CN108716787A - A kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating - Google Patents
A kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating Download PDFInfo
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- CN108716787A CN108716787A CN201810923751.9A CN201810923751A CN108716787A CN 108716787 A CN108716787 A CN 108716787A CN 201810923751 A CN201810923751 A CN 201810923751A CN 108716787 A CN108716787 A CN 108716787A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to heating and cooling apparatus fields, disclose a kind of gradient of temperature conditioning instrumentation based on semiconductor refrigerating heating technology.It creates through the invention,It can provide a kind of using thermoelectric module as Cooling and Heat Source basis,And pass through loading heat-conducting plate,Water-cooling head,Water pump,The gradient of temperature conditioning instrumentation that water route heat removal pipeline and gradient of temperature adjusting control plate etc. erect,Not only there is compact,It is light-weight,It is moved easily,Warming and cooling rate is fast,The advantages such as accuracy of temperature control is high and manufacturing cost is low,- 65~120 degrees Celsius of arbitrary temp environment can also be provided for cooling and warming loading surface,And there is very strong load capacity,I.e. when loading heat-conducting plate carries medium and small miniature electronic product,Their external skin temperatures or chip the monitoring temperature arbitrary heating and cooling between -50~100 degrees Celsius can be made to adjust,And then can be that the manufacturing of various commercial shelves and industrial shelves electronic product and scientific experiment person create a variety of different temperature environments or require continuous temperature cycles environment.
Description
Technical field
The invention belongs to heating and cooling apparatus fields, and in particular to a kind of gradient of temperature heating technology based on semiconductor refrigerating
Conditioning instrumentation is applicable to the fields such as production, manufacture and the research and development of products experiment of optical communication device product, is particularly suitable for
In the production, manufacture, lab process of optic communication chip, TO devices, optical device and optical module etc., creation work is provided
The temperature environment of industry grade low and high temperature degree environment or the continuous temperature shock cycle of high/low temperature.
Background technology
In current optic communication, Electronic products manufacturing field, for optical communication device product, electronic product production,
The activities such as manufacture and research and development of products experiment, general high and low temperature environment are provided there are mainly two types of equipment：One is compressors to set
Standby, another kind is heat flow appearance equipment.
All there are following many deficiencies in aforementioned two kinds of equipment：(1) volume is big and heavy, it is difficult to flexibly move, it is general common
It is more than 80cm*100cm*120cm in the compressor size of manufacture, weight is more than 50kg；(2) cost of investment is high, a compressor
The market price is differed in 100,000~800,000 RMB, is usually used in the compressor and heat flow appearance every of technical grade product manufacture or experiment
The market price of equipment is in 200,000 RMB or so；(3) lifting/lowering temperature speed is very slow, and under normal circumstances, compressor is Celsius from room temperature 25
Degree is reduced to -40 degrees Celsius, then 85 degrees Celsius are warming up to from -40 degrees Celsius, then 25 degree Celsius one of room temperature is returned to from 85 degrees Celsius
A about 20 minutes complete required time in temperature cycles period, and in warm, heat accumulation can be to electronic product temperature
The stabilization of degree causes prodigious influence；(4) temperature stabilization times precision is not high, under normal circumstances, in -40 degrees Celsius of temperature and 85
In the case of degree Celsius, temperature accuracy is not high, and fluctuating temperature is at 3 degrees Celsius or more；(5) enterprise expands production difficulty the middle and later periods, due to
It existing equipment the defects of there are aforementioned (1)~(4), subsequently expands production and needs to be laid out workshop again, cause huge loss, with
And long time is needed to plan.Therefore existing high and low temperature environment provides the application of equipment, to many optic communications, electronic product
Manufacturing enterprise brings many difficulties during rapid investment, growth, update etc..In addition, both equipment there is also
The noise pollution problem more serious with exhaust waste discharge damage ratio.
With the gradual expansion of scope of the enterprise, if still being made a living using existing general compressor apparatus or heat flow appearance equipment
Production activity provides high and low temperature environment, it will causes production capacity expanding difficulty big, great wave is caused to producing line rewiring layout
Take and lose, the problems such as time length are expanded in extension, can no longer meet the demand of optic communication goods producer, are badly in need of research and development
A kind of more integrated, miniaturization, lighting, investment small and high flexibility in use gradient of temperature conditioning instrumentation supports enterprise
Fast development.
Invention content
It is a kind of based on semiconductor refrigerating system present invention aims at providing in order to solve the above problem of the existing technology
The gradient of temperature conditioning instrumentation of thermal technology.
The technical solution adopted in the present invention is：
A kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating, including power supply, gradient of temperature adjust control
Making sheet, loading heat-conducting plate, primary water-cooling head, primary TEC devices, primary water pump and secondary cold and hot interactive system, wherein the electricity
Source is electrically connected the gradient of temperature adjusting control plate, and temperature sensor is equipped in the loading heat-conducting plate；
The loading heat-conducting plate is located at the surface of the primary water-cooling head, and in the loading heat-conducting plate and the primary
The primary TEC devices that several are in matrix arrangement are equipped between water-cooling head, wherein the N-type semiconductor plate of the primary TEC devices
It offsets with the loading heat-conducting plate, the P-type semiconductor plate of the primary TEC devices offsets with the primary water-cooling head；
The cold and hot interactive system of secondary include first grade water-cooling head, second subprime water-cooling head, third secondary water-cooling head,
Secondary TEC devices, secondary water pump and secondary water route heat removal pipeline, wherein first grade water-cooling head, the second subprime water
Cold head and the third secondary water-cooling head are set gradually from top to bottom, and in first grade water-cooling head and the second subprime
Several are respectively equipped between water-cooling head between the second subprime water-cooling head and the third secondary water-cooling head to arrange in matrix
The N-type semiconductor plate of the secondary TEC devices of cloth, the secondary TEC devices offsets with the second subprime water-cooling head, the secondary
The P-type semiconductor plate of TEC devices offsets with first grade water-cooling head or the third secondary water-cooling head；
Second subprime water-cooling head string in the primary water-cooling head, the primary water pump and the cold and hot interactive system of secondary
Connection connection, constitutes initial cycle circuit；
First grade water-cooling head, the third secondary water-cooling head, the secondary water pump and the secondary water route heat extraction
Placed in series is connected to, and constitutes secondary cycles circuit；
The input terminal of the gradient of temperature adjusting control plate is electrically connected the output end of the temperature sensor, the temperature liter
The output end of falling tone section control panel be electrically connected the primary TEC devices, the primary water pump, the secondary TEC devices and
The controlled end of the secondary water pump.
Optimization, further include the cold and hot interactive system of compole, wherein the cold and hot interactive system of compole includes first auxiliary
Help a grade water-cooling head, the second compole water-cooling head, third compole water-cooling head, compole TEC devices, compole water pump and compole
Water route heat removal pipeline；
The first compole water-cooling head, the second compole water-cooling head and the third compole water-cooling head from up to
Under set gradually, and between the first compole water-cooling head and the second compole water-cooling head and second compole
The compole TEC devices that several are in matrix arrangement are respectively equipped between water-cooling head and the third compole water-cooling head, it is described
The N-type semiconductor plate of compole TEC devices offsets with the second compole water-cooling head, the p-type half of the compole TEC devices
Conductor plate offsets with the first compole water-cooling head or the third compole water-cooling head；
The second compole water-cooling head is connected in the secondary cycles circuit, the first compole water-cooling head, institute
Third compole water-cooling head, the compole water pump and the compole water route heat removal pipeline serial communication are stated, compole is constituted
Circulation loop；
The output end of the gradient of temperature adjusting control plate is electrically connected the compole TEC devices and the compole
The controlled end of water pump.
It advanced optimizes, further includes the cold and hot interactive system of final stage, wherein the cold and hot interactive system of final stage includes first
Final stage water-cooling head, the second final stage water-cooling head, third final stage water-cooling head, final stage TEC devices, final stage water pump and final stage water route heat exhausting pipe
Road；
The first final stage water-cooling head, the second final stage water-cooling head and the third final stage water-cooling head are from top to bottom successively
Setting, and between the first final stage water-cooling head and the second final stage water-cooling head and the second final stage water-cooling head with it is described
The final stage TEC devices that several are in matrix arrangement, the N-type of the final stage TEC devices are respectively equipped between third final stage water-cooling head
Semiconductor board offsets with the second final stage water-cooling head, the P-type semiconductor plate of the final stage TEC devices and the first final stage water
Cold head or the third final stage water-cooling head offset；
The second final stage water-cooling head is connected in the compole circulation loop, the first final stage water-cooling head, described
Third final stage water-cooling head, the final stage water pump and the final stage water route heat removal pipeline serial communication constitute final stage circulation loop；
The output end of the gradient of temperature adjusting control plate is electrically connected the final stage TEC devices and the final stage water pump
Controlled end.
Optimize in detail, the cold and hot interactive system of final stage further includes the final stage water being connected in the final stage circulation loop
Case, wherein the final stage water pump is set in the bottom of the final stage water tank.
Optimize in detail, the cold and hot interactive system of final stage further includes for the end to blowing final stage water route heat removal pipeline
Grade fan, wherein the controlled end of the final stage fan is electrically connected the output end of the gradient of temperature adjusting control plate.
It advanced optimizes, the cold and hot interactive system of compole further includes being connected in the compole circulation loop
Compole water tank, wherein the compole water pump is set in the bottom of the compole water tank.
It advanced optimizes, the cold and hot interactive system of compole further includes for blowing compole water route heat exhausting pipe
The compole fan in road, wherein the controlled end of the compole fan is electrically connected the output of the gradient of temperature adjusting control plate
End.
Optimization, further include that the primary water tank being connected in the initial cycle circuit is returned with the secondary cycles are connected on
Secondary water tank in road, wherein in the bottom setting of the primary water tank primary water pump, in the bottom of the secondary water tank
The secondary water pump is set.
Optimization, the cold and hot interactive system of secondary further includes for the secondary wind to blowing the secondary water route heat removal pipeline
Fan, wherein the controlled end of the secondary fan is electrically connected the output end of the gradient of temperature adjusting control plate.
Optimization, the temperature sensor is thermocouple thermometer.
Beneficial effects of the present invention are：
(1) the invention provides a kind of using thermoelectric module as Cooling and Heat Source basis, and passes through loading heat-conducting plate, water cooling
The gradient of temperature conditioning instrumentation that head, water pump, water route heat removal pipeline and gradient of temperature adjusting control plate etc. erect, not only has
Compact, it is light-weight, be moved easily, the advantages such as warming and cooling rate is fast, accuracy of temperature control is high and manufacturing cost is low, can also be
Cooling and warming loading surface provides -65~120 degrees Celsius of arbitrary temp environment, and has very strong load capacity, i.e., in loading
When heat-conducting plate carries medium and small miniature electronic product (such as each electronic product of optical device, optical module, mobile phone), the outer of them can be made
The arbitrary heating and cooling between -50~100 degrees Celsius of table temperature or chip monitoring temperature are adjusted, so can be various commercial shelves and
The manufacturing of industrial shelves electronic product and scientific experiment person create a variety of different temperature environments or require continuous temperature
Recycle environment；
(2) by arranging multistage cold and hot interactive system, heat may be implemented from loading heat-conducting plate/water-cooling head to water route heat extraction
The multiple transfer and differentiation heat dissipation of pipeline, to conducive to the temperature environment of ultralow temperature is quickly obtained, be compared to existing compressor,
Attainable minimum temperature can be made to be down to -65 degrees Celsius from -40 degrees Celsius；
(3) the gradient of temperature conditioning instrumentation also has fast lifting temperature Rate, temperature maintenance stability height, without additional dirt
The advantages that contaminating and be conducive to enterprise's rapid investment, growth and updating, is convenient for practical promotion and application.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structure of the first gradient of temperature conditioning instrumentation based on semiconductor refrigerating heating technology provided by the invention
Schematic diagram.
Fig. 2 is the structure of the second provided by the invention gradient of temperature conditioning instrumentation based on semiconductor refrigerating heating technology
Schematic diagram.
Fig. 3 is the structure of the third gradient of temperature conditioning instrumentation based on semiconductor refrigerating heating technology provided by the invention
Schematic diagram.
In above-mentioned attached drawing：1- power supplys；2- gradient of temperature adjusting control plates；3- loading heat-conducting plates；301- temperature sensors；4-
Primary water-cooling head；5- primary TEC devices；6- primary water pumps；The cold and hot interactive system of 7- grade；First grade water-cooling head of 701-；
702- second subprime water-cooling heads；703- third secondary water-cooling heads；704- grade TEC device；705- secondary water pumps；706- secondary waters
Road heat removal pipeline；707- grade water tank；708- secondary fans；The cold and hot interactive system of 8- compoles；801- the first compole water coolings
Head；802- the second compole water-cooling heads；803- third compole water-cooling heads；804- compole TEC devices；805- compole water
Pump；806- compoles water route heat removal pipeline；807- compole water tanks；808- compole fans；The cold and hot interactive system of 9- final stages；
901- the first final stage water-cooling heads；902- the second final stage water-cooling heads；903- third final stage water-cooling heads；904- final stage TEC devices；905-
Final stage water pump；906- final stages water route heat removal pipeline；907- final stage water tanks；908- final stage fans；10- primary water tanks.
Specific implementation mode
Below in conjunction with the accompanying drawings and specific embodiment the present invention is further elaborated.It should be noted that for this
The explanation of a little way of example is used to help understand the present invention, but does not constitute limitation of the invention.
The terms "and/or", only a kind of incidence relation of description affiliated partner, indicates that there may be three kinds of passes
System, for example, A and/or B, can indicate：Individualism A, individualism B exist simultaneously tri- kinds of situations of A and B, the terms
"/and " it is another affiliated partner relationship of description, indicate may exist two kinds of relationships, for example, A/ and B, can indicate：Individually deposit
In A, two kinds of situations of individualism A and B, in addition, character "/" herein, it is a kind of "or" pass to typically represent forward-backward correlation object
System.
Embodiment one
As shown in Figure 1, the first described gradient of temperature tune based on semiconductor refrigerating heating technology provided in this embodiment
Save instrument, including power supply 1, gradient of temperature adjusting control plate 2, loading heat-conducting plate 3, primary water-cooling head 4, primary TEC devices 5, first
Grade water pump 6 and secondary cold and hot interactive system 7, wherein the power supply 1 is electrically connected the gradient of temperature adjusting control plate 2, described
Temperature sensor 301 is equipped in loading heat-conducting plate 3；The loading heat-conducting plate 3 is located at the surface of the primary water-cooling head 4, and
The primary TEC devices 5 that several are in matrix arrangement are equipped between the loading heat-conducting plate 3 and the primary water-cooling head 4,
In, the N-type semiconductor plate of the primary TEC devices 5 offsets with the loading heat-conducting plate 3, the p-type half of the primary TEC devices 5
Conductor plate offsets with the primary water-cooling head 4.
The cold and hot interactive system 7 of secondary includes first grade water-cooling head 701, second subprime water-cooling head 702, third secondary
Water-cooling head 703, secondary TEC devices 704, secondary water pump 705 and secondary water route heat removal pipeline 706, wherein first secondary water
Cold head 701, the second subprime water-cooling head 702 and the third secondary water-cooling head 703 are set gradually from top to bottom, and described
Between first grade water-cooling head 701 and the second subprime water-cooling head 702 and the second subprime water-cooling head 702 and the third
The secondary TEC devices 704 that several are in matrix arrangement, the secondary TEC devices 704 are respectively equipped between secondary water cold head 703
N-type semiconductor plate offset with the second subprime water-cooling head 702, the P-type semiconductor plate of the secondary TEC devices 704 and institute
It states first grade water-cooling head 701 or the third secondary water-cooling head 703 offsets.
Second subprime water cooling in the primary water-cooling head 4, the primary water pump 6 and the cold and hot interactive system of the secondary 7
First 702 serial communication constitutes initial cycle circuit；First grade water-cooling head 701, the third secondary water-cooling head 703, institute
Secondary water pump 705 and 706 serial communication of secondary water route heat removal pipeline are stated, secondary cycles circuit is constituted；The gradient of temperature
The input terminal of adjusting control plate 2 is electrically connected the output end of the temperature sensor 301, the gradient of temperature adjusting control plate 2
Output end is electrically connected the primary TEC devices 4, the primary water pump 6, the secondary TEC devices 704 and the secondary water
The controlled end of pump 705.
As shown in Figure 1, in the structure of the first gradient of temperature conditioning instrumentation, the power supply 1 is used to be the temperature
Degree lift adjustment control panel 2, the primary TEC devices 5, the primary water pump 6, the secondary TEC devices 704 and described time
Grade water pump 705 provides operating voltage or operating current, and existing power supply module realization may be used.The gradient of temperature adjusts control
Making sheet 2 is used for according to the real-time temperature data from the temperature sensor 301, primary TEC devices 5 and institute described in dynamic control
State secondary TEC devices 704 etc. operating current direction and the control primary water pump 6 and the secondary water pump 705 startup/
Stop, realizing gradient of temperature adjust purpose (during control involved computer program can refer to existing relative program into
Routinely change design obtains row), it can be, but not limited to as singlechip control panel or PLC (Programmable Logic
Controller, programmable logic controller (PLC)) control panel.
The loading heat-conducting plate 3 is used to carry the object of optic communication product etc., the temperature sensor 301 therein
Real-time temperature data for acquiring reflection environment temperature, and the real-time temperature data transmission to the gradient of temperature is adjusted
Control panel 2, the embedded loading heat-conducting plate 3, the temperature sensor 301 preferably use the thermocouple of compact for convenience
Thermometer.In addition, the loading heat-conducting plate 3 can be, but not limited to as copper coin or aluminium sheet etc..The primary water-cooling head 4 is for containing
In the case of filling coolant liquid, coolant liquid and the P-type semiconductor plate of the primary TEC devices 5 is enable to carry out heat transfer, it can
With but be not limited to be made of copper material or aluminium material.The primary TEC devices 5 are to heat the existing of technology based on semiconductor refrigerating
Electronic device can make heat be transferred to P-type semiconductor plate from N-type semiconductor plate under forward current driving, and in reversed electricity
Stream driving under, heat can be made to be transferred to N-type semiconductor plate from P-type semiconductor plate, so as to by the control of current direction (i.e.
Controlled by the gradient of temperature adjusting control plate 2), it realizes and refrigerating/heating purpose is carried out to the loading heat-conducting plate 3.It is described first
Grade water pump 6 realizes the transfer of heat for driving coolant liquid to be circulated in the initial cycle circuit.
The cold and hot interactive system 7 of secondary passes through institute for obtaining certain heat from the initial cycle circuit
It states secondary cycles circuit and the partial heat of acquisition is transferred to secondary water route heat removal pipeline 706, and then distribute, such as Fig. 1 institutes
Show, can be, but not limited to realize parallel heat dissipation using the cold and hot interactive system of two secondary 7.In the cold and hot interactive system of the secondary 7
Structure in, first grade water-cooling head 701 and the third secondary water-cooling head 703 are used for the case where containing coolant liquid
Under, so that coolant liquid and the P-type semiconductor plate of the secondary TEC devices 704 is carried out heat transfer, can be, but not limited to by
Copper material or aluminium material are made；The second subprime water-cooling head 702 is used in the case where containing coolant liquid, makes coolant liquid and institute
Heat transfer can be carried out by stating the N-type semiconductor plate of secondary TEC devices 704, can also but be not limited to by copper material or aluminium
Matter is made.The operation principle of the secondary TEC devices 704 is consistent with the primary TEC devices 5, is repeated no more in this.Described time
Grade water pump 705 realizes the transfer of heat for driving coolant liquid to be circulated in the secondary cycles circuit；The secondary water
Road heat removal pipeline 706 makes the heat part that coolant liquid carries distribute for radiating.Further, since the second subprime water
Cold head 702 is clipped between first grade water-cooling head 701 and the third secondary water-cooling head 703, can be carried out in both up and down
Heat interacts, and greatly speeds up heating or cooling rate.
The course of work of aforementioned temperature lift adjustment instrument can be, but not limited to as follows：(1) in heating, by the temperature
Lift adjustment control panel 2 controls the primary TEC devices 5 and the operating current of the secondary TEC devices 704 is reversed, and starts
The primary water pump 6 and the secondary water pump 705, make coolant liquid in the initial cycle circuit and the secondary cycles circuit
Flowing realizes heat from external environment->Coolant liquid->The purpose of loading heat-conducting plate；(2) in cooling, by the gradient of temperature
Adjusting control plate 2 controls the primary TEC devices 5 and the operating current of the secondary TEC devices 704 is positive, and described in startup
Primary water pump 6 and the secondary water pump 705 make coolant liquid be flowed in the initial cycle circuit and the secondary cycles circuit
It is dynamic, realize heat from loading heat-conducting plate->Coolant liquid->The purpose of external environment；(3) when needing temperature to stablize, by the temperature
Degree lift adjustment control panel 2 controls the operating current cut-off of the primary TEC devices 5 and the secondary TEC devices 704, and stops
The only primary water pump 6 and the secondary water pump 705.
From there through the detailed description of aforementioned temperature lift adjustment instrument so that the gradient of temperature conditioning instrumentation not only has
Compact, it is light-weight, be moved easily, the advantages such as warming and cooling rate is fast, accuracy of temperature control is high and manufacturing cost is low, can also be
Cooling and warming loading surface provides -65~120 degrees Celsius of arbitrary temp environment, and has very strong load capacity, i.e., in loading
When heat-conducting plate carries medium and small miniature electronic product (such as each electronic product of optical device, optical module, mobile phone), the outer of them can be made
The arbitrary heating and cooling between -50~100 degrees Celsius of table temperature or chip monitoring temperature are adjusted, so can be various commercial shelves and
The manufacturing of industrial shelves electronic product and scientific experiment person create a variety of different temperature environments or require continuous temperature
Recycle environment.In addition, the gradient of temperature conditioning instrumentation also has, lifting temperature Rate is fast, temperature maintenance stability is high, without attached
The advantages that adding pollution and being conducive to enterprise's rapid investment, growth and update, it is convenient for practical promotion and application.
Optimization further includes the primary water tank 10 being connected in the initial cycle circuit and is connected on the secondary cycles
Secondary water tank 707 in circuit, wherein in the bottom setting of the primary water tank 10 primary water pump 6, in the secondary water
The secondary water pump 705 is arranged in the bottom of case 707.As shown in Figure 1, the primary water tank 10 and the secondary water tank 707 are distinguished
For containing coolant liquid, to provide enough coolant liquids for the initial cycle circuit and the secondary cycles circuit.
Optimization, the cold and hot interactive system of secondary 7 further includes for blowing the secondary of the secondary water route heat removal pipeline 706
Grade fan 708, wherein the controlled end of the secondary fan 708 is electrically connected the output end of the gradient of temperature adjusting control plate 2.
As shown in Figure 1, by the way that the secondary fan 708 is arranged, can be opened by the gradient of temperature adjusting control plate 2 control in cooling
It is dynamic, further promote the heat dissipation effect of the secondary water route heat removal pipeline 706.
To sum up, the first the gradient of temperature adjusting apparatus based on semiconductor refrigerating heating technology provided using the present embodiment
Device has the following technical effect that：
(1) one kind is present embodiments provided using thermoelectric module as Cooling and Heat Source basis, and passes through loading heat-conducting plate, water cooling
The gradient of temperature conditioning instrumentation that head, water pump, water route heat removal pipeline and gradient of temperature adjusting control plate etc. erect, not only has
Compact, it is light-weight, be moved easily, the advantages such as warming and cooling rate is fast, accuracy of temperature control is high and manufacturing cost is low, can also be
Cooling and warming loading surface provides -65~120 degrees Celsius of arbitrary temp environment, and has very strong load capacity, i.e., in loading
When heat-conducting plate carries medium and small miniature electronic product (such as each electronic product of optical device, optical module, mobile phone), the outer of them can be made
The arbitrary heating and cooling between -50~100 degrees Celsius of table temperature or chip monitoring temperature are adjusted, so can be various commercial shelves and
The manufacturing of industrial shelves electronic product and scientific experiment person create a variety of different temperature environments or require continuous temperature
Recycle environment；
(2) the gradient of temperature conditioning instrumentation also has fast lifting temperature Rate, temperature maintenance stability height, without additional dirt
The advantages that contaminating and be conducive to enterprise's rapid investment, growth and updating, is convenient for practical promotion and application.
Embodiment two
As shown in Fig. 2, present embodiments providing another gradient of temperature adjusting apparatus based on semiconductor refrigerating heating technology
Device, with embodiment one the difference is that：It further include the cold and hot interactive system of compole 8, wherein the cold and hot friendship of compole
Mutual system 8 includes the first compole water-cooling head 801, the second compole water-cooling head 802, third compole water-cooling head 803, compole
TEC devices 804, compole water pump 805 and compole water route heat removal pipeline 806；It is the first compole water-cooling head 801, described
Second compole water-cooling head 802 and the third compole water-cooling head 803 are set gradually from top to bottom, and in first auxiliary
Between grade water-cooling head 801 and the second compole water-cooling head 802 and the second compole water-cooling head 802 is auxiliary with the third
The compole TEC devices 804 for being respectively equipped with that several are in matrix arrangement, the compole TEC devices are helped between grade water-cooling head 803
804 N-type semiconductor plate offsets with the second compole water-cooling head 802, the P-type semiconductor of the compole TEC devices 804
Plate offsets with 801 or described third compole water-cooling head 803 of the first compole water-cooling head；The second compole water-cooling head
802 are connected in the secondary cycles circuit, the first compole water-cooling head 801, the third compole water-cooling head 803,
806 serial communication of the compole water pump 805 and compole water route heat removal pipeline constitutes compole circulation loop；It is described
The output end of gradient of temperature adjusting control plate 2 is electrically connected the compole TEC devices 804 and the compole water pump 805
Controlled end.
As shown in Fig. 2, in second of gradient of temperature conditioning instrumentation, the cold and hot interactive system of the compole 8 is used for
Certain heat is obtained from the secondary cycles circuit, and is turned the partial heat of acquisition by the compole circulation loop
Compole water route heat removal pipeline 806 is moved to, and then is distributed, as shown in Fig. 2, can be, but not limited to cold and hot using a secondary
Interactive system 7 and the cold and hot interactive system of a compole 8 realize serial heat dissipation.In the knot of the cold and hot interactive system of the compole 8
In structure, the first compole water-cooling head 801 and the third compole water-cooling head 803 are used for the case where containing coolant liquid
Under, so that coolant liquid and the P-type semiconductor plate of the compole TEC devices 804 is carried out heat transfer, can be, but not limited to
It is made of copper material or aluminium material；The second compole water-cooling head 802 is used in the case where containing coolant liquid, makes coolant liquid
Heat transfer can be carried out with the N-type semiconductor plate of the compole TEC devices 804, can also but be not limited to by copper material
Or aluminium material is made.The operation principle of the compole TEC devices 804 is consistent with the primary TEC devices 5, no longer superfluous in this
It states.The compole water pump 805 realizes turning for heat for driving coolant liquid to be circulated in the compole circulation loop
It moves；Compole water route heat removal pipeline 806 makes the heat part that coolant liquid carries distribute for radiating.Further, since
The second compole water-cooling head 802 be clipped in the first compole water-cooling head 801 and the third compole water-cooling head 803 it
Between, heat interaction can be carried out in both up and down, greatly speed up heating or cooling rate.
By the cold and hot interactive system of aforementioned arrangement two-stage, heat may be implemented and arranged from loading heat-conducting plate/water-cooling head to water route
The double transfer and differentiation heat dissipation of heat pipeline, to conducive to the temperature environment of ultralow temperature is quickly obtained, be compared to existing compression
Machine can make attainable minimum temperature be down to -65 degrees Celsius from -40 degrees Celsius.
Optimization, the cold and hot interactive system of the compole 8 further includes the auxiliary being connected in the compole circulation loop
Grade water tank 807, wherein the compole water pump 805 is set in the bottom of the compole water tank 807.As shown in Fig. 2, described
Compole water tank 807 is for containing coolant liquid, to provide enough coolant liquids for the compole circulation loop.
Optimization, the cold and hot interactive system of the compole 8 further includes for blowing compole water route heat removal pipeline 806
Compole fan 808, wherein the controlled end of the compole fan 808 is electrically connected the gradient of temperature adjusting control plate 2
Output end.As shown in Fig. 2, by the way that the compole fan 808 is arranged, it can be in cooling by the gradient of temperature adjusting control plate
2 controls start, and further promote the heat dissipation effect of compole water route heat removal pipeline 806.
Second of gradient of temperature conditioning instrumentation based on semiconductor refrigerating heating technology that the present embodiment is provided, with implementation
Example one is compared, and is also had the following technical effect that：
(1) by the cold and hot interactive system of aforementioned arrangement two-stage, heat may be implemented from loading heat-conducting plate/water-cooling head to water route
The double transfer and differentiation heat dissipation of heat removal pipeline, to conducive to the temperature environment of ultralow temperature is quickly obtained, be compared to existing pressure
Contracting machine can make attainable minimum temperature be down to -65 degrees Celsius from -40 degrees Celsius.
Embodiment three
As shown in figure 3, the present embodiment provides the third on the basis of embodiment two is based on semiconductor refrigerating heating skill
The gradient of temperature conditioning instrumentation of art, with embodiment two the difference is that：Further include the cold and hot interactive system of final stage 9, wherein
The cold and hot interactive system 9 of final stage includes the first final stage water-cooling head 901, the second final stage water-cooling head 902, third final stage water-cooling head
903, final stage TEC devices 904, final stage water pump 905 and final stage water route heat removal pipeline 906；The first final stage water-cooling head 901, institute
It states the second final stage water-cooling head 902 and the third final stage water-cooling head 903 is set gradually from top to bottom, and in the first final stage water
Between cold head 901 and the second final stage water-cooling head 902 and the second final stage water-cooling head 902 and the third final stage water-cooling head
The final stage TEC devices 904 that several are in matrix arrangement, the N-type semiconductor of the final stage TEC devices 904 are respectively equipped between 903
Plate offsets with the second final stage water-cooling head 902, P-type semiconductor plate and the first final stage water of the final stage TEC devices 904
Cold head 901 or the third final stage water-cooling head 903 offset；The second final stage water-cooling head 902 is connected on the compole cycle
In circuit, the first final stage water-cooling head 901, the third final stage water-cooling head 903, the final stage water pump 905 and the final stage
Heat removal pipeline 906 serial communication in water route constitutes final stage circulation loop；The output end of the gradient of temperature adjusting control plate 2 is distinguished
It is electrically connected the controlled end of the final stage TEC devices 904 and the final stage water pump 905.
As shown in figure 3, in the third described gradient of temperature conditioning instrumentation, the cold and hot interactive system 9 of final stage be used for from
Certain heat is obtained in the compole circulation loop, and is shifted the partial heat of acquisition by the final stage circulation loop
It to final stage water route heat removal pipeline 906, and then distributes, as shown in figure 3, can be, but not limited to use a cold and hot interaction of secondary
The cold and hot interactive system 8 of 7, compoles of system and the cold and hot interactive system of a final stage 9 realize serial heat dissipation.It is cold in the final stage
In the structure of heat interaction system 9, the first final stage water-cooling head 901 and the third final stage water-cooling head 903 are for cold in splendid attire
But in the case of liquid, coolant liquid and the P-type semiconductor plate of the final stage TEC devices 904 is enable to carry out heat transfer, it can be with
But it is not limited to be made of copper material or aluminium material；The second final stage water-cooling head 902 is used in the case where containing coolant liquid, is made
Coolant liquid and the N-type semiconductor plate of the final stage TEC devices 904 can carry out heat transfer, can also but be not limited to by copper
Material or aluminium material are made.The operation principle of the final stage TEC devices 904 is consistent with the primary TEC devices 5, no longer in this
It repeats.The final stage water pump 905 realizes turning for heat for driving coolant liquid to be circulated in the final stage circulation loop
It moves；Final stage water route heat removal pipeline 906 makes the heat part that coolant liquid carries distribute for radiating.Further, since institute
The second final stage water-cooling head 902 is stated to be clipped between the first final stage water-cooling head 901 and the third final stage water-cooling head 903, it can be
Both up and down carries out heat interaction, greatly speeds up heating or cooling rate.
By the multistage cold and hot interactive system of aforementioned arrangement, heat may be implemented and arranged from loading heat-conducting plate/water-cooling head to water route
The multiple transfer and differentiation heat dissipation of heat pipeline, to conducive to the temperature environment of ultralow temperature is quickly obtained, be compared to existing compression
Machine can be easier that attainable minimum temperature is made to be down to -65 degrees Celsius from -40 degrees Celsius.
Optimization, the cold and hot interactive system of the final stage 9 further includes the final stage water tank being connected in the final stage circulation loop
907, wherein in the bottom of the final stage water tank 907, the final stage water pump 905 is set.As shown in figure 3, the final stage water tank 907
For containing coolant liquid, to provide enough coolant liquids for the final stage circulation loop.
Optimization, the cold and hot interactive system of the final stage 9 further includes for the end to blowing final stage water route heat removal pipeline 906
Grade fan 909, wherein the controlled end of the final stage fan 909 is electrically connected the output end of the gradient of temperature adjusting control plate 2.
As shown in figure 3, by the way that the final stage fan 909 is arranged, can be opened by the gradient of temperature adjusting control plate 2 control in cooling
It is dynamic, further promote the heat dissipation effect of final stage water route heat removal pipeline 906.
The third gradient of temperature conditioning instrumentation based on semiconductor refrigerating heating technology that the present embodiment is provided, has
Technique effect and embodiment two it is consistent, repeated no more in this.
The present invention is not limited to above-mentioned optional embodiment, anyone can show that other are each under the inspiration of the present invention
The product of kind form, such as obtain the serial/parallel heat dissipation instrument with the cold and hot interactive system of more stages.Above-mentioned specific embodiment party
Formula should not be understood the limitation of pairs of protection scope of the present invention, and protection scope of the present invention should be to define in claims
Subject to, and specification can be used for interpreting the claims.
Claims (10)
1. a kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating, it is characterised in that：Including power supply (1), temperature
Spend lift adjustment control panel (2), loading heat-conducting plate (3), primary water-cooling head (4), primary TEC devices (5), primary water pump (6) and
Secondary cold and hot interactive system (7), wherein the power supply (1) is electrically connected the gradient of temperature adjusting control plate (2), in the load
Temperature sensor (301) is equipped in object heat-conducting plate (3)；
The loading heat-conducting plate (3) is located at the surface of the primary water-cooling head (4), and in the loading heat-conducting plate (3) and institute
State the primary TEC devices (5) for being equipped with several in matrix arrangement between primary water-cooling head (4), wherein the primary TEC devices
(5) N-type semiconductor plate offsets with the loading heat-conducting plate (3), the P-type semiconductor plate of the primary TEC devices (5) with it is described
Primary water-cooling head (4) offsets；
The cold and hot interactive system of secondary (7) includes first grade water-cooling head (701), second subprime water-cooling head (702), third time
Grade water-cooling head (703), secondary TEC devices (704), secondary water pump (705) and secondary water route heat removal pipeline (706), wherein described
First grade water-cooling head (701), the second subprime water-cooling head (702) and the third secondary water-cooling head (703) are from top to bottom
It sets gradually, and between first grade water-cooling head (701) and the second subprime water-cooling head (702) and second described
The secondary TEC devices that several are in matrix arrangement are respectively equipped between grade water-cooling head (702) and the third secondary water-cooling head (703)
Part (704), the N-type semiconductor plate of the secondary TEC devices (704) offset with the second subprime water-cooling head (702), described time
The P-type semiconductor plate of grade TEC devices (704) and first grade water-cooling head (701) or the third secondary water-cooling head (703)
It offsets；
Second subprime water in the primary water-cooling head (4), the primary water pump (6) and the cold and hot interactive system of secondary (7)
Cold head (702) serial communication constitutes initial cycle circuit；
First grade water-cooling head (701), the third secondary water-cooling head (703), the secondary water pump (705) and described time
Grade water route heat removal pipeline (706) serial communication, constitutes secondary cycles circuit；
The input terminal of the gradient of temperature adjusting control plate (2) is electrically connected the output end of the temperature sensor (301), the temperature
The output end of degree lift adjustment control panel (2) is electrically connected the primary TEC devices (4), the primary water pump (6), described
The controlled end of secondary TEC devices (704) and the secondary water pump (705).
2. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as described in claim 1, feature are existed
In：Further include the cold and hot interactive system of compole (8), wherein the cold and hot interactive system of compole (8) includes the first compole water
Cold head (801), the second compole water-cooling head (802), third compole water-cooling head (803), compole TEC devices (804), auxiliary
Grade water pump (805) and compole water route heat removal pipeline (806)；
The first compole water-cooling head (801), the second compole water-cooling head (802) and the third compole water-cooling head
(803) it sets gradually from top to bottom, and in the first compole water-cooling head (801) and the second compole water-cooling head
(802) between and the second compole water-cooling head (802) and the third compole water-cooling head (803) if between be respectively equipped with
The dry compole TEC device (804) in matrix arrangement, the N-type semiconductor plate of the compole TEC devices (804) with it is described
Second compole water-cooling head (802) offsets, P-type semiconductor plate and first compole of the compole TEC devices (804)
Water-cooling head (801) or the third compole water-cooling head (803) offset；
The second compole water-cooling head (802) is connected in the secondary cycles circuit, the first compole water-cooling head
(801), the third compole water-cooling head (803), the compole water pump (805) and compole water route heat removal pipeline
(806) serial communication constitutes compole circulation loop；
The output end of the gradient of temperature adjusting control plate (2) is electrically connected compole TEC devices (804) and described auxiliary
Help the controlled end of a grade water pump (805).
3. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as claimed in claim 2, feature are existed
In：Further include the cold and hot interactive system of final stage (9), wherein the cold and hot interactive system of final stage (9) includes the first final stage water-cooling head
(901), the second final stage water-cooling head (902), third final stage water-cooling head (903), final stage TEC devices (904), final stage water pump (905)
With final stage water route heat removal pipeline (906)；
The first final stage water-cooling head (901), the second final stage water-cooling head (902) and the third final stage water-cooling head (903)
It sets gradually from top to bottom, and between the first final stage water-cooling head (901) and the second final stage water-cooling head (902) and institute
It states and is respectively equipped with several between the second final stage water-cooling head (902) and the third final stage water-cooling head (903) in matrix arrangement
Final stage TEC devices (904), the N-type semiconductor plate of the final stage TEC devices (904) and the second final stage water-cooling head (902) phase
It supports, the P-type semiconductor plate of the final stage TEC devices (904) and the first final stage water-cooling head (901) or the third final stage water
Cold head (903) offsets；
The second final stage water-cooling head (902) is connected in the compole circulation loop, the first final stage water-cooling head
(901), the third final stage water-cooling head (903), the final stage water pump (905) and final stage water route heat removal pipeline (906) string
Connection connection, constitutes final stage circulation loop；
The output end of the gradient of temperature adjusting control plate (2) is electrically connected the final stage TEC devices (904) and the final stage
The controlled end of water pump (905).
4. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as claimed in claim 3, feature are existed
In：The cold and hot interactive system of final stage (9) further includes the final stage water tank (907) being connected in the final stage circulation loop, wherein
In the bottom of the final stage water tank (907), the final stage water pump (905) is set.
5. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as claimed in claim 3, feature are existed
In：The cold and hot interactive system of final stage (9) further includes for the final stage fan to blowing final stage water route heat removal pipeline (906)
(908), wherein the controlled end of the final stage fan (908) is electrically connected the output end of the gradient of temperature adjusting control plate (2).
6. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as claimed in claim 2, feature are existed
In：The cold and hot interactive system of compole (8) further includes the compole water tank being connected in the compole circulation loop
(807), wherein in the bottom of the compole water tank (807), the compole water pump (805) is set.
7. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as claimed in claim 2, feature are existed
In：The cold and hot interactive system of compole (8) further includes for the compole to blowing compole water route heat removal pipeline (806)
Fan (808), wherein the controlled end of the compole fan (808) is electrically connected the defeated of the gradient of temperature adjusting control plate (2)
Outlet.
8. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as described in claim 1, feature are existed
In：Time for further including the primary water tank (10) being connected in the initial cycle circuit and being connected in the secondary cycles circuit
Grade water tank (707), wherein in the bottom setting of the primary water tank (10) the primary water pump (6), in the secondary water tank
(707) secondary water pump (705) is arranged in bottom.
9. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as described in claim 1, feature are existed
In：The cold and hot interactive system of secondary (7) further includes for the secondary fan to blowing the secondary water route heat removal pipeline (706)
(708), wherein the controlled end of the secondary fan (708) is electrically connected the output end of the gradient of temperature adjusting control plate (2).
10. a kind of gradient of temperature conditioning instrumentation being heated technology based on semiconductor refrigerating as described in claim 1, feature are existed
In：The temperature sensor (301) is thermocouple thermometer.
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| CN201810923751.9A CN108716787A (en) | 2018-08-14 | 2018-08-14 | A kind of gradient of temperature conditioning instrumentation heating technology based on semiconductor refrigerating |
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