CN104923450A - Optical fiber array dispensing device - Google Patents
Optical fiber array dispensing device Download PDFInfo
- Publication number
- CN104923450A CN104923450A CN201510268903.2A CN201510268903A CN104923450A CN 104923450 A CN104923450 A CN 104923450A CN 201510268903 A CN201510268903 A CN 201510268903A CN 104923450 A CN104923450 A CN 104923450A
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- China
- Prior art keywords
- fiber array
- temperature lowering
- lowering board
- heating plate
- cooled wafer
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Abstract
The invention relates to an optical fiber array dispensing device. The device comprises a heating plate and a cooling plate. The heating plate and the cooling plate are both arranged on a base plate, and the heating plate is arranged above the cooling plate in a dis-placement manner; a plurality of coolers are evenly arranged on the lower end face of the cooling plate in the length direction, and the upper ends of the coolers are connected with semiconductor cooling chips through elastic parts; and the semiconductor cooling chips are tightly pressed on the cooling plate. The optical fiber array dispensing device is simple in structure, has the functions of rapid heating and rapid cooling, and is rapid and convenient to operate; and the temperature can be accurately adjusted, the production efficiency is greatly improved, generation of bubbles in glue is prevented, and the product quality can be ensured.
Description
Technical field
The present invention relates to fiber array process equipment field, particularly relate to a kind of fiber array point glue equipment.
Background technology
Along with domestic broadband generally starts speed-raising, increasing place brings into use optical fiber cable to lay, in the connection of optical fiber is arranged, fiber array often needs 4-64 root optical fiber bonding with slide, need to use glue in bonding process, glue also can enter into the gap between 4-64 root optical fiber at normal temperatures, but the flowing of glue is easy to produce bubble under normal temperature, affect the quality of product, glue would not produce bubble in the state current downflow of heating, but cooling is a process more slowly after heating, greatly can affect production efficiency, so need a kind of Fast Heating and the device of fast cooling to complete the some glue of fiber array.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of fiber array point glue equipment, structure is simple, there is Fast Heating and the function of cooling fast, fast easy to operate, temperature can regulate exactly, substantially increase production efficiency, prevent the generation of glue underwater bubble, ensure that the quality of product.
The technical solution adopted for the present invention to solve the technical problems is: provide a kind of fiber array point glue equipment, comprise heating plate and temperature lowering board, described heating plate and temperature lowering board are installed on bedplate, wherein heating plate dislocation is arranged in the top of temperature lowering board, the lower surface of described temperature lowering board is evenly provided with several radiators along its length, and the upper end of radiator to be connected with semiconductor cooled wafer by elastic component and semiconductor cooled wafer and temperature lowering board to be pressed.
Supplement as one of the present invention, the location arrangements that the lower surface of described temperature lowering board is corresponding with semiconductor cooled wafer has protruding block, and semiconductor cooled wafer and this protruding block press.
As preferably, the spacing between described protruding block is 20-22cm.
As preferably, the surrounding of described protruding block is furnished with connecting hole, and the mounting rod of described radiator extend into connecting hole internal fixtion.
Further, described heating plate is connected with bedplate by column with the two ends of temperature lowering board.
As preferably, the shape of described protruding block is square.
As preferably, described elastic component is the spring connecting radiator and semiconductor cooled wafer.
beneficial effect
The present invention relates to a kind of fiber array point glue equipment, structure is simple, has Fast Heating and the function of cooling fast, fast easy to operate, temperature can regulate exactly, substantially increases production efficiency, prevent the generation of glue underwater bubble, ensure that the quality of product.
Accompanying drawing explanation
Fig. 1 is main TV structure figure of the present invention;
Fig. 2 is side-looking structure chart of the present invention;
Fig. 3 is plan structure figure of the present invention;
Fig. 4 is temperature lowering board plan structure figure of the present invention.
Diagram: 1, bedplate; 2, temperature lowering board; 3, heating plate; 4, frock; 5, radiator; 6, elastic component; 7, protruding block; 8, column; 9, semiconductor cooled wafer; 10, connecting hole.
Detailed description of the invention
Below in conjunction with specific embodiment, set forth the present invention further.Should be understood that these embodiments are only not used in for illustration of the present invention to limit the scope of the invention.In addition should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the present invention's instruction.
As Figure 1-4, embodiments of the present invention relate to a kind of fiber array point glue equipment, comprise heating plate 3 and temperature lowering board 2, described heating plate 3 and temperature lowering board 2 are installed on bedplate 1, wherein heating plate 3 dislocation is arranged in the top of temperature lowering board 2, the lower surface of described temperature lowering board 2 is evenly provided with several radiators 5 along its length, and the upper end of radiator 5 to be connected with semiconductor cooled wafer 9 by elastic component 6 and semiconductor cooled wafer 9 and temperature lowering board 2 to be pressed.
The glue of fiber array has a feature, when temperature 60-70 degree, its flowing velocity is the fastest, can fully spread fast is filled in gap, and then this glue can be static fast when temperature is cooled to 18 to 23 degree, and this is a Fast Heating and the process of cooling fast.
The feature of patent of the present invention is combined at heating structure and the structure that cools, be exactly be provided with heating plate 3 and temperature lowering board 2 specifically, and heating plate 3 is positioned at the top of temperature lowering board 2 and the layout that misplaces, such setting is mainly because the arrangement of fiber array has specific frock 4, be placed directly in after this frock 4 puts glue on heating plate 3 and heat up, and then be put on temperature lowering board 2 and lower the temperature, heating plate 3 upper, temperature lowering board 2 is convenient smoothly when lower convenient transfer frock 4;
Another feature is the cooling structure of temperature lowering board 2, the semiconductor cooled wafer 9 that what it was mainly used is chilling temperature is adjustable, multiple semiconductor cooled wafer 9 is close to temperature lowering board 2 makes temperature lowering board 2 be in a specific temperature, and generally this temperature is between 18-23 degree, is preferably 20 degree.
In order to make semiconductor cooled wafer 9 and temperature lowering board 2 compress all the time, elastic component 6 is used semiconductor cooled wafer 9 and temperature lowering board 2 to be compressed in the lower end of semiconductor cooled wafer 9.
In order to further improve radiating effect, be also provided with radiator 5 in the lower end of semiconductor cooled wafer 9, this radiator 5 can be heat sink, also can be radiator fan, and multiple radiator 5 also can adopt various structures to use simultaneously.
Supplement as one of the present invention, the location arrangements that the lower surface of described temperature lowering board 2 is corresponding with semiconductor cooled wafer 9 has protruding block 7, semiconductor cooled wafer 9 and this protruding block 7 press, the setting of protruding block 7 makes the temperature transmission of semiconductor cooled wafer 9 more concentrated, makes the temperature of monoblock temperature lowering board 2 average.
As preferably, spacing between described protruding block 7 is 20-22cm, this distance is just drawn by many experiments, no matter how long temperature lowering board 2 has, the temperature of each position on temperature lowering board 2 can be made very close according to the protruding block 7 of this pitch arrangement and semiconductor cooled wafer 9, prevent from temperature lowering board 2 produces the temperature difference.
As preferably, the surrounding of described protruding block 7 is furnished with connecting hole 10, and the mounting rod of described radiator 5 extend into connecting hole 10 internal fixtion, facilitate the dismounting of radiator 5, and structure is very compact.
Further, described heating plate 3 is connected with bedplate 1 by column 8 with the two ends of temperature lowering board 2, the two ends of column 8 can be connected with temperature lowering board 2 with heating plate 3 by screw thread, because heating plate 3 and temperature lowering board 2 are all heat conductivity, good metal material is made, reliable so be threaded, also easy disassembly.
As preferably, the shape of described protruding block 7 is square, and convenient processing ensures that protruding block 7 can fully contact with between semiconductor cooled wafer 9.
As preferably, described elastic component 6 is the spring connecting radiator 6 and semiconductor cooled wafer 9, and spring is more conventional, changes also more convenient, certainly can also be used as elastic component 6 with the jacking block that disc spring or elastomeric material are made in actual application.
The controller be connected with the heating element heater on heating plate 3 and semiconductor cooled wafer 9 can be set in bedplate 1, and the control panel with display is installed on the front end face of bedplate 1, facilitate the setting operation of temperature.
Point glue equipment structure of the present invention is simple, and have Fast Heating and the function of cooling fast, fast easy to operate, temperature can regulate exactly, substantially increases production efficiency, prevents the generation of glue underwater bubble, ensure that the quality of product.
Claims (7)
1. a fiber array point glue equipment, comprise heating plate (3) and temperature lowering board (2), it is characterized in that, described heating plate (3) and temperature lowering board (2) are installed on bedplate (1), wherein heating plate (3) dislocation is arranged in the top of temperature lowering board (2), the lower surface of described temperature lowering board (2) is evenly provided with several radiators (5) along its length, the upper end of radiator (5) is connected with semiconductor cooled wafer (9) by elastic component (6) and semiconductor cooled wafer (9) and temperature lowering board (2) is pressed.
2. fiber array point glue equipment according to claim 1, it is characterized in that: the location arrangements that the lower surface of described temperature lowering board (2) is corresponding with semiconductor cooled wafer (9) has protruding block (7), semiconductor cooled wafer (9) and this protruding block (7) press.
3. fiber array point glue equipment according to claim 2, is characterized in that: the spacing between described protruding block (7) is 20-22cm.
4. fiber array point glue equipment according to claim 2, it is characterized in that: the surrounding of described protruding block (7) is furnished with connecting hole (10), the mounting rod of described radiator (5) extend into connecting hole (10) internal fixtion.
5. fiber array point glue equipment according to claim 1, is characterized in that: described heating plate (3) is connected with bedplate (1) by column (8) with the two ends of temperature lowering board (2).
6. fiber array point glue equipment according to claim 2, is characterized in that: the shape of described protruding block (7) is square.
7. fiber array point glue equipment according to claim 1, is characterized in that: described elastic component (6) is the spring connecting radiator (5) and semiconductor cooled wafer (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510268903.2A CN104923450A (en) | 2015-05-22 | 2015-05-22 | Optical fiber array dispensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510268903.2A CN104923450A (en) | 2015-05-22 | 2015-05-22 | Optical fiber array dispensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104923450A true CN104923450A (en) | 2015-09-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510268903.2A Pending CN104923450A (en) | 2015-05-22 | 2015-05-22 | Optical fiber array dispensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104923450A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105855134A (en) * | 2016-06-03 | 2016-08-17 | 杭州奥克光电设备有限公司 | Optical fiber core inserting, dispensing and curing integrated manufacture assembly line |
| CN114405763A (en) * | 2022-02-10 | 2022-04-29 | 深圳市飞翼科技有限公司 | Dispensing machine and dispensing method for touch screen production |
-
2015
- 2015-05-22 CN CN201510268903.2A patent/CN104923450A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105855134A (en) * | 2016-06-03 | 2016-08-17 | 杭州奥克光电设备有限公司 | Optical fiber core inserting, dispensing and curing integrated manufacture assembly line |
| CN114405763A (en) * | 2022-02-10 | 2022-04-29 | 深圳市飞翼科技有限公司 | Dispensing machine and dispensing method for touch screen production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150923 |