TWI387718B - Pulsating heat pipe - Google Patents
Pulsating heat pipe Download PDFInfo
- Publication number
- TWI387718B TWI387718B TW98137883A TW98137883A TWI387718B TW I387718 B TWI387718 B TW I387718B TW 98137883 A TW98137883 A TW 98137883A TW 98137883 A TW98137883 A TW 98137883A TW I387718 B TWI387718 B TW I387718B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat pipe
- flow path
- oscillating heat
- flow
- pipe according
- Prior art date
Links
- 239000012530 fluid Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本揭露係關於一種熱管，特別係關於一種震盪式熱管。The present disclosure relates to a heat pipe, and more particularly to an oscillating heat pipe.
熱管具有良好之熱傳性能，因此被廣泛地運用在電子元件之散熱，特別是在個人電腦以及筆記型電腦之中幾乎都可以看見熱管的運用。通常，面臨平面發熱形式之散熱需求時，設計上必須同時採用多支熱管，方能滿足散熱之需求。可是，多支熱管的使用會造成散熱設計、散熱模組組裝與製作上的困難。因此，面對平面發熱形式之散熱要求時，平板型熱管會是較傳統熱管為合適的傳熱元件。Heat pipes have good heat transfer properties, so they are widely used in the heat dissipation of electronic components, especially in personal computers and notebook computers. Generally, when faced with the heat dissipation requirement in the form of planar heating, multiple heat pipes must be used in the design to meet the heat dissipation requirements. However, the use of multiple heat pipes can cause difficulties in heat dissipation design, assembly and fabrication of the heat dissipation module. Therefore, in the face of the heat dissipation requirements of the planar heating form, the flat type heat pipe is a suitable heat transfer element than the conventional heat pipe.
運用具有毛細結構之平板型熱管，其困難在於毛細結構之燒結製作，主要原因如下：1、平板型熱管越大型，毛細結構之均勻度越難以控制，因而容易導致性能不穩定；2、平板型熱管越大型，用於燒結毛細結構之燒結爐也必須加大，從而導致成本增加，量產速度降低；3、退火後之平板型熱管，其管壁強度大幅降低，因而可能導致其管壁不具可因應內外部壓力變化所需之強度。既然因為毛細結構的燒結，會衍生出許多製作上之問題，因此不具毛細結構之震盪式熱管(pulsating heat pipe or oscillating heat pipe)便成為平面散熱之另一種選擇。The difficulty of using a flat-plate heat pipe with a capillary structure is the sintering of the capillary structure. The main reasons are as follows: 1. The larger the plate-type heat pipe is, the more difficult it is to control the uniformity of the capillary structure, which is easy to cause unstable performance; The larger the heat pipe, the larger the sintering furnace for sintering the capillary structure, which leads to an increase in cost and a decrease in mass production speed. 3. The flat-plate heat pipe after annealing has a greatly reduced wall strength, which may result in a wall of the tube not having The strength required to respond to changes in internal and external pressures. Since many manufacturing problems arise due to the sintering of the capillary structure, the pulsating heat pipe or oscillating heat pipe becomes an alternative to planar heat dissipation.
震盪式熱管之整體結構相當簡單，其係由一平滑的細管連結而成。震盪式熱管之驅動力是藉由較小的管徑所產生的毛細力、工作液體所受之重力以及受熱產生的汽泡壓力來使熱管產生動作。然而傳統震盪式熱管，其毛細力是相當有限的，因此傳統震盪式熱管的運作主要還是利用重力。由於傳統震盪式熱管的運作主要靠的是重力，因此當熱管處於水平或是受熱端高於散熱端的狀況時，熱管將無法運作。此一使用上之限制構成震盪式熱管運用在平面散熱要求之一主要的挑戰。The overall structure of the oscillating heat pipe is quite simple, and it is formed by a smooth thin tube. The driving force of the oscillating heat pipe is to cause the heat pipe to act by the capillary force generated by the smaller pipe diameter, the gravity of the working liquid, and the bubble pressure generated by the heat. However, the traditional oscillating heat pipe has a very limited capillary force, so the operation of the conventional oscillating heat pipe mainly uses gravity. Since the operation of the conventional oscillating heat pipe is mainly based on gravity, the heat pipe will not operate when the heat pipe is at a level or the heat receiving end is higher than the heat radiating end. This limitation of use constitutes one of the major challenges in the application of oscillating heat pipes to planar heat dissipation requirements.
傳統震盪式熱管雖然結構簡單，但由於其結構上之限制，使其難以運用在平面散熱上。因此，傳統震盪式熱管仍待進行改良。Although the conventional oscillating heat pipe has a simple structure, it is difficult to apply to the plane heat dissipation due to its structural limitation. Therefore, the traditional oscillating heat pipe is still to be improved.
本揭露眾實施例揭示一種震盪式熱管，其係利用非均勻流道結構，對工作流體產生不對稱之力量，使得當震盪式熱管水平放置時，仍可發揮其散熱功能。The present disclosure discloses an oscillating heat pipe that utilizes a non-uniform flow path structure to generate an asymmetrical force to the working fluid so that when the oscillating heat pipe is horizontally placed, the heat dissipation function can still be exerted.
本揭露一實施例揭示一種震盪式熱管，其包含一流道系統。流道系統包含複數段第一流道及複數段第二流道，其中該些第一流道與該些第二流道係沿該流道系統交錯設置，且該第一流道之橫截面與該第二流道之橫截面不同。One embodiment of the present disclosure discloses an oscillating heat pipe that includes a first-rate system. The flow channel system includes a plurality of first flow channels and a plurality of second flow channels, wherein the first flow channels and the second flow channels are staggered along the flow channel system, and the cross section of the first flow channel and the first flow channel The cross section of the second flow path is different.
上文已經概略地敍述本揭露之技術特徵及優點，俾使下文之本揭露詳細描述得以獲得較佳瞭解。構成本揭露之申請專利範圍標的之其它技術特徵及優點將描述於下文。本揭露所屬技術領域中具有通常知識者應可瞭解，下文揭示之概念與特定實施例可作為基礎而相當輕易地予以修改或設計其它結構或製程而實現與本揭露相同之目的。本揭露所屬技術領域中具有通常知識者亦應可瞭解，這類等效的建構並無法脫離後附之申請專利範圍所提出之本揭露的精神和範圍。The technical features and advantages of the present disclosure are summarized above, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It is to be understood by those of ordinary skill in the art that the present invention disclosed herein may be It is also to be understood by those of ordinary skill in the art that this invention is not limited to the spirit and scope of the disclosure disclosed in the appended claims.
圖1例示本揭露一實施例之震盪式熱管1之示意圖，而圖2例示本揭露一實施例之震盪式熱管1之流道系統12。參照圖1與圖2所示，震盪式熱管1包含一基板11、一流道系統12以及一蓋板13。流道系統12係於一平面上彎繞之迴路式流道，其係形成於該基板11之一表面111。蓋板13覆蓋於基板11上，蓋板13係被建構以密封該流道系統12，以使該流道系統12成為可使一工作流體循環流動之密封迴路。蓋板13上可設置複數個開孔131，相對地，基板11上可設置複數個螺孔112。利用複數個鎖固件(未繪示)分別穿越相對應之該些開孔131，並與相對應之該些螺孔112鎖合，即可將蓋板13與基板11鎖固。此處例舉之螺孔112與開孔131之設置方式，本揭露不以此為限，凡其他合適之鎖固方式，亦可包含於本揭露之中。鎖固件可為螺絲，但本揭露不以此為限。基板與蓋板亦可以透過焊接方式製作，而達到密封之要求。1 is a schematic view showing an oscillating heat pipe 1 according to an embodiment of the present disclosure, and FIG. 2 is a view showing a flow path system 12 of the oscillating heat pipe 1 according to an embodiment of the present invention. Referring to FIGS. 1 and 2, the oscillating heat pipe 1 includes a substrate 11, a channel system 12, and a cover plate 13. The runner system 12 is a looped flow path that is bent on a plane and is formed on one surface 111 of the substrate 11. The cover plate 13 covers the substrate 11, and the cover plate 13 is constructed to seal the flow path system 12 such that the flow path system 12 becomes a sealed circuit that allows a working fluid to circulate. A plurality of openings 131 may be disposed on the cover plate 13. In contrast, a plurality of screw holes 112 may be disposed on the substrate 11. The cover plate 13 and the substrate 11 can be locked by using a plurality of locks (not shown) respectively passing through the corresponding openings 131 and engaging with the corresponding screw holes 112. The manner in which the screw hole 112 and the opening 131 are exemplified herein is not limited thereto, and other suitable locking methods may also be included in the disclosure. The lock can be a screw, but the disclosure is not limited thereto. The substrate and the cover can also be fabricated by soldering to meet the sealing requirements.
參照圖2所示，基板11之表面111可為一下凹表面，本揭露不以此為限。基板11可包含金屬，而流道系統12可銑製於基板11之表面111上，本揭露不以此銑製加工方式為限。在一實施例中，基板11之材質可為銅或鋁，本揭露不以此為限。流道系統12可包含複數段第一流道121和複數段第二流道122，其中該些第一流道121與該些第二流道122可沿流道系統12交錯設置。各該第一流道121與各該第二流道122可分別為一均勻流道，第一流道121之橫截面與第二流道122兩者之橫截面不同。換言之，第一流道121之橫截面與第二流道122之橫截面可分別具有不同的截面積，本揭露不以此為限；第一流道121之橫截面與第二流道122之橫截面可分別具有不同之形狀，本揭露不以此為限；或者，第一流道121之橫截面與第二流道122之橫截面可分別具有不同之水力直徑(Hydraulic Diameter)，本揭露不以此為限。第一流道121與第二流道122橫截面之不同可使位於其內之工作流體具有不同之毛細力。流道系統12內之工作流體由基板11上之注入口133注入，當工作流體注入完畢後，再將注入口133封住。工作流體注入前，需從注入口133將流道系統12抽真空。Referring to FIG. 2, the surface 111 of the substrate 11 may be a concave surface. The disclosure is not limited thereto. The substrate 11 may comprise metal and the runner system 12 may be milled onto the surface 111 of the substrate 11, the disclosure being not limited by this milling process. In an embodiment, the material of the substrate 11 may be copper or aluminum, and the disclosure is not limited thereto. The flow channel system 12 can include a plurality of first flow channels 121 and a plurality of second flow channels 122, wherein the first flow channels 121 and the second flow channels 122 can be staggered along the flow channel system 12. Each of the first flow path 121 and each of the second flow paths 122 may be a uniform flow path, and the cross section of the first flow path 121 and the second flow path 122 are different. In other words, the cross section of the first flow path 121 and the cross section of the second flow path 122 may have different cross-sectional areas, respectively, and the disclosure is not limited thereto; the cross section of the first flow path 121 and the cross section of the second flow path 122 The disclosure may not be limited thereto; or the cross section of the first flow path 121 and the cross section of the second flow path 122 may have different hydraulic diameters respectively, and the disclosure does not Limited. The difference in cross-section between the first flow path 121 and the second flow path 122 allows the working fluid located therein to have different capillary forces. The working fluid in the flow path system 12 is injected from the injection port 133 on the substrate 11, and after the injection of the working fluid is completed, the injection port 133 is sealed. The flow channel system 12 is evacuated from the injection port 133 prior to injection of the working fluid.
就本實施例言，第一流道121與第二流道122在垂直於表面111之方向上可具相同的管深，而在第一流道121在橫向上可具有較窄的管寬；而第二流道122在橫向上可具有較寬的管寬，但本揭露不以此為限。又，該些第一流道121與該些第二流道122可平行設置，且相鄰之第一流道121與第二流道122之兩端處，分別以一彎流道123連接，但本揭露不以此為限。位於流道系統12相對兩側(圖2中上下兩側)上端之第一流道121左端處1211與下端第二流道122之左端處1221間，可利用一連接流道124連接，藉此形成一循環迴路流道，其中該第一流道左端處1211可為入口處，而該第二流道左端處1221之可為出口處。For the present embodiment, the first flow path 121 and the second flow path 122 may have the same tube depth in a direction perpendicular to the surface 111, and may have a narrow tube width in the lateral direction at the first flow path 121; The second flow path 122 may have a wider tube width in the lateral direction, but the disclosure is not limited thereto. Moreover, the first flow path 121 and the second flow paths 122 may be disposed in parallel, and the two ends of the adjacent first flow path 121 and the second flow path 122 are respectively connected by a curved flow path 123, but Exposure is not limited to this. The left end 1211 of the first flow path 121 and the left end 1211 of the lower second flow path 122 located at opposite ends of the flow channel system 12 (upper and lower sides in FIG. 2) may be connected by a connecting flow channel 124, thereby forming A circulating circuit flow path, wherein the first end of the first flow path 1211 can be an inlet, and the left end of the second flow path 1221 can be an outlet.
由於第一流道121之管寬較第二流道122之管寬微小，使得工作流體在第一流道121內之毛細力較在第二流道122內為大，因此當工作流體之兩端分別位於第一流道121與第二流道122時，工作流體將被拉向第一流道121。當加熱區134受熱時，工作流體會蒸發而增加蒸汽壓力，進而推動工作流體之流動。高溫高壓之工作流體將會流至冷卻區132，亦即將熱由高溫之加熱區134送至低溫之冷卻區132，以達到熱量傳遞之效果。該加熱區134係在連接流道124之另一端，而冷卻區132與連接流道124同一端。另，當工作流體受到蒸發流體之壓力擠壓時，由於工作流體流往第二流道122之流阻較小，因此工作流體可較易被推向第二流道122流動。本揭露藉流道系統12內因具有非均勻的流道結構，而使在流道系統12內之工作流體可受到不對稱之力量，藉此促進震盪式熱管1之初始啟動運作，從而使震盪式熱管1可水平放置操作。Since the tube width of the first flow path 121 is smaller than the tube width of the second flow path 122, the capillary force of the working fluid in the first flow path 121 is larger than that in the second flow path 122, so that the two ends of the working fluid are respectively When located in the first flow path 121 and the second flow path 122, the working fluid will be pulled toward the first flow path 121. When the heating zone 134 is heated, the working fluid evaporates to increase the vapor pressure, thereby pushing the flow of the working fluid. The high temperature and high pressure working fluid will flow to the cooling zone 132, that is, the heat is sent from the high temperature heating zone 134 to the low temperature cooling zone 132 to achieve the effect of heat transfer. The heating zone 134 is at the other end of the connecting flow path 124, and the cooling zone 132 is at the same end as the connecting flow path 124. In addition, when the working fluid is pressed by the pressure of the evaporating fluid, since the flow resistance of the working fluid to the second flow path 122 is small, the working fluid can be more easily pushed toward the second flow path 122. It is disclosed that the working fluid in the flow channel system 12 can be subjected to an asymmetrical force due to the non-uniform flow channel structure in the borrowing channel system 12, thereby promoting the initial starting operation of the oscillating heat pipe 1, thereby making the oscillating type The heat pipe 1 can be placed horizontally.
圖3例示本揭露另一實施例之流道系統22之示意圖。流道系統22包含複數段第一流道221及複數段第二流道222，其中該些第一流道221與該些第二流道222係沿該流道系統22交錯設置。第二流道222可為一均勻流道，而第一流道221可包含一噴嘴結構223，藉此使第一流道221與第二流道222可分別具有不同的橫截面，以讓工作流體於流道系統22內因毛細力或流阻之差異在受熱啟動時容易流動。在本實施例中，第一流道221與第二流道222可平行交錯設置，本揭露不以此為限。FIG. 3 illustrates a schematic diagram of a runner system 22 in accordance with another embodiment of the present disclosure. The flow channel system 22 includes a plurality of first flow channels 221 and a plurality of second flow channels 222, wherein the first flow channels 221 and the second flow channels 222 are staggered along the flow channel system 22. The second flow path 222 can be a uniform flow path, and the first flow path 221 can include a nozzle structure 223, so that the first flow path 221 and the second flow path 222 can have different cross sections respectively, so that the working fluid is The flow path system 22 easily flows during warm start due to the difference in capillary force or flow resistance. In this embodiment, the first flow path 221 and the second flow path 222 may be arranged in parallel, and the disclosure is not limited thereto.
圖4例示本揭露又一實施例之流道系統32之示意圖。流道系統32形成於一基板11上，其包含複數段第一流道321及複數段第二流道322，第一流道321分別設置於第二流道322之間。第二流道322可為一均勻流道，而第一流道321可包含一孔口結構323，亦即第一流道321之截面積較第二流道322之截面積小，藉此使第一流道321與第二流道322可分別具有不同的橫截面，以讓工作流體於流道系統32內因毛細力或流阻之差異在受熱啟動時容易流動。4 illustrates a schematic diagram of a runner system 32 in accordance with yet another embodiment of the present disclosure. The flow channel system 32 is formed on a substrate 11 and includes a plurality of first flow channels 321 and a plurality of second flow channels 322. The first flow channels 321 are respectively disposed between the second flow channels 322. The second flow path 322 can be a uniform flow path, and the first flow path 321 can include an aperture structure 323, that is, the cross-sectional area of the first flow path 321 is smaller than the cross-sectional area of the second flow path 322, thereby making the first flow The passages 321 and the second flow passages 322 may have different cross sections, respectively, to allow the working fluid to flow easily in the flow passage system 32 due to the difference in capillary force or flow resistance when heated.
圖5例示本揭露再一實施例之流道系統42之示意圖。除依前述在基板11上加工形成之流道系統(12至32)之形式外，主要流道系統42為一密封彎折之金屬管所形成。流道系統42包含複數段壓扁之管段423，而該些壓扁之管段423可間隔形成，藉此在各壓扁之管段423上形成一第一流道421，而於各未壓扁或壓扁程度不同於第一流道421之管段形成一第二流道422等截面不同之流道。金屬管亦可設置於基板11之表面111上，以增加傳熱面積，金屬管與基板11之表面111可利用導熱膏或銲錫等形成熱耦接，本揭露不以此為限。FIG. 5 illustrates a schematic diagram of a runner system 42 in accordance with yet another embodiment of the present disclosure. In addition to the form of the runner system (12 to 32) formed on the substrate 11 as described above, the main runner system 42 is formed as a sealed bent metal tube. The flow channel system 42 includes a plurality of flattened tube sections 423, and the flattened tube sections 423 are spaced apart, thereby forming a first flow path 421 on each of the flattened tube sections 423, and each is unsquashed or pressed. The pipe section having a flatness different from that of the first flow passage 421 forms a flow passage having a different cross section such as a second flow passage 422. The metal tube can also be disposed on the surface 111 of the substrate 11 to increase the heat transfer area. The metal tube and the surface 111 of the substrate 11 can be thermally coupled by using a thermal paste or solder. The disclosure is not limited thereto.
在本實驗範例中，分別以圖2實施例之結構製作一傳統震盪式熱管與一本揭露之震盪式熱管。在本揭露之震盪式熱管之基板11上，第一流道121與第二流道122分別平行且交錯形成，其中第一流道121之寬度為1毫米而第二流道122之寬度為2毫米；而在傳統震盪式熱管之基板上，僅形成寬度為2毫米之均勻流道。接著，以蓋板13分別密封本揭露之震盪式熱管與傳統震盪式熱管並抽真空，然後再個別填充約佔總流道系統體積百分之60之工作流體。接著，再對本揭露之震盪式熱管與傳統震盪式熱管分別施以不同之熱量(Qin )，並調整本揭露之震盪式熱管與傳統震盪式熱管之角度，以量測本揭露之震盪式熱管與傳統震盪式熱管之受熱端(TH )與散熱端(TL )之溫度，最後藉由熱阻(Rth )計算公式：In the experimental example, a conventional oscillating heat pipe and an exposed oscillating heat pipe are fabricated by the structure of the embodiment of FIG. 2, respectively. In the substrate 11 of the oscillating heat pipe of the present disclosure, the first flow path 121 and the second flow path 122 are respectively formed in parallel and staggered, wherein the first flow path 121 has a width of 1 mm and the second flow path 122 has a width of 2 mm; On the substrate of the conventional oscillating heat pipe, only a uniform flow path having a width of 2 mm is formed. Then, the oscillating heat pipe of the present disclosure and the conventional oscillating heat pipe are respectively sealed by the cover plate 13 and vacuumed, and then the working fluid accounts for about 60% of the total flow channel system volume. Then, the oscillating heat pipe of the present disclosure and the conventional oscillating heat pipe are respectively subjected to different heat (Q in ), and the angle of the oscillating heat pipe and the conventional oscillating heat pipe of the present disclosure are adjusted to measure the oscillating heat pipe disclosed in the present disclosure. The temperature of the heated end (T H ) and the heat sink end (T L ) of the conventional oscillating heat pipe is finally calculated by the thermal resistance (R th ):
R th =(T H -T L )/Q in R th =( T H - T L )/ Q in
計算在各操作角度下，本揭露之震盪式熱管與傳統震盪式熱管之熱阻與加熱量間之曲線，藉以比較兩者之性能。Calculate the curve between the thermal resistance and the heating amount of the oscillating heat pipe of the present disclosure and the conventional oscillating heat pipe under various operating angles, thereby comparing the performance of the two.
圖6A與6B分別例示傳統震盪式熱管與本揭露一實施例之震盪式熱管之熱阻曲線圖，橫座標為加熱瓦數(W)，縱座標為熱阻(℃/W)。從圖6A可發現，傳統震盪式熱管在水平放置，即操作角度為0度時，不論加熱量大小，其熱阻甚無變化且均在1.5℃/W以上。由此顯示，傳統震盪式熱管在水平放置時，無法發揮其散熱功能。相較地，本揭露之震盪式熱管在水平放置時，其熱阻低於1.5，且隨加熱量之增加，熱阻亦隨著降低。因此，由圖6B顯示可得知，本接露之震盪式熱管即便以水平放置，仍能發揮其應有之散熱功能。6A and 6B respectively illustrate thermal resistance curves of a conventional oscillating heat pipe and an oscillating heat pipe according to an embodiment of the present disclosure. The abscissa is a heating wattage (W) and the ordinate is a thermal resistance (°C/W). It can be seen from Fig. 6A that the conventional oscillating heat pipe is placed horizontally, that is, when the operating angle is 0 degree, the thermal resistance of the oscillating heat pipe is not changed and is above 1.5 ° C / W regardless of the amount of heating. This shows that the traditional oscillating heat pipe can not exert its heat dissipation function when placed horizontally. In contrast, when the oscillating heat pipe of the present disclosure is placed horizontally, its thermal resistance is less than 1.5, and as the amount of heating increases, the thermal resistance also decreases. Therefore, as shown in FIG. 6B, it can be seen that the oscillating heat pipe of the present invention can exert its proper heat dissipation function even if it is placed horizontally.
綜上所述，本揭露之震盪式熱管由於具有非均勻的流道結構，因而可讓其內之工作流體受到不對稱之毛細力及流阻。當震盪式熱管受熱時，工作流體同時受加熱蒸汽的推動及不對稱之毛細力與流阻之影響，而往一方向上流動。因此，本揭露之震盪式熱管之非均勻的流道結構可促進流道系統內之工作流體之初始啟動運作，而使其可水平放置操作。In summary, the oscillating heat pipe of the present disclosure has a non-uniform flow path structure, so that the working fluid therein can be subjected to asymmetric capillary forces and flow resistance. When the oscillating heat pipe is heated, the working fluid is simultaneously driven by the heated steam and the asymmetrical capillary force and flow resistance, and flows upward in one direction. Thus, the non-uniform flow path structure of the oscillating heat pipe of the present disclosure facilitates the initial startup operation of the working fluid within the flow channel system, allowing it to be placed horizontally.
本揭露之技術內容及技術特點已揭示如上，然而熟悉本項技術之人士仍可能基於本揭露之教示及揭示而作種種不背離本揭露精神之替換及修飾。因此，本揭露之保護範圍應不限於實施例所揭示者，而應包括各種不背離本揭露之替換及修飾，並為以下之申請專利範圍所涵蓋。The technical content and technical features of the present disclosure have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the present disclosure is not to be construed as being limited by the scope of
1．．．震盪式熱管1. . . Oscillating heat pipe
11．．．基板11. . . Substrate
12．．．流道系統12. . . Runner system
13．．．蓋板13. . . Cover
22．．．流道系統twenty two. . . Runner system
32．．．流道系統32. . . Runner system
42．．．流道系統42. . . Runner system
111．．．表面111. . . surface
112．．．螺孔112. . . Screw hole
121．．．第一流道121. . . First runner
122．．．第二流道122. . . Second flow path
123．．．彎流道123. . . Curved flow path
124．．．連接流道124. . . Connecting the flow channel
131．．．開孔131. . . Opening
132．．．冷卻區132. . . Cooling zone
133．．．注入口133. . . Note entry
134．．．加熱區134. . . Heating zone
221．．．第一流道221. . . First runner
222．．．第二流道222. . . Second flow path
223．．．噴嘴結構223. . . Nozzle structure
321．．．第一流道321. . . First runner
322．．．第二流道322. . . Second flow path
323．．．孔口結構323. . . Orifice structure
421．．．第一流道421. . . First runner
422．．．第二流道422. . . Second flow path
1211．．．左端處1211. . . Left end
1221．．．左端處1221. . . Left end
圖1例示本揭露一實施例之震盪式熱管之示意圖；1 is a schematic view showing an oscillating heat pipe according to an embodiment of the present disclosure;
圖2例示本揭露一實施例之震盪式熱管之流道系統之示意圖；2 is a schematic view showing a flow path system of an oscillating heat pipe according to an embodiment of the present disclosure;
圖3例示本揭露另一實施例之流道系統之示意圖；Figure 3 is a schematic view showing a flow path system of another embodiment of the present disclosure;
圖4例示本揭露又一實施例之流道系統之示意圖；4 is a schematic view showing a flow path system according to still another embodiment of the present disclosure;
圖5例示本揭露再一實施例之流道系統之示意圖；Figure 5 is a schematic view showing a flow path system according to still another embodiment of the present disclosure;
圖6A例示傳統震盪式熱管之熱阻曲線圖；及6A illustrates a thermal resistance curve of a conventional oscillating heat pipe; and
圖6B例示本揭露一實施例之震盪式熱管之熱阻曲線圖。FIG. 6B illustrates a thermal resistance diagram of an oscillating heat pipe according to an embodiment of the present disclosure.
11．．．基板11. . . Substrate
12．．．流道系統12. . . Runner system
111．．．表面111. . . surface
121．．．第一流道121. . . First runner
122．．．第二流道122. . . Second flow path
123．．．彎流道123. . . Curved flow path
124．．．連接流道124. . . Connecting the flow channel
132．．．冷卻區132. . . Cooling zone
133．．．注入口133. . . Note entry
134．．．加熱區134. . . Heating zone
1211．．．左端處1211. . . Left end
1221．．．左端處1221. . . Left end
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98137883A TWI387718B (en) | 2009-11-09 | 2009-11-09 | Pulsating heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98137883A TWI387718B (en) | 2009-11-09 | 2009-11-09 | Pulsating heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201116793A TW201116793A (en) | 2011-05-16 |
| TWI387718B true TWI387718B (en) | 2013-03-01 |
Family
ID=44934962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98137883A TWI387718B (en) | 2009-11-09 | 2009-11-09 | Pulsating heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI387718B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105651089A (en) * | 2016-02-23 | 2016-06-08 | 南昌大学 | Composite pulsating heat pipe |
| TWI685638B (en) * | 2018-09-14 | 2020-02-21 | 財團法人工業技術研究院 | Three dimensional pulsating heat pipe, three dimensional pulsating heat pipe assembly and heat dissipation module |
| US10883768B2 (en) | 2017-10-13 | 2021-01-05 | Cooler Master Co. Ltd. | Pulsating vapor chamber |
| US11320209B2 (en) | 2019-11-04 | 2022-05-03 | Industrial Technology Research Institute | Pulsating heat pipe |
| US11359874B2 (en) | 2020-10-19 | 2022-06-14 | Industrial Technology Research Institute | Three dimensional pulsating heat pipe |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016035436A1 (en) * | 2014-09-04 | 2017-05-25 | 富士通株式会社 | Heat transport device and electronic equipment |
| WO2016060350A1 (en) * | 2014-10-14 | 2016-04-21 | 한국과학기술원 | Flat plate pulsating heat pipe applicable at various angles and method for manufacturing same |
| TWI600873B (en) * | 2016-03-31 | 2017-10-01 | 力致科技股份有限公司 | One-way circulation starting structure for oscillatory heat dissipation device |
| TWI637131B (en) * | 2017-03-16 | 2018-10-01 | 國立交通大學 | A dehumidification apparatus with enhanced dehumidification effect |
-
2009
- 2009-11-09 TW TW98137883A patent/TWI387718B/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105651089A (en) * | 2016-02-23 | 2016-06-08 | 南昌大学 | Composite pulsating heat pipe |
| US10883768B2 (en) | 2017-10-13 | 2021-01-05 | Cooler Master Co. Ltd. | Pulsating vapor chamber |
| US11885571B2 (en) | 2017-10-13 | 2024-01-30 | Cooler Master Co., Ltd. | Pulsating vapor chamber |
| TWI685638B (en) * | 2018-09-14 | 2020-02-21 | 財團法人工業技術研究院 | Three dimensional pulsating heat pipe, three dimensional pulsating heat pipe assembly and heat dissipation module |
| US10782079B2 (en) | 2018-09-14 | 2020-09-22 | Industrial Technology Research Institute | Three-dimensional pulsating heat pipe, three-dimensional pulsating heat pipe assembly and heat dissipation module |
| US11320209B2 (en) | 2019-11-04 | 2022-05-03 | Industrial Technology Research Institute | Pulsating heat pipe |
| US11359874B2 (en) | 2020-10-19 | 2022-06-14 | Industrial Technology Research Institute | Three dimensional pulsating heat pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201116793A (en) | 2011-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI387718B (en) | Pulsating heat pipe | |
| TWI580921B (en) | Pulsating multi-pipe heat pipe | |
| US11686532B2 (en) | Heat dissipation structure | |
| JP6951786B2 (en) | heat sink | |
| TW201510457A (en) | Pulsating multi-pipe heat pipe | |
| TW201915424A (en) | Pulsating vapor chamber | |
| US20080035310A1 (en) | Isothermal Plate Module | |
| CN102062552A (en) | Oscillating heat pipe | |
| US20180283798A1 (en) | Plate pulsating heat spreader with artificial cavities | |
| KR102556693B1 (en) | Laminated Heat Exchanger | |
| CN101566748A (en) | Radiating module and backlight module adopting same | |
| CN107241887A (en) | A kind of micro-channel evaporator with staggeredly sawtooth pattern rib wall | |
| CN107084550A (en) | Semiconductor refrigerating component and ice cream maker | |
| CN206532224U (en) | CPU phase transformations suppress radiator structure and electronic product | |
| TWI704326B (en) | Pulsating heat pipe | |
| TW200926950A (en) | Fin and heat sink | |
| TW202029878A (en) | Thin heat dissipation device and manufacturing method thereof | |
| US20220346269A1 (en) | Water cooling head with sparse and dense fins | |
| TWM628217U (en) | Rapid heat dissipation device | |
| TWI425178B (en) | A Closed Groove Heat Pipe Capillary Structure | |
| TWM628154U (en) | Air-liquid dual cooling radiator for memory modules | |
| TWM594725U (en) | Rapid heat dissipation device of evaporator | |
| TWI549596B (en) | Electrode type liquid cooling device | |
| TWI795198B (en) | Rapid heat dissipation device | |
| TWI723701B (en) | Fast heat dissipation device of evaporator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |