CN110981171A - Method for sealing ampoule bottle by fusing at low temperature - Google Patents

Method for sealing ampoule bottle by fusing at low temperature Download PDF

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Publication number
CN110981171A
CN110981171A CN201911423667.1A CN201911423667A CN110981171A CN 110981171 A CN110981171 A CN 110981171A CN 201911423667 A CN201911423667 A CN 201911423667A CN 110981171 A CN110981171 A CN 110981171A
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CN
China
Prior art keywords
sealing
ampoule bottle
low
temperature
sleeve
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Withdrawn
Application number
CN201911423667.1A
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Chinese (zh)
Inventor
王立建
刘君丽
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Jinan Deyang Special Gas Co ltd
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Jinan Deyang Special Gas Co ltd
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Priority to CN201911423667.1A priority Critical patent/CN110981171A/en
Publication of CN110981171A publication Critical patent/CN110981171A/en
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00Re-forming shaped glass
    • C03B23/18Re-forming and sealing ampoules

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)

Abstract

The invention belongs to the field of sealing, and particularly relates to a method for sealing an ampoule bottle at a low temperature, wherein the ampoule bottle filled with a standard solution prepared from a low-boiling-point solvent is sealed at an environment lower than 15 ℃, the environment lower than 15 ℃ is provided by a low-temperature sealing device, the device comprises a flame nozzle and a rotating motor, and further comprises a brass sleeve, wherein the ampoule bottle is internally provided with a cavity with a shape matched with that of the ampoule bottle, the outer side of the brass sleeve is sleeved with a red copper sleeve, the outer side of the red copper sleeve is connected with a semiconductor refrigerating sheet, the outer side of the semiconductor refrigerating sheet is connected with an aluminum cooling plate, the outer side of the aluminum cooling plate is connected with an exhaust fan, the red copper sleeve, the semiconductor refrigerating sheet, the aluminum cooling plate and the exhaust fan are all arranged on a support, the rotating motor. The invention provides a melt sealing method for the standard solution prepared from the low-boiling-point solvent, avoids solvent volatilization caused by sealing under a high-temperature condition and other properties of the standard solution changed at high temperature, and ensures the accuracy and other properties of the standard solution.

Description

Method for sealing ampoule bottle by fusing at low temperature
Technical Field
The invention belongs to the field of sealing, and particularly relates to a method for sealing an ampoule bottle by fusing at a low temperature.
Background
An ampoule is a sealed glass vial having a capacity of 1-25mL, and is commonly used for storing standard solutions of solvents and the like. After the ampoule is filled with the standard solution, the ampoule is usually sealed by a hot-melt method, and the glass at the opening of the ampoule is melted by the high temperature generated by combustion and sealed. The standard solvent sealed and melted by the method is easy to volatilize due to the high temperature of flame, and particularly, the quality, the concentration and other properties of the standard solution in the bottle are influenced by the standard solution prepared from the low-boiling-point solvent.
Disclosure of Invention
Aiming at the technical problems, the invention provides a method for sealing an ampoule bottle at a low temperature, which can effectively reduce the temperature of the ampoule bottle and avoid the solvent from volatilizing due to the rise of the temperature by sealing and melting the ampoule bottle at the low temperature.
The technical scheme of the invention is as follows:
a method for sealing ampoule bottle by fusing at low temperature comprises sealing ampoule bottle containing standard solution prepared from low boiling point solvent at below 15 deg.C.
Preferably, the environment below 15 ℃ is provided by low temperature sealing device, the device includes the flame nozzle, the rotating electrical machines, still including the inside brass cover that is provided with ampoule shape adaptation cavity, the brass cover outside cup joints the red copper cover, semiconductor refrigeration piece is connected to the red copper cover outside, the aluminium cooling plate is connected to the semiconductor refrigeration piece outside, the exhaust fan is connected to the aluminium cooling plate outside, the red copper cover, semiconductor refrigeration piece, the aluminium cooling plate, the exhaust fan all sets up on the support, the rotating electrical machines hangs and connects on the support, the bull stick and the brass cover of rotating electrical machines are connected.
The brass sleeve and the red copper sleeve are selected, the brass and the red copper have high heat conductivity coefficients and good heat dissipation effect, but the brass and the red copper are selected as materials, and further the red copper sleeve is preferably used for both the brass sleeve and the red copper sleeve. The direct red copper cover that cup joints in the brass cover outside, and the red copper cover sets up on the support, and the brass cover is connected with the bull stick of rotating electrical machines, and the rotating electrical machines drives the brass cover and rotates, takes place relative motion with the red copper cover, places the ampoule in the brass cover, and the ampoule rotates along with the brass cover, and the quick even melting in ampoule seal position realizes automatic the sealing.
Preferably, a thermometer is arranged in the red copper sleeve.
Preferably, the rotating rod on the rotating motor is in threaded connection with the brass sleeve, the threaded connection is convenient to mount and dismount, and meanwhile, the connection can be guaranteed to be tight.
Preferably, the bottom of support is provided with the slide, and convenient push-and-pull, the position of flame nozzle is fixed, through push-and-pull support for the ampoule is close to flame, carries out the melt-sealing.
Preferably, the bracket is provided with a handle, so that the push-pull control is convenient.
Preferably, the thermometer is electrically connected with the semiconductor refrigeration piece and the exhaust fan, the required temperature of a low-temperature environment is set through the control of the PLC system, and after the temperature is measured by the thermometer, signals are transmitted to the semiconductor refrigeration piece and the exhaust fan to control the refrigeration temperature and the heat dissipation so as to control the temperature.
Preferably, the semiconductor chilling plates can be replaced by circulating water or other cooling devices. The semiconductor refrigerating sheet is a cooling device, and has the characteristics of no vibration noise, no need of refrigerant, real-time temperature control, no pollution and the like. The semiconductor refrigerating piece provides low-temperature environment for refrigeration, and the power of the semiconductor refrigerating piece or a proper refrigerating device can be selected according to different required temperatures.
Preferably, the low temperature environment during sealing by fusing is 0-5 ℃. The semiconductor refrigerating piece is used for refrigerating in the low-temperature environment, and the power of the semiconductor refrigerating piece or the appropriate refrigerating equipment can be selected according to different required temperatures.
Preferably, the ampoule bottle contains one of carbon disulfide, methanol, benzene, acetone and cyclohexane as the low-boiling point solvent during low-temperature sealing. But not limited to, preparing a standard solution, selecting a proper low-boiling point solvent, selecting a proper low-temperature environment according to the property of the low-boiling point solvent, and selecting the power of a semiconductor refrigeration piece in a proper low-temperature melting and packaging device or other proper refrigeration equipment.
Preferably, the cylindrical bottle body at the lower half part of the ampoule bottle is completely placed in the cavity of the brass sleeve, so that the standard solution in the bottle body is completely in the required low-temperature environment; when the ampoule bottle is sealed by melting, the temperature of the sealing position of the upper half part of the ampoule bottle is too high, and the temperature of the cylindrical bottle body of the lower half part of the ampoule bottle is too low, so that the safety of sealing by melting can be ensured by slightly lowering the semiconductor refrigerating piece to be lower than the brass sleeve and the red copper sleeve, and the bottle body is prevented from being cracked.
The invention provides a method for sealing an ampoule bottle by melting at a low temperature, which is used for sealing the ampoule bottle filled with a standard solution prepared from a low-boiling-point solvent in a low-temperature environment, realizing rapid sealing by melting, realizing automatic closing-in, and having no need of wire drawing and sealing steps and subsequent cooling; the used low-temperature sealing device can rapidly push and pull the bracket through the design of the bracket slideway, rapidly approach the ampoule bottle to flame, realize rapid sealing and melting, and does not need subsequent cooling; the brass sheath can be changed, and the shape of cavity wherein for adapting to different ampoule sizes can be according to the brass sheath of the size change different models of the ampoule that will seal the melting like this, convenient the change, later through red copper heat transfer and through the cooling of semiconductor refrigeration piece, the heat dissipation of aluminium heating panel and exhaust fan can effectively reduce the temperature in the ampoule, avoids leading to temperature rise in the ampoule because of the hot melt is sealed, the solvent volatilizees. The invention has simple process, simple installation and disassembly of the used device and easy operation. The invention provides a melt sealing method for the standard solution prepared from the low-boiling-point solvent, avoids solvent volatilization caused by sealing under a high-temperature condition and other properties of the standard solution changed at high temperature, and ensures the accuracy and other properties of the standard solution.
Drawings
FIG. 1 is a schematic structural diagram of a low-temperature sealing apparatus according to the present invention;
in the figure, 1 is a flame nozzle, 2 is a brass sleeve, 3-position red copper sleeve, 4 is an exhaust fan, 5 is a bracket, 6 is a rotating motor, 7 is a slideway, 8 is an ampoule bottle, 9 is a thermometer, 10 is a semiconductor refrigeration sheet, 11 is an aluminum heat dissipation plate, and 12 is a handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A method for sealing an ampoule bottle at low temperature comprises the step of sealing and melting the ampoule bottle at 5-10 ℃, wherein a solvent of a standard solution contained in the ampoule bottle is carbon disulfide. As shown in fig. 1, the low-temperature melt-sealing device comprises a brass sleeve 2, an ampoule bottle shape-adaptive cavity is arranged in the brass sleeve 2, a red copper sleeve 3 is sleeved outside the brass sleeve 2, a thermometer 9 is arranged in the red copper sleeve 3, a semiconductor refrigerating sheet 10 is connected outside the red copper sleeve 3, and the height of the semiconductor refrigerating sheet 10 is slightly lower than that of the red copper sleeve 3, so that the safety of melt-sealing is ensured, and the bottle body is prevented from being cracked; the outer side of the semiconductor refrigeration piece 10 is connected with an aluminum heat dissipation plate 11, the outer side of the aluminum heat dissipation plate 11 is connected with an exhaust fan 4, the red copper sleeve 3, the semiconductor refrigeration piece 10, the aluminum heat dissipation plate 11 and the exhaust fan 4 are all arranged on a support 5, a rotating rod of the rotating motor 6 is hung on the support 5 and penetrates through the brass sleeve 2 to be in threaded connection, and the flame nozzle 1 is adjusted according to the height of the ampoule bottle 8; the outer side of the brass sleeve 2 is directly sleeved with the red copper sleeve 3, the rotating motor 6 drives the brass sleeve 2 to rotate and to move relative to the red copper sleeve 3, the ampoule bottle 8 is placed in the brass sleeve 2, the ampoule bottle 8 rotates along with the brass sleeve 2, the sealing position of the ampoule bottle 8 is rapidly and uniformly melted, and automatic sealing is realized; the thermometer 9 is electrically connected with the semiconductor refrigeration piece 10 and the exhaust fan 4 and is controlled by a PLC system, after the temperature is measured by the thermometer 9, signals are transmitted to the semiconductor refrigeration piece 10 and the exhaust fan 4, and the refrigeration temperature and the heat dissipation are controlled, so that the temperature is controlled; the bottom of the bracket 5 is provided with a slideway 7, and the bracket 5 is provided with a handle 12 which is convenient for pushing and pulling.
When the device works, an ampoule bottle 8 to be sealed filled with a standard solution is placed in a brass sleeve 2, the cylindrical bottle body at the lower half part of the ampoule bottle 8 is completely placed in the brass sleeve 2, the required environment temperature is set to be 5-10 ℃ according to the property of a solvent, the refrigerating temperature of a semiconductor refrigerating sheet 10 and the heat dissipation size of an exhaust fan 4 are adjusted through a PLC (programmable logic controller) system, the height and the position of a flame nozzle 1 are adjusted, flame is ignited, a handle 12 is pushed, the ampoule bottle 8 on the device is pushed to the flame, a rotating rod of a rotating motor 6 drives the ampoule bottle 8 in the brass sleeve 2 to rotate and rotate relative to a red copper sleeve 3, the sealing position of the ampoule bottle 8 is quickly and uniformly contacted with the flame sprayed from the flame nozzle 1, the automatic sealing is realized through quick and uniform melting of the sealing position, and the sealing of the ampoule bottle 8.
Example 2
A method for sealing ampoule bottle at low temperature comprises sealing and melting ampoule bottle at 10-15 deg.C, wherein the solvent of standard solution contained in ampoule bottle is methanol. The low temperature sealing apparatus was the same as in example 1.
When the device works, an ampoule bottle 8 to be sealed filled with a standard solution is placed in a brass sleeve 2, the cylindrical bottle body at the lower half part of the ampoule bottle 8 is completely placed in the brass sleeve 2, the required environment temperature is set to be 10-15 ℃ according to the property of a solvent, the refrigerating temperature of a semiconductor refrigerating sheet 10 and the heat dissipation size of an exhaust fan 4 are adjusted through a PLC (programmable logic controller) system, the height and the position of a flame nozzle 1 are adjusted, flame is ignited, a handle 12 is pushed, the ampoule bottle 8 on the device is pushed to the flame, a rotating rod of a rotating motor 6 drives the ampoule bottle in the brass sleeve 2 to rotate and rotate relative to a red copper sleeve 3, the sealing position of the ampoule bottle 8 is quickly and uniformly contacted with the flame sprayed from the flame nozzle 1, the sealing position is quickly and uniformly melted to realize automatic sealing, and the ampoule bottle 8 is sealed by melting.
Example 3
A method for sealing ampoule bottle at low temperature comprises sealing and melting ampoule bottle at 10-15 deg.C, wherein the solvent of standard solution contained in ampoule bottle is benzene. The low temperature sealing apparatus was the same as in example 1.
When the device works, an ampoule bottle 8 to be sealed filled with a standard solution is placed in a brass sleeve 2, the cylindrical bottle body at the lower half part of the ampoule bottle 8 is completely placed in the brass sleeve 2, the required environment temperature is set to be 10-15 ℃ according to the property of a solvent, the refrigerating temperature of a semiconductor refrigerating sheet 10 and the heat dissipation size of an exhaust fan 4 are adjusted through a PLC (programmable logic controller) system, the height and the position of a flame nozzle 1 are adjusted, flame is ignited, a handle 12 is pushed, the ampoule bottle 8 on the device is pushed to the flame, a rotating rod of a rotating motor 6 drives the ampoule bottle in the brass sleeve 2 to rotate and rotate relative to a red copper sleeve 3, the sealing position of the ampoule bottle 8 is quickly and uniformly contacted with the flame sprayed from the flame nozzle 1, the sealing position is quickly and uniformly melted to realize automatic sealing, and the ampoule bottle 8 is sealed by melting.
Example 4
A method for sealing ampoule bottle at low temperature comprises sealing and melting ampoule bottle at 0-5 deg.C, wherein the solvent of standard solution contained in ampoule bottle is acetone. The low temperature sealing apparatus was the same as in example 1.
When the device works, an ampoule bottle 8 to be sealed filled with a standard solution is placed in a brass sleeve 2, a cylindrical bottle body at the lower half part of the ampoule bottle 8 is completely placed in the brass sleeve 2, the required environment temperature is set to be 0-5 ℃ according to the property of a solvent, the refrigerating temperature of a semiconductor refrigerating sheet 10 and the heat dissipation size of an exhaust fan 4 are adjusted through a PLC (programmable logic controller) system, the height and the position of a flame nozzle 1 are adjusted, flame is ignited, a handle 12 is pushed, the ampoule bottle 8 on the device is pushed to the flame, a rotating rod of a rotating motor 6 drives the ampoule bottle in the brass sleeve 2 to rotate and rotate relative to a red copper sleeve 3, the sealing position of the ampoule bottle 8 is quickly and uniformly contacted with the flame sprayed from the flame nozzle 1, the sealing position is quickly and uniformly melted to realize automatic sealing, and the ampoule bottle 8 is sealed by melting.
The invention provides a method for sealing an ampoule bottle at low temperature, which is used for sealing the ampoule bottle filled with a standard solution prepared from a low-boiling-point solvent at low temperature, realizing rapid sealing, realizing automatic closing, and having no need of wire drawing and sealing steps and subsequent cooling. The invention provides a melt sealing method for the standard solution prepared from the low-boiling-point solvent, avoids solvent volatilization caused by sealing under a high-temperature condition and other properties of the standard solution changed at high temperature, and ensures the accuracy and other properties of the standard solution.

Claims (9)

1. The method for sealing the ampoule bottle at low temperature is characterized in that the ampoule bottle filled with a standard solution prepared from a low-boiling point solvent is sealed at the temperature lower than 15 ℃.
2. The method of claim 1, wherein the ampoule is sealed by low-temperature fusion, the environment below 15 ℃ is provided by a low-temperature fusion sealing device which comprises a flame nozzle (1) and a rotating motor (6), it is characterized by also comprising a brass sleeve (2) with an ampoule bottle (8) inside and a cavity with a shape adapting to the shape of the ampoule bottle, wherein the brass sleeve (2) is sleeved with a red copper sleeve (3) outside, the semiconductor refrigeration sheet (10) is connected with the red copper sleeve (3) outside, the aluminum cooling plate (11) is connected with the semiconductor refrigeration sheet (10) outside, the exhaust fan (4) is connected with the aluminum cooling plate (11) outside, the red copper sleeve (3), the semiconductor refrigeration piece (10), the aluminum heat dissipation plate (11) and the exhaust fan (4) are all arranged on the support (5), the rotating motor (6) is hoisted below the support (5), and the rotating rod (5) of the rotating motor (6) is connected with the brass sleeve (2).
3. The method for low-temperature sealing of the ampoule bottle according to claim 2, characterized in that a thermometer (9) is arranged in the red copper sleeve (3).
4. The method for sealing the ampoule bottle by fusing at low temperature according to claim 2, characterized in that a rotating rod on the rotating motor (6) is in threaded connection with the bottom of the brass sleeve (2).
5. The ampoule bottle low-temperature sealing method according to claim 2, characterized in that the bottom of the bracket (5) is provided with a slide way (7).
6. A method of cryo-sealing an ampoule according to claim 2, characterized in that the holder (5) is provided with a handle (12).
7. The ampoule bottle low-temperature sealing method according to claim 2, characterized in that the thermometer (9) is electrically connected with the semiconductor refrigeration sheet (10) and the exhaust fan (4) and is controlled by a PLC system.
8. The method of claim 1 wherein the low temperature environment required for sealing is 0-5 ℃.
9. The method of claim 1, wherein the ampoule is sealed by low temperature melting, and the low boiling point solvent is one of carbon disulfide, methanol, benzene, acetone, and cyclohexane.
CN201911423667.1A 2019-12-31 2019-12-31 Method for sealing ampoule bottle by fusing at low temperature Withdrawn CN110981171A (en)

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CN201911423667.1A CN110981171A (en) 2019-12-31 2019-12-31 Method for sealing ampoule bottle by fusing at low temperature

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB380384A (en) * 1932-04-01 1932-09-15 Adolphe Meyer Apparatus for sealing ampoules and the like
CN2311734Y (en) * 1997-09-30 1999-03-24 郑万烈 Thermoelectric semi-conductor cold-hot head apparatus
JP2007308356A (en) * 2006-05-22 2007-11-29 Hario Glass Kk Apparatus and method for manufacturing sealed container, and sealed container
CN101475303A (en) * 2009-01-22 2009-07-08 河北科技大学 Vacuum ampoule fusion sealing machine
CN203473561U (en) * 2013-09-22 2014-03-12 厦门茶叶进出口有限公司 Low-temperature retaining device for ampoule sealed by fusing
CN104193142A (en) * 2014-09-02 2014-12-10 中国建筑材料科学研究总院 Device and process for preparing chalcogenide infrared glass material and method of device
CN209508000U (en) * 2018-12-28 2019-10-18 成都普思生物科技股份有限公司 A kind of ampoule bottle heat sealing improvement device containing volatile substances
CN209507999U (en) * 2018-12-26 2019-10-18 成都普思生物科技股份有限公司 A kind of Portable ampoule bottle sealing device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB380384A (en) * 1932-04-01 1932-09-15 Adolphe Meyer Apparatus for sealing ampoules and the like
CN2311734Y (en) * 1997-09-30 1999-03-24 郑万烈 Thermoelectric semi-conductor cold-hot head apparatus
JP2007308356A (en) * 2006-05-22 2007-11-29 Hario Glass Kk Apparatus and method for manufacturing sealed container, and sealed container
CN101475303A (en) * 2009-01-22 2009-07-08 河北科技大学 Vacuum ampoule fusion sealing machine
CN203473561U (en) * 2013-09-22 2014-03-12 厦门茶叶进出口有限公司 Low-temperature retaining device for ampoule sealed by fusing
CN104193142A (en) * 2014-09-02 2014-12-10 中国建筑材料科学研究总院 Device and process for preparing chalcogenide infrared glass material and method of device
CN209507999U (en) * 2018-12-26 2019-10-18 成都普思生物科技股份有限公司 A kind of Portable ampoule bottle sealing device
CN209508000U (en) * 2018-12-28 2019-10-18 成都普思生物科技股份有限公司 A kind of ampoule bottle heat sealing improvement device containing volatile substances

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