CN213069729U - Heat radiator for host computer machine case based on semiconductor refrigeration - Google Patents
Heat radiator for host computer machine case based on semiconductor refrigeration Download PDFInfo
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- CN213069729U CN213069729U CN202022172890.8U CN202022172890U CN213069729U CN 213069729 U CN213069729 U CN 213069729U CN 202022172890 U CN202022172890 U CN 202022172890U CN 213069729 U CN213069729 U CN 213069729U
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Abstract
The utility model discloses a heat abstractor is used to host computer machine case based on semiconductor refrigeration, it is including first water-cooling board and the cold head that forms a circulation water route system, be provided with a semiconductor refrigeration piece among the circulation water route system, the refrigeration side laminating of semiconductor refrigeration piece is right circulation water route system sets up and cools down to it, the side of generating heat of semiconductor refrigeration piece is provided with a cooling pipeline. The utility model discloses utilize semiconductor refrigeration to be applied to on the water-cooling board, integrated in computer machine incasement, improved the radiating efficiency of host computer machine incasement portion and effect greatly, improved host computer life.
Description
[ technical field ] A method for producing a semiconductor device
The utility model belongs to the technical field of quick-witted incasement portion cools off, especially relate to a heat abstractor for host computer machine case based on semiconductor refrigeration.
[ background of the invention ]
With the change of computer technology, personal computers are becoming more and more indispensable tools for people's life, work and study, and various industrial computers are also very common in the industrial field. The computer can be roughly divided into a notebook computer and a desktop computer, and the desktop computer has the advantages of high cost performance, good heat dissipation performance, firmness, durability, strong expandability and the like, so that the computer still occupies a place in the field of computers.
The internal parts of the computer host are more, and the heat productivity is larger, therefore, a heat dissipation cooling device is required to be arranged in the host box body. In the prior art, most of computer host boxes adopt fans for heat dissipation, but the heat dissipation effect is poor, the heat dissipation efficiency is low, and the service life of the computer host is influenced.
Therefore, there is a need to provide a new heat dissipation device for a host chassis based on semiconductor cooling to solve the above problems.
[ Utility model ] content
The utility model discloses a main aim at provides a heat abstractor for host computer machine case based on semiconductor refrigeration utilizes semiconductor refrigeration to be applied to the water-cooling board on, integrated in computer machine incasement, has improved the radiating efficiency of host computer machine incasement portion and effect greatly, has improved host computer life.
The utility model discloses a following technical scheme realizes above-mentioned purpose: the utility model provides a heat abstractor for host computer machine case based on semiconductor refrigeration, its is including first water-cooling board and the cold head that forms a circulation water route system, be provided with a semiconductor refrigeration piece among the circulation water route system, the laminating of the refrigeration side of semiconductor refrigeration piece is right circulation water route system sets up and cools down to it, the side of generating heat of semiconductor refrigeration piece is provided with a cooling pipeline.
Furthermore, the circulating water path system comprises a first connecting pipe and a second connecting pipe, wherein the first connecting pipe is connected with the output end of the first water cooling plate and the input end of the cold head, and the second connecting pipe is connected with the output end of the cold head and the input end of the first water cooling plate.
Furthermore, the refrigeration side of the semiconductor refrigeration piece is attached to the first connecting pipe or the second connecting pipe.
Furthermore, the refrigeration side of the semiconductor refrigeration piece is attached to the first water cooling plate.
Furthermore, the refrigeration side of the semiconductor refrigeration piece is attached to the cold head.
Further, the cooling pipeline is
One end of the pipeline is communicated with the output end of the cold head, and the other end of the pipeline is communicated with the input end of the first water cooling plate;
or the second connecting pipe.
Furthermore, the first water-cooling plate is arranged in the case or outside the case, and the cold head is arranged on the surface of the heating element which needs to be cooled and radiated.
Furthermore, the cooling device also comprises a second water cooling plate, wherein one end of the cooling pipeline is connected with the input end of the second water cooling plate, and the other end of the cooling pipeline is connected with the output end of the second water cooling plate.
Furthermore, the second water-cooling plate is arranged in the case or outside the case, and the second water-cooling plate cools and dissipates heat of the case through a heat dissipation fan.
Furthermore, the first water-cooling plate cools and dissipates heat of the first water-cooling plate through a heat dissipation fan.
Compared with the prior art, the utility model relates to a host computer is heat abstractor for machine case based on semiconductor refrigeration's beneficial effect lies in: semiconductor refrigeration is applied to the water cooling plate and integrated in a heat dissipation system of the computer host case, so that the efficiency and the effect of heat dissipation inside the host case are greatly improved, and the service life of the host is prolonged; and the heating side of the semiconductor refrigerating sheet is provided with a cooling pipeline, and the heating surface of the semiconductor refrigerating sheet is further cooled by the cooling pipeline, so that the refrigerating effect is better.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of the present invention;
the figures in the drawings represent:
100 a heat radiator for a host case based on semiconductor refrigeration;
1 a first water-cooling plate; 2, cooling the head; 3 a first connecting pipe; 4 a second connecting pipe; 5, semiconductor refrigerating sheets; 6, cooling the pipeline; 7 a second water-cooling plate; 8 connecting pieces.
[ detailed description ] embodiments
The first embodiment is as follows:
referring to fig. 1, the heat dissipation device 100 for a host chassis based on semiconductor refrigeration of the present embodiment includes a first water-cooling plate 1, a cold head 2, a first connection pipe 3 connecting an output end of the first water-cooling plate 1 and an input end of the cold head 2, a second connection pipe 4 connecting an output end of the cold head 2 and an input end of the first water-cooling plate 1, and a semiconductor refrigeration sheet 5 disposed on the first connection pipe 3, wherein the first connection pipe 3 penetrates through a refrigeration side of the semiconductor refrigeration sheet 5, and a cooling pipeline 6 is disposed on a heating side of the semiconductor refrigeration sheet 5.
In this embodiment, the output of cold head 2 is connected to the one end of cooling tube 6, and the input of first water-cooling board 1 is connected to the other end of cooling tube 6.
After the semiconductor refrigerating sheet 5 is refrigerated for a long time, the temperature of the heating surface of the semiconductor refrigerating sheet can rise, so that the heating surface can be cooled through the arrangement of the cooling pipeline 6, and the normal refrigeration of the semiconductor refrigerating sheet 5 is guaranteed.
The first water cooling plate 1 is arranged in the case, and the cold head 2 is arranged on the surface of a heating element needing cooling and heat dissipation, so that the heating element is cooled.
The coolant liquid gets into in first connecting pipe 3 from the output of first water-cooling board 1, the refrigeration face through semiconductor refrigeration piece 5 carries out further cooling, coolant liquid temperature has been lower, then 2 parts of cold head that need the refrigerated are entered into, the coolant liquid is exported from 2 output ends of cold head again, coolant liquid temperature rises to some extent, then divide into two the tunnel and get into respectively in second connecting pipe 4 and cooling tube 6, one way is through second connecting pipe 4 direct reflux in first water-cooling board 1, another way is cooled down to the face that generates heat of semiconductor refrigeration piece 5 through cooling tube 6.
The periphery of the bottom of the cold head 2 is provided with a plurality of connecting sheets 8, which are convenient to install on the surface of the heating element.
Example two:
referring to fig. 2, the heat dissipation device 100 for a host chassis based on semiconductor refrigeration of the present embodiment includes a first water-cooling plate 1, a cold head 2, a first connection pipe 3 connecting an output end of the first water-cooling plate 1 and an input end of the cold head 2, a second connection pipe 4 connecting an output end of the cold head 2 and an input end of the first water-cooling plate 1, and a semiconductor refrigeration sheet 5 disposed on the first connection pipe 3, wherein the first connection pipe 3 penetrates through a refrigeration side of the semiconductor refrigeration sheet 5, and a cooling pipeline 6 is disposed on a heating side of the semiconductor refrigeration sheet 5.
The implementation further comprises a second water cooling plate 7, wherein one end of the cooling pipeline 6 is connected with the input end of the second water cooling plate 7, and the other end of the cooling pipeline is connected with the output end of the second water cooling plate 7.
First water-cooling board 1 and second water-cooling board 7 set up at quick-witted incasement, and cold head 2 sets up on the radiating heating element surface of needs cooling, cools off heating element cooling.
The first water cooling plate 1 is specially used for cooling the cold head 2, cooling liquid radiated from the first water cooling plate 1 passes through the refrigerating surface of the semiconductor refrigerating sheet 5, the temperature of the cooling liquid is lower, the cooling liquid enters the cold head 2 to be cooled, the cooling liquid exits the cold head 2, the temperature is raised, and the cooling liquid circulates to the first water cooling plate 1 for radiating; the second water-cooling plate 7 is dedicated to cooling the heating surface of the semiconductor refrigeration piece 5, the back of the semiconductor refrigeration piece 5 can generate heat in refrigeration, and the semiconductor refrigeration piece 5 can be rapidly cooled through the second water-cooling plate 7, so that the cooling liquid can be better cooled.
In the heat dissipation system inside the computer host case, the first water-cooling plate 1 and the second water-cooling plate 7 are both cooled and dissipated heat further by a heat dissipation fan.
In other embodiments, the refrigeration side of the semiconductor refrigeration piece 5 can be further attached to the first water cooling plate 1 or attached to the surface of the cold head 2, as long as the refrigeration side of the semiconductor refrigeration piece 5 is attached to the circulation waterway system formed by the first water cooling plate 1 and the cold head 2, and the cooling efficiency of the circulation waterway system is improved by the rapid and efficient refrigeration of the semiconductor refrigeration piece 5.
What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.
Claims (10)
1. The utility model provides a heat abstractor for host computer machine case based on semiconductor refrigeration which characterized in that: the semiconductor refrigeration device comprises a first water cooling plate and a cold head which form a circulation water path system, wherein a semiconductor refrigeration piece is arranged in the circulation water path system, the refrigeration side of the semiconductor refrigeration piece is attached to the circulation water path system and cools the circulation water path system, and a cooling pipeline is arranged on the heating side of the semiconductor refrigeration piece.
2. The heat sink for a semiconductor-refrigeration-based host computer case of claim 1, wherein: the circulating water path system comprises a first connecting pipe and a second connecting pipe, wherein the first connecting pipe is connected with the output end of the first water cooling plate and the input end of the cold head, and the second connecting pipe is connected with the output end of the cold head and the input end of the first water cooling plate.
3. The heat sink for a semiconductor-refrigeration-based host computer case of claim 2, wherein: the refrigerating side of the semiconductor refrigerating piece is attached to the first connecting pipe or the second connecting pipe.
4. The heat sink for a semiconductor-refrigeration-based host computer case of claim 1, wherein: the refrigerating side of the semiconductor refrigerating piece is attached to the first water cooling plate.
5. The heat sink for a semiconductor-refrigeration-based host computer case of claim 1, wherein: the refrigerating side of the semiconductor refrigerating sheet is attached to the cold head.
6. The heat sink for a semiconductor-refrigeration-based host computer case of claim 2, wherein: the cooling pipeline is
One end of the pipeline is communicated with the output end of the cold head, and the other end of the pipeline is communicated with the input end of the first water cooling plate;
or the second connecting pipe.
7. The heat sink for a semiconductor-refrigeration-based host computer case of claim 1, wherein: the first water cooling plate is arranged in the case or outside the case, and the cold head is arranged on the surface of the heating element needing cooling and heat dissipation.
8. The heat sink for a semiconductor-refrigeration-based host computer case of claim 1, wherein: the water cooling device is characterized by further comprising a second water cooling plate, wherein one end of the cooling pipeline is connected with the input end of the second water cooling plate, and the other end of the cooling pipeline is connected with the output end of the second water cooling plate.
9. The heat sink for a semiconductor-refrigeration-based host computer case of claim 8, wherein: the second water-cooling plate is arranged in the case or outside the case, and is cooled and radiated by a radiating fan.
10. The heat sink for a semiconductor-refrigeration-based host computer case of claim 1, wherein: the first water-cooling plate cools and dissipates heat of the first water-cooling plate through a heat dissipation fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022172890.8U CN213069729U (en) | 2020-09-28 | 2020-09-28 | Heat radiator for host computer machine case based on semiconductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022172890.8U CN213069729U (en) | 2020-09-28 | 2020-09-28 | Heat radiator for host computer machine case based on semiconductor refrigeration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213069729U true CN213069729U (en) | 2021-04-27 |
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ID=75560851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022172890.8U Active CN213069729U (en) | 2020-09-28 | 2020-09-28 | Heat radiator for host computer machine case based on semiconductor refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213069729U (en) |
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2020
- 2020-09-28 CN CN202022172890.8U patent/CN213069729U/en active Active
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