M252063 五、創作說明（1) 一、【創作所屬之技術領域】 本案是有關CPU的辅助散熱器，尤指將CPU設置在主 基板上後，於主基板的背部裝置輔助散熱器，用以降低該 部份的溫度者。 二、【先前技術】 電腦的CPU在運作狀態時，是一個發熱體，通常在CPU 的上方設置一散熱器，並在散熱器的上方或側面設置一風 扇，CPU所生的熱經傳導至散熱器後，藉風扇之力，使空 氣流動，並促使散熱器降低溫度，進而降低CPU的溫度。 惟，CPU的發熱亦向下傳導，經由腳座等的傳導，使 主基板（Mother board)維持在某種溫度狀態。該主基板裝 置於機殼上時’通常與機殼間相距gjjjin〜15ιππι ，因空間甚 小，迄今為止，尚未有業者具體的、有效的處理此處的散 熱，因此，在正常狀況下，該部位係處在60 t以上的溫度 〇 機殼通常係由鋁等金屬或合金製成，基本上是熱的良 導體，若能藉以將主基板的熱傳出，則對CPU的壽命等皆 有益處。 一般裝置在CPU上方的散熱器，係裝置一殼架於主基 板上，並將散熱器設置於其上，該殼架以四支腳柱固定於 主基板上。且於CPU與散熱器間夾合一層矽膠，使兩者間 具有良好的導熱效果。M252063 V. Creation instructions (1) 1. [Technical field to which the creation belongs] This case relates to the auxiliary radiator of the CPU, especially after the CPU is set on the main substrate, and an auxiliary radiator is installed on the back of the main substrate to reduce The temperature of the part. 2. [Previous technology] When the computer's CPU is in operation, it is a heating element. A radiator is usually placed above the CPU, and a fan is placed above or on the side of the radiator. The heat generated by the CPU is transmitted to the heat sink. After the device, the air flow is caused by the power of the fan, and the heat sink is reduced to reduce the temperature of the CPU. However, the heat of the CPU is also transmitted downward, and the mother board is maintained at a certain temperature state through the conduction of the feet and the like. When the main substrate is mounted on the casing, the distance between the casing and the casing is usually gjjjin ~ 15ιππι. Due to the small space, there has not been a specific and effective treatment of heat dissipation by the industry so far. Therefore, under normal conditions, the The part is at a temperature of 60 t or more. The casing is usually made of metal or alloy such as aluminum, which is basically a good conductor of heat. If the heat of the main substrate can be transmitted, the life of the CPU will be all. benefit. The heat sink generally mounted above the CPU is a shell of the device mounted on the main base plate, and the heat sink is arranged thereon. The shell frame is fixed on the main base plate with four legs. And a layer of silicon glue is sandwiched between the CPU and the heat sink, so that the two have good thermal conductivity.
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三、【新型内容】 本案係設置一辅助散熱器於CPlJ下方的主基板與機殼 之間，藉熱傳導以降低該溫度。 本案的辅助散熱器具有一導熱板、若干傳熱板，其中 導熱板緊靠於主基板下方。 於主基板與導熱板之間，得以矽膠使導熱板與主基板 靠合的更密切。 導熱板舆傳熱板係由熱的良導體製成，主要目的在將 裳置CPU的主基板下方的溫度傳導至傳熱板，再由傳熱板 傳導至機殼，大面積的機殻極易與其外方的空間中和溫 度，換言之，經由辅助散熱器的導熱至機殼後，亦能有效 的降低有關位置的溫度。 本案輔助散熱係可設置若干不靠掣於主基板的支腳或 類似構造’該些支腳可結合於CPU的主散熱器的殼架的腳 柱下方。 本案的導熱板，傳熱板的材料可選用磷青銅等製造， 惟其不侷限於此特定料。 四、【實施方式】 如第一圖所示，本案的構成主要包括一導熱板1〇、若 干傳熱板20 ’以及若干結合部30。其中導熱板10用以靠合 在主基板40上，傳熱板2〇用以將熱傳導至機殼go，結合部 30則在使散熱器結合在主基板4〇上。3. [New content] This case is to set an auxiliary radiator between the main substrate and the case under CPlJ, and reduce the temperature by heat conduction. The auxiliary radiator of the present case has a heat conducting plate and a plurality of heat conducting plates, wherein the heat conducting plate is close to the main substrate. Between the main substrate and the heat-conducting plate, a silicon glue is used to bring the heat-conducting plate closer to the main substrate. The heat transfer plate and the heat transfer plate are made of good thermal conductors. The main purpose is to transfer the temperature below the main board of the CPU to the heat transfer plate, and then the heat transfer plate to the case. It is easy to neutralize the temperature with the outside space, in other words, it can effectively reduce the temperature of the relevant location after conducting heat to the cabinet through the auxiliary radiator. In this case, the auxiliary heat-dissipating system may be provided with a plurality of feet or similar structures that do not rely on the main substrate. These feet may be combined below the legs of the main frame of the CPU's main heat sink. The material of the heat transfer plate and the heat transfer plate in this case may be made of phosphor bronze, but it is not limited to this specific material. 4. Embodiment As shown in the first figure, the structure of this case mainly includes a heat conducting plate 10, several heat conducting plates 20 ', and a plurality of joints 30. The heat transfer plate 10 is used to abut against the main substrate 40, the heat transfer plate 20 is used to conduct heat to the case go, and the bonding portion 30 is used to couple the heat sink to the main substrate 40.
第5頁 M252063Page 5 M252063
態，其得作若干形狀的變化，亦應屬本案的專利範圍。 導熱板10向外延伸或結合傳熱板20，該傳熱板2〇向外 延伸或結合接觸板21，接觸板21用以靠合於機殼5〇上。 傳熱板20及其接觸板21得設置成一體，其並得作彈片 狀之設計’使本案辅助散熱器可適應於不同間距的主基板 40與機殼50。 另’可設置若干結合部30，使其本體不接觸於主基板 10，並可結合於主基板1〇上，藉以固定本案散熱器。 如第二圖所示，CPU 60的外圍設置框架70以裝置主散 熱器80，框架70通常設置四支固定腳71，結合部3〇得設置 於其上，導熱板1〇緊貼於CPU 60下方的主基板1〇上，傳熱 板20則將導熱板1〇的熱傳導至接觸板2丨並傳至機殼5〇以進 行本案辅助散熱器的主要的散熱功能。 上述之結合部3 0並非必要元件，其亦得以其他形態結 合、裝置或放置於主基板4〇與機殼50之間。 所以，經由本案實施，其可有效地疏導CPlJ 6〇下方的 主基板40的熱，堪稱開拓電滕用輔助散熱器之新領域。 本案所揭示者，乃較佳實施例之一種，舉凡局部之變 更或修飾而源於本案之技術思想而為熟習該項技藝之人所 易於推知者，俱不脫本案之專利權範疇。 綜上所陳，本案無論就目的、手段與功效，在在顯承 其週異於習知之技術特徵，且其首先創作合於實用，亦在 在符合新型之專利要件，懇請貴審查委員明察，並祈早 曰賜予專利’俾嘉惠社會，實感德便。State, which can be changed in several shapes, should also fall within the scope of the patent in this case. The heat-conducting plate 10 extends or combines with a heat-transfer plate 20. The heat-transfer plate 20 extends or combines with a contact plate 21. The contact plate 21 is configured to rest on the casing 50. The heat transfer plate 20 and its contact plate 21 may be provided as a whole, and they may be designed in the shape of a spring sheet ', so that the auxiliary radiator of this case can be adapted to the main substrate 40 and the casing 50 with different pitches. In addition, a plurality of coupling portions 30 may be provided so that the body does not contact the main substrate 10 and may be coupled to the main substrate 10 to fix the heat sink in this case. As shown in the second figure, the frame 70 of the CPU 60 is provided with a main radiator 80. The frame 70 is usually provided with four fixed feet 71, and the joint portion 30 can be set thereon. The heat conducting plate 10 is closely attached to the CPU 60. On the lower main substrate 10, the heat transfer plate 20 conducts the heat of the heat transfer plate 10 to the contact plate 2 and to the case 50 to perform the main heat dissipation function of the auxiliary radiator in this case. The above-mentioned joint portion 30 is not an essential component, and it may also be combined, installed, or placed between the main substrate 40 and the case 50 in other forms. Therefore, through the implementation of this case, it can effectively dissipate the heat of the main substrate 40 below CPlJ 60, and it can be said to open up a new field of auxiliary radiators for electric power. The one disclosed in this case is one of the preferred embodiments, and any change or modification that is partly derived from the technical ideas of this case and easily inferred by those who are familiar with the technology, does not depart from the scope of patent rights in this case. To sum up, regardless of the purpose, method and effect, this case is clearly showing its technical characteristics that are different from the conventional ones, and its first creation is practical and practical, and it is also in line with the new type of patent requirements. And I prayed that the patent was granted to the society in the early days.
M252063 圖式簡單說明 一 ·附圖部份： 第一圖：本案辅助散熱裝置的立體圖例。 第二圖：本案裝置在電滕機體上的狀態示意圖。 二·圖號部份：M252063 Brief description of the drawings I. Part of the drawings: The first figure: a perspective view of the auxiliary heat sink in this case. The second picture: the state of the device on the electric machine. 2. Drawing number part:
第7頁 10… ...導熱板 20… ...傳熱板 21… ...接觸板 30… ...結合部 40… 50… ...機殼 60… …CPU 70… ...框架 71… ...固定腳 80… ..·主散熱器Page 7 10 ... heat transfer plate 20 ... heat transfer plate 21 ... contact plate 30 ... joint 40 ... 50 ... housing 60 ... CPU 70 ... Frame 71 ... ... Fixed feet 80 ..... · Main radiator