CN214335442U - Heat radiation structure of scientific grade CMOS camera - Google Patents
Heat radiation structure of scientific grade CMOS camera Download PDFInfo
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- CN214335442U CN214335442U CN202120443376.5U CN202120443376U CN214335442U CN 214335442 U CN214335442 U CN 214335442U CN 202120443376 U CN202120443376 U CN 202120443376U CN 214335442 U CN214335442 U CN 214335442U
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Abstract
The utility model relates to a science level CMOS camera field especially relates to a science level CMOS camera's heat radiation structure, and it includes mainboard, chip, heat pipe and heat abstractor, the chip sets up in the mainboard below, the mainboard top is provided with heat abstractor, the heat pipe extends to the another side of mainboard from a mainboard side, heat pipe one end sets up between chip and mainboard, and the other end setting is between heat abstractor and mainboard, be provided with the heat dissipation liquid in the heat pipe. Different from the prior distributed heat dissipation, the heat sources such as the mainboard, the chip and the like are used for transmitting heat to the heat dissipation device together and dissipating the heat by the heat conduction pipe; the heat pipe absorbs and releases heat repeatedly by means of the vaporization and liquefaction processes of the heat dissipation liquid in the heat pipe, so that efficient and centralized heat dissipation is realized.
Description
Technical Field
The utility model relates to a science level CMOS camera field especially relates to a science level CMOS camera's heat radiation structure.
Background
The scientific grade CMOS camera is generally used for measuring and judging by converting a digital image pickup object into an image signal, and the captured image is used for replacing human eyes. The precision devices of the scientific grade CMOS camera, such as a mainboard and a chip, can generate a large amount of heat in the working process; there are strict requirements on temperature, both for the operating efficiency of the motherboard and the chip, and also for the quality of the image. Therefore, it is particularly important to realize heat dissipation of the camera by a simple and effective heat dissipation structure.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the heat dissipation structure of the scientific grade CMOS camera can dissipate heat in a centralized mode and guarantee heat dissipation efficiency.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a heat radiation structure of science level CMOS camera, includes mainboard, chip, heat pipe and heat abstractor, the chip sets up in the mainboard below, the mainboard top is provided with heat abstractor, the heat pipe extends to the another side of mainboard from a mainboard side, heat pipe one end sets up between chip and mainboard, and the other end sets up between heat abstractor and mainboard, be provided with the heat dissipation liquid in the heat pipe.
Further, the heat conduction pipe is provided with a plurality of, the heat conduction pipe sets up side by side and covers mainboard both sides face.
The heat dissipation device further comprises a first heat conduction piece and a second heat conduction piece, wherein the first heat conduction piece is arranged between the heat dissipation device and the heat conduction pipe and fixes one side of the heat conduction pipe; the second heat conducting piece is arranged between the chip and the heat conducting pipe and fixes the other side of the heat conducting pipe.
Further, the first heat-conducting member and the second heat-conducting member are aluminum blocks.
Further, the heat dissipation device comprises a fan, and the fan blows air towards a direction away from the main board.
Further, the heat dissipation device further comprises a heat sink, the heat sink is arranged between the fan and the first heat conducting piece, and a plurality of rows of heat dissipation fins are arranged on the heat sink and face the fan.
The beneficial effects of the utility model reside in that: different from the prior distributed heat dissipation, the heat sources such as the mainboard, the chip and the like are used for transmitting heat to the heat dissipation device together and dissipating the heat by the heat conduction pipe; the heat pipe absorbs and releases heat repeatedly by means of the vaporization and liquefaction processes of the heat dissipation liquid in the heat pipe, so that efficient and centralized heat dissipation is realized.
Drawings
Fig. 1 is a front view of a heat dissipation structure of a scientific grade CMOS camera according to an embodiment of the present invention;
fig. 2 is a side view of a heat dissipation structure of a scientific grade CMOS camera according to an embodiment of the present invention.
Description of reference numerals:
1. a main board; 2. a chip; 3. a first heat-conducting member; 4. a second heat-conducting member; 5. a fan; 6. a heat sink; 7. a heat conducting pipe.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 and 2, a heat dissipation structure of a scientific grade CMOS camera includes a main board 1, a chip 2, a heat pipe 7 and a heat dissipation device, wherein the chip 2 is disposed below the main board 1, the heat dissipation device is disposed above the main board 1, the heat pipe 7 extends from one side surface of the main board 1 to the other side surface of the main board 1, one end of the heat pipe 7 is disposed between the chip 2 and the main board 1, the other end of the heat pipe is disposed between the heat dissipation device and the main board 1, and a heat dissipation liquid is disposed in the heat pipe 7.
The utility model discloses a theory of operation does: when the camera works, the mainboard 1 and the chip 2 generate a large amount of heat, the heat conduction pipe 7 surrounds two side surfaces of the mainboard 1 and is in contact with the heat dissipation device at the chip 2, so that the heat generated by the mainboard 1 and the chip 2 is absorbed by the heat dissipation liquid in the heat conduction pipe 7 together, and the heat dissipation liquid is vaporized and moves to the lower part of the heat dissipation device along the heat conduction pipe 7; the heat dissipation device continuously dissipates heat of the heat conduction pipe 7 and the mainboard 1, and vaporized heat dissipation liquid in the heat conduction pipe 7 recovers liquid state after heat dissipation and flows back to the lower side, so that heat absorption and heat dissipation are repeatedly performed.
From the above description, the beneficial effects of the present invention are: different from the prior distributed heat dissipation, the heat sources such as the main board 1 and the chip 2 are collectively transferred to the heat dissipation device for heat dissipation by the heat conduction pipe 7; the heat pipe 7 repeatedly absorbs and releases heat by vaporization and liquefaction of the heat dissipating liquid therein, thereby realizing efficient and concentrated heat dissipation.
Further, a plurality of heat pipes 7 are provided, and the heat pipes 7 are arranged side by side and cover both side surfaces of the main board 1.
As can be seen from the above description, the plurality of heat pipes 7 can increase the heat absorbed at a single time, and the heat absorption efficiency is improved; the heat pipes 7 cover the two sides of the main board 1 side by side to fully absorb heat generated by the main board 1 and the chip 2, and efficient heat dissipation is guaranteed.
Further, the heat radiator comprises a first heat conducting member 3 and a second heat conducting member 4, wherein the first heat conducting member 3 is arranged between the heat radiator and the heat conducting pipe 7 and fixes one side of the heat conducting pipe 7; the second heat conduction member 4 is disposed between the chip 2 and the heat conduction pipe 7 and fixes the other side of the heat conduction pipe 7.
As can be seen from the above description, the first heat conducting member 3 and the second heat conducting member 4 are provided to fix the heat conducting pipe 7 and simultaneously play a role of assisting heat conduction in the area not covered by the heat conducting pipe 7, thereby improving the heat dissipation efficiency.
Further, the first heat-conducting member 3 and the second heat-conducting member 4 are aluminum blocks.
As can be seen from the above description, the aluminum block is used as the heat conducting member, which is excellent in heat dissipation and heat conduction; while the quality and cost of the camera can be reduced.
Further, the heat dissipation device comprises a fan 5, and the fan 5 blows air in a direction away from the main board 1.
Further, the heat dissipation device further comprises a heat sink 6, the heat sink 6 is disposed between the fan 5 and the first heat conducting member 3, and the heat sink 6 is provided with a plurality of rows of heat dissipation fins facing the fan 5.
As can be seen from the above description, the heat sink 6 is in contact with the first heat conducting member 3, the heat dissipating fins of the heat sink 6 face the fan 5, the heat exchange area of the side is enlarged, and the fan 5 draws air and blows air to the outside to take away heat.
Referring to fig. 1 and 2, a first embodiment of the present invention is:
the heat dissipation structure of the scientific grade CMOS camera comprises a main board 1, a chip 2, a heat pipe 7 and a heat dissipation device, wherein the chip 2 is arranged below the main board 1, the heat dissipation device is arranged above the main board 1, and the main board 1 involved in the heat dissipation structure comprises a camera main board and the like and is a heat source located in the middle of the camera. Heat pipe 7 extends to the another side of mainboard 1 from a mainboard 1 side, heat pipe 7 one end sets up between chip 2 and mainboard 1, and the other end sets up between heat abstractor and mainboard 1, heat pipe 7 adopts is the copper pipe, be provided with the heat dissipation liquid in the heat pipe 7.
The heat conduction pipes 7 are provided in plurality, and the heat conduction pipes 7 are arranged side by side and cover two side faces of the main board 1.
The heat radiator also comprises a first heat conducting piece 3 and a second heat conducting piece 4, wherein the first heat conducting piece 3 is arranged between the heat radiator and the heat conducting pipe 7 and is used for fixing one side of the heat conducting pipe 7; the second heat conduction member 4 is disposed between the chip 2 and the heat conduction pipe 7 and fixes the other side of the heat conduction pipe 7. Specifically, the first heat conduction member 3 and the second heat conduction member 4 are respectively provided with a fixing plate protruding toward the motherboard 1, and the heat conduction pipe 7 passes through between the fixing plate and the adjacent first heat conduction member 3 or second heat conduction member 4 and is fixed by the fixing plate in a pressing manner. The first and second heat-conducting members 3 and 4 are locked to the camera housing by a screw connection.
The first and second heat-conducting members 3 and 4 are aluminum blocks.
The heat dissipation device comprises a fan 5, and the fan 5 blows air in a direction away from the main board 1.
The heat dissipation device further comprises a heat sink 6, wherein the heat sink 6 is arranged between the fan 5 and the first heat conducting member 3, and a plurality of rows of heat dissipation fins are arranged on the heat sink 6 and face the fan 5.
To sum up, the utility model provides a heat dissipation structure of scientific grade CMOS camera, different from the previous distributed heat dissipation, the heat sources such as mainboard and chip are concentrated together by the heat pipe and transmit the heat to the heat dissipation device for heat dissipation; the heat pipe repeatedly absorbs and releases heat by virtue of the vaporization and liquefaction processes of the heat dissipation liquid in the heat pipe, so that efficient and centralized heat dissipation is realized; a plurality of rows of heat conduction pipes covering the mainboard are arranged and used for improving the single heat dissipation capacity and enlarging the heat dissipation area; the first heat conducting piece and the second heat conducting piece are arranged, so that the heat conducting pipe is fixed and the auxiliary heat conducting effect is achieved; the first heat conducting piece and the second heat conducting piece which adopt the aluminum blocks not only have good heat dissipation and heat conduction effects, but also can effectively reduce the cost and the quality; set up fan and radiator, dispel the heat for heat pipe and mainboard effectively, guarantee the continuation work of the interior heat dissipation liquid of heat pipe.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (6)
1. The utility model provides a heat radiation structure of science level CMOS camera, its characterized in that, includes mainboard, chip, heat pipe and heat abstractor, the chip sets up in the mainboard below, the mainboard top is provided with heat abstractor, the heat pipe extends to the another side of mainboard from a mainboard side, heat pipe one end sets up between chip and mainboard, and the other end setting is between heat abstractor and mainboard, be provided with the heat dissipation liquid in the heat pipe.
2. The thermal dissipation structure of scientific grade CMOS camera of claim 1, wherein said heat conducting pipes are arranged in plurality, said heat conducting pipes are arranged side by side and cover both sides of the main board.
3. The thermal dissipation structure of a scientific grade CMOS camera according to claim 1, further comprising a first thermal conduction member and a second thermal conduction member, the first thermal conduction member being disposed between the heat sink and the heat pipe and fixing one side of the heat pipe; the second heat conducting piece is arranged between the chip and the heat conducting pipe and fixes the other side of the heat conducting pipe.
4. The thermal dissipation structure of a scientific grade CMOS camera of claim 3, wherein the first and second thermal conductive members are aluminum blocks.
5. The thermal dissipation structure of a scientific grade CMOS camera of claim 1, wherein the thermal dissipation means comprises a fan that blows air away from the motherboard.
6. The thermal dissipation structure of a scientific grade CMOS camera of claim 5, wherein the thermal dissipation device further comprises a heat sink disposed between the fan and the first heat conductive member, the heat sink having a plurality of rows of heat fins disposed thereon toward the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120443376.5U CN214335442U (en) | 2021-03-01 | 2021-03-01 | Heat radiation structure of scientific grade CMOS camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120443376.5U CN214335442U (en) | 2021-03-01 | 2021-03-01 | Heat radiation structure of scientific grade CMOS camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214335442U true CN214335442U (en) | 2021-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120443376.5U Active CN214335442U (en) | 2021-03-01 | 2021-03-01 | Heat radiation structure of scientific grade CMOS camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214335442U (en) |
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2021
- 2021-03-01 CN CN202120443376.5U patent/CN214335442U/en active Active
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