CN111102867A - Heat pipe for controlling auxiliary phase change in segmented mode - Google Patents

Heat pipe for controlling auxiliary phase change in segmented mode Download PDF

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Publication number
CN111102867A
CN111102867A CN202010102778.9A CN202010102778A CN111102867A CN 111102867 A CN111102867 A CN 111102867A CN 202010102778 A CN202010102778 A CN 202010102778A CN 111102867 A CN111102867 A CN 111102867A
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CN
China
Prior art keywords
phase change
section
heat
heat transfer
transfer medium
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Pending
Application number
CN202010102778.9A
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Chinese (zh)
Inventor
姚永明
倪庆海
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Jiangsu Gaoke Applied Science Research Institute Co ltd
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Jiangsu Gaoke Applied Science Research Institute Co ltd
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Priority to CN202010102778.9A priority Critical patent/CN111102867A/en
Publication of CN111102867A publication Critical patent/CN111102867A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06Control arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a heat pipe for controlling auxiliary phase change in a segmented manner, which comprises a pipe shell, wherein a closed cavity is formed in the pipe shell, the pipe shell comprises an evaporation section and a condensation section, a liquid absorption core and a heat transfer medium are arranged in the closed cavity, a plurality of semiconductor refrigeration pieces are respectively arranged on the liquid absorption cores positioned in the evaporation section and the condensation section, and two ends of each semiconductor refrigeration piece are respectively arranged in the liquid absorption core and the closed cavity. According to the invention, the semiconductor refrigeration pieces are arranged at the evaporation section and the condensation section, when the working temperature of the heat pipe is not in the nominal working temperature range and the heat transfer medium cannot be subjected to phase change or is incomplete in phase change, the corresponding semiconductor refrigeration pieces are controlled to work, so that the heat transfer medium is ensured to be subjected to evaporation phase change at the evaporation section and condensation phase change at the condensation section of the heat pipe, and the heat transfer medium in the heat pipe can be ensured to realize phase change in the whole working temperature range, thereby maintaining continuous high-efficiency heat transfer and improving the critical heat flux density of the heat pipe.

Description

Heat pipe for controlling auxiliary phase change in segmented mode
Technical Field
The invention belongs to the technical field of heat exchange devices, and particularly relates to a heat pipe for sectional control of auxiliary phase change.
Background
A typical heat pipe consists of a pipe shell, a wick, and end caps. The interior of the heat pipe is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The tube wall has a wick that is constructed of a capillary porous material. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power of heat diffusion, the vapor is condensed at the cold end to release heat, and the liquid flows back to the evaporation section along the porous material under the action of capillary action, so that the circulation is not stopped until the temperatures of the two ends of the heat pipe are equal (at the moment, the heat diffusion of the vapor is stopped).
From the thermodynamic perspective, the heat pipe has such good heat conductivity that the heat absorption and heat release of the object are relative, and when a temperature difference exists, the phenomenon that heat is transferred from a high temperature to a low temperature inevitably occurs. From the three modes of heat transfer (radiation, convection, conduction), convection conduction is the fastest. The heat pipe utilizes the phase change process of medium evaporation at the hot end and then condensation at the cold end (namely, utilizes the latent heat of evaporation and the latent heat of condensation of liquid) to quickly conduct heat.
Therefore, how to provide a heat pipe, which can keep the medium inside the heat pipe to be always phase-changed in the working temperature range is the key point for the heat pipe to preserve high-efficiency heat transfer.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the defects in the prior art, the invention aims to provide a heat pipe with sectional control for assisting phase change, which can ensure that the phase change of a heat transfer medium in the heat pipe can be realized in the whole working temperature range, thereby keeping continuous and efficient heat transfer.
The technical scheme is as follows: in order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: a heat pipe with a segmented control auxiliary phase change comprises a pipe shell, wherein a closed cavity is formed inside the pipe shell, the pipe shell comprises an evaporation section and a condensation section, a liquid absorption core and a heat transfer medium are arranged in the closed cavity, a plurality of semiconductor refrigeration pieces are arranged on the liquid absorption core in the evaporation section and the condensation section respectively, two ends of each semiconductor refrigeration piece are arranged in the liquid absorption core and the closed cavity respectively, and when the temperature outside the evaporation section and/or the condensation section is not enough to cause the heat transfer medium in the evaporation section and/or the condensation section to generate evaporation phase change and condensation phase change respectively, the corresponding semiconductor refrigeration pieces are controlled to be electrified and operated, so that the heat transfer medium in the evaporation section and the condensation section is kept in a nominal working range.
Furthermore, the cross section of the pipe shell is circular or rectangular.
Furthermore, the liquid absorption core is tightly attached to the inner wall of the pipe shell.
Furthermore, a liquid injection port communicated with the closed cavity is arranged on the pipe shell.
Further, the heat transfer medium includes ammonia, ethanol, freon, and water.
Further, the shell of the tube also comprises an insulating section arranged between the evaporation section and the condensation section.
Has the advantages that: compared with the prior art, the invention has the following advantages: according to the invention, the semiconductor refrigeration pieces are arranged at the evaporation section and the condensation section, when the working temperature of the heat pipe is not in the nominal working temperature range and the heat transfer medium cannot be subjected to phase change or is incomplete in phase change, the corresponding semiconductor refrigeration pieces are controlled to work, so that the heat transfer medium is ensured to be subjected to evaporation phase change at the evaporation section and condensation phase change at the condensation section of the heat pipe, and the heat transfer medium in the heat pipe can be ensured to realize phase change in the whole working temperature range, thereby maintaining continuous high-efficiency heat transfer and improving the critical heat flux density of the heat pipe.
Drawings
FIG. 1 is a schematic diagram of a heat pipe structure with segmented control to assist phase change according to an embodiment of the present invention;
fig. 2 is a schematic sectional view taken along the line a-a in fig. 1.
Detailed Description
The present invention will be further illustrated by the following specific examples, which are carried out on the premise of the technical scheme of the present invention, and it should be understood that these examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.
As shown in fig. 1 and 2, the heat pipe for assisting phase change by sectional control of the present application includes a pipe shell 1 having a closed cavity 3 inside, a wick 4 disposed inside the pipe shell 1, a heat transfer medium filled in the closed cavity 3 at a certain pressure, and a plurality of semiconductor cooling fins 5.
In particular, the cartridge 1 is a closed hollow shell, whose cross-section may be circular, rectangular or other. The pipe shell 1 can also be provided with a liquid injection port communicated with the cavity, and the cavity is vacuumized and injected with a heat transfer medium through the liquid injection port. The closed cavity 3 has a certain vacuum degree, and the vacuum degree can be determined according to the type and the boiling point temperature of the heat transfer medium which are actually required. The heat transfer medium can adopt ammonia, ethanol, Freon (R21, R22, R113 and the like) or water, and the boiling point temperature can be determined according to the nominal working temperature of the heat pipe, so that the type of the heat transfer medium is determined. The wick 4 is preferably arranged in close proximity to the inner wall of the housing 1. Generally, the heat transfer medium is evaporated by absorbing heat at one end of the tube case 1 and then condensed by releasing heat at the other end, a section where the heat transfer medium is evaporated into a gas is referred to as an evaporation section 2, a section where the heat transfer medium is condensed into a liquid is referred to as a condensation section 6, and an adiabatic section 7 may be disposed between the evaporation section 2 and the condensation section 6 as needed. The heat transfer medium condensed into a liquid in the condensing section 6 flows back to the evaporating section 2 from the wick 4 by capillary action. The plurality of semiconductor chilling plates 5 are respectively arranged on the liquid absorption cores 4 in the evaporation section 2 and the condensation section 6, and two ends of each semiconductor chilling plate 5 are respectively arranged in the liquid absorption cores 4 and the closed cavity 3.
When the temperature measuring device is used, the temperature sensors are arranged on the outer sides of the evaporation section 2 and the condensation section 6 to respectively measure the temperatures of the outer sides of the evaporation section 2 and the condensation section 6, and when the temperatures of the outer sides of the evaporation section 2 and/or the condensation section 6 are not enough to respectively cause evaporation phase change and condensation phase change of a heat transfer medium in the evaporation section 2 and/or the condensation section 6, the semiconductor refrigeration sheet 5 is electrified to work so that the heat transfer media in the evaporation section 2 and the condensation section 6 are kept in a nominal working range. Specifically, when a temperature sensor arranged outside the evaporation section 2 detects that the temperature is not enough to cause the heat transfer medium to generate evaporation phase change, the semiconductor refrigeration sheet 5 in the evaporation section 2 is electrified to work, the temperature of the end part, positioned inside the liquid absorption core 4, of the semiconductor refrigeration sheet 5 is increased and changed into a hot end, the temperature of the end part, positioned inside the closed cavity 3, of the semiconductor refrigeration sheet 5 is reduced and changed into a cold end, the heat of the semiconductor refrigeration sheet heats the heat transfer medium in the liquid absorption core 4 through the hot end, the heat transfer medium and the heat absorbed by the evaporation section 2 of the heat pipe from the outside heat the heat pipe heat the heat transfer medium together, so that the heat transfer medium is evaporated, absorbs heat (latent heat) and is vaporized (vapor phase) in the; meanwhile, when a temperature sensor arranged at the condensation section 6 of the heat pipe detects that the temperature of the heat transfer medium is not enough to cause the heat transfer medium to generate condensation phase change, reverse current is applied to the semiconductor chilling plate 5 in the condensation section 6, the temperature of the end part, located inside the liquid absorption core 4, of the semiconductor chilling plate 5 is reduced and changed into a cold end, the temperature of the end part, located inside the closed cavity 3, of the semiconductor chilling plate 5 is increased and changed into a hot end, the cold end of the semiconductor chilling plate 5 and the medium outside the heat pipe absorb the heat of the heat transfer medium in the liquid absorption core 4 together, the heat transfer medium steam is strengthened to release latent heat in the liquid absorption core 4, namely, the condensation returns to a liquid phase, and then the heat transfer medium in the heat pipe is driven to return to the evaporation section.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (6)

1. The utility model provides a heat pipe of supplementary phase transition of segmentation control, includes that inside is formed with the tube of closed cavity, the tube includes evaporation zone and condensation segment, be equipped with imbibition core and heat transfer medium in the closed cavity, its characterized in that: the liquid absorption cores positioned in the evaporation section and the condensation section are respectively provided with a plurality of semiconductor refrigeration sheets, two ends of each semiconductor refrigeration sheet are respectively arranged in the liquid absorption cores and the closed cavity, and when the temperature of the outer side of the evaporation section and/or the outer side of the condensation section is not enough to respectively cause evaporation phase change and condensation phase change of a heat transfer medium in the evaporation section and/or the condensation section, the corresponding semiconductor refrigeration sheets are controlled to be electrified and operated, so that the heat transfer medium in the evaporation section and the heat transfer medium in the condensation section are both kept in a nominal working range.
2. A heat pipe with segmented control assisted phase change as claimed in claim 1, wherein: the cross section of the pipe shell is circular or rectangular.
3. A heat pipe with segmented control assisted phase change as claimed in claim 1, wherein: the liquid absorption core is tightly attached to the inner wall of the pipe shell.
4. A heat pipe with segmented control assisted phase change as claimed in claim 1, wherein: and the tube shell is provided with a liquid injection port communicated with the closed cavity.
5. A heat pipe with segmented control assisted phase change as claimed in claim 1, wherein: the heat transfer medium includes ammonia, ethanol, freon, and water.
6. A heat pipe with segmented control assisted phase change as claimed in claim 1, wherein: the shell and tube also comprises a heat insulation section arranged between the evaporation section and the condensation section.
CN202010102778.9A 2020-02-19 2020-02-19 Heat pipe for controlling auxiliary phase change in segmented mode Pending CN111102867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010102778.9A CN111102867A (en) 2020-02-19 2020-02-19 Heat pipe for controlling auxiliary phase change in segmented mode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010102778.9A CN111102867A (en) 2020-02-19 2020-02-19 Heat pipe for controlling auxiliary phase change in segmented mode

Publications (1)

Publication Number Publication Date
CN111102867A true CN111102867A (en) 2020-05-05

Family

ID=70427676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010102778.9A Pending CN111102867A (en) 2020-02-19 2020-02-19 Heat pipe for controlling auxiliary phase change in segmented mode

Country Status (1)

Country Link
CN (1) CN111102867A (en)

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