JP2002100816A - Thermoelectric cooling system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric cooing system, using a thermoelectric module having Peltier effect. SOLUTION: This thermoelectric cooling system is equipped with the thermoelectric module, having a heat-absorbing surface and a heat-radiating surface where the heat-radiating surface is heated, and the heat-absorbing surface is cooled by applying a current, band an outer shell where the thermoelectric module is included, a part of the space except the module is maintained in an almost vacuum state, and the heat-absorbing surface of the module is in contact thermally with the heat radiating surface of the module. Thereby, heat leakage from the periphery of the module is restrained to be with a compact region, a block or the like for thickness adjustment which has been usually necessary is eliminated, and cooling efficiency of the thermoelectric cooling system can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thermoelectric cooling device using a thermoelectric module having a Peltier effect.

[0002]

2. Description of the Related Art In recent years, the ozone layer destruction effect of Freon gas has become a global problem, and the development of a cooling device that does not use Freon gas has been urgently required. As one of the cooling devices that do not use Freon gas, a cooling device that uses a thermoelectric module has attracted attention.

Here, a thermoelectric module is a Peltier (Pe
ltier) module, known as a thermo module or a thermoelectric element, has two heat transfer surfaces, one current transfer surface is heated by passing an electric current, and the other heat transfer surface is cooled It is a member that has a function. That is, in the thermoelectric module, one surface functions as a heat radiation surface, and the other functions as a heat absorption surface.

A cooling device using a thermoelectric module is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 7-176796.

Hereinafter, the conventional thermoelectric cooling device will be described with reference to the drawings.

FIG. 9 is a sectional view of a thermoelectric cooling device according to the invention disclosed in Japanese Patent Application Laid-Open No. 7-176796. In FIG. 9, reference numeral 1 denotes a thermoelectric module, and heat dissipation surfaces 1a are provided on both sides.
And the heat absorbing surface 1b are substantially parallel to each other. Reference numeral 2 denotes a heat sink for heat dissipation provided with a plurality of fins 2a, and the back side of the fins 2a is thermally joined to the heat dissipation surface 1a of the thermoelectric module 1. Reference numeral 3 denotes a cooling heat sink having a plurality of fins 3a, and the back side of the fins 3a is thermally connected to the heat absorbing surface 1b of the thermoelectric module 1 via a block 4.

In the case where the conventional thermoelectric cooling device configured as described above is generally used for a refrigerator or the like, a through hole is provided in a part of a heat insulating wall separating the inside and outside of the refrigerator, and the heat sink for heat radiation is provided. It is attached to the outside with the through hole so that the cooling heat sink is located inside the refrigerator. In FIG. 9, reference numeral 5 denotes a heat insulating wall, in which a thermoelectric module 1 and a block 4 are inserted into a penetrating portion provided in the heat insulating wall 5, and a heat sink 2 for heat radiation and a heat sink 3 for cooling protrude from both sides of the heat insulating wall 5. .

[0008]

However, in the above-mentioned prior art, it is necessary to minimize the number of through holes provided in the heat insulating wall 5 in order to suppress the amount of heat that enters from the outside of the storage to the inside of the storage. In addition, the heat sink 2 for heat radiation and the heat sink 3 for cooling have the size in the plane direction of the thermoelectric module 1 in order to enlarge the heat transfer area due to the low heat transfer coefficient of the air flow for heat exchange.
Larger than the thermoelectric module 1
Since the amount of heat radiation is greater than the amount of cooling by the amount of electric input to the heat sink, the heat sink 2 for heat radiation is usually larger than the heat sink 3 for cooling. In order to satisfy these, the heat sink 2 for heat radiation and the heat sink 3 for cooling
Has a structure that can be attached with the heat insulating wall 5 interposed therebetween, and blocks the difference between the thickness of the heat insulating wall 5 and the thickness of the thermoelectric module 1.
Will make up for it. Therefore, the total thermal resistance on the cooling side between the airflow inside the refrigerator and the thermoelectric module 1 increases due to the increase in the contact thermal resistance due to the increase in the number of joints and the generation of the thermal resistance inside the block 4. Surface 1a
The temperature difference between the thermoelectric module 1 and the heat absorbing surface 1b increases, and the cooling efficiency of the thermoelectric module 1 decreases.

Further, as described above, the heat sink 2 for heat radiation and the heat sink 3 for cooling protrude from the heat insulating wall 5, so that there is a problem that the thermoelectric cooling device cannot be made compact in the thickness direction of the heat insulating wall 5.

Further, since the size of the heat radiating heat sink 2 and the size of the cooling heat sink 3 are larger than that of the through hole of the heat insulating wall 5, at least one of the heat radiating heat sink 2 and the cooling heat sink 3 is in a block with the thermoelectric module 1. After insertion into the through-holes of the heat insulating wall 5, it is necessary to join them with each other, and there is a problem that the assembly process becomes complicated because the thermoelectric cooling device cannot be unitized.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems, and it is possible to increase the cooling efficiency of a cooling device by enabling a thermoelectric cooling device to be attached to a refrigerator or the like without using a component such as a block which increases thermal resistance. With the goal. Another object is to make the thermoelectric cooling device compact. It is another object of the present invention to facilitate the incorporation of a thermoelectric cooling device into a refrigerator or the like.

[0012]

In order to achieve this object, the present invention according to the first aspect of the present invention has a heat absorbing surface and a heat radiating surface, and the current radiating surface is heated by passing an electric current to cool the heat absorbing surface. A thermoelectric cooling device comprising: a thermoelectric module to be provided; and an outer casing that contains the thermoelectric module, is kept in a reduced pressure state, and has a heat absorbing surface and a heat radiating surface in thermal contact with the thermoelectric module.

[0013] Thus, since a region having the same thickness as the thermoelectric module and having excellent heat insulation performance is integrally formed around the thermoelectric module, heat leakage from the periphery of the thermoelectric module can be suppressed in a compact region, which has conventionally been required. It is possible to suppress an increase in the thermal resistance of the block for adjusting the thickness and the like and the contact thermal resistance generated at the joint thereof, and to increase the cooling efficiency of the thermoelectric cooling device.

According to a second aspect of the present invention, a core material having a thickness equal to the thickness of the thermoelectric module is provided in a space excluding the thermoelectric module. Strength can be increased.

According to the third aspect of the present invention, a plurality of thermoelectric modules are arranged in a plane direction, so that the cooling capacity of the thermoelectric cooling device can be increased.

According to a fourth aspect of the present invention, the thermoelectric modules are stacked in a plurality of layers in the thickness direction, and the heat radiating surfaces or the heat absorbing surfaces of the thermoelectric modules at both ends in the thickness direction are in thermal contact with the outer shell. The cooling temperature can be reduced by increasing the temperature difference between the heat radiating surface and the heat absorbing surface of the thermoelectric module at both ends in the thickness direction.

According to a fifth aspect of the present invention, a heat sink is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. In addition to adding the function of exchanging heat with airflow to the device, the area except the thermoelectric module on the back of the heat sink can be fully insulated with the same thickness as the thermoelectric module, making the thermoelectric cooling device including the heat sink compact. be able to.

According to a sixth aspect of the present invention, a tank forming a liquid flow path is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. Thus, a function of exchanging heat with a liquid can be added to the thermoelectric cooling device to enable heat transfer between the thermoelectric cooling device and a remote location.

According to a seventh aspect of the present invention, a heat pipe is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. Thus, it is possible to add a function to the thermoelectric cooling device that enables heat transfer to and from the thermoelectric cooling device.

According to the present invention, the tank or the heat pipe forming the heat sink or the liquid flow path also serves as part or all of the outer shell, and the tank or the heat pipe forming the heat sink or the liquid flow path is used. The pipe can be in direct contact with the thermoelectric module,
The cooling efficiency is further increased due to the decrease in the thermal resistance, and the structure can be simplified and the cost can be reduced by reducing the outer shell.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a thermoelectric module having a heat absorbing surface and a heat radiating surface, wherein the heat radiating surface is heated by passing an electric current to cool the heat absorbing surface, A thermoelectric cooling device that includes the thermoelectric module, is kept in a decompressed state, and has an outer shell in which a heat absorbing surface and a heat radiating surface of the thermoelectric module are in thermal contact with each other, and has excellent heat insulation performance while having the same thickness as the thermoelectric module. Since the area having the thermoelectric module is integrally formed around the thermoelectric module, heat leakage from the thermoelectric module area can be suppressed in a compact area, and the heat resistance of the conventionally necessary thickness adjustment block and the like occurs at the heat resistance and its junction. It has the effect of suppressing an increase in contact thermal resistance and increasing the cooling efficiency of the thermoelectric cooling device.

According to a second aspect of the present invention, there is provided the thermoelectric cooling device according to the first aspect, wherein a core material having a thickness equal to the thickness of the thermoelectric module is provided in a space excluding the thermoelectric module. It has the effect of facilitating formation and increasing the strength of the space.

According to the third aspect of the present invention, a plurality of thermoelectric modules are arranged in a plane direction, and has an effect of increasing the cooling capacity of the thermoelectric cooling device.

According to a fourth aspect of the present invention, a plurality of thermoelectric modules are stacked in the thickness direction, and the heat radiating surfaces or the heat absorbing surfaces of the thermoelectric modules at both ends in the thickness direction are in thermal contact with the outer shell. It has the effect of reducing the cooling temperature by increasing the temperature difference between the heat radiating surface and the heat absorbing surface of the thermoelectric module at both ends in the thickness direction.

According to a fifth aspect of the present invention, a heat sink is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. In addition to adding the function of exchanging heat with airflow to the thermoelectric cooling device, the area excluding the thermoelectric module on the back of the heat sink can be sufficiently insulated with the same thickness as the thermoelectric module, and the heat sink is included. This has the effect of making the thermoelectric cooling device compact.

According to a sixth aspect of the present invention, a tank constituting a liquid flow path is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. It has a function of adding a function of exchanging heat with a liquid to the thermoelectric cooling device and enabling heat transfer between the thermoelectric cooling device and a remote place.

According to the present invention, a part of the heat pipe is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. It has the function of allowing the thermoelectric cooling device to transfer heat between the thermoelectric cooling device and a location remote from the thermoelectric cooling device.

The present invention described in claim 8 is characterized in that the tank or the heat pipe constituting the heat sink or the liquid flow path also serves as part or all of the outer shell. The tanks or heat pipes that make up the road can be in direct contact with the thermoelectric module, further reducing the thermal resistance to further increase cooling efficiency, and reducing the outer shell to simplify the structure and reduce costs. Has an action.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.

(Embodiment 1) FIG. 1 is a sectional view of a thermoelectric cooling device according to a first embodiment of the present invention, in which the thermoelectric cooling device is attached to a heat insulating material such as a refrigerator. In FIG. 1, reference numeral 6 denotes a thermoelectric module having a heat-dissipating surface 6a and a heat-absorbing surface 6b on both sides in a substantially parallel manner. 7 is a thermoelectric module 1
Inside the outer shell 7, the heat radiation surface 6 a and the heat absorbing surface 6 b of the thermoelectric module 6 are in thermal contact with the inner surface of the outer shell 7, respectively, and the space 8 inside the outer shell 7. Is maintained in a reduced pressure state (about 133 Pa) including the inside of the thermoelectric module 1. 9 is a plurality of fins 9a
The back surface of the fin 9a is thermally bonded to the outer shell 7 on the side in contact with the heat radiating surface 6a of the thermoelectric module 6. 10 is a plurality of fins 10
In the cooling heat sink provided with the a, the back surface of the fin 10a is thermally joined to the outer shell 7 on the side in contact with the heat absorbing surface 6b of the thermoelectric module 6.

When the thermoelectric cooling device configured as described above is used in a refrigerator or the like, a through hole is provided in a part of a heat insulating wall that separates the inside of the refrigerator from the outside of the refrigerator, and a heat sink for heat radiation is provided on the outside of the refrigerator. A thermoelectric cooling device is attached to the through hole so that the cooling heat sink faces the inside of the refrigerator.

In FIG. 1, reference numeral 11 denotes a heat insulating wall, and a heat sink 10 for cooling and a heat sink 9 for heat radiation are already joined to an outer shell 7 including a thermoelectric module 6 in a penetrating portion provided on the heat insulating wall 11. Inserted. Then, only the heat sink 9 for heat radiation protrudes outside the heat insulating wall 11, and the heat sink 10 for cooling is inserted into the through hole of the heat insulating wall 11 together with the outer shell 7.

When a current is applied to the thermoelectric module 6, the heat radiating surface 6a is heated and the heat absorbing surface 6b is cooled. Inside the refrigerator, when the heat absorbing surface 6b is cooled, the cooling heat sink 10
Is cooled almost directly by the heat absorbing surface 6 b through the outer shell 7, and the airflow inside the refrigerator is further cooled by the cooling heat sink 10. By this process, the airflow inside the refrigerator is efficiently cooled by the thermoelectric module 6.

On the outside of the refrigerator, when the heat radiating surface 6a is heated, the heat radiating heat sink 9 is substantially directly heated by the heat radiating surface 6a through the outer shell 7, and further, the airflow outside the refrigerator is heated by the heat radiating heat sink 9.

By this process, the heat from the thermoelectric module 6 is efficiently wasted by the airflow outside the refrigerator. Furthermore, since the space inside the thermoelectric module 6 is also maintained in a vacuum state, heat transfer due to convection and heat conduction inside the thermoelectric module 6 is suppressed, and the efficiency of the thermoelectric module 6 is improved.

As described above, the thermoelectric cooling device according to the present embodiment has the heat absorbing surface 6b and the heat radiating surface 6a, and the heat radiating surface 6a is heated by passing a current to cool the heat absorbing surface 6b. , The thermoelectric module 6 is included, the space 8 excluding the thermoelectric module 6 is kept in a vacuum state, and the heat absorbing surface 6b and the heat radiating surface 6a of the thermoelectric module 6 have an outer shell 7 that is in thermal contact with the thermoelectric module 6. Since a region having the same thickness and excellent heat insulation performance is integrally formed around the thermoelectric module 6, heat leakage from the periphery of the thermoelectric module 6 is suppressed in a compact region, and a block for adjusting the thickness, which has been conventionally required, is provided. Therefore, it is possible to suppress an increase in thermal resistance and the like and a contact thermal resistance generated at a joint portion thereof, and to increase a cooling efficiency of the thermoelectric cooling device.

Also, by keeping the space inside the thermoelectric module 6 in a reduced pressure state, the amount of heat transfer from the heat radiating surface 6a to the heat absorbing surface 6b of the thermoelectric module 6 due to convection and heat conduction in the space inside the thermoelectric module 6 is suppressed. Thus, the cooling efficiency of the thermoelectric module 6 can be further increased, and the deterioration of the thermoelectric material due to invasion of steam or moisture can be suppressed.

Furthermore, the heat sink 9 for cooling and the heat sink 10 for cooling are directly joined to both sides of the surface of the outer shell 7 where the heat dissipation surface 6a and the heat absorption surface 6b of the thermoelectric module 6 are in thermal contact with each other, so that the thermoelectric cooling device can reduce airflow. A heat exchanging function can be added, and a region other than the thermoelectric module 9 on the back of the heat sink 9 or the cooling heat sink 10 can be sufficiently insulated with the same thickness as the thermoelectric module 6. The thermoelectric cooling device including the cooling heat sink 10 can be made compact, and the internal volume of the refrigerator can be increased without projecting the cooling heat sink 10 inside the refrigerator.

In a state where both the heat sink 9 for heat radiation and the heat sink 10 for cooling are joined to the outer shell 7,
Can be attached to the device, and the uniting process as a thermoelectric cooling device can simplify the assembly process.

In the thermoelectric cooling device of the present embodiment, the space 8 inside the outer shell 7 is evacuated, but as shown in FIG. By inserting 12, a reduced pressure state inside the outer shell 7 may be realized. This facilitates formation of a reduced pressure state, and can increase the strength of the outer shell 7.

Further, in the thermoelectric cooling device of this embodiment, the number of thermoelectric modules 6 included in the outer shell 7 is one.
As shown in (1), a plurality of thermoelectric modules 6 may be arranged in a plane direction.

Thus, the cooling capacity of the thermoelectric cooling device can be increased.

Further, in the thermoelectric cooling device of the present embodiment, the thermoelectric module 6 contained in the outer shell 7 is provided in one stage.
As shown in (1), the thermoelectric modules 6 may be stacked in multiple layers in the thickness direction.

Thus, by increasing the temperature difference between the heat radiating surface 6a and the heat absorbing surface 6b at both ends in the thickness direction, the temperature of the cooling heat sink 10 can be further lowered, and the cooling temperature of the airflow in the refrigerator can be further lowered. .

Further, in the thermoelectric cooling device of this embodiment, the outer shell 7 completely includes the thermoelectric module 6;
As shown in (1), the heat sink 2 for heat radiation and the heat sink 3 for cooling may also serve as a part of the outer shell 7.

As a result, the heat radiating heat sink 2 and the cooling heat sink 3 can be in direct contact with the thermoelectric module 6, and the cooling efficiency can be further increased by reducing the thermal resistance, and the structure can be simplified by reducing the outer shell. Cost and cost can be reduced.

In the thermoelectric cooling device of the present embodiment, the heat sink 2 for heat radiation and the heat sink 3 for cooling are joined to both surfaces of the outer shell 7 containing the thermoelectric module 6, but as shown in FIG. A tank 13 forming a fluid flow path may be joined to at least one surface of the outer shell 7 including the inner shell 6.

As a result, the function of exchanging heat with the liquid can be added to the thermoelectric cooling device, and the heat transfer between the thermoelectric cooling device and the remote place can be made possible.

Further, in the thermoelectric cooling device of this embodiment, the heat sink 2 for heat radiation and the heat sink 3 for cooling are joined to both sides of the outer shell 7 containing the thermoelectric module 6, but as shown in FIG. A heat pipe 14 may be joined to at least one surface of the outer shell 7 including the inner shell 6.

Thus, it is possible to allow the thermoelectric cooling device to transfer heat to and away from the thermoelectric cooling device.

[0051]

As described above, the invention according to the first aspect of the present invention has a heat absorbing surface and a heat dissipating surface, and the heat dissipating surface is heated by passing an electric current, and the heat absorbing surface is cooled. A thermoelectric cooling device including a module and the thermoelectric module, the thermoelectric cooling device including the thermoelectric module, the heat absorbing surface and the heat radiating surface of the thermoelectric module being kept in a decompressed state and having a thermal contact with the heat absorbing surface. Area around the thermoelectric module is integrally formed, so heat leakage from the periphery of the thermoelectric module can be suppressed in a compact area, and the heat resistance of the conventionally necessary thickness adjustment block and other parts and its joints can be reduced. An increase in the generated contact thermal resistance can be suppressed, and the cooling efficiency of the thermoelectric cooling device can be increased.

According to a second aspect of the present invention, there is provided the thermoelectric cooling device according to the first aspect, wherein the space inside the thermoelectric module is also maintained at a substantially reduced pressure. The amount of heat transfer from the heat dissipation surface to the heat absorption surface of the thermoelectric module due to convection and heat conduction can be suppressed, the cooling efficiency of the thermoelectric module can be further increased, and the deterioration of thermoelectric material due to intrusion of steam and moisture is suppressed be able to.

According to a third aspect of the present invention, there is provided the thermoelectric cooling device according to the first or second aspect, wherein a plurality of thermoelectric modules are arranged in a plane direction. You can improve your ability.

According to a fourth aspect of the present invention, the thermoelectric modules are stacked in a plurality of layers in the thickness direction, and the heat radiating surfaces or the heat absorbing surfaces of the thermoelectric modules at both ends in the thickness direction are in thermal contact with the outer shell. The cooling temperature can be reduced by increasing the temperature difference between the heat radiating surface and the heat absorbing surface of the thermoelectric module at both ends in the thickness direction.

According to a fifth aspect of the present invention, a heat sink is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. The thermoelectric cooling device according to any one of claims 1 to 4, wherein a function of exchanging heat with airflow is added to the thermoelectric cooling device, and a region excluding the thermoelectric module on the back surface of the heat sink is the same as the thermoelectric module. The thickness can provide sufficient heat insulation, and the thermoelectric cooling device including the heat sink can be made compact.

According to a sixth aspect of the present invention, a tank constituting a liquid flow path is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. The thermoelectric cooling device according to any one of claims 1 to 4, wherein a function of exchanging heat with a liquid is added to the thermoelectric cooling device, and heat generated at a location remote from the thermoelectric cooling device is added. Movement can be enabled.

According to a seventh aspect of the present invention, the heat pipe is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. The thermoelectric cooling device according to any one of claims 1 to 4, wherein the thermoelectric cooling device can perform heat transfer between the thermoelectric cooling device and a place remote from the thermoelectric cooling device.

According to a ninth aspect of the present invention, the tank or the heat pipe constituting the heat sink or the liquid flow path also serves as part or all of the outer shell. The thermoelectric cooling device according to claim 1, wherein a tank or a heat pipe that forms a heat sink or a liquid flow path can directly contact the thermoelectric module, and the cooling efficiency is further increased due to a reduction in thermal resistance. By reducing the number, the structure can be simplified and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of a thermoelectric cooling device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 3 is a cross-sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 4 is a sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 5 is a sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 6 is a sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 7 is a sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 8 is a sectional view of another embodiment of the thermoelectric cooling device according to the present invention.

FIG. 9 is a cross-sectional view of a conventional thermoelectric cooling device.

[Explanation of symbols]

 Reference Signs List 6 thermoelectric module 6a heat dissipation surface 6b heat absorption surface 7 outer shell 8 space 9 heat sink 10 cooling heat sink 12 vacuum heat insulating material 13 tank 14 heat pipe

Claims (8)

[Claims] 1. A thermoelectric module having a heat absorbing surface and a heat radiating surface, wherein the heat radiating surface is heated by passing a current to cool the heat absorbing surface, and the thermoelectric module is enclosed by the thermoelectric module and is maintained in a reduced pressure state. A thermoelectric cooling device comprising a heat absorbing surface of a module and an outer shell in which a heat radiating surface is in thermal contact. 2. The thermoelectric cooling device according to claim 1, wherein a core material equal to the thickness of the thermoelectric module is provided in a space excluding the thermoelectric module. 3. The thermoelectric cooling device according to claim 1, wherein a plurality of thermoelectric modules are arranged in a plane direction. 4. The thermoelectric module according to claim 1, wherein a plurality of thermoelectric modules are stacked in the thickness direction, and a heat radiation surface or a heat absorption surface of the thermoelectric module at both ends in the thickness direction is in thermal contact with the outer shell.
Or the thermoelectric cooling device according to claim 2. 5. The thermoelectric module according to claim 1, wherein a heat sink is directly or indirectly connected to at least one of the outer surfaces where the heat absorbing surface and the heat radiating surface are in thermal contact with each other. A thermoelectric cooling device according to claim 1. 6. A tank constituting a liquid flow path is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. The thermoelectric cooling device according to any one of claims 1 to 4. 7. The heat pipe according to claim 1, wherein a part of the heat pipe is directly or indirectly connected to at least one of the outer surfaces of the thermoelectric module where the heat absorbing surface and the heat radiating surface are in thermal contact. Item 5. The thermoelectric cooling device according to any one of Item 4. 8. The thermoelectric cooling device according to claim 5, wherein a tank or a heat pipe forming a heat sink or a liquid flow path also serves as a part or the whole of an outer shell.