plate 202 (with thin slice 226) comprises stainless steel, titanium, nickel, invar (ex invar), kovar (kovar), graphite epoxy resin, metal matrix material, pottery etc.In addition, can use alloy or any above-mentioned material and other mixtures of material of any above-mentioned material.Should it is evident that stiffening plate 202 and thin slice 226 can form with probe assembly 222 append to detecting head plate 121 metal construction.
Fig. 2 A, 2B, 2C, 3A and 3B also illustrate and can be implemented to reduce another technology that probe 224 thermoinductions move.As mentioned above, typical 204 pairs of thermoinduction motion sensitives of wiring substrate.In the example shown in Fig. 2 A, 2B, 2C, 3A and the 3B, wiring substrate 204 can append to stiffening plate 202 makes wiring substrate 204 to be radially expanded and to shrink.That is, stiffening plate 202 and probe assembly 222 move radially wiring substrate 204 relatively.This has reduced to expand in response to the variation of environment temperature because of wiring substrate 204 on the stiffening plate 202 or shrink the power that produces.
Shown in Fig. 2 A and 2C, wiring substrate 204 can be fixed to stiffening plate 202 in its position (for example usually at the center).Shown in Fig. 2 A, 2C, 3A and 3B, screw or bolt 214 can be used for wiring substrate 204 is fixed to stiffening plate 202.This screw or bolt 214 can pass the hole 316 (referring to Fig. 3 B) in (or being screwed into) stiffening plate 202, and twist (or inserting) and go into the threaded hole 252 in the wiring substrate 204 (referring to Fig. 3 A).
The space can be set or adopt other measure, be used to allow wiring substrate 204 to deviate from that screw 214 is radially expanded or towards screw 214 radial shrinkage.For example, in Fig. 2 A, 2B and 2C, additional bolts 212 and nut 232 prevent that wiring substrate 204 from rotating with respect to stiffening plate 202.As seen the hole 246 that bolt 212 passes in the wiring substrate 204 can be elongated as best in Fig. 3 A, thereby provides the space for the expansion and the contraction of wiring substrate 204.Can be similarly in wiring substrate 204 machanical fastener 216 pass in the hole 242 of probe assembly 222 being fixed in stiffening plate 202 exceptional space to be set.This exceptional space allows wiring substrate 204 to expand and shrinks.Exceptional space can be set in the groove 302 of wiring substrate 204 similarly to expand and contraction to allow wiring substrate 204.On wiring substrate 204 surfaces, can randomly be provided with lubricated, the supporting or other means (not shown) so that wiring substrate 204 moves relative to stiffening plate 202 and probe assembly 222.
Fig. 6 illustrates the simplified block diagram that is configured to resist another mobile exemplary probe card assemblies 600 of heat of some embodiment according to the present invention.Probe card assembly 600 can be roughly the same with probe card assembly 200, but added truss-frame structure 604.The stiffening plate 202 of probe card assembly 600, wiring substrate 204 and probe assembly 222 can be identical with the element of similar name in the probe card assembly 200 and label, and, in Fig. 6, illustrate and do not have an above details that illustrates and describe about probe card assembly 200 with block diagram format for simple and be easy to explanation.(side view of probe card assembly 600 is shown) as shown in Figure 6, truss-frame structure 604 can be fixed to stiffening plate 202.As can be seen, truss-frame structure 604 can be further to help the probe card assembly 600 additional reinforcement structure that opposing thermoinduction " z " moves and/or machinery moves.
Fig. 7 A of truss-frame structure 604 and stiffening plate 202 and the details that 7B illustrates an exemplary truss-frame structure 604 only are shown.(Fig. 7 A illustrates vertical view, and Fig. 7 B illustrates the cross-sectional side view of truss-frame structure 604 and stiffening plate 202.)
Shown in Fig. 7 A and 7B, truss-frame structure 604 can be fixed to stiffening plate 202.Can use any appropriate device that truss-frame structure 604 is fixed to stiffening plate 202.In Fig. 7 A and 7B, a plurality of screws (or bolt) 614 pass the hole (not shown) in the truss-frame structure 604 and are screwed in the corresponding aperture (not shown) in the stiffening plate 202.In the exemplary truss-frame structure 604 shown in Fig. 7 A and 7B, the part in the screw 614 is passed the main body of truss-frame structure 604, and the part in the screw 614 is passed the arm 628 that extends from truss-frame structure 604 main bodys.
Truss-frame structure 604 can be designed to stiffening plate 202 combination to make up the bigger composite structure that unit weight rigidity ratio (stiffness-per-weight ratio) can reach during for single solid construction than truss-frame structure 604 and stiffening plate 202.Truss-frame structure 604 can comprise hollow space but not be solid.Exemplary truss-frame structure 604 shown in Fig. 7 A and the 7B can comprise a plurality of foursquare hollow space 620 and a plurality of rectangle or flattened oval shape hollow spaces 618 of being generally of being generally.Certainly, the quantity of hollow space and shape are not crucial, and can use the hollow space of any other quantity and shape.Hollow space 618,620 can be provided to the path of machanical fastener 216 (not shown in Fig. 6,7A and the 7B).For example, in Fig. 7 A, the hole 314 in the stiffening plate 202 of machanical fastener 216 can be by the part in the square hollow space 620 as seen.
Because structure 604 can comprise hollow space 618 and 620, so it is heavy unlike solid construction.Yet, physical strength-be rigidity effect-can be the function of the thickness of structure 604 usually.Therefore, structure 604 has the fact of hollow space 618 and 620 to be represented, for given thickness, truss-frame structure 604 is lighter than solid construction weight, but the physical strength with the identical size of solid construction can be provided usually.
Because truss-frame structure 604 increases to probe card assembly 200 and strengthens intensity, so can do stiffening plate 202 thinner.Generally speaking, stiffening plate 202 is thin more, and the heat balance time of probe assembly 600 is short more.As mentioned above, follow closely in the check-out console with heating (or cooling) platform 106 (for example 102 of Figure 1A) after the installation probe card assembly, probe card assembly just experiences thermoinduction usually and moves.(being that significantly moving of probe card assembly stops) being stablized in the position of probe card assembly only reach abundant thermal equilibrium between probe card assembly front side and rear side after.(in Fig. 6, the front side is designated as 690 and rear side is designated as 692.) similarly, as described above, this balance does not need the front side temperature of probe card assembly to equal the desirable balance of rear side temperature; On the contrary, front side temperature and rear side temperature only need enough approaching, stop but the perception of probe card assembly is moved.As mentioned above, reach this temperature balance or be commonly referred to hot dipping time or heat balance time near the required time of balance.Stiffening plate 202 is thin more, the thermal mass of stiffening plate 202 is more little, thus with stiffening plate 202 heating (or cooling) to equaling or to be substantially equal to time of probe card assembly 600 front side temperature short more.Therefore, the thin more heat balance time of stiffening plate 202 is short more.
The heat balance time of probe card assembly 600 can further obtain by between stiffening plate 202 and truss-frame structure 604 the heat proof material (not shown) being set reducing.The heat proof material (not shown) can be isolated truss-frame structure 604 and stiffening plate 202 heat, to eliminate or to reduce any influence of 604 pairs of heat balance times of truss-frame structure.Because truss-frame structure 604 is heat insulation with stiffening plate 202, so have only stiffening plate 202-but not also have truss-frame structure 604-need reach roughly temperature balance (as mentioned above) with the front side (wafer side) of probe card assembly.
Therefore in addition, because truss-frame structure 604 has hollow space 618 and 620,, and remain on usually or near environment temperature so truss-frame structure 604 can be used as similar heating radiator.This is because the space 618 in the truss- frame structure 604 and 620 allows air around truss-frame structure 604 circulations and take away any unnecessary heat (if perhaps air ratio truss-frame structure 604 is warmmer then heat truss-frame structure 604) of accumulation in truss-frame structure 604.No matter but the thermoinduction that this expression truss-frame structure 604 self can not experience the perception level (is at " z " direction or " z; y if moving " direction), this has further removed the influence (and increase therefore) of the heat balance time of 604 pairs of probe card assemblies 600 of truss-frame structure.
Referring to Fig. 6, in test process, the electron device of being tested 680 can be placed the front side 690 of probe card assembly 600 certainly once more.If electron device 680 is heated, then the thermal source (not shown) also can be in the front side 690 of probe card assembly 600.Therefore, thermal gradient can be set up from front side 690 to the rear side 692 of probe card assembly 600.By arrow 682 expressions, wherein the direction indicated temperature of arrow reduces this thermal gradient in Fig. 6.If the value of thermal gradient 682 is known or can be by approximate evaluation, then the material of probe assembly 222, stiffening plate 202 and truss-frame structure 604 can be selected such that and all expand separately or shrink same amount.That is, probe assembly 222 can be made by the low material of thermal expansivity, makes it in response to its preferred temperature in thermograde 682 and the about distance to a declared goal " d " that expands.Stiffening plate 202 under the temperature lower than probe assembly 222 can be made by the higher material of expansion coefficient, make it in response to its (lower) preferred temperature in thermograde 682 also expansion phase with distance to a declared goal " d ".Truss-frame structure 604 under the temperature lower than stiffening plate 202 can be made by the higher material of thermal expansivity, make it in response to its same expansion phase of (lower) preferred temperature in thermograde 682 with distance to a declared goal " d ".
Shown in Fig. 7 A and 7B, probe card assembly 600 can comprise and is used to regulate the governor motion 616 of stiffening plate 202 with respect to the position of truss-frame structure 604.Governor motion 616 shown in Fig. 7 A and the 7B can be to comprise the differential screw assemblies that is screwed into the screw 632 in the threaded nut 634 separately, and nut 634 self is screwed into truss-frame structure 604, as above about differential screw assemblies 502 general descriptions.That is, screw 632 also is screwed in the threaded column 636 that is additional to stiffening plate 202.As above described about differential screw assemblies 502, nut 634 pulls to truss-frame structure 604 in the rotation of a direction with threaded column 636 (and therefore the part of add of the column 636 on the stiffening plate 202), and nut 634 rotation in the opposite direction with threaded column 636 (and so stiffening plate 202 on column 636 part of being added) push away truss-frame structure 604.As should be conspicuous, use a plurality of this governor motion 616 (for example differential screw) that is arranged on diverse location place on truss-frame structure 604 and the stiffening plate 202 to allow the planar orientation even the shape of stiffening plate 202 to regulate with respect to truss-frame structure 604.
Using differential screw assemblies only is exemplary as governor motion 616; Can use other mechanism of the planar orientation that is used to regulate stiffening plate 202 relative truss-frame structures 604.For example, the available mechanism that only stiffening plate 202 is pushed away truss-frame structure 604 of one or more differential screw assemblies (for example 616) replaces.For example, threaded column 636 can be removed, make screw 632 press to stiffening plate 202 or be arranged on screw 632 and stiffening plate 202 between mechanical organ (for example Metal Ball).In this configuration, cause screw 632 to press to stiffening plate 202, and therefore stiffening plate 202 is pushed away truss-frame structure 604 at first direction rotating screw 632.Yet, rotate in an opposite direction screw 632 and only draw back screw 632 and do not spur stiffening plate 202 from stiffening plate 202.The spring-feel mechanism (not shown) can be set to be come to truss 604 biasing stiffening plates 202.No matter use the governor motion 616 of what type, can use than Fig. 7 A and the more or less governor motion 616 of 7B.
The detection that probe 224 is moved can realize directly or indirectly by any proper method.For example, sensor can be used for detecting this moving.In the example shown in Fig. 7 A and 7B, strainometer 622 can be arranged on the stiffening plate 202 that comprises chamber 638 to monitor the strain level on stiffening plate 202 ad-hoc locations.At four this sensors 622 shown in Fig. 7 A, but can use more or less sensor 622.Because probe assembly 222 is directly appended to stiffening plate 202, so the supervision of strain on the stiffening plate 202 has been monitored moving of probe 224 indirectly.Indicate probe to move maybe may to move if detect enough strains on stiffening plate 202, then governor motion 616 can optionally be activated and be offset detected strain and/or prediction is moved.Certainly, can use the sensor 622 that is different from strainometer.The example of other sensor comprises the sensor based on laser that moves of the probe that is used for surveillance probes card assembly 600 or another part, and the sensor that is used for contacting between surveillance probes 224 and the wafer (not shown) resistance that is connected.
Fig. 8 illustrates and is used to monitor the mobile or distortion of stiffening plate 202 and regulates stiffening plate 202 to offset the system that moves or be out of shape.The output 706 of sensor 622 (for example strainometer) can be output to display 702 by processor 704 processing and result.Processor 704 can be microprocessor or the controller that for example moves under software (including but not limited to firmware or microcode) control, and display 702 can be typical graphoscope.Operating personnel's viewable display 702, and definite stiffening plate experience move or distortion after control governor motion 616 and offset this and move or be out of shape.Fig. 8 also illustrates processor 704 output control signals 710 and comes driving actuator 712 rotating nuts 634 to regulate another alternative of stiffening plate 202.For example, this actuator 712 can be a precision step motor (not shown).
Fig. 9 A and 9B illustrate an exemplary probe card assemblies 900 (shown in check-out console 802) again.Probe card assembly 900 can be roughly similar to probe card assembly 600, and can comprise and the similar name of probe card assembly 600 and identical probe assembly 222, distributing board 204, stiffening plate 202 and the truss-frame structure 604 of element of label.Shown in Fig. 9 A, probe card assembly 900 also can comprise the pillar construction 820 that can be fixed to truss-frame structure 604.Removable clip 822 appends to measuring head 804, otherwise measuring head 104 similar (for example cable 810 or other communication media are connected to the tester (not shown) with measuring head 804) among this measuring head 804 and Figure 1A.Check-out console 802 also can be similar to the check-out console 102 of Figure 1A.Shown in Fig. 9 A, probe card assembly 900 can by bolt 842 be bolted to can be similar to the detecting head plate 121 of Figure 1A detecting head plate 834.Notice that Fig. 9 A comprises the section 850 that appears probe assembly 222 and have the platform 906 of wafer 912.Platform 906 can be similar with the platform 106 of Figure 1A, and wafer to be tested 912 can right and wrong be singly got the wafer of semiconductor crystal wafer (for example wafer 112 of Figure 1A), singly got wafer (for example carrying in the carrier (not shown)), the wafer that forms multi-chip module or any other configuration of wafer to be tested.
Shown in Fig. 9 A, in case probe card assembly 900 is arrived detection head plate 834 by bolt (842), clip 822 just can be clamped pillar construction 820 equally.Clip 822 can append to measuring head 804, and the intensity that therefore increases measuring head 804 moves with the thermoinduction of opposing probe card assembly 900.Shown in Fig. 9 A, clip 822 can append to rigidity bar, plate or other structure 874 that is arranged in the measuring head 804.
Shown in Fig. 9 B, pillar construction 820 can comprise column 830 and can append to the additional substrate 832 of truss-frame structure 604 by bolt, welding or any other suitable means (not shown).Clip 822 can comprise vertical moving (with respect to Fig. 9 B) actuator 824 and can also level and/or rotation move.Rigid plate 825 can append to actuator 824, and moveable arm 826 can append to rigid plate 825.Each moveable arm 826 comprises folder pad 828.
At first, actuator 824 can depart from the location with clip 822, shown in dotted line among Fig. 9 B.In that afterwards, actuator 824 can align clip 822 with column 830, shown in dotted line 890 among Fig. 9 B to detecting head plate 834 (be shown be spirally connected 842 to detecting head plate 834 at Fig. 9 A middle probe card assembly 900) with probe card assembly 900 bolts (842).Then, actuator 824 removable clips 822 make rigid plate 825 and column 830 near, shown in dotted line 892 among Fig. 9 B.Removable then moveable arm 826 makes folder pad 828 clamp column 830, shown in the solid line among Fig. 9 B and Fig. 9 A.As mentioned above, it is mobile that the intensity of measuring head 804 can reach the thermoinduction " z " that can bear probe card assembly 900.
Figure 10 A, 10B and 10C illustrate another exemplary probe card assemblies 1000, this assembly as Figure 10 A, 10B with can comprise shown in the 10C and the similar name of probe card assembly 200 and similar probe assembly 222, wiring substrate 204 and the stiffening plate 202 of element of label.Shown in Figure 10 B and 10C, probe card assembly 1000 also can comprise the heat radiator 1002 that is arranged on probe card assembly 1000 front sides.The heat radiator 1002 that comprises perforate 1004 for probe assembly 222 can be made by the material with high heat conductance, and can use the add ons 1006 that has high heat conductance equally to append to stiffening plate 202.In the example shown in Figure 10 C, each add ons 1006 can comprise the screw 1008 that is screwed into the threaded column 1014 on the heat radiator 1001.Screw 1008 passes threaded hole (not shown) in the stiffening plate 202 and the hole 1012 in the wiring substrate 204.Hole 1012 in the wiring substrate can comprise that exceptional space expands or contraction to allow wiring substrate, and is described as above correlogram 2A, 2B and 2C.Threaded column 1014 can be near stiffening plate 202, and column 1014 and screw 1008 can be made by Heat Conduction Material.
What it should be obvious that is that heat radiator 1002 and heat conduction add ons 1006 can provide a plurality of high heat conductance path of from probe card assembly 1002 front sides to stiffening plate 202 (rear side of probe card assembly 1002).When probe card assembly 1000 is bolted to check-out console (for example probe card assembly 900 among the image pattern 9A), heat radiator 1002 thereby towards the platform (for example 906 among Fig. 9 A) of carrying institute testing wafer (not shown).If this is heated or cooled, if perhaps the wafer (not shown) produces in test process or absorbs a large amount of heats, then heat radiator 1002 and add ons 1006 thereby a plurality of low thermal resistive path can be provided are to be transmitted to heat probe card assembly 1000 rear sides or to be transmitted to the front side from rear side from probe card assembly 1000 front sides.This can reduce probe card assembly 1000 front sides and rear side reaches the required time of temperature balance, and therefore reduces the heat balance time of probe card assembly 1000.This can help the temperature balance between maintenance probe card assembly 1000 front sides and the rear side equally in test process.The machanical fastener 216 (referring to Fig. 2 C) that probe assembly 222 is appended to stiffening plate 202 also can comprise Heat Conduction Material, and therefore is provided for heat is transmitted to from probe assembly 222 (in the front side of probe card assembly 1000) the additional low thermal resistive path of stiffening plate 202 (at the rear side of probe card assembly 1000).
Though not shown in Figure 10 A, 10B or the 10C, but can the heat-barrier material (not shown) be set around stiffening plate 202 and transfer to the heat dissipation of stiffening plate 202 in stiffening plate 202 ambient airs by above-mentioned thermally conductive pathways (for example, heat radiator 1002 and heat conduction add ons 1006 and/or probe assembly 222 and machanical fastener 216) to slow down or to prevent.If truss-frame structure 604 is appended to stiffening plate 202 (as shown in Figure 6), then also can the heat-barrier material (not shown) be set around truss-frame structure 604.Though not shown in Figure 10 A, 10B or the 10C, but can in the thermally conductive pathways between heat radiator 1002 and the stiffening plate 202, thermal diode be set, and it is configured to close, and stop thermal energy conduction when therefore between the front side of probe card assembly 1000 or rear side, reaching thermal equilibrium (or another predetermined condition).
Exemplary probe card assemblies 1100 shown in Figure 11 A, 11B and the 11C illustrates an alternative of heat radiator 1002.In exemplary probe card assemblies 1100, fan 1102 is extracted into air the rear side of probe card assembly 1100 from the front side of probe card assembly 1100.Shown in Figure 11 A, 11B and 11C, fan 1102 is extracted into from the front side of probe card assembly 1100 air the rear side of probe card assembly 1100 by the passage 1104 and 1106 wiring substrate 204 and the stiffening plate 202.(arrow 1110 illustrates the direction of air-flow.) same, this front side and rear side that can reduce probe card assembly 1100 reaches the required time of thermal equilibrium, and therefore reduces the heat balance time of probe card assembly 1100.This also can help to keep the front side of probe card assembly 1100 and the temperature balance between the rear side in test process, thereby eliminates or the thermoinduction that reduces wafer (not shown) test process middle probe card assembly 1100 at least moves.Certainly, gas channel 1104 and 1106 each can replace by a plurality of smaller channels.Fan 1102 and passage 1104,1106 thereby the front side of heat from probe card assembly 1100 can be transmitted to the rear side of probe card assembly 1100 or be transmitted to the front side from rear side.
Figure 12 A illustrates the probe card assembly 1200 roughly similar to the probe card assembly 1100 of Figure 11 A, 11B and 11C with 12B, and its difference is that fan 1104 is replaced by the fan 1204 that is arranged in shell 1202.Be that shell 1202 can append to stiffening plate 202, thereby form the chamber 1206 shown in Figure 12 B.Fan 1204 passes through passage 1104 and 1106 extracting airs wiring substrate 204 and the stiffening plate 202 from probe card assembly 1200 front sides.Shown in Figure 12 B, air also passes chamber 1206 and passes on stiffening plate 202 equally.(air-flow is illustrated by arrow 1210.) same, this front side and rear side that can reduce probe card assembly 1200 reaches the required time of temperature balance, and therefore reduces the heat balance time of probe card assembly 1200.This also can help in test process to keep the front side of probe card assembly 1200 and the temperature balance between the rear side, also can eliminate or the thermoinduction that reduces wafer (not shown) test process middle probe card assembly 1200 at least moves.Fan 1204 and passage 1104,1106 can be transmitted to heat the rear side of probe card assembly 1200 from the front side of probe card assembly 1200, perhaps be transmitted to the front side from rear side.Gas channel 1104 and 1106 each can replace by a plurality of smaller channels.
Figure 13 A, 13B and 13C illustrate another exemplary probe card assemblies 1300.Probe card assembly 1300 can comprise installation/distribution structure 1302 and have probe assembly 1322 with the roughly the same probe (probe 1324a-d is shown) of probe 224.Installation/distribution structure 1302 (illustrating with partial view in Figure 13 A, 13B and 13C) can provide electric wiring that comes and goes linking probe head assembly 1322 and the structure that is installed to check-out console.Installation/distribution structure 1302 generally illustrates in Figure 13 A, 13B and 13C, because it is intended to represent to be suitable for any structure that is provided to the distribution of probe assembly 1322 and is used to be installed to the structure of check-out console.For example, installation/distribution structure 1302 can be simply to being wiring substrate 120 similar standard wiring substrates with Figure 1A.Perhaps, installation/distribution structure 1302 can comprise one or more in distributing board, stiffening plate, truss-frame structure and the pillar construction of or similar configuration similar to pillar construction 820 among truss-frame structure 604 among wiring substrate 204 and stiffening plate 202, Fig. 7 A and the 7B and Fig. 9 A and the 9B among Fig. 2 A, 2B and the 2C.As another example, installation/distribution structure 1302 can comprise coaxial cable interface (not shown) or other connector that is connected by interface with the tester (not shown).An example (not shown) of coaxial cable interface is open in U.S. Patent Application Publication No.2002/0195265.
Sometimes wish testing semiconductor wafer on an operating temperature range.Promptly when sending test signal to wafer via probe card assembly is round, the temperature of wafer is (or opposite) from the low temperature change to the higher temperature.Yet, have potential problems.Because wafer can be made by the different different materials of thermal expansivity usually with the probe assembly, so wafer and probe component responds expand or contraction with different rates in temperature variation.For example, the probe assembly can be likened to the higher stupalith of the silicon of wafer typical material by thermal expansivity and make.
Figure 13 A and 13B illustrate this problem.In Figure 13 A, the probe 1324a-d of probe card assembly 1300 is contacted with the terminals 1344 of one or more wafers 1312 to be tested.(wafer 1312 can right and wrong be singly got the wafer of semiconductor crystal wafer (for example wafer 112 of image pattern 1A), is singly got wafer (for example being supported on the carrier (not shown)), the wafer that forms multi-chip module or any other configuration of wafer to be tested.) (in Figure 13 A, 13B, installation/distribution structure 1302, semiconductor wafer 1312 and platform 1306 are illustrated as partial view.As mentioned above, probe card assembly 1300 can be installed in the check-out console (not shown), and platform 1306 can be in check-out console.) in this example, the temperature of wafer 1312 rises, and causes wafer 1312 and probe card assembly 1322 to expand in response to temperature rises.Yet wafer 1312 to be expanding greater than the speed of probe assembly 1322, and finally shown in Figure 13 B, probe 1324a-d no longer aims at the terminals of wafer 1312.In the example of Figure 13 B, corresponding terminals 1344 with it so depart from and make to lose between probe 1324d and the terminals 1344 and contact thereby probe 1324d becomes.(wafer is represented by arrow 1330 in Figure 13 B with respect to the clean expansion of probe assembly 1322.)
The temperature control device that can activate probe assembly 1322 departing from of correcting probe 1324a-d and terminals 1344.That is, can activate temperature control device 1340 comes a heated probe assembly 1322 to make its amount identical or approximate with wafer 1312 that expand.In Figure 13 C, the after-expansion of the probe assembly 1322 that is caused by temperature control device 1340 can be by arrow 1332 expressions.Shown in Figure 13 C, this expansion causes probe 1324a-d to aim at again with terminals 1344.
Certainly, cool off if desired to keep probe 1324a-d to aim at the wafer terminals 1344 of wafer 1312 on given Range of measuring temp, then temperature control device 1340 can cool off probe assembly 1322 selectively.In fact, control the temperature of probe assembly 1322 independently by the temperature of such and wafer 1312, wafer 1312 can detect on the bigger temperature range that may reach than other method, keeps probe 1324a-d and wafer terminals 1344 to aim at simultaneously.Therefore, temperature control device 1340 thereby can be used for position (for example lateral attitude) such as control probe 1324a-1324d in wafer 1312 test processs.
In one embodiment, the part that the probe 1324a-d of probe assembly 1322 is installed comprises stupalith, and wafer 1312 comprises silicon.In the maximum temperature following time that can be on probe assembly 1322 probe 1324a-d be positioned in the temperature range that probe assembly 1322 and wafer 1312 all be in the wafer (not shown) that detects wafer 1312, aim at the terminals 1344 on the wafer 1312.Therefore, in the wafer measuring process of wafer 1312, under the highest probe temperature, probe 1324a-d aims at wafer terminals 1344 naturally and need not to change the temperature of probe assembly 1322, and under all lower temperatures, can be by temperature control device 1340 (therefore be a heater element) heated probe assembly 1322 so that probe 1324a-d aim at wafer terminals 1344.
In some embodiments, probe assembly 1322 can comprise having the multilager base plate that is arranged on the one or more conductive material layers between one or more insulation material layers.Figure 14 illustrates an example of this multilager base plate of some embodiment according to the present invention.As shown in the figure, probe assembly 1322 can comprise a plurality of layers 1410,1412 of electrically insulating material (for example pottery).Though (two layers 1410,1412 are shown, can use more or less layer.) conductive spacer or trace 1402,1404,1426 can or be set on it between insulation course 1410,1412, and the conductive through hole (not shown) can pass one of layer 1410,1412 or both are provided with to be electrically connected pad or the trace on the different layers.As shown in figure 14, probe 1324a-d can append to pad 1404, and pad 1402 can be provided to the electrical connection of installation/distribution structure 1302 (referring to Figure 13 C).Passing layer 1410 through hole (not shown), trace (for example 1426 between the layer 1410,1412 and pass the through hole (not shown) of layer 1412) can be electrically connected one of pad 1402 with one of pad 1404.
The conductive material that produces heat at electric current during by this material is an example of temperature control device 1340.In other example, temperature control device 1340 can comprise the pipe that heating and cooling liquid or gas are passed through.In addition, temperature control device 1340 can be set at outside the probe assembly 1322.
Figure 15 illustrates the aiming at of the probe that is used for monitoring probe card assembly when wafer sort process wafer temperature variations and wafer terminals, and as any detected process 1500 that departs from the temperature of regulating the probe assembly of compensation requiredly.Figure 16 illustrates the simplified block diagram of the system 1600 that is used for implementation procedure 1500, and Figure 17 illustrates exemplary test head 1704 and check-out console 1704 that the process of Figure 15 can be used thereon.
As shown in figure 15, process 1500 can begin (1502) by probe card assembly is installed in check-out console.With reference to the example shown in Figure 17, probe card assembly 1300 can be bolted to (can comprise installation/distribution structure 1302 and probe assembly 1322 as mentioned above) the detecting head plate 1732 of check-out console 1702.Referring again to Figure 15, can make the probe of probe card assembly contact (1504) with the terminals of wafer to be tested.For example, as shown in figure 17, wafer 1312 can place on the platform 1706 of check-out console 1702, and the terminals 1321 of the wafer (not shown) of platform 1706 removable wafers 1312 are to contact with the probe 1324 of probe card assembly 1300.At 1506 of Figure 15, can test wafer.In example shown in Figure 17, the tester (not shown) produces test data, test data can be sent to measuring head 1704 and be sent to the wafer (not shown) of wafer 1312 by probe card assembly 1300 via cable 1710, and the response data that is produced by the wafer (not shown) can send back the tester (not shown) by probe card assembly 1300, measuring head 1704 and cable 1710.Though (not shown, can illustrate measuring head 1704 is connected to probe card assembly 1300 with Figure 1A in 114 similarly be connected.) at 508 of Figure 15,, can change the temperature of wafer when when 1506 pairs of wafers are tested.For example, the platform among Figure 17 1706 can comprise well heater and/or the refrigeratory that is used to heat and/or cool off wafer 1312.Though change chip temperature at 1506 testing wafers and 1508, the process of Figure 15 judges 1510 whether probe and wafer terminals are still suitably aimed at.If then the process 1500 of Figure 15 continue to detect wafers 1506, in 1508 temperature that change wafers, and at the aligning of 1510 surveillance probes and wafer terminals.Yet if judge that 1510 probes and wafer terminals no longer suitably aim at, process 1500 changes the temperature of probe assemblies and checks once more 1510 1512 aims at, up to probe and terminals as illustrated in fig. 15 once more till the aligning.Though (not shown, in case 1506 wafer sorts finish, repeat 1512 and 1510 successfully do not make yet for several times probe and terminals aim at after or other reason, the process 1500 that can provide measure to finish Figure 15.)
Figure 16 illustrates 1510 and 1512 the example system that is used to realize Figure 15.As shown in figure 16, system 1600 can comprise according to the processor 1604 that is stored in software (including but not limited to microcode or the firmware) operation in the storer 1604.Processor 1604 can receive input 1610 from monitor 1606, whether judgement represents that from the input 1610 of monitor 1606 probe and wafer terminals depart from aligning (Figure 15 1510), and if, the temperature control device in the probe assembly 1608 output control signals 1612 (Figure 15 1512) then.Temperature control device 1608 can be any in the temperature control device described relatively of above and Figure 13 A-13C and 14A-14D.
Certainly, an example of camera 1720 and 1722 monitor 1606 that just can use with the system 1600 of Figure 16.As another example, alignment mark 1724 and 1726 can replace with the target pad on another in the probe on one of in probe assembly 1322 or the wafer and probe assembly 1322 or the wafer 1312, wherein the output of target pad is corresponding to the signal of probe location on the target pad, and this signal is indicated probe assembly 1322 relatively moving with respect to wafer 1312.
As the alternative of feedback control procedure shown in Figure 15 1500, the system of Figure 17 can operate under the situation of FEEDBACK CONTROL not having.That is, the system of Figure 17 can not operate under the situation of surveillance probes 1324 and wafer terminals 1726 1510.Replace, the temperature of probe assembly 1322 can be according to changing 1512 in the wafer temperature variations of 1508 wafers 1312.The simplification version of the process 1500 of this Figure 15 can be specially adapted to the known and predictable situation of relation between the temperature of the position of its middle probe 1324 and wafer 1312.
Figure 18 illustrates an exemplary probe assembly 1322, and it is another example of the realization of the probe assembly 1322 shown in Figure 13 A, 13B and the 13C.As shown in figure 18, probe assembly 1322 comprises a plurality of probe substrates 1808 (show two, but can comprise more than two).A plurality of probes 1812 (can be identical with probe 224) can append to each probe substrate 1808, and are arranged to wafer (not shown) terminals to be tested and contact.Each probe substrate 1808 can append to additional structure 1802, and additional structure 1802 can be as shown in FIG. 13A with the above append to installation/distribution structure 1302.Probe substrate 1808 can append to additional structure 1802 by any proper method, including, but not limited to using bolt, screw, clip, bonding agent etc.
As shown in figure 18, each probe substrate 1808 can comprise as the expansion of the above Figure 13 of being relevant to A, 13B and 13C general description or the temperature control device 1810 of contraction probe substrate 1808.As shown in figure 18, additional structure 1802 also can comprise with identical general fashion expansion that as above is relevant to Figure 13 A, 13B and 13C description or the temperature control device 1804 that shrinks additional structure 1802.Because probe substrate 1808 appends to additional structure 1802, so expansion or contraction additional structure 1802 can influence the position of probe substrate 1808.Therefore, can provide two-stage control with the roughly similar temperature control device 1804 and 1810 of temperature control device 1340 among Figure 13 A, be used for respect to the wafer terminals (not shown) position probe 1812 on institute's testing wafer (not shown): the temperature control device 1804 of additional structure 1802 influences the position of probe substrate 1808, and temperature control device 1810 influences in each probe substrate 1808 append to the position of the probe 1812 of probe substrate 1808.
Alternative as the temperature control device 1340 shown in Figure 13 A, 13B and 13C (or the temperature control device 1426 shown in Figure 14 C and 14D), can apply mechanical force to stretch or compression probe assembly 1322 to probe assembly 1322, make its expansion or contraction to mate the expansion and the contraction of the wafer of being tested 1312 (as Figure 13 A, 13B and 13C, illustrating).For example, threaded column (not shown) can append to the periphery of probe assembly 1322, and threaded actuator (not shown) is used for applying pulling force or force of compression to stretch respectively or compression probe assembly 1322 to probe assembly 1322.As example, this pulling force can be applied to probe assembly 1322 to stretch (expansion) probe assembly 1322, shown in the transformation of Figure 13 B to Figure 13 C (shown in arrow 1332 among Figure 13 C).As another alternative, can use temperature control device 1340 and be used for expanding or shrinking probe assembly 1322 to the mechanical devices that probe assembly 1322 applies mechanical force.In a similar fashion, be used for that mechanical devices (not shown) that additional structure 1802 and probe substrate 1808 to Figure 18 apply mechanical force can replace or use in conjunction with the temperature control device 1804 and 1810 of Figure 18.
Various technology as herein described can variously combine use.Figure 19 illustrates and can comprise the above Fig. 2 of being relevant to A, 2B and the distributing board 204 of 2C description and the exemplary probe card assemblies 1800 of stiffening plate 202.Probe card assembly 1800 also can comprise the truss-frame structure 604 that the above Fig. 6 of being relevant to, 7A and 7B describe.The pillar construction 820 similar with the pillar construction of 9B description to being relevant to 9A can append to truss-frame structure 604.Probe card assembly 1800 also can comprise the heat radiator 1002 that the above Figure 10 of being relevant to A, 10B and 10C describe.Probe card assembly 1800 can comprise the probe assembly 1322 with temperature control device 1340 that the above Figure 13 of being relevant to A, 13B, 13C, 14A, 14B, 14C and 14D describe.The probe card assembly 1800 of Figure 19 has made up the feature from probe card assembly 200,600,900,1000 and 1300.
Other combination also is possible.For example, probe card assembly 1800 can comprise the fan of similar fan 1102 or 1204 and be similar to air duct 1104 in probe card assembly 1100 and 1200 and 1106 air duct, with replace heat radiator 1002 or with its combination.As another example, truss-frame structure 604 can remove from probe card assembly 900, and pillar construction 820 can append to stiffening plate 202.As another example, truss-frame structure 604 can append to the stiffening plate 202 (shown in Fig. 7 A and 7B) of probe assembly 1000,1100 or 1200.It also is possible also having other combination.
Though this paper has described each illustrative embodiments of the present invention and application, be not intended to the present invention is limited to these illustrative embodiments and application, perhaps be limited to the mode of operating or describe these illustrative embodiments and application herein.In fact, many variations and the change to illustrative embodiments all is possible.For example, though describe each embodiment herein in the context of testing semiconductor wafer, the present invention is so not limited, but can be used for wherein testing by sensitive detection parts or monitoring any equipment, system or the environment of this device.
As another example, in the exemplary card assembly shown and described herein some are shown to have a probe assembly (for example 222 shown in Fig. 2 C), but any in these probe card assemblies is configurable the more than one probe assembly that comprises one group of probe is separately arranged, and the probe assembly can be arranged to form the big probe array that comprises many group probes on each probe assembly.Non-limiting example with probe card assembly of a plurality of probe assemblies is No.11/165 at the sequence number that is entitled as " Method And Apparatus For Adjusting AMulti-Substrate Probe Structure (regulating the method and apparatus of many substrates probe structure) " of submission on June 24th, 2005, shown in 833 the U.S. Patent application.This probe card assembly can be configured to that each probe assembly can be independent of other probe assembly and move separately.
Claims (31)
1. probe card assembly comprises:
Strengthen structure, be configured to append to proving installation;
Detecting structure comprises and is arranged to a plurality of probes of contacting with electron device to be tested, and described detecting structure is additional to described reinforcement structure regularly makes described reinforcement structure can resist moving of described detecting structure; And
Wiring substrate, being configured to provides electrical interface to described detecting structure, and described wiring substrate appends to described reinforcement structure movably.
2. probe card assembly as claimed in claim 1 is characterized in that, described reinforcement structure has the physical strength bigger than described wiring substrate.
3. probe card assembly as claimed in claim 1 is characterized in that, described reinforcement structure is a metal construction.
4. probe card assembly as claimed in claim 1 is characterized in that, described detecting structure is appended to described reinforcement structure by direct mechanical.
5. probe card assembly as claimed in claim 1 is characterized in that, described wiring substrate can be radially expanded from the position that described wiring substrate appends to described reinforcement structure or shrink.
6. probe card assembly as claimed in claim 5 is characterized in that, the described position that described wiring substrate appends to described reinforcement structure is the center of described wiring substrate.
7. probe card assembly as claimed in claim 1 is characterized in that, also comprises the truss-frame structure that appends to described reinforcement structure.
8. probe card assembly as claimed in claim 7 is characterized in that, also comprises being configured to optionally change the governor motion of described reinforcement structure with respect to the orientation of described truss-frame structure.
9. probe card assembly as claimed in claim 8 is characterized in that described governor motion comprises differential screw assemblies.
10. probe card assembly as claimed in claim 8 is characterized in that described governor motion can be configured to optionally change the shape of described reinforcement structure.
11. probe card assembly as claimed in claim 1 is characterized in that, also comprises being configured to optionally change the governor motion of described detecting structure with respect to the orientation of described stiffening plate.
12. probe card assembly as claimed in claim 11 is characterized in that, described governor motion comprises differential screw assemblies.
13. probe card assembly as claimed in claim 11 is characterized in that, described governor motion is configured to optionally change the shape of described stiffening plate.
14. probe card assembly as claimed in claim 1 is characterized in that, also comprises being used to be convenient to heat is delivered to an opposite side of described probe card assembly from a side of described probe card assembly device.
15. probe card assembly as claimed in claim 1 is characterized in that, also comprises being used for regulating the device of described detecting structure with respect to the position of described reinforcement structure when described detecting structure appends to described reinforcement structure.
16. probe card assembly as claimed in claim 1 is characterized in that, described electron device comprises semiconductor wafer.
17. probe card assembly as claimed in claim 1, it is characterized in that, described detecting structure is included in the additional probe substrate that described probe is arranged on the surface, and described reinforcement structure can be resisted described detecting structure moving on the direction on the described surface that is approximately perpendicular to described probe substrate.
18. probe card assembly as claimed in claim 1, it is characterized in that, described detecting structure is included in the additional probe substrate that described probe is arranged on the surface, and described wiring substrate can move on the direction on the described surface that is roughly parallel to described probe substrate with respect to described reinforcement structure.
19. probe card assembly as claimed in claim 1, it is characterized in that, described detecting structure is included on the surface the additional probe substrate that described probe is arranged, and described probe card assembly also comprises and is used for the device that optionally expands on the direction on described surface and/or shrink described detecting structure being roughly parallel to.
20. probe card assembly as claimed in claim 1 is characterized in that, also comprises the device of the lateral attitude that is used for optionally controlling described probe.
21. probe card assembly as claimed in claim 1 is characterized in that, also comprises the temperature control element of the temperature that is configured to change described detecting structure.
22. probe card assembly as claimed in claim 1 is characterized in that, also comprises being configured to engage to resist the pillar construction that moves of described detecting structure with the structural detail of described testing apparatus.
23. probe card assembly as claimed in claim 1, it is characterized in that, the outside of described reinforcement structure is configured to append to described testing apparatus, and described probe card assembly also comprises the pillar construction that moves that is configured to engage with the structural detail of described testing apparatus with the inside of resisting described reinforcement structure.
24. a method of making probe card assembly, described method comprises:
Setting is configured to append to the reinforcement structure of testing apparatus;
Regularly detecting structure is appended to described reinforcement structure and make described reinforcement structure can resist moving of described detecting structure, described detecting structure comprises and is configured to a plurality of probes of contacting with electron device to be tested; And
Wiring substrate is appended to described reinforcement structure make described wiring substrate to move with respect to described reinforcement structure, described wiring substrate provides an electrical interface between described detecting structure and described testing apparatus.
25. method as claimed in claim 24 is characterized in that, described reinforcement structure has the physical strength bigger than described interface structure.
26. method as claimed in claim 24 is characterized in that, described reinforcement structure is a metal construction.
27. method as claimed in claim 24 is characterized in that, comprises that also described wiring substrate is appended to described reinforcement structure makes described wiring substrate to be radially expanded from the position that described wiring substrate appends to described reinforcement structure or to shrink.
28. method as claimed in claim 27 is characterized in that, described position is the center of described wiring substrate.
29. method as claimed in claim 24 is characterized in that, also comprises truss-frame structure is appended to described reinforcement structure.
30. method as claimed in claim 29 is characterized in that, also comprises the heat transfer conduit of setting from described probe card assembly one side to an opposite side of described probe card assembly.
31. method as claimed in claim 24 is characterized in that, described electron device comprises semiconductor wafer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59456205P | 2005-04-19 | 2005-04-19 | |
| US60/594,562 | 2005-04-19 | ||
| US11/306,515 | 2005-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101512354A true CN101512354A (en) | 2009-08-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800127133A Pending CN101512354A (en) | 2005-04-19 | 2006-04-18 | Apparatus and method for managing thermally induced motion of a probe card assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101512354A (en) |
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| CN104769224A (en) * | 2012-11-07 | 2015-07-08 | 西门子能量股份有限公司 | Modular drop-in transition assembly for industrial gas turbine and method for installation |
| TWI612316B (en) * | 2017-05-22 | 2018-01-21 | 京元電子股份有限公司 | High-Lower Temperature Switch Test Module |
| CN108603915A (en) * | 2016-02-29 | 2018-09-28 | 泰拉丁公司 | The thermal control of probe card assembly |
| CN109541423A (en) * | 2017-09-21 | 2019-03-29 | 德州仪器公司 | Multi-plate semiconductor wafer test system |
| CN110618370A (en) * | 2018-06-04 | 2019-12-27 | 苏州能讯高能半导体有限公司 | Testing device |
| CN111426891A (en) * | 2019-11-19 | 2020-07-17 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN112240945A (en) * | 2019-07-17 | 2021-01-19 | 中华精测科技股份有限公司 | Improved structure of wafer probe card |
| CN115267503A (en) * | 2022-08-01 | 2022-11-01 | 镭神技术（深圳）有限公司 | Automatic chip testing equipment |
| CN116298863A (en) * | 2023-02-01 | 2023-06-23 | 深圳市致诚达科技有限公司 | Quick inspection system and control method for BLDC motor production line |
| CN117250383A (en) * | 2023-11-20 | 2023-12-19 | 安盈半导体技术(常州)有限公司 | Probe card grafting structure |
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| CN104769224A (en) * | 2012-11-07 | 2015-07-08 | 西门子能量股份有限公司 | Modular drop-in transition assembly for industrial gas turbine and method for installation |
| CN104769224B (en) * | 2012-11-07 | 2017-05-31 | 西门子能量股份有限公司 | Modelling block for industry gas turbine is with transition parts and installation method |
| US11280827B2 (en) | 2016-02-29 | 2022-03-22 | Teradyne, Inc. | Thermal control of a probe card assembly |
| CN108603915A (en) * | 2016-02-29 | 2018-09-28 | 泰拉丁公司 | The thermal control of probe card assembly |
| TWI612316B (en) * | 2017-05-22 | 2018-01-21 | 京元電子股份有限公司 | High-Lower Temperature Switch Test Module |
| CN109541423A (en) * | 2017-09-21 | 2019-03-29 | 德州仪器公司 | Multi-plate semiconductor wafer test system |
| CN109541423B (en) * | 2017-09-21 | 2023-09-15 | 德州仪器公司 | Multi-plate type semiconductor wafer testing system |
| CN110618370A (en) * | 2018-06-04 | 2019-12-27 | 苏州能讯高能半导体有限公司 | Testing device |
| CN110618370B (en) * | 2018-06-04 | 2022-02-01 | 苏州能讯高能半导体有限公司 | Testing device |
| CN112240945A (en) * | 2019-07-17 | 2021-01-19 | 中华精测科技股份有限公司 | Improved structure of wafer probe card |
| CN111426891A (en) * | 2019-11-19 | 2020-07-17 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN115267503A (en) * | 2022-08-01 | 2022-11-01 | 镭神技术（深圳）有限公司 | Automatic chip testing equipment |
| CN116298863A (en) * | 2023-02-01 | 2023-06-23 | 深圳市致诚达科技有限公司 | Quick inspection system and control method for BLDC motor production line |
| CN117250383A (en) * | 2023-11-20 | 2023-12-19 | 安盈半导体技术(常州)有限公司 | Probe card grafting structure |
| CN117250383B (en) * | 2023-11-20 | 2024-02-02 | 安盈半导体技术(常州)有限公司 | Probe card grafting structure |
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