CN111102866A - Heat pipe capable of synchronously controlling auxiliary phase change - Google Patents
Heat pipe capable of synchronously controlling auxiliary phase change Download PDFInfo
- Publication number
- CN111102866A CN111102866A CN202010102572.6A CN202010102572A CN111102866A CN 111102866 A CN111102866 A CN 111102866A CN 202010102572 A CN202010102572 A CN 202010102572A CN 111102866 A CN111102866 A CN 111102866A
- Authority
- CN
- China
- Prior art keywords
- heat
- section
- phase change
- pipe
- semiconductor refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008859 change Effects 0.000 title claims abstract description 24
- 238000001704 evaporation Methods 0.000 claims abstract description 39
- 230000008020 evaporation Effects 0.000 claims abstract description 39
- 230000005494 condensation Effects 0.000 claims abstract description 36
- 238000009833 condensation Methods 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 238000005057 refrigeration Methods 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 238000010521 absorption reaction Methods 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims abstract description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005213 imbibition Methods 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
- 239000013529 heat transfer fluid Substances 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract description 2
- 239000012071 phase Substances 0.000 description 14
- 239000012530 fluid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat pipe for synchronously controlling auxiliary phase change, which comprises a pipe shell, wherein a closed cavity is formed in the pipe shell, the pipe shell comprises an evaporation section, a condensation section and a heat insulation section, a liquid absorption core and a heat transfer medium are arranged in the closed cavity, a plurality of semiconductor refrigeration sheets are arranged in the liquid absorption core in the heat insulation section, and two ends of each semiconductor refrigeration sheet are respectively arranged in the evaporation section and the condensation section. According to the invention, the semiconductor refrigeration piece is arranged in the heat insulation section, and two ends of the semiconductor refrigeration piece are respectively arranged in the evaporation section and the condensation section, when the working temperature of the heat pipe is not in the nominal working temperature range, the semiconductor refrigeration piece works, the cold end of the semiconductor refrigeration piece absorbs heat from the condensation section of the heat pipe, the auxiliary heat transfer medium is condensed, the hot end of the semiconductor refrigeration piece releases heat in the evaporation section of the heat pipe, the evaporation of the heat transfer fluid is enhanced, and the phase change of the heat transfer fluid in the heat pipe can be realized in the whole working temperature range, so that the continuous high-efficiency heat transfer is maintained, and the critical heat flux density of the heat pipe.
Description
Technical Field
The invention belongs to the technical field of heat exchange devices, and particularly relates to a heat pipe capable of synchronously controlling auxiliary phase change.
Background
The heat pipe is mainly composed of a sealed metal pipe body, a capillary core structure in the sealed metal pipe body and heat transfer fluid filled in the metal pipe body, and proper vacuum degree is kept in the metal pipe body so as to reduce the starting temperature difference of the heat pipe. The evaporation end part (Evaporator) of the heat pipe is arranged on the heat source, so that the heat generated by the heat source evaporates the fluid (liquid phase) in the pipe to absorb heat (latent heat) and vaporize (vapor phase), the generated vapor is driven to flow to the condensation part (condensor) of the heat pipe by the vapor pressure difference, the vapor releases the latent heat in the condensation part, namely, is condensed and recovered to the liquid phase, and then is driven by capillary force to return to the evaporation part through the capillary wick structure, namely, the heat is rapidly conducted out through the structure.
Heat pipes have long been used in heat recovery or other different heat exchange applications due to their simple construction and their high conductivity and low thermal resistance. However, the heat pipe is a heat transfer element which transfers heat by means of the phase change of the working liquid in the heat pipe, and the phase change condition is controlled by the pressure and the working temperature of the fluid filled in the heat pipe. On the other hand, the operating temperature is variable, and therefore, improving the performance of the heat pipe should ensure that the fluid inside the heat pipe can achieve phase change within the whole operating temperature range. However, the existing heat pipe product cannot ensure that the fluid in the heat pipe can realize phase change in the whole working temperature range.
Therefore, how to provide a heat pipe, which can maintain high heat transfer efficiency in the working temperature range, is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the defects in the prior art, the invention aims to provide a heat pipe for synchronously controlling auxiliary phase change, which can ensure that the phase change of heat transfer fluid in the heat pipe can be realized in the whole working temperature range, thereby keeping continuous and efficient heat transfer.
The technical scheme is as follows: in order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: a heat pipe capable of synchronously controlling auxiliary phase change comprises a pipe shell, wherein a closed cavity is formed in the pipe shell, the pipe shell comprises an evaporation section, a condensation section and a heat insulation section arranged between the evaporation section and the condensation section, a liquid absorption core and a heat transfer medium are arranged in the closed cavity, a plurality of semiconductor refrigeration sheets are arranged in the liquid absorption core in the heat insulation section, two ends of each semiconductor refrigeration sheet are respectively arranged in the evaporation section and the condensation section, and when the temperature outside the evaporation section or the condensation section is not enough to respectively cause the evaporation phase change and the condensation phase change of the heat transfer medium in the evaporation section and the condensation section, the semiconductor refrigeration sheets are electrified to work, so that the heat transfer medium in the evaporation section and the condensation section is kept in a nominal working range.
Furthermore, heat conduction fins are arranged at two ends of the semiconductor refrigeration piece and are in a long strip shape, and the heat conduction fins extend to the outer ends of the evaporation section and the condensation section respectively.
Furthermore, the cross section of the pipe shell is circular or rectangular.
Furthermore, the liquid absorption core is tightly attached to the inner wall of the pipe shell.
Furthermore, a liquid injection port communicated with the closed cavity is arranged on the pipe shell.
Further, the heat transfer medium includes ammonia, ethanol, freon, and water.
Has the advantages that: compared with the prior art, the invention has the following advantages:
according to the invention, the semiconductor refrigeration piece is arranged in the heat insulation section, and two ends of the semiconductor refrigeration piece are respectively arranged in the evaporation section and the condensation section, when the working temperature of the heat pipe is not in the nominal working temperature range, the semiconductor refrigeration piece works, the cold end of the semiconductor refrigeration piece absorbs heat from the condensation section of the heat pipe, the auxiliary heat transfer medium is condensed, the hot end of the semiconductor refrigeration piece releases heat in the evaporation section of the heat pipe, the evaporation of the heat transfer fluid is enhanced, and the phase change of the heat transfer fluid in the heat pipe can be realized in the whole working temperature range, so that the continuous high-efficiency heat transfer is maintained, and the critical heat flux density of the heat pipe.
Drawings
FIG. 1 is a schematic diagram of a heat pipe structure according to an embodiment of the present invention;
fig. 2 is a schematic sectional view taken along the line a-a in fig. 1.
Detailed Description
The present invention will be further illustrated by the following specific examples, which are carried out on the premise of the technical scheme of the present invention, and it should be understood that these examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.
As shown in fig. 1 and 2, the heat pipe for synchronously controlling auxiliary phase change comprises a pipe shell 1 with a closed cavity 3 inside, a liquid absorption core 4 arranged in the pipe shell 1, a heat transfer medium filled in the closed cavity 3 at a certain pressure, and a plurality of semiconductor cooling fins 5.
In particular, the cartridge 1 is a closed hollow shell, whose cross-section may be circular, rectangular or other. The pipe shell 1 can also be provided with a liquid injection port communicated with the closed cavity 3, and the closed cavity 3 is vacuumized and injected with heat transfer media through the liquid injection port. The closed cavity 3 has a certain vacuum degree, and the vacuum degree can be determined according to the type and the boiling point temperature of the heat transfer medium which are actually required. The heat transfer medium can adopt ammonia, ethanol, Freon (R21, R22, R113 and the like) or water, and the boiling point temperature can be determined according to the nominal working temperature of the heat pipe, so that the type of the heat transfer medium is determined. The wick 4 is preferably arranged in close proximity to the inner wall of the housing 1. Generally, the heat transfer medium is evaporated by absorbing heat at one end of the tube case 1 and then condensed by releasing heat at the other end, a section where the heat transfer medium is evaporated into a gas is referred to as an evaporation section 2, a section where the heat transfer medium is condensed into a liquid is referred to as a condensation section 6, and an adiabatic section 7 is disposed between the evaporation section 2 and the condensation section 6. The heat transfer medium condensed into a liquid state in the condensation section 6 flows back to the evaporation section 2 from the wick 4 by capillary action. A plurality of semiconductor refrigeration pieces 5 are arranged in a liquid absorption core 4 in a heat insulation section 7, two ends of each semiconductor refrigeration piece 5 are respectively arranged in an evaporation section 2 and a condensation section 6, and then when the semiconductor refrigeration pieces 5 are electrified to work, the temperature of heat transfer media in the evaporation section 2 and the condensation section 6 can be adjusted simultaneously.
In order to improve the temperature adjusting effect of the heat transfer medium, heat conducting fins 8 are arranged at two ends of the semiconductor refrigerating sheet 5, the heat conducting fins 8 are preferably long strips, and the heat conducting fins 8 at the two ends extend to the outer ends of the evaporation section and the condensation section respectively.
When the heat pipe is used, temperature sensors are arranged on the outer sides of the evaporation section 2 and the condensation section 6 to measure the temperatures of the outer sides of the evaporation section 2 and the condensation section 6 respectively, when the temperature of the outer sides of the evaporation section 2 or the condensation section 6 is not within a nominal working range, the semiconductor refrigeration piece 5 is electrified to work, the temperature of the end part of the semiconductor refrigeration piece 5 positioned in the direction of the evaporation section 2 is increased to become a hot end, the heat of the semiconductor refrigeration piece heats the heat transfer medium in the liquid absorption core 4 through the heat conduction fin 8 of the hot end, the heat transfer medium is heated together with the heat absorbed by the evaporation section 2 of the heat pipe from the outside, the heat transfer medium is evaporated to absorb heat (latent heat) and is vaporized (vapor phase), and the generated vapor is. Meanwhile, the temperature of the end part of the semiconductor refrigeration piece 5, which is positioned in the direction of the condensation section 6, is reduced and becomes a cold end, the heat conduction fins 8 at the cold end absorb the heat of the heat transfer medium in the liquid absorption core 4, the heat transfer medium steam is enhanced to release latent heat in the condensation section 6, namely, the heat is condensed and recovered to a liquid phase, and then the heat transfer medium is driven by capillary force to return to the evaporation section 2 through the liquid absorption core 4, so that the heat transfer medium in the evaporation section 2 and the condensation section 6 is kept in a nominal working range, and further, the phase change of the heat transfer fluid in the heat.
When the heat pipe needs reverse heat transfer, reverse current is applied to the semiconductor refrigerating sheet 5, and the original hot end of the semiconductor refrigerating sheet 5 becomes the cold end and the original cold end becomes the hot end.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. The utility model provides a heat pipe of supplementary phase transition of synchronous control, includes that inside is formed with the tube of closed cavity, the tube includes evaporation zone, condensation segment and sets up the adiabatic section between evaporation zone and the condensation segment, be equipped with imbibition core and heat transfer medium in the closed cavity, its characterized in that: the heat insulation section is characterized in that a plurality of semiconductor refrigeration pieces are arranged in the liquid absorption core in the heat insulation section, two ends of each semiconductor refrigeration piece are respectively arranged in the evaporation section and the condensation section, and when the temperature of the outer side of the evaporation section or the outer side of the condensation section is not enough to respectively cause evaporation phase change and condensation phase change of a heat transfer medium in the evaporation section or the condensation section, the semiconductor refrigeration pieces are electrified to work, so that the heat transfer medium in the evaporation section and the heat transfer medium in the condensation section are both kept in a nominal working range.
2. A heat pipe with synchronously controlled assisted phase change as claimed in claim 1, wherein: the both ends of semiconductor refrigeration piece all are equipped with heat conduction fin, heat conduction fin is rectangular form, and its outer end setting that stretches to evaporation zone and condensation zone respectively.
3. A heat pipe with synchronously controlled assisted phase change as claimed in claim 1, wherein: the cross section of the pipe shell is circular or rectangular.
4. A heat pipe with synchronously controlled assisted phase change as claimed in claim 1, wherein: the liquid absorption core is tightly attached to the inner wall of the pipe shell.
5. A heat pipe with synchronously controlled assisted phase change as claimed in claim 1, wherein: and the tube shell is provided with a liquid injection port communicated with the closed cavity.
6. A heat pipe with synchronously controlled assisted phase change as claimed in claim 1, wherein: the heat transfer medium includes ammonia, ethanol, freon, and water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010102572.6A CN111102866A (en) | 2020-02-19 | 2020-02-19 | Heat pipe capable of synchronously controlling auxiliary phase change |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010102572.6A CN111102866A (en) | 2020-02-19 | 2020-02-19 | Heat pipe capable of synchronously controlling auxiliary phase change |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111102866A true CN111102866A (en) | 2020-05-05 |
Family
ID=70427722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010102572.6A Pending CN111102866A (en) | 2020-02-19 | 2020-02-19 | Heat pipe capable of synchronously controlling auxiliary phase change |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111102866A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061848A (en) * | 2021-03-25 | 2021-07-02 | 南京昀光科技有限公司 | Evaporation source |
| CN114034198A (en) * | 2021-12-03 | 2022-02-11 | 北京微焓科技有限公司 | Variable heat conductivity heat pipe system and heat conductivity control method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1508085A1 (en) * | 1987-11-02 | 1989-09-15 | Омский политехнический институт | Controllable heat pipe |
| JPH06331286A (en) * | 1993-05-26 | 1994-11-29 | Nec Corp | Heat transfer controlling heat pipe |
| CN2311734Y (en) * | 1997-09-30 | 1999-03-24 | 郑万烈 | Thermoelectric semi-conductor cold-hot head apparatus |
| JP2002100816A (en) * | 2000-09-22 | 2002-04-05 | Matsushita Refrig Co Ltd | Thermoelectric cooling system |
| CN108344317A (en) * | 2018-02-08 | 2018-07-31 | 西南石油大学 | A kind of overlength gravity assisted heat pipe geothermal exploitation system assisted using peltier effect |
| CN109741848A (en) * | 2018-12-26 | 2019-05-10 | 西安交通大学 | A kind of static heat transfer generating integration device and method based on high-temperature heat pipe heat transfer |
| CN211823995U (en) * | 2020-02-19 | 2020-10-30 | 江苏高科应用科学研究所有限公司 | Heat pipe capable of synchronously controlling auxiliary phase change |
-
2020
- 2020-02-19 CN CN202010102572.6A patent/CN111102866A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1508085A1 (en) * | 1987-11-02 | 1989-09-15 | Омский политехнический институт | Controllable heat pipe |
| JPH06331286A (en) * | 1993-05-26 | 1994-11-29 | Nec Corp | Heat transfer controlling heat pipe |
| CN2311734Y (en) * | 1997-09-30 | 1999-03-24 | 郑万烈 | Thermoelectric semi-conductor cold-hot head apparatus |
| JP2002100816A (en) * | 2000-09-22 | 2002-04-05 | Matsushita Refrig Co Ltd | Thermoelectric cooling system |
| CN108344317A (en) * | 2018-02-08 | 2018-07-31 | 西南石油大学 | A kind of overlength gravity assisted heat pipe geothermal exploitation system assisted using peltier effect |
| CN109741848A (en) * | 2018-12-26 | 2019-05-10 | 西安交通大学 | A kind of static heat transfer generating integration device and method based on high-temperature heat pipe heat transfer |
| CN211823995U (en) * | 2020-02-19 | 2020-10-30 | 江苏高科应用科学研究所有限公司 | Heat pipe capable of synchronously controlling auxiliary phase change |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061848A (en) * | 2021-03-25 | 2021-07-02 | 南京昀光科技有限公司 | Evaporation source |
| CN113061848B (en) * | 2021-03-25 | 2023-03-10 | 南京昀光科技有限公司 | Evaporation source |
| CN114034198A (en) * | 2021-12-03 | 2022-02-11 | 北京微焓科技有限公司 | Variable heat conductivity heat pipe system and heat conductivity control method thereof |
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