JP3050357U - CPU heat dissipation device - Google Patents

Abstract

(57) [Problem] To efficiently dissipate heat generated by a CPU within a short time. A cavity (11) is provided in a motherboard (1), and a metal piece (2) having a high thermal conductivity is welded to the cavity (11) to bring the surface of a CPU (6) into contact.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a CPU (Central Processing Unit) having a function of improving the heat radiation efficiency of a CPU.

[0002]

[Prior art]

 In recent years, the spread and progress of notebook computers have been remarkable. Notebook computers are designed to be small and portable. Therefore, the interior space is limited, and each part is designed to be as small and lightweight as possible so as not to occupy the space. A typical example of such a component is a heat radiator of a CPU. The CPU heat dissipation device of a general desktop personal computer has a structure in which a heat dissipation piece is mounted above the CPU and a hot air fan is installed above the heat dissipation piece.

[0003]

[Problems to be solved by the invention]

 As can be seen from the above description, the conventional CPU heat radiating device for a desktop personal computer is not suitable for a notebook personal computer having a limited internal space. Therefore, its structure needs to be improved.

[0004]

[Means for Solving the Problems]

 In order to solve the above problems, the present invention provides a cavity in a motherboard, incorporates a heat conductive metal piece (such as copper) having a high thermal conductivity into the cavity, and closely adheres to a CPU to ensure high heat dissipation efficiency. To avoid damage caused by pressing on

[0005]

[Embodiment of the invention]

 As shown in FIG. 1, the CPU heat radiating device of a notebook personal computer which is usually used includes a normal mother board 1 'and a heat conductive metal piece 2' which covers the upper portion of the CPU 6, and the metal piece 2 'is usually made of aluminum ( Al)), a light metal with a high thermal conductivity is used. Further, a single layer of a soft heat conductive agent 8 is applied to the upper portion of the upper portion, so as to be in contact with the metal piece 51 at the bottom of the keyboard 5. By doing so, the heat radiated by the CPU 6 is transmitted from the layer of the heat conductive agent 8 to the metal piece 51 at the bottom of the keyboard 5 through the heat conductive metal piece 2 'and radiated into the atmosphere by a heat conduction method. You can do it. Alternatively, some computers have ventilation holes in the computer frame to dissipate heat to the atmosphere using heat convection. Due to the nature of the material, its heat transfer efficiency through solids (especially metals) is higher than through air convection. For this reason, the heat dissipation method using the heat conduction of the metal is the main heat generation method of the notebook computer CPU. Aluminum has a thermal conductivity of 120 to 200 W / m · K. On the other hand, when the heat conductivity coefficient of copper is compared at 401 W / m · K, it can be seen that the heat conduction speed of aluminum is considerably low. However, the specific gravity of the heat conductive metal piece 2 'using copper is 8.9 g / cm3, which is three times or more than that of aluminum, 2.8 g / cm3. It is enough to cause damage. For this reason, most notebook computers now use aluminum as the material of the heating device. However, as the operation speed of the CPU increases, the heat dissipation also increases, and the space for the notebook PC itself is limited. There is a need to develop equipment.

As shown in FIG. 2, the heat radiator of the present invention mainly includes a motherboard 1 having a cavity 11 and a metal piece 2 (copper) having a high thermal conductivity. The metal piece 2 has a weld 21. The CPU 6 is mounted on the first surface 12 of the motherboard 1 and is located at a position that blocks the cavity 11. The second surface 13 of the motherboard 1 and the CPU 6 are located at relative positions, and the welded portion 21 of the heat conductive metal piece 2 (copper) is formed on the inner wall of the cavity 11 by Surface Mount Technology (abbreviated as SMT). Is welded on the annular joint surface 121. The shape and thickness of the heat conductive metal piece 2 (copper) matches the cavity 11, so that it is in close contact with the CPU 6. For this reason, the high thermal conductivity of the heat conductive metal piece 2 (copper) is utilized, and the heat radiated by the CPU 6 is quickly conducted, and the heat radiation efficiency of the CPU 6 is enhanced.

As shown in FIG. 3, the heat conductive metal piece 2 (copper) has its welded portion 21 firmly combined with the mother board 1, so that the mother board 1 receives its weight and the heat conductive metal piece 2 (copper) (Copper) does not directly squeeze the CPU 6. Further, since the precision of the SMT is high, the heat conductive metal piece 2 (copper) fits exactly into the cavity 11 and adheres firmly to the first surface 12. For this reason, the heat conductive metal piece 2 (copper) adheres closely to the CPU 6, and the contact surface between the heat conductive metal piece 2 (copper) and the CPU 6 receives a large amount of pressure as in the prior art, so that the electronic components are not damaged. In addition, since machining can be performed directly with an existing SMT automation machine, there is an advantage in that machining steps are not increased, and low cost and simple machining. In addition, the material of the heat conductive metal piece 2 used in the present invention may be silver (Ag) having a higher heat conductive coefficient. Further, the heat conducting metal piece 2 may be combined with another heat generating device (for example, a heat conducting agent or an aluminum heat radiating piece). Utilizing the high thermal conductivity of the heat conducting metal piece 2, heat can be conducted to the heat radiating device within a short time.

[0008]

[Effect of the invention]

 The CPU heat dissipation device described in detail above basically has a high thermal conductivity coefficient on a motherboard provided with a cavity, but has a structure in which somewhat heavy metal pieces (copper, silver, etc.) are firmly fitted. In addition to ensuring heat dissipation efficiency, there is no need to worry about the CPU being damaged due to pressure. In addition, the basic principle of the present invention can be applied to all heat-generating components in a computer in addition to heat radiation of a CPU.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram relating to a heat radiator of a notebook personal computer which is usually used.

FIG. 2 is a three-dimensional exploded view of the present invention.

FIG. 3 is a side sectional view of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 'Motherboard 6 CPU 2' Heat conductive metal piece 8 Heat conductive agent 5 Keyboard 51 Metal piece 11 Cavity 1 Motherboard 2 Heat conductive metal piece (copper) 21 Welded part 12 First surface 13 Second surface 121 Ring joint surface

Claims (3)

[Utility model registration claims] The present invention comprises a mother board provided with a cavity and a heat conducting metal piece having a high thermal conductivity. The metal piece is fitted into the cavity and welded, and then the surface of the CPU is brought into contact with the heat conducting metal piece. A CPU heat dissipation device characterized by the above-mentioned. 2. The CPU heat radiating device according to claim 1, wherein the heat conductive metal piece has a welded portion, which is welded to the motherboard by a surface adhesive processing technique. 3. The CPU heat radiating device according to claim 1, wherein a metal having a high thermal conductivity such as copper or silver is used as the heat conducting metal piece.