TWM246992U - Heat sink for portable power supply - Google Patents

Description

M246992 V. Creation Description (1) [Technical Field to which the New Type belongs] This creation is related to a heat sink of a portable power supply, especially a portable power supply that provides better heat dissipation. [Prior art]

Under the rapid development of the computer industry, in order to make the internal system devices of the computer obtain the power required for operation, a general computer host needs to be provided with a power supply or an external portable power supply. Its main function is Generally, the AC power is converted into a stable DC power supply required by each component. Usually, when the power supply is converting between AC power and DC power, a heating effect is generated. Therefore, generally, a heat dissipation device is provided in a portable power supply. It can effectively dissipate the heat emitted by it or maintain normal operation in a faster heat dissipation manner. As shown in the first figure, it is a general portable power supply A, which is covered by an upper cover A1 and a lower cover A2. A circuit board A 3 is fixed on the lower cover A2, and a chip A 4 (heat source) is soldered on the circuit board A 3. The chip A 4 is contacted by a heat sink B, which is made of aluminum. The sheet metal body B1 and the copper sheet body B2 are fixed on the circuit board A3 by two angles B3 and are in contact with the wafer A 4 to conduct heat. The aluminum sheet body B 1 can absorb the heat source to the outer copper sheet body B 2 ,Then by The high conductivity of the copper sheet B 2 quickly transfers the heat energy of the wafer A 4 (heat source), and dissipates the heat source.

However, as shown in the second and third figures, the assembly and processing method of the heat dissipation device B is to firstly couple the two corners B 3 to one side of the aluminum sheet B 1 by riveting, and then the copper material The sheet body B2 is locked to the other side of the aluminum sheet body B1 with more than one screw C to form a heat dissipation device B; the processing method is more complicated

Page 4 M246992 V. Creation instructions (2) 'and processing parts (screws) are needed to fix the Lü Cai sheet B 1 and the copper sheet B 2 ^ Not only the processing process is complicated and the cost is high, which is not economical . [New content] The main purpose of this creation is to provide a heat dissipation device for a portable power supply. The heat dissipation device is composed of an aluminum sheet and a copper sheet in a riveted manner and fixed on a circuit board. When the aluminum sheet is used in contact with the heat source, the aluminum sheet can absorb the heat source to the outer copper sheet, and then the heat of the heat source can be quickly transferred by the high conductivity of the copper sheet to dissipate the heat source. .

Another object of this creation is that the copper sheet body is inserted and fixed with the circuit board at the angle formed by the body to fix the heat sink on the circuit board. [Implementation] In order to make your reviewing committee clear about the composition and overall operation of this creation, the drawings are described as follows: The cooling device of the portable power supply of this creation, and the overall portable power supply The basic structure, as shown in the first figure, is composed of an upper cover A1 and a lower cover A2, wherein a circuit board A 3 is fixed on the lower cover A2, and a chip A 4 is soldered on the circuit board A 3 (Heat source), and is in contact with the chip A 4 through a heat sink 10.

The focus of this creation is that the heat sink device 10 is a combination of aluminum sheet body 11 and copper sheet body 12 in a riveted manner. The production process is shown in the fourth figure (A) ~ (C) and the fifth As shown in the figure, the aluminum sheet body 1 1 is pushed to the other side at an appropriate position, so that the other side is protruded with a protruding column 1 1 1, and it is arranged on the copper sheet body 12 as predicted on the other side. The holes 1 1 2 are aligned and fitted, and the aluminum sheet 1 1 and the copper

Page 5 M246992 V. Creation instructions (3) After the body 1 2 is attached and fixed, a force is applied from one side of the protruding column 1 1 1 to press the protruding thickness of the protruding column 111 from the hole 1 2 1 toward the hole 12 1, thereby fixing and fixing the aluminum sheet 11 and the copper sheet 12. In addition, two insert angles 13 formed integrally on the copper sheet body 12 are interposed and fixed with the circuit board A 3, as shown in the sixth figure, to fix the heat sink 10 on the circuit board A 3 and use When the aluminum sheet 1 1 is in contact with the wafer A 4 (heat source), the aluminum sheet 11 can absorb the heat source to the outer copper sheet 12 and the high conductivity of the copper sheet 12 The heat of the heat source is quickly transferred, and the heat source is dissipated to achieve the effect of dissipating heat. It can improve the inconvenience of assembly and processing of conventional heat sinks, simplify the processing procedures, and save costs. As mentioned above, the heat dissipation device of the portable power supply of this creation is composed of aluminum sheet and copper sheet in a riveted manner, which can improve the inconvenience of assembly and processing of conventional heat sinks to simplify The processing procedure is indeed in accordance with the conditions for a new patent, and the application for a new patent is submitted according to law; however, the above implementation description and drawings are only one of the preferred embodiments of this creation, and are not intended to limit this creation. That is to say, those who are familiar with this creative technique and similar to the structure, device, features, etc. of the present invention in accordance with the spirit of this creative, should be within the scope of the original purpose of the creation and the scope of patent application.

M246992 Schematic description The first diagram is a schematic diagram of the structure of a general portable power supply. The second figure is a three-dimensional exploded view of the structure of a conventional heat sink_assembly. The third figure is a schematic structural diagram of a general conventional heat sink assembly. The fourth pictures (A) ~ (C) are schematic diagrams of the structure of the heat sink in the creation. The fifth figure is a structural diagram of the heat sink assembly in the creation. The sixth picture is a three-dimensional exploded view of the structure of the heat dissipation device in the creation. ([Description of component representative symbols]

Portable power supply A Upper cover A 1 Lower cover A2 Circuit board A 3 Chip A4

Radiator β, 1 0 Aluminum sheet B 1, 1 1 Copper sheet B 2, 1 2 Bump 1 1 1 Hole 1 1 2 Angle B 3, 1 3 Screw C ·

Page 7

Claims (1)

M246992 6. Application patent scope 1. A type of heat dissipation device for portable power supply, characterized in that the heat dissipation device is combined by aluminum sheet and copper sheet in a riveted manner and fixed on the circuit board When the aluminum sheet is in contact with the heat source, the heat source can be absorbed by the I sheet to the outer copper sheet, and then the heat of the heat source can be quickly transmitted by the high conductivity of the copper sheet, and the heat source can be dissipated. . 2. The heat sink of the portable power supply as described in item 1 of the scope of the patent application, wherein the copper sheet body is inserted and fixed with the circuit board at an angle. 3. The heat dissipation device of the portable power supply as described in item 2 of the scope of patent application, wherein the insert angle is made integrally with the copper sheet body. W iifl 1 p. 8