CN112718550A - Test sorting device applied to test electronic elements - Google Patents
Test sorting device applied to test electronic elements Download PDFInfo
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- CN112718550A CN112718550A CN202011436506.9A CN202011436506A CN112718550A CN 112718550 A CN112718550 A CN 112718550A CN 202011436506 A CN202011436506 A CN 202011436506A CN 112718550 A CN112718550 A CN 112718550A
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- temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H3/00—Air heaters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/20—Arrangement or mounting of control or safety devices
- F24H9/2064—Arrangement or mounting of control or safety devices for air heaters
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- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application relates to a test sorting device applied to testing electronic elements, which comprises a machine table and a test chamber arranged on the machine table; the machine table is also provided with heat exchange equipment connected with the test chamber through a pipeline, the heat exchange equipment carries out cold and heat exchange on externally input gas and then inputs the gas into the test chamber, and the gas input into the test chamber is used for adjusting the test temperature of the test chamber; the machine table is further provided with a refrigerant substance compression device connected with the heat exchange device through a pipeline, the refrigerant substance compression device is used for compressing refrigerant substances and providing the refrigerant substances for the heat exchange device, the problem that in the related art, a refrigerant conveying device and a testing device are inconvenient to carry is solved, and the carrying convenience of the testing and sorting device is improved.
Description
Technical Field
The application relates to the technical field of high and low temperature testing, in particular to a testing and sorting device applied to testing electronic elements.
Background
Most of electronic devices are used in different temperature environments, and in order to simulate the device performance of electronic components in high and low temperature environments, the electronic components need to be placed in corresponding temperature environments for performance testing so as to distinguish defective products.
In the related technology, the sorting device is provided with a feeding device and a receiving device in the front section area of the top surface of the machine platform, the feeding device is provided with an electronic component to be tested, the receiving device is provided with a tested electronic component, the machine platform is provided with a testing device and a transferring device, the sorting device is provided with a testing chamber on the machine platform, a plurality of pressure connectors and testing seats are arranged in the testing chamber for testing the electronic component, and the transferring device transfers the electronic component among the feeding device, the receiving device and the testing device; when the pressure connector of the testing device presses the electronic component to execute the testing operation, the electronic component generates high temperature, and in order to keep the electronic component at the preset testing temperature, the pressure connector of the testing device is connected with a refrigerant conveying device to perform heat dissipation operation in the testing process; the refrigerant conveying device is arranged on the side outside the machine table and is independently provided with a box body, a connecting frame is arranged between the box body and the machine table and is used for assembling a plurality of refrigerant units comprising an evaporator, a compressor, a condenser, an expander and the like, and the conveying pipes are used for respectively outputting/inputting refrigerants. However, the box body of the refrigerant conveying device and the testing device are respectively and independently configured, and the first control valve, the second control valve, the conveying pipe with a relatively long distance and the connecting pipe are additionally arranged between the box body and the testing device, so that the conveying of the refrigerant conveying device and the testing device is not facilitated.
At present, aiming at the problems that in the related art, a box body of a refrigerant conveying device and a testing device are respectively and independently configured, and the refrigerant conveying device and the testing device are inconvenient to carry, an effective solution is not provided.
Disclosure of Invention
The embodiment of the application provides a test sorting unit for testing electronic elements, which is used for at least solving the problem that a refrigerant conveying device and a testing device in the related art are inconvenient to carry.
In a first aspect, an embodiment of the present application provides a test sorting apparatus for testing electronic components, where the apparatus includes a machine platform and a test chamber disposed on the machine platform;
the machine table is also provided with heat exchange equipment connected with the test chamber through a pipeline, the heat exchange equipment carries out cold and heat exchange on externally input gas and then inputs the gas into the test chamber, and the gas input into the test chamber is used for adjusting the test temperature of the test chamber;
the machine table is further provided with a refrigerant substance compression device connected with the heat exchange device through a pipeline, and the refrigerant substance compression device is used for compressing refrigerant substances and providing the refrigerant substances for the heat exchange device.
In some embodiments, a cavity is disposed below the machine platform, and the refrigerant substance compression device is disposed in the cavity.
In some embodiments, the apparatus further includes a drying device connected to the heat exchange device through a pipeline, and the drying device dries an externally input gas and inputs the gas into the heat exchange device.
In some of these embodiments, a replaceable cartridge is provided in the drying apparatus.
In some embodiments, a heating device is further disposed on the machine platform, the heating device is located near the test chamber, one end of the heating device is connected to the heat exchange device through a pipeline, the other end of the heating device is connected to the test chamber through a pipeline, and the heating device heats the gas subjected to heat and cold exchange to reach a gas temperature required by the test chamber.
In some embodiments, a gas distribution block is arranged inside the test chamber, the gas distribution block is connected with the heating device, and the gas distribution block inputs gas output by the heating device into the test chamber to reach the required gas temperature of the test chamber.
In some embodiments, the heating device is located inside the test chamber, and one end of the heating device is connected with the heat exchange device, and the other end of the heating device is connected with the gas distribution block.
In some of these embodiments, the apparatus further comprises a processor;
the processor obtains the testing temperature of the testing area in the testing chamber, and adjusts the gas outlet temperature of the refrigerant substance compression equipment and the working temperature of the heating equipment according to the testing temperature.
In some embodiments, the processor is further configured to adjust an operating temperature of the heating device according to the test temperature and a preset temperature.
In some embodiments, if the test temperature is lower than the preset temperature, the processor adjusts the working temperature of the heating device up;
and if the test temperature is higher than the preset temperature, the processor adjusts the working temperature of the heating equipment downwards.
In some embodiments, before the processor adjusts the operating temperature of the heating device according to the test temperature and the preset temperature, the processor is further configured to obtain a device temperature at the heating device, and compare the device temperature with a preset safety upper temperature limit;
and under the condition that the equipment temperature is greater than or equal to the upper limit of the safety temperature, the processor closes the heating equipment, and under the condition that the equipment temperature is less than the upper limit of the safety temperature, the processor adjusts the working temperature of the heating equipment according to the test temperature and the preset temperature.
Compared with the related art, the test sorting device applied to the test of the electronic element provided by the embodiment of the application comprises a machine table and a test chamber arranged on the machine table; the machine table is also provided with heat exchange equipment connected with the test chamber through a pipeline, the heat exchange equipment carries out cold and heat exchange on externally input gas and then inputs the gas into the test chamber, and the gas input into the test chamber is used for adjusting the test temperature of the test chamber; the machine table is further provided with refrigerant substance compression equipment, the refrigerant substance compression equipment is used for compressing refrigerant substances and providing the refrigerant substances for the heat exchange equipment, the problem that conveying of a refrigerant conveying device and a testing device in the related technology is inconvenient is solved, and the convenience in conveying of the testing and sorting device is improved.
The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below to provide a more thorough understanding of the application.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a first schematic diagram of a test handler apparatus for testing electronic components according to an embodiment of the present application;
FIG. 2 is a second schematic diagram of a test handler apparatus for testing electronic components according to an embodiment of the present application;
FIG. 3 is a third schematic diagram of a test handler apparatus for testing electronic components according to an embodiment of the present application;
FIG. 4 is a block diagram of a test handler for testing electronic components according to an embodiment of the present application;
FIG. 5 is a fourth schematic diagram of a test handler apparatus for testing electronic components according to an embodiment of the present application;
FIG. 6 is a block diagram of the interior of a test chamber according to an embodiment of the present application;
FIG. 7 is a first flowchart of a temperature control method according to an embodiment of the present application;
FIG. 8 is a second flowchart of a temperature control method according to an embodiment of the present application;
FIG. 9 is a flow chart of a method of adjusting an operating temperature of a heating device according to an embodiment of the present application;
FIG. 10 is a flow chart III of a temperature control method according to an embodiment of the present application;
fig. 11 is a block diagram of a temperature control device according to an embodiment of the present application;
fig. 12 is a schematic diagram of an internal structure of a computer device according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided in the present application without any inventive step are within the scope of protection of the present application.
It is obvious that the drawings in the following description are only examples or embodiments of the present application, and that it is also possible for a person skilled in the art to apply the present application to other similar contexts on the basis of these drawings without inventive effort. Moreover, it should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of ordinary skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments without conflict.
Unless defined otherwise, technical or scientific terms referred to herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which this application belongs. Reference to "a," "an," "the," and similar words throughout this application are not to be construed as limiting in number, and may refer to the singular or the plural. The present application is directed to the use of the terms "including," "comprising," "having," and any variations thereof, which are intended to cover non-exclusive inclusions; for example, a process, method, system, article, or apparatus that comprises a list of steps or modules (elements) is not limited to the listed steps or elements, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The term "plurality" as referred to herein means two or more. "and/or" describes an association relationship of associated objects, meaning that three relationships may exist, for example, "A and/or B" may mean: a exists alone, A and B exist simultaneously, and B exists alone. Reference herein to the terms "first," "second," "third," and the like, are merely to distinguish similar objects and do not denote a particular ordering for the objects.
Most electronic devices are used in different temperature environments, and in order to simulate the device performance of electronic components in high and low temperature environments, the electronic components need to be placed in a responsive temperature environment for performance testing to distinguish defective products. The application provides a be applied to test sorting unit of test electronic component can make electronic component test at predetermined test temperature within range.
The embodiment of the application provides a test sorting device applied to testing electronic elements, which comprises a machine table and a test chamber arranged on the machine table; the machine table is also provided with heat exchange equipment connected with a test chamber pipeline, the heat exchange equipment carries out cold and heat exchange on externally input gas and then inputs the gas into the test chamber, and the gas input into the test chamber is used for adjusting the test temperature of the test chamber; the machine table is also provided with refrigerant substance compression equipment connected with the heat exchange equipment through a pipeline, and the refrigerant substance compression equipment is used for compressing refrigerant substances and providing the refrigerant substances for the heat exchange equipment;
in the test sorting device, the test chamber, the heat exchange equipment and the refrigerant substance compression equipment are all arranged on the same machine table, so that the problem that in the related technology, the refrigerant conveying device and the test device are inconvenient to carry due to the fact that the box body of the refrigerant conveying device and the test device are respectively and independently arranged is solved, and the carrying convenience of the test sorting device is improved; and secondly, the pipeline between the refrigerant substance compression equipment and the heat exchange equipment is shortened, and the loss of gas heat is reduced.
It should be noted that a testing area is disposed in the testing chamber of the machine platform, and the testing area is used for placing the electronic component to be tested in the testing chamber. Fig. 1 is a schematic view of a test sorting apparatus applied to test electronic components according to an embodiment of the present application, in which, as shown in fig. 1, heat exchange equipment performs heat and cold exchange on externally input gas, and the gas after heat and cold exchange by the heat exchange equipment enters a test chamber; alternatively, the heat exchange device may be a plate heat exchanger, and the gas input into the plate heat exchanger exchanges heat with cold fluid in the plate heat exchanger and then reaches the test chamber.
It should be further noted that the refrigerant substance compression device is connected with the heat exchange device, the refrigerant substance compression device is used for compressing the refrigerant substance and providing the refrigerant substance for the heat exchange device, the refrigerant substance refers to a refrigerant, namely, external hot gas enters the heat exchange device, cold gas from the refrigerant substance compression device also enters the heat exchange device, external gas and the refrigerant substance complete heat exchange at the heat exchange device, and the refrigerant substance from the refrigerant substance compression device reaches the heat exchange device and then returns to the refrigerant substance compression device to form a cycle. After the secondary compression of the refrigerant substance is completed in the refrigerant substance compression equipment, the outlet temperature can reach-70 ℃ at the lowest, and the temperature of the refrigerant substance can be controlled between-70 ℃ and-20 ℃ according to the use requirement. The gas input into the plate heat exchanger from the outside exchanges heat with cold fluid in the plate heat exchanger and then reaches the test chamber, so that cold gas is provided for the test chamber to adjust the test temperature of the test chamber.
In some embodiments, fig. 2 is a schematic diagram of a second testing and sorting apparatus applied to testing electronic components according to an embodiment of the present application, and as shown in fig. 2, the testing and sorting apparatus applied to testing electronic components further includes a drying device disposed on the machine platform, connected to the heat exchange device through a pipeline, and disposed on the machine platform, and the drying device dries an externally input gas and inputs the gas into the heat exchange device;
specifically, the drying device dries the externally input gas, optionally, the drying device may be a dryer, and the externally input gas is filtered by the dryer and then enters the subsequent heat exchange device; because the atmospheric air contains moisture and other impurities, the atmospheric air is easy to meet condensation junctions to generate water drops, the atmospheric air is easy to pollute and block a gas circuit in the testing and sorting device, and then the gas input into the testing and sorting device from the outside is filtered by the drier and then enters subsequent equipment, so that the phenomenon that the water drops block the gas circuit in the gas circuit can be avoided, the maintenance cost of the gas circuit is reduced, and the phenomenon that the water drops short circuit an electronic element in the gas circuit can be avoided.
In some of these embodiments, a replaceable cartridge is provided in the drying apparatus; the gas comes from the gas filtered and dried by the dryer, so that the gas is pure, no water vapor is mixed, the gas path is smooth, and the risk of ice blockage is avoided; the drying equipment is provided with the replaceable filter element, and the filter element of the dryer only needs to be replaced regularly, so that the operation is convenient.
In some embodiments, a heating device is further disposed on the machine platform near the test chamber, fig. 3 is a third schematic diagram of the test sorting apparatus applied to test electronic components according to an embodiment of the present application, as shown in fig. 3, one end of the heating device is connected to the heat exchanging device pipe, the other end of the heating device is connected to the test chamber pipe, the heating device heats the gas subjected to heat and cold exchange to reach a gas temperature required by the test chamber, and optionally, the drying device may be an air heater.
In some embodiments, fig. 4 is a structural diagram of a test sorting apparatus applied to test electronic components according to an embodiment of the present application, as shown in fig. 4, a cavity 47 is disposed below a machine table 46, and a refrigerant substance compression device 42 is disposed in the cavity 47. It should be noted that the refrigerant substance compression device 42 and the test chamber 45 are arranged on the same rack, so that the machine table 46 can be conveniently carried integrally, and the refrigerant substance compression device 42 is embedded in the cavity 47 of the machine table 46, so that the noise is low, and the carrying is convenient; and in order to reduce the gas heat loss, the installation positions of the heat exchange device 41 and the heating device 43 can be as close to the electronic component testing area as possible, so as to shorten the gas transmission path.
In some embodiments, as shown in fig. 4, a gas distribution block 44 is disposed inside the testing chamber 45, the gas distribution block 44 is connected to the heating device 43, and the gas distribution block 44 inputs the gas output from the heating device 43 into the testing chamber 45 to reach the gas temperature required by the testing chamber 45. Preferably, the heating device 43 is located inside the testing chamber 45, one end of the heating device 43 is connected with the heat exchanging device 41, and the other end is connected with the gas distribution block 44; for example, after being filtered and dried by the drying device 40, the gas passes through the internal gas path to the heat exchanging device 41, and after exchanging heat with the cold fluid in the heat exchanging device 41, the gas reaches the heating device 43, and after being heated by the heating device 43, the gas reaches the gas distributing block 44, and the gas distributing block 44 inputs the gas into the testing chamber 45 to reach the gas temperature required by the testing chamber 45, wherein the cold fluid in the heat exchanging device 41 is derived from the refrigerant substance compressing device 42. It should be noted that the gas entering the testing chamber 45 is emitted from the gap of the table 46 after passing through the testing area, and no aggregated thermal gas is generated, thereby avoiding the thermal effect. In some of these embodiments, the heating device 43 is located inside the test chamber 45, and one end of the heating device 43 is connected to the heat exchanging device 41, and the other end is connected to the gas distribution block 44.
In some embodiments, fig. 5 is a schematic diagram of a test handler apparatus applied to test electronic components according to an embodiment of the present disclosure, as shown in fig. 4 and 5, the test handler apparatus further includes a processor, the processor obtains a test temperature of a test area in the test chamber 45, and adjusts a gas outlet temperature of the refrigerant substance compressing device 42 and an operating temperature of the heating device 43 according to the test temperature; and then the temperature of the testing area can be fed back to control the fluid outlet temperature of the refrigerant substance compression equipment 42 and the working temperature of the heating equipment 43, so as to achieve the effect of accurately controlling the temperature of the testing area.
Wherein fig. 6 is a structural view of the inside of a test chamber according to an embodiment of the present application, and as shown in fig. 4 and 6, a test temperature of a test area in the test chamber 45 can be obtained by a temperature sensor 60 installed at a test zone of the test chamber 45; it should be noted that the processor is further configured to adjust the working temperature of the heating device 43 according to the test temperature and the preset test temperature, and if the current test temperature is lower than the preset test temperature, the processor sends an instruction to adjust the working temperature of the heating device 43, and the heating device 43 receives the instruction and adjusts the working temperature in response to the instruction; if the current test temperature is greater than the preset test temperature, the processor sends an instruction for adjusting the working temperature of the heating device 43 down, and the heating device 43 receives the instruction and adjusts the working temperature down in response to the instruction.
In some embodiments, before the processor adjusts the working temperature of the heating device 43 according to the test temperature and the preset temperature, the processor is further configured to obtain the device temperature at the heating device 43 and compare the device temperature with the preset upper safety temperature limit; when the temperature of the heating device 43 is greater than or equal to the upper safety temperature limit, the processor issues an instruction to turn off the heating device 43, that is, the heating device 43 is powered off, for example, the upper safety temperature limit is 300 ℃, if the current temperature of the heating device 43 is greater than or equal to 300 ℃, in order to prevent the heating device 43 from being burned out due to an excessively high temperature, the heating device 43 is powered off, and the heating device 43 is protected. Under the condition that the equipment temperature is lower than the upper limit of the safety temperature, the processor adjusts the working temperature of the heating equipment 43 according to the test temperature and the preset temperature; for example, if the test temperature is less than the preset temperature, the processor issues an instruction to adjust the operating temperature of the heating device 43 up, and the heating device 43 receives the instruction and adjusts the operating temperature up in response to the instruction; if the test temperature is greater than the preset temperature, the processor issues an instruction to turn down the operating temperature of the heating device 43, and the heating device 43 receives the instruction and turns down the operating temperature in response to the instruction.
It should be noted that the device temperature at the heating device 43 can be obtained by a temperature sensor provided at the heating device 43, and the processor mentioned above can be a chip with a processing program integrated on the temperature sensor.
An embodiment of the present application further provides a temperature control method for a test sorting apparatus, where fig. 7 is a first flowchart of the temperature control method according to the embodiment of the present application, and as shown in fig. 7, the method includes the following steps:
step S701, acquiring the test temperature of a test area in a test chamber;
step S702, adjusting the gas outlet temperature of the refrigerant substance compression equipment and the working temperature of the heating equipment according to the test temperature.
Through the steps S701 to S702, the fluid outlet temperature of the refrigerant substance compression device and the working temperature of the heating device can be controlled according to the feedback of the temperature of the test area, so as to achieve the effect of accurately controlling the temperature of the test area.
In some embodiments, fig. 8 is a second flowchart of a temperature control method according to an embodiment of the present application, and as shown in fig. 8, the method includes the following steps:
step S801, adjusting the working temperature of the heating equipment according to the test temperature and the preset temperature.
In some embodiments, fig. 9 is a flowchart of a method for adjusting an operating temperature of a heating device according to an embodiment of the present application, as shown in fig. 9, the method includes the following steps:
step S901, adjusting the working temperature of the heating equipment up under the condition that the test temperature is less than the preset temperature;
and step S902, adjusting the working temperature of the heating equipment downwards under the condition that the test temperature is higher than the preset temperature.
In some embodiments, fig. 10 is a flowchart three of a temperature control method according to an embodiment of the present application, and as shown in fig. 10, before adjusting an operating temperature of a heating device according to a test temperature and a preset temperature, the temperature control method further includes the following steps:
step S1001, acquiring the equipment temperature of heating equipment;
step S1002, comparing the equipment temperature with a preset safety temperature upper limit;
step S1003, under the condition that the equipment temperature is greater than or equal to the upper limit of the safety temperature, the heating equipment is closed, and under the condition that the equipment temperature is less than the upper limit of the safety temperature, the working temperature of the heating equipment is adjusted according to the test temperature and the preset temperature;
it should be noted that, when the temperature of the device is greater than or equal to the upper limit of the safety temperature, the heating device is turned off, so that the heating device can be protected; under the condition that the equipment temperature is lower than the upper limit of the safety temperature, adjusting the working temperature of the heating equipment according to the test temperature and the preset temperature, for example, if the test temperature is lower than the preset temperature, sending an instruction for adjusting the working temperature of the heating equipment, and receiving the instruction by the heating equipment and responding to the instruction to adjust the working temperature; if the test temperature is higher than the preset temperature, an instruction for adjusting the working temperature of the heating equipment downwards can be sent, and the heating equipment receives the instruction and responds to the instruction for adjusting the working temperature downwards.
It should be noted that the steps illustrated in the above-described flow diagrams or in the flow diagrams of the figures may be performed in a computer system, such as a set of computer-executable instructions, and that, although a logical order is illustrated in the flow diagrams, in some cases, the steps illustrated or described may be performed in an order different than here.
The present embodiment further provides a temperature control device for a test sorting apparatus, which is used to implement the foregoing embodiments and preferred embodiments, and the description of the temperature control device is omitted. As used hereinafter, the terms "module," "unit," "subunit," and the like may implement a combination of software and/or hardware for a predetermined function. Although the means described in the embodiments below are preferably implemented in software, an implementation in hardware, or a combination of software and hardware is also possible and contemplated.
In some embodiments, fig. 11 is a block diagram of a temperature control device according to an embodiment of the present application, and as shown in fig. 11, the device includes: the temperature acquisition module and the feedback module;
a temperature acquisition module 1101 for acquiring a test temperature of a test area in the test chamber;
the feedback module 1102 is configured to adjust a gas outlet temperature of the refrigerant substance compression device and a working temperature of the heating device according to the test temperature;
through foretell temperature control device, can be according to the feedback of the temperature in test area, control refrigerant material compression equipment's fluid outlet temperature and heating equipment's operating temperature to reach the accurate control effect of test area temperature.
In some embodiments, the temperature obtaining module 1101 and the feedback module 1102 may implement the steps in the temperature control method provided in each of the above embodiments when executed, and are not described herein again.
The above modules may be functional modules or program modules, and may be implemented by software or hardware. For a module implemented by hardware, the modules may be located in the same processor; or the modules can be respectively positioned in different processors in any combination.
In one embodiment, a computer device is provided, which may be a terminal. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a method of temperature control of a test handler. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
In one embodiment, fig. 12 is a schematic diagram of an internal structure of a computer device according to an embodiment of the present application, and as shown in fig. 12, there is provided a computer device, which may be a server, and its internal structure diagram may be as shown in fig. 12. The computer device includes a processor, a memory, a network interface, and a database connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the computer device is used for storing data. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a method of temperature control of a test handler.
Those skilled in the art will appreciate that the architecture shown in fig. 12 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, which includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the processor executes the computer program, the steps in the temperature control method of the test sorting apparatus provided in the above embodiments are implemented.
In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, which when executed by a processor implements the steps in the temperature control method of the test sorting apparatus provided in the above-described embodiments.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A test sorting device applied to testing electronic elements is characterized by comprising a machine table and a test chamber arranged on the machine table;
the machine table is also provided with heat exchange equipment connected with the test chamber through a pipeline, the heat exchange equipment carries out cold and heat exchange on externally input gas and then inputs the gas into the test chamber, and the gas input into the test chamber is used for adjusting the test temperature of the test chamber;
the machine table is further provided with a refrigerant substance compression device connected with the heat exchange device through a pipeline, and the refrigerant substance compression device is used for compressing refrigerant substances and providing the refrigerant substances for the heat exchange device.
2. The testing and sorting device applied to the testing of electronic elements according to claim 1, wherein a cavity is arranged below the machine table, and the refrigerant substance compressing device is arranged in the cavity.
3. The test sorting device applied to the test of the electronic components as claimed in claim 1, further comprising a drying device connected with the heat exchange device through a pipeline, wherein the drying device dries externally input gas and then inputs the gas into the heat exchange device.
4. The test handler apparatus of claim 3, wherein the drying device includes a replaceable cartridge.
5. The test sorting device applied to the test of the electronic elements according to claim 1, wherein a heating device is further disposed on the machine platform near the test chamber, one end of the heating device is connected to the heat exchanging device through a pipeline, the other end of the heating device is connected to the test chamber through a pipeline, and the heating device heats the gas after heat exchange to reach a gas temperature required by the test chamber.
6. The test handler apparatus applied to test electronic components of claim 5, wherein a gas distribution block is disposed inside the test chamber, the gas distribution block is connected to the heating device, and the gas distribution block inputs the gas output from the heating device into the test chamber to reach a desired gas temperature of the test chamber.
7. The test handler apparatus of claim 6, wherein the heating device is located inside the test chamber, and one end of the heating device is connected to the heat exchanging device and the other end of the heating device is connected to the air distributing block.
8. The test handler apparatus for testing electronic components of claim 5, wherein the apparatus further comprises a processor;
the processor obtains the testing temperature of the testing area in the testing chamber, and adjusts the gas outlet temperature of the refrigerant substance compression equipment and the working temperature of the heating equipment according to the testing temperature.
9. The test handler of claim 8, wherein the processor is further configured to adjust the operating temperature of the heating device according to the test temperature and a predetermined temperature.
10. The test handler apparatus of claim 9, wherein the test handler apparatus further comprises a test handler,
if the test temperature is lower than the preset temperature, the processor adjusts the working temperature of the heating equipment;
and if the test temperature is higher than the preset temperature, the processor adjusts the working temperature of the heating equipment downwards.
11. The test handler apparatus applied to test electronic components of claim 9, wherein before the processor adjusts the operating temperature of the heating device according to the test temperature and the preset temperature, the processor is further configured to obtain a device temperature at the heating device and compare the device temperature with a preset upper safety temperature limit;
and under the condition that the equipment temperature is greater than or equal to the upper limit of the safety temperature, the processor closes the heating equipment, and under the condition that the equipment temperature is less than the upper limit of the safety temperature, the processor adjusts the working temperature of the heating equipment according to the test temperature and the preset temperature.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201040553A (en) * | 2009-05-07 | 2010-11-16 | Hon Tech Inc | Cold source supplying device for a cool testing room of a test classification handler |
| CN103776163A (en) * | 2014-02-20 | 2014-05-07 | 广东志高暖通设备股份有限公司 | Heat pump water heater |
| CN104853565A (en) * | 2014-02-19 | 2015-08-19 | 爱德万测试公司 | Integrated cooling system for electronics testing apparatus |
| CN106290991A (en) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | Electronic components test equipment |
| CN106269584A (en) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | Electronic component operation unit and the implement of application thereof |
| TW201711559A (en) * | 2015-09-04 | 2017-03-16 | Hon Tech Inc | Refrigerant cooling system of temperature control device for test equipment crimper whereby the compressor of a refrigerant cooling system can be operated in a normal operating temperature range so as to avoid the occurrence of thermal trip |
| CN109212370A (en) * | 2017-07-07 | 2019-01-15 | 鸿劲精密股份有限公司 | Electronic component testing equipment with underneath type cold source conveying device |
| CN110244141A (en) * | 2018-03-09 | 2019-09-17 | 泰克元有限公司 | Sorting machine is used in electronic component test |
| CN111426891A (en) * | 2019-11-19 | 2020-07-17 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN211552106U (en) * | 2019-11-19 | 2020-09-22 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test |
-
2020
- 2020-12-11 CN CN202011436506.9A patent/CN112718550B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201040553A (en) * | 2009-05-07 | 2010-11-16 | Hon Tech Inc | Cold source supplying device for a cool testing room of a test classification handler |
| CN104853565A (en) * | 2014-02-19 | 2015-08-19 | 爱德万测试公司 | Integrated cooling system for electronics testing apparatus |
| CN103776163A (en) * | 2014-02-20 | 2014-05-07 | 广东志高暖通设备股份有限公司 | Heat pump water heater |
| CN106290991A (en) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | Electronic components test equipment |
| CN106269584A (en) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | Electronic component operation unit and the implement of application thereof |
| TW201711559A (en) * | 2015-09-04 | 2017-03-16 | Hon Tech Inc | Refrigerant cooling system of temperature control device for test equipment crimper whereby the compressor of a refrigerant cooling system can be operated in a normal operating temperature range so as to avoid the occurrence of thermal trip |
| CN109212370A (en) * | 2017-07-07 | 2019-01-15 | 鸿劲精密股份有限公司 | Electronic component testing equipment with underneath type cold source conveying device |
| CN110244141A (en) * | 2018-03-09 | 2019-09-17 | 泰克元有限公司 | Sorting machine is used in electronic component test |
| CN111426891A (en) * | 2019-11-19 | 2020-07-17 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN211552106U (en) * | 2019-11-19 | 2020-09-22 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test |
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| CN112718550B (en) | 2023-06-16 |
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