TWI561967B - Heat-dissipation valve device and electronic device - Google Patents

Heat-dissipation valve device and electronic device

Info

Publication number
TWI561967B
TWI561967B TW104142371A TW104142371A TWI561967B TW I561967 B TWI561967 B TW I561967B TW 104142371 A TW104142371 A TW 104142371A TW 104142371 A TW104142371 A TW 104142371A TW I561967 B TWI561967 B TW I561967B
Authority
TW
Taiwan
Prior art keywords
heat
electronic device
dissipation valve
valve device
dissipation
Prior art date
Application number
TW104142371A
Other languages
Chinese (zh)
Other versions
TW201723731A (en
Inventor
Tsung-Hsiang Wang
Ren-Ci Guo
Ming-Yang Hsiao
Chia-Liang Chiang
Original Assignee
Pegatron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pegatron Corp filed Critical Pegatron Corp
Priority to TW104142371A priority Critical patent/TWI561967B/en
Application granted granted Critical
Publication of TWI561967B publication Critical patent/TWI561967B/en
Publication of TW201723731A publication Critical patent/TW201723731A/en

Links

TW104142371A 2015-12-16 2015-12-16 Heat-dissipation valve device and electronic device TWI561967B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104142371A TWI561967B (en) 2015-12-16 2015-12-16 Heat-dissipation valve device and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104142371A TWI561967B (en) 2015-12-16 2015-12-16 Heat-dissipation valve device and electronic device

Publications (2)

Publication Number Publication Date
TWI561967B true TWI561967B (en) 2016-12-11
TW201723731A TW201723731A (en) 2017-07-01

Family

ID=58227303

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142371A TWI561967B (en) 2015-12-16 2015-12-16 Heat-dissipation valve device and electronic device

Country Status (1)

Country Link
TW (1) TWI561967B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111465252A (en) * 2019-01-18 2020-07-28 名硕电脑(苏州)有限公司 Heat sink device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200904315A (en) * 2007-07-13 2009-01-16 Inventec Corp Heat-dissipating module and electronic apparatus
TW200911099A (en) * 2007-08-28 2009-03-01 Inventec Corp Heat dissipation module
TW201022894A (en) * 2008-12-05 2010-06-16 Hon Hai Prec Ind Co Ltd Electronic device
TW201039105A (en) * 2009-04-24 2010-11-01 Foxconn Tech Co Ltd Extendable heat dissipation device and fixing equipment thereof and portable electronic device using same
TWM435812U (en) * 2012-04-03 2012-08-11 Acer Inc Electronic device
TWM489462U (en) * 2014-03-28 2014-11-01 Lite-On Electronics (Guangzhou) Ltd Fan fixing structure, heat dissipation module having the fan fixing structure and electronic device having the heat dissipation module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200904315A (en) * 2007-07-13 2009-01-16 Inventec Corp Heat-dissipating module and electronic apparatus
TW200911099A (en) * 2007-08-28 2009-03-01 Inventec Corp Heat dissipation module
TW201022894A (en) * 2008-12-05 2010-06-16 Hon Hai Prec Ind Co Ltd Electronic device
TW201039105A (en) * 2009-04-24 2010-11-01 Foxconn Tech Co Ltd Extendable heat dissipation device and fixing equipment thereof and portable electronic device using same
TWM435812U (en) * 2012-04-03 2012-08-11 Acer Inc Electronic device
TWM489462U (en) * 2014-03-28 2014-11-01 Lite-On Electronics (Guangzhou) Ltd Fan fixing structure, heat dissipation module having the fan fixing structure and electronic device having the heat dissipation module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111465252A (en) * 2019-01-18 2020-07-28 名硕电脑(苏州)有限公司 Heat sink device

Also Published As

Publication number Publication date
TW201723731A (en) 2017-07-01

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