CN113915792A - Semiconductor refrigerator temperature control device for sampling adsorption tube - Google Patents
Semiconductor refrigerator temperature control device for sampling adsorption tube Download PDFInfo
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- CN113915792A CN113915792A CN202111267014.6A CN202111267014A CN113915792A CN 113915792 A CN113915792 A CN 113915792A CN 202111267014 A CN202111267014 A CN 202111267014A CN 113915792 A CN113915792 A CN 113915792A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a temperature control device of a semiconductor refrigerator for a sampling adsorption tube, which comprises a control system, a semiconductor refrigeration module, a cold guide block, a heat dissipation module, a temperature detection module, a key adjustment input module and a display module, wherein the control system is connected with the semiconductor refrigeration module; the control system comprises a singlechip minimum system and a driving circuit; the semiconductor refrigeration module comprises a cold surface and a hot surface, the cold surface of the semiconductor refrigeration module is connected with the cold guide block, and the hot surface is connected with the heat dissipation module; the temperature detection module is fixedly arranged on the cold guide block; the key adjustment input module is used for setting a temperature value for the temperature control device through keys; the display module is used for displaying the temperature in real time; the temperature detection module and the key adjustment input module are respectively connected with the input end of the singlechip minimum system, and the output end of the singlechip minimum system is connected with the semiconductor refrigeration module and the display module through the driving circuit. The invention maintains the adsorption tube at low temperature in the sampling process, reduces the influence of temperature change on the adsorption performance of the adsorption tube, and improves the sampling efficiency and reliability.
Description
Technical Field
The invention belongs to the field of temperature control, and particularly relates to a semiconductor refrigerator temperature control device for a sampling adsorption tube.
Background
With the rapid development of economy, the national living standard is also continuously improved, but increasingly serious environmental problems are more and more emphasized by people, so that how to enable people to live in a safe and healthy environment is a problem which needs to be solved urgently, changes of the environment can be objectively reflected through an environment monitoring technology, and a direction or a method for solving the environmental problems is provided for relevant departments through monitoring data, so that the accuracy of a monitoring result is very important.
In the existing VOCs sampling technology, for example, in a chinese granted patent "adsorption tube for detecting VOCs capable of efficiently adsorbing" (publication number CN212301032U) ", it is a common way to collect volatile organic compounds, namely VOCs, emitted from fixed pollutant source waste gas and ambient air by using an adsorption tube containing a suitable adsorbent, but in the field sampling process, the temperature of the field environment has a certain influence on the adsorption performance of the adsorbent in the adsorption tube. When the environmental temperature is higher, the adsorption performance of the adsorbent to the low-boiling-point VOCs is reduced, and the monitoring result error is larger.
Disclosure of Invention
In order to overcome the problems in the prior art, the application provides a semiconductor refrigerator temperature control device for sampling adsorption tubes, which maintains the adsorption tubes at low temperature in the sampling process, reduces the influence of temperature change on the adsorption performance of the adsorption tubes, and improves the sampling efficiency and the reliability.
In order to achieve the above object, the present invention provides a temperature control device for a semiconductor refrigerator of a sampling adsorption tube, which comprises a control system, a semiconductor refrigeration module, a cold conducting block, a heat dissipation module, a temperature detection module, a key adjustment input module and a display module,
the control system comprises a singlechip minimum system and a driving circuit;
the semiconductor refrigeration module is used for cooling the cold guide block and comprises a cold surface and a hot surface, the cold surface of the semiconductor refrigeration module is connected with the cold guide block, the hot surface is connected with the heat dissipation module, and the heat dissipation module dissipates heat by using circulating water;
the temperature detection module is fixedly arranged on the cold guide block and used for measuring the temperature of the cold guide block;
the key adjustment input module is used for setting a temperature value for the temperature control device through keys;
the display module is used for displaying the temperature in real time;
the temperature detection module and the key adjustment input module are respectively connected with the input end of the singlechip minimum system, and the output end of the singlechip minimum system is connected with the semiconductor refrigeration module and the display module through the driving circuit.
Furthermore, the control system also comprises a power supply module which is used for supplying power to the temperature control device.
Furthermore, the semiconductor refrigeration module comprises a first semiconductor refrigerator and a second semiconductor refrigerator, the cold surfaces of the first semiconductor refrigerator and the second semiconductor refrigerator are respectively connected with the cold guide block, and the first semiconductor refrigerator and the second semiconductor refrigerator are both connected with the output end of the minimum system of the single chip microcomputer through the driving circuit;
the heat dissipation module comprises a first water-cooling head and a second water-cooling head, the first water-cooling head is connected with the hot surface of the first semiconductor refrigerator, and the second water-cooling head is connected with the hot surface of the second semiconductor refrigerator.
The heat dissipation module is a cooling device for the hot surfaces of the first semiconductor refrigerator and the second semiconductor refrigerator, the cooling mode is water cooling, circulating water absorbs the heat of the hot surfaces of the first semiconductor refrigerator and the second semiconductor refrigerator through the first water cooling head and the second water cooling head and is conveyed to the water cooling through a pipeline by the circulating water pump, and the water cooling is provided with the heat dissipation fan, so that the heat dissipation performance is improved.
Furthermore, the heat dissipation module further comprises a circulating water pump, a water tank, water cooling and a heat dissipation fan, wherein the water inlet end of the circulating water pump is communicated with the water tank, the water outlet end of the circulating water pump is communicated with the water inlets of the first water-cooling head and the second water-cooling head through pipelines, and the water outlets of the first water-cooling head and the second water-cooling head are communicated with the water tank through pipelines.
Further, the bottom surface and the top surface of the cold guide block are respectively connected with the cold surfaces of the first semiconductor refrigerator and the second semiconductor refrigerator through heat-conducting silicone grease.
Furthermore, the first semiconductor refrigerator and the second semiconductor refrigerator adopt a plurality of semiconductor refrigeration sheets which are connected in series to form a high-power semiconductor refrigerator, and one surfaces of the first semiconductor refrigerator and the second semiconductor refrigerator are cold surfaces which are lowered in temperature and absorb heat; the other side is a hot side where the temperature rises and heat is released.
Furthermore, the temperature detection module is a thermocouple or a temperature sensor, and the thermocouple or the temperature sensor is attached to the cold conducting block.
Furthermore, the control module adopts a singlechip control circuit, is the core of a system temperature control circuit structure, and comprises a power supply module, a minimum singlechip system and a drive circuit. The power supply module converts an external power supply into voltages required by electric appliances such as a single chip microcomputer, a semiconductor refrigerator, a circulating water pump and a cooling fan; the minimum single chip microcomputer system is the core of a system temperature control circuit structure, and realizes the collection and processing of the temperature detection module, the control of the first semiconductor refrigerator and the second semiconductor refrigerator through the drive circuit and the real-time display of the temperature on the display module. The driving circuit drives the first semiconductor refrigerator and the second semiconductor refrigerator in an on-off control mode, adopts a direct current pulse width modulation technology, namely a PWM duty ratio regulation mode, and controls the on-off of the voltage at two ends of the first semiconductor refrigerator and the second semiconductor refrigerator through an H bridge driving chip. Under the condition that the real-time temperature of the cold guide block is not less than a set value, the temperature PID operation program of the control system is used, and the generated result controls the working voltage and working time of the refrigeration module through the built-in PWM module of the control system, so that the stability of the system in a small temperature range is improved.
Further, the key adjustment input module includes three keys: the temperature control system comprises two temperature adjusting keys and a reset key, wherein the two temperature adjusting keys are used for reducing or increasing the temperature, and the reset key is used for preventing faults such as running and flying in the operation process of the single chip microcomputer system.
Furthermore, the display module adopts a nixie tube or an LCD display screen and is used for outputting the current temperature and the set temperature.
Compared with the closest prior art, the invention can realize the following beneficial effects:
1. a semiconductor refrigerator temperature control device for a sampling adsorption tube mainly comprises a refrigerator, a heat dissipation module and a control system, and has the advantages of compact structure, small volume, simplicity in operation, no environmental pollution and the like.
2. In the invention, the singlechip controls the on-off of the voltages at two ends of the first semiconductor refrigerator and the second semiconductor refrigerator by adopting a direct current pulse width modulation technology, namely a PWM duty ratio regulation mode through a PID control algorithm, and drives the first semiconductor refrigerator and the second semiconductor refrigerator through a drive circuit.
3. In order to meet the requirement of a semiconductor refrigerator on larger refrigerating power, a plurality of semiconductor refrigerators are connected in series to form a high-power semiconductor refrigerator.
4. According to the temperature control device provided by the invention, when the temperature detection module detects that the temperature of the cold conducting block is higher than the temperature set by the key adjustment input module, the driving circuit is controlled by the built-in PID algorithm of the minimum system of the single chip microcomputer, the first semiconductor refrigerator and the second semiconductor refrigerator start to work, the cold conducting block is cooled, and therefore the temperature of the adsorption tube is reduced; when the temperature detection module detects that the temperature of the cold conducting block is lower than the temperature set by the key adjustment input module, the first semiconductor refrigerator and the second semiconductor refrigerator stop working, so that the temperature of the cold conducting block is stabilized at a set value, the temperature of the adsorption tube can be stabilized, and the influence of temperature change on the adsorption performance of the adsorption tube is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a temperature control device of a semiconductor refrigerator for a sampling adsorption tube according to an embodiment of the present invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
As shown in the drawings, the semiconductor refrigerator temperature control device for gas (including but not limited to Volatile Organic Compounds, namely VOCs) sampling adsorption tubes provided by the present invention includes a control system 1, a semiconductor refrigeration module, a cold conduction block 2, a heat dissipation module, a temperature detection module 3, a key adjustment input module 4, and a display module 5. When in use, the sampling adsorption tube is inserted into the embedded type attached cold conduction block 2 for use.
The control system 1 comprises a singlechip minimum system and a driving circuit; the semiconductor refrigeration module is used for cooling the cold conducting block 2 and comprises a cold surface and a hot surface, the cold surface of the semiconductor refrigeration module is connected with the cold conducting block 2, the hot surface is connected with the heat dissipation module, and the working state of the heat dissipation module changes along with the change of the working state of the refrigeration module; the temperature detection module 3 is fixedly arranged on the cold guide block 2 and used for measuring the temperature of the cold guide block 2; the key adjustment input module 4 is used for setting a temperature value for the temperature control device through keys; the display module 5 is used for displaying the temperature in real time; the temperature detection module 3 and the key adjustment input module 4 are respectively connected with the input end of the singlechip minimum system, and the output end of the singlechip minimum system is connected with the semiconductor refrigeration module and the display module 5 through the driving circuit. The driving circuit drives the semiconductor refrigeration module in an on-off control mode.
In one embodiment of the present invention, the control system 1 further includes a power supply module for supplying power to the temperature control device.
In one embodiment of the invention, the semiconductor refrigeration module comprises a first semiconductor refrigerator 6 and a second semiconductor refrigerator 7, the cold surfaces of the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 are respectively connected with the cold guide block 2, and the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 are connected with the output end of the SCM minimum system through the driving circuit. One surface of the first semiconductor cooler 6 and the second semiconductor cooler 7 is a cold surface in which the current direction is from N to P, the temperature drops, and the heat is absorbed; the other side is the hot side where the current direction is from P to N, the temperature rises and heat is released.
Preferably, in one embodiment of the present invention, each of the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 includes a plurality of semiconductor refrigeration sheets connected in series. In order to meet the requirement of a semiconductor refrigerator on larger refrigerating power, a plurality of semiconductor refrigerating sheets are connected in series to form the high-power semiconductor refrigerator.
Preferably, the first semiconductor cooler 6 and the second semiconductor cooler 7 are connected to the cold block 2 by a heat conductive silicone grease.
The control module adopts a singlechip control circuit and is the core of a system temperature control circuit structure. The power supply module converts an external power supply into voltages required by electrical appliances such as a singlechip minimum system, the first semiconductor refrigerator 6, the second semiconductor refrigerator 7, the circulating water pump 10, the cooling fan 13 and the like; the minimum single chip microcomputer system is the core of a system temperature control circuit structure, and the minimum single chip microcomputer system realizes the collection and processing of the temperature detection module, the control of the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 through the driving circuit and the real-time display of the temperature on the display module. The driving circuit drives the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 in an on-off control mode, adopts a direct current pulse width modulation technology, namely a PWM duty ratio regulation mode, and controls the on-off of the voltage at two ends of the first semiconductor refrigerator and the second semiconductor refrigerator through an H-bridge driving chip.
In one embodiment of the invention, the temperature detection module 3 is attached to one surface of the cold guide block 2.
In one embodiment of the invention, the heat dissipation module dissipates heat by using circulating water, and comprises a first water-cooling head 8, a second water-cooling head 9, a water cooling device 12, a circulating water pump 10, a water tank and 11 a heat dissipation fan 13; the first water cooling head 8 and the second water cooling head 9 are respectively connected with hot surfaces of the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7, and are cooling devices of the hot surfaces of the first semiconductor refrigerator and the second semiconductor refrigerator, the cooling mode is water cooling, circulating water absorbs heat of the hot surfaces of the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 through the first water cooling head 8 and the second water cooling head 9 and is conveyed to the water discharge cooling 12 through a pipeline by the circulating water pump, the heat radiation fan is installed on the water discharge cooling 12 to improve heat radiation performance, and the circulating water after heat radiation returns to the water tank to form circulation. The heat generated by the heating end of the semiconductor refrigerating sheet is taken away in a circulating cooling water mode, and the cooling water is cooled through the water cooling row and air heat exchange, so that the normal work and the service life of the device are guaranteed.
In one embodiment of the present invention, after the control module obtains the temperature value of the temperature detection module and the temperature value set by the key adjustment input module, the minimum single chip microcomputer system is processed by the PID control algorithm and then controls the on/off of the voltages at the two ends of the first semiconductor refrigerator and the second semiconductor refrigerator by the driving circuit in the manner of direct current pulse width modulation, i.e., PWM duty cycle adjustment, so as to control the first semiconductor refrigerator and the second semiconductor refrigerator.
In one embodiment of the present invention, the temperature detection module collects the temperature of the cold conducting block 2 in real time, when the temperature detection module detects that the temperature of the cold conducting block 2 is higher than the temperature set by the key adjustment input module, the driving circuit is controlled by the PID algorithm built in the minimum single chip system, and the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 start to work to cool the cold conducting block 2.
When the temperature detection module detects that the temperature of the cold guide block is lower than the temperature set by the key adjustment input module, the first semiconductor refrigerator 6 and the second semiconductor refrigerator 7 stop working, so that the temperature of the cold guide block 2 is stabilized at a set value.
When the adsorption tube is used for sampling, the temperature control device provided by the embodiment of the invention can maintain the adsorption tube at a low temperature in the adsorption tube sampling process, reduce the influence of temperature change on the adsorption performance of the adsorption tube, and improve the sampling efficiency and reliability.
It is well within the skill of those in the art to implement and protect the present invention from software modifications, both as to circuitry and internal electronic components and modules.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and not for the purpose of limiting the scope of the present invention, and it is obvious that any person skilled in the art can easily conceive of alternatives or modifications to obtain other embodiments based on the above embodiments, which should be covered by the scope of the present invention.
Claims (10)
1. A temperature control device of a semiconductor refrigerator for a sampling adsorption tube is characterized by comprising a control system (1), a semiconductor refrigeration module, a cold guide block (2), a heat dissipation module, a temperature detection module (3), a key adjustment input module (4) and a display module (5),
the control system (1) comprises a singlechip minimum system and a driving circuit;
the semiconductor refrigeration module is used for cooling the cold conducting block (2) and comprises a cold surface and a hot surface, the cold surface of the semiconductor refrigeration module is connected with the cold conducting block (2), and the hot surface is connected with the heat dissipation module;
the temperature detection module (3) is fixedly arranged on the cold guide block (2) and is used for measuring the temperature of the cold guide block (2);
the key adjustment input module (4) is used for setting a temperature value for the temperature control device through keys;
the display module (5) is used for displaying the temperature in real time;
the temperature detection module (3) and the key adjustment input module (4) are respectively connected with the input end of the singlechip minimum system, and the output end of the singlechip minimum system is connected with the semiconductor refrigeration module and the display module (5) through the driving circuit.
2. The semiconductor cooler temperature control device for the sampling adsorption tube of claim 1, wherein the control system further comprises a power supply module for supplying power to the temperature control device.
3. The semiconductor refrigerator temperature control device for the sampling adsorption tube of claim 1, wherein the semiconductor refrigeration module comprises a first semiconductor refrigerator (6) and a second semiconductor refrigerator (7), the cold surfaces of the first semiconductor refrigerator (6) and the second semiconductor refrigerator (7) are respectively connected with the cold guide block (2), and the first semiconductor refrigerator (6) and the second semiconductor refrigerator (7) are connected with the output end of the SCM minimum system through a driving circuit;
the heat dissipation module comprises a first water cooling head (8) and a second water cooling head (9), the first water cooling head (8) is connected with the hot surface of the first semiconductor refrigerator (6), and the second water cooling head (9) is connected with the hot surface of the second semiconductor refrigerator (7).
4. A semiconductor refrigerator thermostat for sampling adsorption tubes according to claim 3, characterized in that the first semiconductor refrigerator (6) and the second semiconductor refrigerator (7) are connected to the cold conduction block (2) by heat conductive silicone grease.
5. A semiconductor refrigerator thermostat for sampling adsorption tubes according to claim 3, characterized in that the first semiconductor refrigerator (6) and the second semiconductor refrigerator (7) each comprise a plurality of semiconductor refrigeration sheets connected in series.
6. The semiconductor refrigerator temperature control device for the sampling adsorption tube according to claim 3, wherein the heat dissipation module further comprises a circulating water pump (10), a water tank (11), a water cooling device (12) and a heat dissipation fan (13), a water inlet end of the circulating water pump (10) is communicated with the water tank (11), a water outlet end of the circulating water pump is communicated with water inlets of the first water cooling head (8) and the second water cooling head (9) through pipelines, and water outlets of the first water cooling head (8) and the second water cooling head (9) are communicated with the water tank (11) through pipelines.
7. The semiconductor refrigerator temperature control device for the sampling adsorption tube of claim 1, wherein the display module (5) adopts a digital tube or an LCD display screen.
8. The temperature control device of the semiconductor refrigerator for the sampling adsorption tube according to claim 1, wherein the temperature detection module (3) is a thermocouple or a temperature sensor, and the thermocouple or the temperature sensor is attached to the cold-conducting block (2).
9. The semiconductor refrigerator temperature control device for the sampling adsorption tube of claim 1, wherein the key adjustment input module (4) comprises two temperature adjustment keys for adjusting the temperature down or up and a reset key for resetting.
10. The semiconductor refrigerator temperature control device for the sampling adsorption tube according to any one of claims 1 to 9, wherein the driving circuit drives the semiconductor refrigeration module by an on-off control manner.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111267014.6A CN113915792A (en) | 2021-10-28 | 2021-10-28 | Semiconductor refrigerator temperature control device for sampling adsorption tube |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111267014.6A CN113915792A (en) | 2021-10-28 | 2021-10-28 | Semiconductor refrigerator temperature control device for sampling adsorption tube |
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| CN113915792A true CN113915792A (en) | 2022-01-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115264991A (en) * | 2022-08-29 | 2022-11-01 | 南华大学 | Adsorption tube cooling device and method based on semiconductor refrigeration-sky radiation refrigeration |
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| WO2012018287A1 (en) * | 2010-08-06 | 2012-02-09 | Rezvov Andrey Vladimirovich | Fast freezer, preferably for polymeric packets filled with biological medicinal substances (variants) and cooling device for a fast freezer |
| CN108716787A (en) * | 2018-08-14 | 2018-10-30 | 胡晓 | A kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating |
| CN209656380U (en) * | 2018-12-17 | 2019-11-19 | 中国科学院生态环境研究中心 | A kind of portable adsorption tube refrigeration sampling apparatus |
| CN113071288A (en) * | 2021-04-28 | 2021-07-06 | 吉林大学 | Solar vehicle-mounted auxiliary air conditioning system |
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2021
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012018287A1 (en) * | 2010-08-06 | 2012-02-09 | Rezvov Andrey Vladimirovich | Fast freezer, preferably for polymeric packets filled with biological medicinal substances (variants) and cooling device for a fast freezer |
| CN108716787A (en) * | 2018-08-14 | 2018-10-30 | 胡晓 | A kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating |
| CN209656380U (en) * | 2018-12-17 | 2019-11-19 | 中国科学院生态环境研究中心 | A kind of portable adsorption tube refrigeration sampling apparatus |
| CN113071288A (en) * | 2021-04-28 | 2021-07-06 | 吉林大学 | Solar vehicle-mounted auxiliary air conditioning system |
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| CN115264991A (en) * | 2022-08-29 | 2022-11-01 | 南华大学 | Adsorption tube cooling device and method based on semiconductor refrigeration-sky radiation refrigeration |
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