CN203101160U - Semiconductor pathological paraffin embedded refrigerator - Google Patents
Semiconductor pathological paraffin embedded refrigerator Download PDFInfo
- Publication number
- CN203101160U CN203101160U CN 201320100386 CN201320100386U CN203101160U CN 203101160 U CN203101160 U CN 203101160U CN 201320100386 CN201320100386 CN 201320100386 CN 201320100386 U CN201320100386 U CN 201320100386U CN 203101160 U CN203101160 U CN 203101160U
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- water
- semiconductor
- temperature
- heat radiation
- cold
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000012188 paraffin wax Substances 0.000 title claims abstract description 18
- 230000001575 pathological effect Effects 0.000 title abstract 5
- 238000001816 cooling Methods 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 21
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 230000007170 pathology Effects 0.000 claims description 16
- 238000005057 refrigeration Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 2
- 230000001351 cycling effect Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a semiconductor pathological paraffin embedded refrigerator. The semiconductor pathological paraffin embedded refrigerator consists of a temperature controller, a temperature sensor, a relay, a heat radiation water bar, a water bar heat radiation fan, a water pump, a direct-current switch power supply, a cold conduction metal plate, a semiconductor refrigerating sheet and a water cooling heat radiation plate. The cold conduction metal plate is arranged above the semiconductor refrigerating sheet, the water cooling heat radiation plate is arranged below the semiconductor refrigerating sheet, and the temperature sensor is installed on the cold conduction metal plate; the water cooling heat radiation plate, the heat radiation water bar, the water bar heat radiating fan and the water pump are combined together to form a water cycling cooling system, and the water pump is connected with the heat radiation water bar and the water cooling heat radiation plate through a pipeline; and the semiconductor pathological paraffin embedded refrigerator adopts a temperature control system consisting of the temperature controller, the temperature sensor, the relay and the direct-current switch power supply to control the temperature. By adopting the semiconductor refrigerating technology, the semiconductor pathological paraffin embedded refrigerator has the characteristics of rapidness in refrigeration, stable performance under a high-temperature environment, simplicity in maintenance and long service life and has a wide commercial application prospect.
Description
Technical field:The utility model belongs to technical field of medical instruments, is specifically related to cold of a kind of semiconductor pathology paraffin embedding.
Background technology:Requirement to cold of pathology paraffin embedding in the practical application is: the one, and refrigerating speed is fast, stable performance, safeguards simple; Have round-the-clock ability to work, also can drop to the temperature that needs to temperature under the hot environment; The 2nd, in light weight, remainder is littler except that using volume; The Three Greens colour circle is protected.
The cold Daepori of existing pathology paraffin embedding is all over adopting compressor cooling, and noise is big; Need to add cold-producing medium, contaminated environment; Refrigerating speed is slow, environment temperature poor refrigerating efficiency during greater than 27 ℃; Owing to be subjected to the restriction of actual request for utilization, the volume that pathology is cold is unsuitable excessive, weight can not be overweight, thereby cold employed refrigeration compressor of traditional pathology must be " microminiaturization ", " microminiaturization " though the compressor volume little, in light weight, but the ability of its durability and continuous working also just greatly reduces, cold failure rate height of this just traditional pathology paraffin embedding, life-span weak point, the main cause that refrigerating speed is slow, maintenance is complicated.
Summary of the invention:The purpose of this utility model is exactly the problem at existing cold existence of pathology paraffin embedding, and cold of a kind of efficient, stable, easy to use semiconductor pathology paraffin embedding is provided.
The utility model adopts following technical scheme: cold of semiconductor pathology paraffin embedding is made up of temperature controller, temperature sensor, relay, water of radiation row, water row heat emission fan, water pump, direct-current switch power supply, conduction cooling sheet metal, semiconductor chilling plate, water-cooling plate.Being the conduction cooling sheet metal above the semiconductor chilling plate, is water-cooling plate below, and temperature sensor is installed on the conduction cooling sheet metal; Water-cooling plate, water of radiation row, water row heat emission fan, water pump combine the composition hydrologic cycle cooling system, and water pump pipeline connects with water of radiation row, water-cooling plate; Cold of semiconductor pathology paraffin embedding is carried out temperature controlling by the temperature control system of being made up of temperature controller, temperature sensor, relay, direct-current switch power supply.
Principle of work of the present utility model is: energising back semiconductor chilling plate is started working, and will produce transfer of heat between the semiconductor chilling plate both ends of the surface, and heat will be transferred to the other end from an end face, forms hot and cold end face thereby produce the temperature difference; The cold junction face of semiconductor chilling plate contacts with the conduction cooling sheet metal, and the temperature of sheet metal is reduced; And the heat of hot junction face dissipates heat with the continuous working of assurance semiconductor chilling plate by hydrologic cycle cooling system, thereby makes the cold junction face reach lower temperature.The temperature sensor of conduction cooling metal sheet surface is passed to temperature control system in real time to its temperature, when temperature reaches the temperature of setting, temperature control system promptly stops to power to semiconductor chilling plate, in order to avoid the temperature of conduction cooling sheet metal continues to reduce, the temperature of conduction cooling sheet metal can raise gradually after stopping power supply, and at this moment, temperature control system is powered to semiconductor chilling plate again, so go round and begin again, keep the constant of conduction cooling sheet metal temperature.
The utility model beneficial effect is: used semiconductor refrigerating technology, had refrigeration rapidly, stable performance under the hot environment, the characteristics that maintaining is simple, the life-span is long.Because do not need compressor, so without any need for cold-producing medium, but continuous working does not have environmental pollution, has wide commercial applications prospect.
Description of drawings:
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the theory structure block diagram representation of the type of an embodiment of the utility model
Among the figure
:The 1st, temperature controller, the 2nd, direct-current switch power supply, the 3rd, relay, the 4th, conduction cooling sheet metal, the 5th, temperature sensor, the 6th, semiconductor chilling plate, the 7th, water-cooling plate, the 8th, water of radiation row, the 9th, water row heat emission fan, the 10th, water pump.
Embodiment:
Semiconductor chilling plate 6 is installed below the conduction cooling sheet metal 4, is water-cooling plate 7 below the semiconductor chilling plate 6, and temperature sensor 5 is installed on the conduction cooling sheet metal 4; Water-cooling plate 7, water of radiation row 8, water row heat emission fan 9, water pump 10 combine the composition hydrologic cycle cooling system, and water pump 10 connects with water of radiation row 8, water-cooling plate 7; Cold of semiconductor pathology paraffin embedding is carried out temperature controlling by temperature control system, and temperature control system control is made up of temperature controller 1, temperature sensor 5, relay 3, direct-current switch power supply 2.
After the energising, semiconductor chilling plate 6 is started working, and produces the temperature difference and forms hot and cold end face, and the cold junction face contacts with conduction cooling sheet metal 4, and its temperature is reduced; The heat of hot junction face dissipates heat by hydrologic cycle cooling system, thereby makes the cold junction face reach lower temperature; Temperature sensor 5 above conduction cooling sheet metal 4 surfaces is passed to temperature controller 1 in real time to temperature, keeps the constant of conduction cooling sheet metal 4 temperature.
The characteristics of the utility model embodiment: 1, semiconductor chilling plate cooling is fast, and 20 ℃ of energisings of room temperature dropped to 0 ℃ after 19 seconds, and after 25 seconds-5 ℃, after 35 seconds-10 ℃, after 60 seconds-15 ℃, after 90 seconds-20 ℃; Can drop to-20 ℃ in 180 seconds when 2, stable performance under the hot environment, 31 ℃ of room temperatures, can operation continuously in 24 hours; 3, adopt the semiconductor chilling plate refrigeration, do not need compressor, semiconductor chilling plate is a kind of solid piece part, and rotation, slide unit do not have vibrations, noise during work; Without any need for cold-producing medium, but continuous working does not have pollution source; 4, this instrument uses semiconductor refrigerating technology, so the characteristics that maintaining is simple, the life-span is long are arranged; 5,,, can realize the high-precision temperature control in cold drawing surface by the size and the switch of control input current because semiconductor chilling plate is an electric current transducing type element; Add temperature sensor and control module, be easy to realize remote control, program control, computer control, and then form automatic control system.Through the runtime verification of empirical model, this utility model can replace cold of the pathology embedding that utilizes compressor cooling fully.
Claims (3)
1. a semiconductor pathology paraffin embedding is cold, form by temperature controller, temperature sensor, relay, water of radiation row, water row heat emission fan, water pump, direct-current switch power supply, conduction cooling sheet metal, semiconductor chilling plate, water-cooling plate, it is characterized in that semiconductor chilling plate above be the conduction cooling sheet metal, be water-cooling plate below, temperature sensor is installed on the conduction cooling sheet metal.
2. cold of semiconductor pathology paraffin embedding according to claim 1 is characterized in that described water-cooling plate, water of radiation row, water are arranged heat emission fan, water pump is combined the composition hydrologic cycle cooling system, and water pump pipeline connects with water of radiation row, water-cooling plate.
3. cold of semiconductor pathology paraffin embedding according to claim 1 is characterized in that described temperature sensor, relay, direct-current switch power supply formed the temperature circuit control system, carries out temperature control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320100386 CN203101160U (en) | 2013-03-06 | 2013-03-06 | Semiconductor pathological paraffin embedded refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320100386 CN203101160U (en) | 2013-03-06 | 2013-03-06 | Semiconductor pathological paraffin embedded refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203101160U true CN203101160U (en) | 2013-07-31 |
Family
ID=48852551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320100386 Expired - Fee Related CN203101160U (en) | 2013-03-06 | 2013-03-06 | Semiconductor pathological paraffin embedded refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203101160U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103642692A (en) * | 2013-12-19 | 2014-03-19 | 孙迪祥 | Inner low-temperature operation table of cell culture clean bench |
| CN104390837A (en) * | 2014-10-22 | 2015-03-04 | 中国人民解放军总医院第一附属医院 | Tissue embedding box |
| CN107340789A (en) * | 2017-08-30 | 2017-11-10 | 中国医科大学附属第医院 | Cryo tissue embeds adapter |
| CN107463193A (en) * | 2017-08-30 | 2017-12-12 | 中国医科大学附属第医院 | A kind of cryo tissue embeds temperature control system |
-
2013
- 2013-03-06 CN CN 201320100386 patent/CN203101160U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103642692A (en) * | 2013-12-19 | 2014-03-19 | 孙迪祥 | Inner low-temperature operation table of cell culture clean bench |
| CN104390837A (en) * | 2014-10-22 | 2015-03-04 | 中国人民解放军总医院第一附属医院 | Tissue embedding box |
| CN104390837B (en) * | 2014-10-22 | 2017-01-18 | 中国人民解放军总医院第一附属医院 | Tissue embedding instrument capable of automatically adjusting temperature |
| CN107340789A (en) * | 2017-08-30 | 2017-11-10 | 中国医科大学附属第医院 | Cryo tissue embeds adapter |
| CN107463193A (en) * | 2017-08-30 | 2017-12-12 | 中国医科大学附属第医院 | A kind of cryo tissue embeds temperature control system |
| CN107463193B (en) * | 2017-08-30 | 2022-09-09 | 中国医科大学附属第一医院 | Low temperature tissue embedding temperature control system |
| CN107340789B (en) * | 2017-08-30 | 2022-10-21 | 中国医科大学附属第一医院 | Low-temperature tissue embedding adapter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170713 Address after: 510000, No. 4, building H1, No. two, silver sand road, Xintang Town, Zengcheng District, Guangzhou, Guangdong Patentee after: Guangzhou Wexis Biotechnology Co., Ltd. Address before: 276200 No. 48 Mengshan Road, Mengyin County, Shandong, Linyi Patentee before: Sun Dixiang |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20180306 |