CN113061848B - Evaporation source - Google Patents
Evaporation source Download PDFInfo
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- CN113061848B CN113061848B CN202110321264.7A CN202110321264A CN113061848B CN 113061848 B CN113061848 B CN 113061848B CN 202110321264 A CN202110321264 A CN 202110321264A CN 113061848 B CN113061848 B CN 113061848B
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- crucible
- type semiconductor
- evaporation source
- refrigeration
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The embodiment of the invention provides an evaporation source, which comprises a crucible, a heating wire and a plurality of semiconductor refrigerating sheets; the heating wires are distributed around the crucible, the semiconductor refrigeration pieces are arranged on one side, away from the crucible, of the heating wires, and the semiconductor refrigeration pieces are sequentially arranged along the direction surrounding the crucible; each semiconductor refrigerating piece comprises a cold end and a hot end, wherein the cold end is used for refrigerating, and the hot end is used for heating; the semiconductor refrigeration piece comprises a first refrigeration piece and a second refrigeration piece, the cold end of the first refrigeration piece is arranged at one side close to the crucible, and the hot end of the second refrigeration piece is arranged at one side close to the crucible. The evaporation source provided by the embodiment of the invention can improve the heating rate and the cooling rate of the evaporation source.
Description
Technical Field
The invention relates to the field of evaporation machines, in particular to an evaporation source.
Background
At present, evaporation source structures of evaporation machines used in the micro display and panel industry are almost the same, fig. 1 is a schematic top view structure diagram of an evaporation source in the prior art, and referring to fig. 1, the evaporation source is composed of a crucible 11, a heating wire 12, a reflection plate 13, cooling water 14, an outer profile 15 and other components. Although the evaporation source meets the process requirements, the evaporation source has the defect that the cooling speed is relatively slow, and is similar to natural cooling under vacuum.
Disclosure of Invention
The evaporation source provided by the embodiment of the invention can improve the heating rate and the cooling rate of the evaporation source.
The embodiment of the invention provides an evaporation source, which comprises a crucible, a heating wire and a plurality of semiconductor refrigerating sheets; the heating wires are distributed around the crucible, the semiconductor refrigeration pieces are arranged on one side, away from the crucible, of the heating wires, and the semiconductor refrigeration pieces are sequentially arranged along the direction surrounding the crucible; each semiconductor refrigerating piece comprises a cold end and a hot end, wherein the cold end is used for refrigerating, and the hot end is used for heating; the semiconductor refrigeration piece comprises a first refrigeration piece and a second refrigeration piece, the cold end of the first refrigeration piece is arranged at one side close to the crucible, and the hot end of the second refrigeration piece is arranged at one side close to the crucible.
Optionally, the first chilling plate and the second chilling plate are distributed at intervals along the direction surrounding the crucible.
Optionally, the first refrigeration pieces are uniformly distributed along a direction surrounding the crucible, and the second refrigeration pieces are uniformly distributed along a direction surrounding the crucible. Optionally, the evaporation source provided in the embodiment of the present invention further includes: the power supply module is respectively connected with the first refrigerating sheet and the second refrigerating sheet; the control module is used for controlling the power supply module to supply power to the first refrigeration piece or controlling the power supply module to supply power to the second refrigeration piece according to the working state of the evaporation source.
Optionally, the control module is configured to control the power module to supply power to the second cooling plate when the evaporation source is in a temperature rising state, and control the power module to supply power to the first cooling plate when the evaporation source is in a temperature lowering state.
Optionally, the first cooling plate and the second cooling plate each include a first insulating layer, a plurality of N-type semiconductor structures and a plurality of P-type semiconductor structures that are disposed on the first insulating layer, and a second insulating layer that is disposed on one side of the plurality of N-type semiconductor structures and the plurality of P-type semiconductor structures away from the first insulating layer;
the N-type semiconductor structure and the P-type semiconductor structure are sequentially arranged at intervals; the first end of the first N-type semiconductor structure is connected with the anode of the power supply module, and the first end of the last P-type semiconductor structure is connected with the cathode of the power supply module; a second terminal of a first one of the N-type semiconductor structures is connected to a second terminal of a first one of the P-type semiconductor structures;
the first end of the kth N-type semiconductor structure is connected with the first end of the kth-1P-type semiconductor structure, the second end of the kth N-type semiconductor structure is connected with the second end of the kth P-type semiconductor structure, wherein k is more than or equal to 2, and k is a positive integer;
the first insulating layer of the first refrigeration sheet is close to the crucible;
the second insulating layer of the second chilling plate is close to the crucible.
Optionally, the N-type semiconductor structure and the P-type semiconductor structure are connected through a metal structure.
Optionally, in the depth direction of the crucible, the size of the first refrigeration piece and the size of the second refrigeration piece are greater than or equal to the size of the crucible.
Optionally, the embodiments of the present invention provide a method further including: and the outline layer is arranged on one side of the semiconductor refrigeration sheet, which is far away from the heating wire.
Optionally, the crucible is cylindrical or the crucible is rectangular.
According to the evaporation source provided by the embodiment of the invention, the cold end of the semiconductor refrigeration sheet is used for refrigerating, the hot end of the semiconductor refrigeration sheet is used for heating, the cold end of the first refrigeration sheet in the semiconductor refrigeration sheet is arranged at one side adjacent to the crucible, the hot end of the second refrigeration sheet can accelerate the heating rate of the crucible in the heating process of the crucible, and the cold end of the first refrigeration sheet can accelerate the cooling rate of the crucible in the cooling process of the crucible, so that the heating rate and the cooling rate of the evaporation source can be improved.
Drawings
Fig. 1 is a schematic top view of an evaporation source in the prior art;
fig. 2 is a schematic top view of an evaporation source according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another evaporation source according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first cooling fin provided in an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another evaporation source according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another evaporation source according to an embodiment of the present invention;
fig. 7 is a schematic top view of another evaporation source according to an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the embodiments of the invention and do not delimit the embodiments. It should be further noted that, for convenience of description, only some structures, not all structures, relating to the embodiments of the present invention are shown in the drawings.
Fig. 2 is a schematic top view of an evaporation source according to an embodiment of the present invention, and referring to fig. 2, the evaporation source includes a crucible 110, a heating wire 120, and a plurality of semiconductor chilling plates; the heating wire 120 is distributed around the crucible 110, the plurality of semiconductor chilling plates are arranged on one side of the heating wire 120 away from the crucible 110, and the plurality of semiconductor chilling plates are sequentially arranged along the direction surrounding the crucible 110; each semiconductor refrigeration piece comprises a cold end 10 and a hot end 20, wherein the cold end 10 is used for refrigeration, and the hot end 20 is used for heating; the semiconductor chilling plate comprises a first chilling plate 130 and a second chilling plate 140, wherein a cold end 10 of the first chilling plate 130 is arranged at one side adjacent to the crucible 110, and a hot end 20 of the second chilling plate 140 is arranged at one side adjacent to the crucible 110.
Specifically, the semiconductor refrigerating sheet is composed of an N-type semiconductor and a P-type semiconductor, wherein the N-type semiconductor has redundant electrons and has negative temperature difference potential, and the P-type semiconductor has insufficient electrons and has positive temperature difference potential. When electrons pass from the P-type semiconductor to the N-type semiconductor through the junction, the temperature of the junction decreases, the energy thereof inevitably increases, and the increased energy corresponds to the energy consumed by the junction. Conversely, when electrons flow from the N-type semiconductor to the P-type semiconductor, the temperature of the junction increases. Current flows from the N-type semiconductor to one end of the P-type semiconductor, the temperature drops and absorbs heat, which is the cold side. Current flows from the P-type semiconductor to one end of the N-type semiconductor, the temperature rises and heat is released, i.e., the hot side. The hot end 20 of the first chilling plate 130 is disposed at a side far from the crucible 110, and the cold end 10 of the second chilling plate 140 is disposed at a side far from the crucible 110. In the heating process of the crucible 110, in order to increase the heating rate of the crucible 110, the first chilling plate 130 is controlled not to work, and the second chilling plate 140 is controlled to work at the same time, when the second chilling plate 140 works, because the hot end 20 of the second chilling plate 140 is adjacent to one side of the crucible 110 and the temperature of the hot end 20 can be higher than 100 ℃, the hot end 20 of the second chilling plate 140 can increase the heating rate of the crucible 110, secondly, in the heating process of the crucible 110, the heating wire 120 is also heated, the hot end 20 of the second chilling plate 140 can reflect the heat of the heating wire 120 to the crucible 110, thereby increasing the heat preservation effect of the crucible 110, because the cold end 10 of the second chilling plate 140 is arranged at one side far away from the crucible 110, the cold end 10 of the second chilling plate 140 can reduce the temperature of the body, prevent heat radiation to other evaporation sources, can reduce the overall temperature of the chamber, and prevent the film formation characteristics from being influenced by overhigh temperature. When the crucible 110 is cooled, the first refrigeration sheet 130 is controlled to work, and the second refrigeration sheet 140 is controlled not to work, the cold end 10 of the first refrigeration sheet 130 can absorb heat of the heating wire 120 and the crucible 110, and the temperature of the cold end 10 can reach-100 ℃ at the lowest, so that compared with the prior art in which cooling water is adopted, the first refrigeration sheet 130 can greatly reduce the cooling time of the crucible 110 and improve the cooling rate of the crucible 110.
According to the evaporation source provided by the embodiment of the invention, the cold end of the semiconductor refrigeration sheet is used for refrigerating, the hot end of the semiconductor refrigeration sheet is used for heating, the cold end of the first refrigeration sheet in the semiconductor refrigeration sheet is arranged at one side adjacent to the crucible, the hot end of the second refrigeration sheet can accelerate the heating rate of the crucible in the heating process of the crucible, and the cold end of the first refrigeration sheet can accelerate the cooling rate of the crucible in the cooling process of the crucible, so that the heating rate and the cooling rate of the evaporation source can be improved.
Optionally, the first chilling plates and the second chilling plates are distributed at intervals along the direction surrounding the crucible.
The distribution mode can avoid the aggregation of the first refrigerating sheets and the aggregation of the second refrigerating sheets, thereby avoiding uneven heating or heat absorption speed of the semiconductor sheets on different areas of the crucible, ensuring the even heating or absorption speed of the semiconductor sheets on the crucible, and accelerating the heating rate and the cooling rate of the evaporation source.
Alternatively, fig. 3 is a schematic structural diagram of another evaporation source according to an embodiment of the present invention, and referring to fig. 3, a plurality of first chilling plates 130 are uniformly distributed along the direction surrounding crucible 110, and a plurality of second chilling plates 140 are uniformly distributed along the direction surrounding crucible 110.
Specifically, the first refrigeration sheet 130 is uniformly distributed along the direction surrounding the crucible 110, so that when the crucible 110 is cooled, the cold end 10 of the first refrigeration sheet 130 can uniformly absorb heat on the crucible 110 and the heating wire 120, so that the temperature of the crucible 110 is rapidly reduced, and the cooling rate of the crucible 110 is further improved. The second cooling fins 140 are uniformly distributed along the direction surrounding the crucible 110, so that when the crucible 110 is heated, the hot end 20 of the second cooling fins 140 ensures the uniformity of heating of the crucible 110, and further increases the heating rate of the crucible 110.
Fig. 2 and 3 in the embodiment of the present invention are schematic top-view structural diagrams of the evaporation source, and the crucible in the embodiment of the present invention may have a cylindrical shape or a rectangular parallelepiped shape.
Optionally, the evaporation source provided in the embodiment of the present invention further includes: the power supply module is respectively connected with the first refrigerating sheet and the second refrigerating sheet; the control module is used for controlling the power supply module to supply power to the first refrigeration piece or controlling the power supply module to supply power to the second refrigeration piece according to the working state of the evaporation source.
Specifically, the power module can include the first switch with between the first refrigeration piece, the power module can include the second switch with between the second refrigeration piece, control module is connected with first switch and second switch respectively, when the evaporation source is in the cooling state, control module controls the disconnection of second switch simultaneously through controlling the first switch closure, makes power module for the power supply of first refrigeration piece. When the evaporation source is in a temperature rising state, the control module controls the first switch to be switched off and controls the second switch to be switched on at the same time, so that the power module supplies power to the second refrigeration sheet. The power module also can comprise a first power supply unit and a second power supply unit, the first power supply unit is connected with the first refrigerating sheet and supplies power to the first refrigerating sheet, and the second power supply unit is connected with the second refrigerating sheet and supplies power to the second refrigerating sheet. When the evaporation source is in a heating state, the control module controls a second power supply unit in the power supply module to supply power to the second refrigeration piece, and controls the first power supply unit not to work. When the evaporation source is in a cooling state, the control module controls the first power supply unit in the power supply module to supply power to the first refrigeration sheet, and controls the second power supply unit not to work.
Optionally, the control module is configured to control the power supply module to supply power to the second cooling plate when the evaporation source is in a temperature rising state, and control the power supply module to supply power to the first cooling plate when the evaporation source is in a temperature falling state.
Specifically, when the evaporation source is in a temperature rising state, the control module controls the power supply module to supply power to the second refrigeration sheet, so that the hot end of the second refrigeration sheet can provide certain heat for the crucible, and the temperature rising rate of the crucible is improved. When the evaporation source is in a cooling state, the control module controls the power supply module to supply power to the first refrigeration piece, so that the cold end of the first refrigeration piece can be ensured to absorb heat of the heating wire and the crucible, the cooling of the crucible is accelerated, and the cooling rate of the crucible is improved.
Optionally, fig. 4 is a schematic structural diagram of the first chilling plate according to an embodiment of the present invention, and referring to fig. 4, each of the first chilling plate 130 and the second chilling plate includes a first insulating layer 30, a plurality of N-type semiconductor structures 40 and a plurality of P-type semiconductor structures 50 disposed on the first insulating layer 30, and a second insulating layer 60 disposed on a side of the plurality of N-type semiconductor structures 40 and the plurality of P-type semiconductor structures 50 away from the first insulating layer 30; the N-type semiconductor structures 40 and the P-type semiconductor structures 50 are sequentially arranged at intervals; the first end of the first N-type semiconductor structure 40 is connected to the positive pole of the power module 150, and the first end of the last P-type semiconductor structure 50 is connected to the negative pole of the power module 150; a second terminal of the first N-type semiconductor structure 40 is connected to a second terminal of the first P-type semiconductor structure 50; the first end of the kth N-type semiconductor structure 40 is connected with the first end of the kth-1P-type semiconductor structure 50, the second end of the kth N-type semiconductor structure 40 is connected with the second end of the kth P-type semiconductor structure 50, wherein k is more than or equal to 2, and k is a positive integer; the first insulating layer 30 of the first cooling plate 130 is close to the crucible 110; the second insulating layer 60 of the second chilling plate 140 is adjacent to the crucible 110.
Specifically, the N-type semiconductor structure 40 has excess electrons and a negative temperature difference potential, the P-type semiconductor structure 50 has insufficient electrons and a positive temperature difference potential, and the evaporation source is heated or cooled by utilizing the principle of a semiconductor chilling plate. The operation principle of the first cooling plate 130 and the second cooling plate 140 is shown in fig. 4, when current is transmitted from the P-type semiconductor structure 50 to the N-type semiconductor structure 40, the semiconductor cooling plate has a temperature rise at one end of the second insulating layer, which is a hot end of the first cooling plate 130, and conversely, when current is transmitted from the N-type semiconductor structure 40 to the P-type semiconductor structure 50, the semiconductor cooling plate has a temperature drop at one end of the first insulating layer 30, which is a cold end of the first cooling plate 130. The first chilling plate 130 and the second chilling plate 140 have the same structure, and in the process of manufacturing the evaporation source, the first insulating layer 30 of the first chilling plate 130 is close to one side of the crucible 110, and the second insulating layer 60 of the second chilling plate 140 is close to one side of the crucible 110.
Alternatively, with continued reference to fig. 4, the n-type semiconductor structure 40 and the P-type semiconductor structure 50 are connected by a metal structure 70.
Specifically, the metal structure 70 is used for transmitting current, and the metal structure 70 may be a metal wire or a metal sheet, for example.
Optionally, fig. 5 is a schematic structural diagram of another evaporation source provided by an embodiment of the present invention, fig. 6 is a schematic structural diagram of another evaporation source provided by an embodiment of the present invention, and referring to fig. 5 and fig. 6, in a depth direction of the crucible 110, a size of the first chilling plate 130 and a size of the second chilling plate 140 are both greater than or equal to a size of the crucible 110.
Specifically, the size of the first cooling plate 130 and the size of the second cooling plate 140 are greater than or equal to the depth of the crucible 110, so that the crucible 110 can be heated uniformly in the depth direction, and the crucible 110 can be cooled or heated rapidly, and it should be noted that fig. 5 and fig. 6 are both side views of the evaporation source.
Optionally, fig. 7 is a schematic top view structure diagram of another evaporation source provided in an embodiment of the present invention, and referring to fig. 7, the evaporation source provided in an embodiment of the present invention further includes: and the outer contour layer 160 is arranged on one side of the semiconductor refrigeration sheet far away from the heating wire 120.
In particular, the outer layer 160 is used to protect the semiconductor cooling fins.
Optionally, the crucible is cylindrical or rectangular.
Specifically, when the crucible is rectangular, the evaporation source is a linear evaporation source, and when the crucible is cylindrical, the evaporation source is a point evaporation source.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will appreciate that the embodiments of the present invention are not limited to the specific embodiments described herein, and that various obvious changes, adaptations, and substitutions are possible, without departing from the scope of the embodiments of the present invention. Therefore, although the embodiments of the present invention have been described in more detail through the above embodiments, the embodiments of the present invention are not limited to the above embodiments, and many other equivalent embodiments may be included without departing from the concept of the embodiments of the present invention, and the scope of the embodiments of the present invention is determined by the scope of the appended claims.
Claims (8)
1. An evaporation source is characterized by comprising a crucible, a heating wire and a plurality of semiconductor refrigerating pieces;
the heating wires are distributed around the crucible, the semiconductor refrigeration pieces are arranged on one side, away from the crucible, of the heating wires, and the semiconductor refrigeration pieces are sequentially arranged along the direction surrounding the crucible;
each semiconductor refrigerating piece comprises a cold end and a hot end, wherein the cold end is used for refrigerating, and the hot end is used for heating; the semiconductor refrigeration piece comprises a first refrigeration piece and a second refrigeration piece, the cold end of the first refrigeration piece is arranged at one side adjacent to the crucible, and the hot end of the second refrigeration piece is arranged at one side adjacent to the crucible;
along the direction of encircleing the crucible first refrigeration piece with second refrigeration piece interval distribution is a plurality of first refrigeration piece is along encircleing the direction evenly distributed of crucible, and is a plurality of the second refrigeration piece is along encircleing the direction evenly distributed of crucible.
2. The evaporation source according to claim 1, further comprising:
the power supply module is respectively connected with the first refrigerating sheet and the second refrigerating sheet; the control module is used for controlling the power supply module to supply power to the first refrigeration piece or controlling the power supply module to supply power to the second refrigeration piece according to the working state of the evaporation source.
3. An evaporation source according to claim 2, characterized in that:
the control module is used for controlling the power supply module to supply power to the second refrigeration piece when the evaporation source is in a temperature rising state, and controlling the power supply module to supply power to the first refrigeration piece when the evaporation source is in a temperature lowering state.
4. The evaporation source according to claim 2, wherein:
the first refrigerating piece and the second refrigerating piece respectively comprise a first insulating layer, a plurality of N-type semiconductor structures and a plurality of P-type semiconductor structures which are arranged on the first insulating layer, and a second insulating layer which is arranged on one side, far away from the first insulating layer, of the plurality of N-type semiconductor structures and the plurality of P-type semiconductor structures;
the N-type semiconductor structure and the P-type semiconductor structure are sequentially arranged at intervals; the first end of the first N-type semiconductor structure is connected with the anode of the power supply module, and the first end of the last P-type semiconductor structure is connected with the cathode of the power supply module; the second end of the first N-type semiconductor structure is connected with the second end of the first P-type semiconductor structure;
the first end of the kth N-type semiconductor structure is connected with the first end of the kth-1P-type semiconductor structure, the second end of the kth N-type semiconductor structure is connected with the second end of the kth P-type semiconductor structure, wherein k is more than or equal to 2, and k is a positive integer;
the first insulating layer of the first refrigeration sheet is close to the crucible;
the second insulating layer of the second chilling plate is close to the crucible.
5. An evaporation source according to claim 4, characterized in that:
the N-type semiconductor structure and the P-type semiconductor structure are connected through a metal structure.
6. An evaporation source according to claim 1, characterized in that:
in the depth direction of the crucible, the size of the first refrigeration sheet and the size of the second refrigeration sheet are greater than or equal to the size of the crucible.
7. The evaporation source according to claim 1, further comprising:
and the outline layer is arranged on one side of the semiconductor refrigeration sheet, which is far away from the heating wire.
8. An evaporation source according to claim 1, characterized in that:
the crucible is cylindrical or rectangular.
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| CN202110321264.7A CN113061848B (en) | 2021-03-25 | 2021-03-25 | Evaporation source |
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| CN202110321264.7A CN113061848B (en) | 2021-03-25 | 2021-03-25 | Evaporation source |
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| CN113061848A CN113061848A (en) | 2021-07-02 |
| CN113061848B true CN113061848B (en) | 2023-03-10 |
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2021
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