CN1553501A

CN1553501A - Radiator

Info

Publication number: CN1553501A
Application number: CNA031406769A
Authority: CN
Inventors: 钟兆才; 萧万进
Original assignee: Asustek Computer Inc
Current assignee: Asustek Computer Inc
Priority date: 2003-06-02
Filing date: 2003-06-02
Publication date: 2004-12-08
Anticipated expiration: 2023-06-02
Also published as: CN1309063C

Abstract

The heat sink is suitable to electronic equipment possessing integration type cooling plate. The cooling plate is setup on the electronic equipment inserted in a receptacle. The heat sink includes a base and at least one fin of heat dispersion. The base of heat sink possessing a concave contact area is contacted to the cooling plate. Shape and position of contact area in the heat sink is corresponding to shape and position of integration type cooling plate. Fins of heat dispersion are formed on base of the heat sink.

Description

Heat abstractor

(1) technical field

The relevant a kind of heat abstractor of the present invention, the particularly relevant more easy heat abstractor of a kind of dismounting.

(2) background technology

In general, central processor (CPU) mostly disposes integrated fin (integrated heat spreader among being used in desk-top or the notebook computer at present; IHS) structure, for example the Pentium 4Northwood of Intel.This integrated fin (IHS) mostly is made by copper alloy, with the heat radiation of secondary CPU.

See also Fig. 1, a central processing unit 1 mainly has a substrate 11, a plurality of pin (pin) 12 and a silicon 13 (shown in dotted line), and this silicon 13 is positioned on the substrate 11, and a plurality of pin 12 is to be positioned under the substrate 11.Be provided with an integrated fin 2 on the substrate 11 of central processing unit 1, simultaneously, integrated fin 2 has the recess (not shown) corresponding to silicon 13 in addition, with ccontaining and coat whole silicon 13.

See also Fig. 2, when the central processing unit 1 that contains integrated fin 2 was plugged among the socket (socket) 3 on the computer motherboard by its pin 12, a radiator (heat sink) the 4th and then was arranged on the integrated fin 2 to help heat radiation.Yet, owing to having the gap because of its surface smoothness deficiency between the base 41 of integrated fin 2 and radiator 4, thereby influence heat conduction usefulness between integrated fin 2 and the radiator 4, so between the base 41 of integrated fin 2 and radiator 4, can be provided with the very thin thermal grease of one deck, phase change heat-conducting medium (phase change material, PCM) 5 for example.Phase change heat-conducting medium 5 can be filled up the gap between integrated fin 2 and the base 41, increasing the surperficial contact area between integrated fin 2 and the base 41, and then promotes the heat conduction usefulness between integrated fin 2 and the radiator 4.

Then general description is as follows as for the physical characteristic of phase change heat-conducting medium 5.Because the fusing point of phase change heat-conducting medium 5 is approximately 50 ℃, so it is solid-state form under normal temperature or room temperature, but when its ambient temperature surpasses 50 ℃, phase change heat-conducting medium 5 will be fused into liquid form, at this moment, the phase change heat-conducting medium 5 of liquid form just can be filled up the gap between integrated fin 2 and the base 41, even when its ambient temperature is got back to below 50 ℃ again, and the shape when phase change heat-conducting medium 5 still can keep it to be in liquid form.In addition, phase change heat-conducting medium 5 also has the low advantage of thermal resistance value, so its heat conducting speed is come soon more than known fin such as silica gel sheet.

As mentioned above, because central processing unit 1 can produce high temperature (greater than 50 ℃) when running,, phase change heat-conducting medium 5 is attached to integrated fin 2 and base 41 so can melting.Then, when the temperature of central processing unit 1 reduced, phase change heat-conducting medium 5 just can become solid-state form and be attached to integrated fin 2 and base 41, and the phase change heat-conducting medium 5 of this moment can have extremely strong adhesion.When desiring more heat exchange radiator 4 or central processing unit 1, just need in regular turn radiator 4 and central processing unit 1 pulled out and pull down, yet, because the phase change heat-conducting medium 5 of this moment has extremely strong adhesion, so under the adhesion of 41 of phase change heat-conducting medium 5 and the bases situation greater than the chucking power of 3 of the pin 12 of central processing unit 1 and sockets, radiator 4 can break away from socket 3 with central processing unit 1.At this moment, pin 12 regular meetings of central processing unit 1 produce situation crooked or that break and because of the excessive drawing application of force, the drawing application of force improperly or the direction of the drawing application of force improperly, as shown in Figure 3.

In addition, if the pin 12 that will avoid central processing unit 1 is crooked or break because of the drawing application of force improperly produces, phase change heat-conducting medium 5 can also be heated on its fusing point, delamination central processing unit 1 (or integrated fin 2) and radiator 4 when utilizing phase change heat-conducting medium 5 to be fused into liquid form, yet heating phase change heat-conducting medium 5 will be wasted the too much dismounting time.

(3) summary of the invention

In view of this, the objective of the invention is to provide a kind of improved heat abstractor, its simple structure, and can under the situation of not damaging the central processing unit structure, easily it be detached in central processing unit, simultaneously, the time that heat abstractor of the present invention is detached in central processing unit can significantly shorten.

The present invention is applicable to the electronic installation with an integrated fin, and comprise a base, be connected in this integrated fin, and have a groove and a contact area, wherein, this contact area is to be connected in this integrated fin, and the shape of this contact area and position are corresponding to the shape of this integrated fin and position, this groove is to form on this base, and this groove is that edge from this base extends to this contact area; And at least one radiating fin, be to form on this base.

Simultaneously, according to heat abstractor of the present invention, this contact area of this base is to be connected in this integrated fin by a phase change heat-conducting medium, and this phase change heat-conducting medium is to be arranged between this contact area and this integrated fin.

Again in the present invention, the cross section of this groove is the shape for rectangle.

Again in the present invention, the cross section of this groove is to be semicircular shape.

Again in the present invention, the cross section of this groove is to be leg-of-mutton shape.

Again in the present invention, the shape of this integrated fin and this contact area is shaped as rectangle.

Again in the present invention, this electronic installation is a central processing unit.

(4) description of drawings

For above-mentioned purpose of the present invention, characteristics and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. are elaborated.

Fig. 1 shows that an integrated fin is arranged at the schematic perspective view on the central processing unit;

Fig. 2 shows that a known radiator and a central processing unit are plugged in the schematic side view in the socket;

Fig. 3 shows according to the radiator of Fig. 2 and central processing unit to pull out schematic side view in socket;

Fig. 4 A is the schematic side view that shows heat abstractor of the present invention;

Fig. 4 B is the elevational schematic view that shows according to Fig. 4 A;

Fig. 5 shows that a heat abstractor of the present invention and a central processing unit are plugged in the schematic side view in the socket;

Fig. 6 shows that word bottle opener one by one is inserted in the schematic perspective view in the heat abstractor of the present invention; And

Fig. 7 shows that heat abstractor of the present invention is detached in the schematic perspective view of central processing unit with word bottle opener one by one.

(5) embodiment

See also Fig. 4 A and Fig. 4 B, the heat abstractor 100 of present embodiment is made of a base 110 and a plurality of radiating fin 120, and radiating fin 120 is to form in equably on the base 110, in order to auxiliary heat dissipation.In addition, the surface also has a groove 111 and a contact area 112 under the base 110.Shown in Fig. 4 A, groove 111 is the lower surfaces that form in base 110, and groove 111 has the cross sectional shape of a rectangle.Shown in Fig. 4 B, groove 111 is that the bottom margin from base 110 extends among the contact area 112.In addition, these a plurality of radiating fins 120 are the upper surfaces that are formed at heat abstractor 100.

See also Fig. 5, the heat abstractor 100 of present embodiment is to be applicable to that the electronic installation 1 to having an integrated fin 2 carries out heat conduction and heat radiation, in the present embodiment, electronic installation 1 can be a central processing unit that encapsulates in crystal covering type needle-like matrix (FCPGA) mode, have a substrate 11, a plurality of pin (pin) 12 and a silicon (not shown), and on substrate 11, be provided with an integrated fin 2.As shown in Figure 5, central processing unit 1 is to be plugged among the socket 3.When heat abstractor 100 is when being arranged on the central processing unit 1, heat abstractor 100 is to contact with integrated fin 2 on the central processing unit 1 by its base 110, in more detail, integrated fin 2 is the contact areas 112 that are connected in the lower surface of the base 110 shown in Fig. 4 B.Simultaneously, between contact area 112 and integrated fin 2, also be provided with a thermal grease, a phase change heat-conducting medium 5 for example, to fill up the gap between integrated fin 2 and the contact area 112, increasing the surperficial contact area between integrated fin 2 and the contact area 112, and then promote the heat conduction usefulness between integrated fin 2 and the heat abstractor 100.Specifically, the position of the contact area 112 of the base 110 of present embodiment is the position corresponding to integrated fin 2, and the shape of contact area 112 can be identical with the shape of integrated fin 2, and is all the shape of rectangle haply.

Similarly, because of central processing unit 1 at the high temperature that running the time is produced, make 5 fusings of phase change heat-conducting medium and be attached to integrated fin 2 and base 110.When the temperature of central processing unit 1 reduced, phase change heat-conducting medium 5 just can become solid-state form and be attached to integrated fin 2 and base 110, and the phase change heat-conducting medium 5 of this moment can have extremely strong adhesion.At this moment, when desire is changed heat abstractor 100, only need utilize one one word bottle opener to get final product, and not need numerous and diverse extracting tool.Detailed, shown in Fig. 6 and Fig. 4 B, the operator only needs the flat end 61 of a word bottle opener 6 is inserted among the contact area 112 by the groove 111 of base 110.Then, shown in Fig. 7 and Fig. 4 B, be the point of application with the contact area 112 and the integrated fin 2 of base 110, a word bottle opener 6 is rotated the contact area 112 that angles (for example 90 degree) can be located away from integrated fin 2 base 110 easily.Then, if will further dismantle central processing unit 1, can directly central processing unit 1 be pulled up in socket 3 together with integrated fin 2 and get final product, and can not make pin 12 on it take place crooked or rupture.

According to above mode of operation, so be understandable that base 110 groove 111 must extend to its contact area 112, the point of application for fear of a word bottle opener 6 can fall within on the substrate 11 of central processing unit 1 exactly, and substrate 11 is broken, and then the circuit in the substrate 11 is damaged.On the other hand, because integrated fin 2 is made with copper alloy,, and be difficult for being damaged so the ability of its opposing external force is preferable.

In addition, the cross section of the groove 111 of base 110 of the present invention need not be confined to the shape of rectangle, in other words, the cross section of groove 111 can also be semicircle or leg-of-mutton shape, as long as groove 111 can allow a word bottle opener 6 or other similar instruments be inserted and rotated.

Though the present invention is disclosed in preferred embodiment; yet it is not in order to limit the present invention; any person skilled in the art person without departing from the spirit and scope of the present invention; change with equivalence and replace when making all equivalence, so protection scope of the present invention is when looking being as the criterion that accompanying Claim defines.

Claims

1. a heat abstractor is arranged at one and has on the electronic installation of integrated fin, it is characterized in that this heat abstractor comprises at least:

One base, have an a lower surface and a upper surface, when this base was arranged on this electronic installation, this lower surface had a contact area that contacts with this integrated fin, and this lower surface has a groove, and this groove is that the edge by this base extends to this contact area.

2. heat abstractor as claimed in claim 1 is characterized in that, this contact area of described base is to be connected in described integrated fin by a thermal grease.

3. heat abstractor as claimed in claim 2 is characterized in that, described thermal grease is a phase change heat-conducting medium.

4. heat abstractor as claimed in claim 1 is characterized in that the upper surface of described base also has radiating fin.

5. described according to claim 1 heat abstractor is characterized in that,, the cross section of this groove is the shape for rectangle.

6. described according to claim 1 heat abstractor is characterized in that,, the cross section of this groove is to be semicircular shape.

7. described according to claim 1 heat abstractor is characterized in that,, the cross section of this groove is to be leg-of-mutton shape.

8. described according to claim 1 heat abstractor is characterized in that,, the shape of this integrated fin and this contact area be shaped as rectangle.

9. described according to claim 1 heat abstractor is characterized in that,, this electronic installation is a central processing unit.