CN217181512U

CN217181512U - Heat dissipation module capable of conducting heat quickly

Info

Publication number: CN217181512U
Application number: CN202220761058.8U
Authority: CN
Inventors: 张文鲁; 徐应鹏
Original assignee: Sichuan Lihong Electronic Technology Co ltd
Current assignee: Sichuan Lihong Electronic Technology Co ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-08-12
Anticipated expiration: 2032-04-02

Abstract

The utility model relates to a quick heat conduction's heat dissipation module, including the mainboard body, the positive fixedly connected with conduction piece of mainboard body, the outside fixedly connected with fixed block of mainboard body, the positive fixedly connected with heat dissipation mechanism of mainboard body, the lower fixed surface of mainboard body is connected with heat conduction mechanism, heat dissipation mechanism includes the positive conducting strip of fixed connection at the mainboard body, the positive fixedly connected with apron of conducting strip, the back fixedly connected with frame of apron, the outside fixedly connected with locating piece of frame, the air outlet has been seted up to the upper surface of frame, the inside fixedly connected with grid of air outlet. This quick heat conduction's thermal module, through with conducting strip and mainboard body contact, absorb the heat that the mainboard body produced through a plurality of conducting strips, the heat emission through fan with a plurality of conducting strips absorption to reach radiating effect.

Description

Heat dissipation module capable of conducting heat quickly

Technical Field

The utility model relates to a quick heat conduction and heat dissipation technical field specifically are a quick heat conduction's heat dissipation module.

Background

With the development of the electronic industry technology, the transistor density of various chips is increasing day by day, although the data processing speed is faster and faster, the consumed power and the generated heat are higher and higher, in order to ensure the stable operation of the central processing unit, the high-efficiency heat sink is the inevitable requirement at present, especially in the notebook computer, the heat dissipation is usually performed by adopting aluminum fins at present, and the traditional aluminum fins are complex to process, time-consuming, labor-consuming and high in processing cost.

Various quick heat conduction heat dissipation modules exist in the current market, but the defects of poor heat dissipation effect generally exist, the existing heat dissipation assembly is composed of a plurality of heat dissipation fins, the heat dissipation fins of one specification are fastened together in a longitudinal stacking mode generally, one side of a fastening surface is provided with a plurality of fastening points protruding out of the fastening surface, the front end of the heat dissipation fin set is flat after installation, the tail end fastening points protrude, the appearance is influenced on the one hand, and on the other hand, an installer can be scratched or internal parts of a computer can be damaged.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a quick heat conduction's heat dissipation module possesses advantages such as the radiating effect is good, has solved the front end and has leveled and the convex problem of tail end lock point.

In order to achieve the above object, the utility model provides a following technical scheme: a quick heat-conducting heat dissipation module comprises a main board body, wherein a conducting piece is fixedly connected to the front surface of the main board body, a fixed block is fixedly connected to the outer side of the main board body, a heat dissipation mechanism is fixedly connected to the front surface of the main board body, and a heat conduction mechanism is fixedly connected to the lower surface of the main board body;

the heat dissipation mechanism comprises a heat conducting fin fixedly connected to the front face of the main board body, a cover plate is fixedly connected to the front face of the heat conducting fin, a frame is fixedly connected to the back face of the cover plate, a positioning block is fixedly connected to the outer side of the frame, an air outlet is formed in the upper surface of the frame, and a grid is fixedly connected to the inner portion of the air outlet.

Further, the heat dissipation mechanism further comprises a bottom plate fixedly connected to the outer side of the main plate body, and the back of the frame is fixedly connected with the bottom plate.

Further, an air inlet is formed in the lower surface of the frame, and a fan is fixedly connected inside the air inlet.

Furthermore, the number of the heat conducting fins is not less than two, and the heat conducting fins are vertically distributed on the front face of the main board body.

Further, the heat conduction mechanism comprises a transverse heat conduction block fixedly connected to the lower surface of the mainboard body, one side of the transverse heat conduction block, away from the mainboard body, is fixedly connected with the vertical heat conduction block, the front of the vertical heat conduction block is fixedly connected with a brass sheet, the front of the brass sheet is fixedly connected with a transverse plate, the back of the vertical heat conduction block is fixedly connected with a heat dissipation base, and the outer side of the heat dissipation base is fixedly connected with a support.

Further, the transverse heat conducting blocks are fixedly connected inside the frame, and the lower surfaces of the heat conducting fins are fixedly connected with the transverse heat conducting blocks.

Further, the transverse heat conducting blocks and the vertical heat conducting blocks are all brass blocks, and the grating is a stainless steel metal net.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this quick heat conduction's thermal module, through with conducting strip and mainboard body contact, absorb the heat that the mainboard body produced through a plurality of conducting strips, the heat emission through fan with a plurality of conducting strips absorption to reach radiating effect.

2. This quick heat conduction's thermal module, for promoting the radiating effect of module, this device has added a quick heat conduction's device, through the cooperation of horizontal heat-conducting plate and vertical heat-conducting plate to come out the heat conduction, accelerated radiating speed.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the heat dissipation mechanism of the present invention;

fig. 3 is a schematic view of the heat conducting mechanism of the present invention.

In the figure: 1 mainboard body, 2 conduction pieces, 3 fixed blocks, 4 heat dissipation mechanisms, 401 heat conduction pieces, 402 cover plates, 403 frames, 404 positioning blocks, 405 air outlets, 406 grids, 407 air inlets, 408 fans, 409 bottom plates, 5 heat conduction mechanisms, 501 transverse heat conduction blocks, 502 vertical heat conduction blocks, 503 brass sheets, 504 transverse plates, 505 heat dissipation bases and 506 supports.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the heat dissipation module with fast heat conduction in this embodiment includes a main board body 1, a conductive sheet 2 fixedly connected to the front of the main board body 1, a fixed block 3 fixedly connected to the outer side of the main board body 1, a heat dissipation mechanism 4 fixedly connected to the front of the main board body 1, and a heat conduction mechanism 5 fixedly connected to the lower surface of the main board body 1.

Referring to fig. 2, in order to perform a heat dissipation function, the heat dissipation mechanism 4 in this embodiment includes a heat conductive sheet 401 fixedly connected to the front surface of the main board body 1, a cover plate 402 is fixedly connected to the front surface of the heat conductive sheet 401, the cover plate 402 performs a sealing function, a frame 403 is fixedly connected to the back surface of the cover plate 402, a positioning block 404 is fixedly connected to the outer side of the frame 403, the frame 403 is fixed by the positioning block 404, an air outlet 405 is formed in the upper surface of the frame 403, the air outlet 405 discharges heat, a grille 406 is fixedly connected to the inside of the air outlet 405, the grille 406 is a stainless steel metal mesh, and the grille 406 prevents entry of impurities.

The heat dissipation mechanism 4 further comprises a bottom plate 409 fixedly connected to the outer side of the main board body 1, the back of the frame 403 is fixedly connected with the bottom plate 409, the lower surface of the frame 403 is provided with an air inlet 407, the inside of the air inlet 407 is fixedly connected with a fan 408, the fan 408 is electrically connected, the number of the heat-conducting fins 401 is not less than two, and the heat-conducting fins are vertically distributed on the front of the main board body 1.

Referring to fig. 3, in order to conduct heat, the heat conducting mechanism 5 in this embodiment includes a transverse heat conducting block 501 fixedly connected to the lower surface of the main board body 1, a vertical heat conducting block 502 is fixedly connected to a side of the transverse heat conducting block 501 away from the main board body 1, a brass sheet 503 is fixedly connected to a front surface of the vertical heat conducting block 502, the brass sheet 503 has good heat conductivity, a transverse plate 504 is fixedly connected to the front surface of the brass sheet 503, a heat dissipating base 505 is fixedly connected to a back surface of the vertical heat conducting block 502, a support 506 is fixedly connected to an outer side of the heat dissipating base 505, and the support 506 is used for fixing the heat dissipating base 505.

The transverse heat-conducting blocks 501 are fixedly connected inside the frame 403, the transverse heat-conducting blocks 501 are fixedly connected to the lower surface of the heat-conducting fin 401, and the transverse heat-conducting blocks 501 and the vertical heat-conducting blocks 502 are all brass blocks.

Therefore, the heat conducting mechanism 5 mainly functions to transfer heat generated by the heat main board body 1 to the brass sheet 503 through conduction of the transverse heat conducting blocks 501 and the vertical heat conducting blocks 502, and then to the heat dissipation base 505 through the brass sheet 503.

The working principle of the above embodiment is as follows:

(1) when the heat is dissipated from the main board body 1, the heat-conducting fins 401 are firstly contacted with the heat-conducting fins 2 on the main board body 1, the heat generated by the main board body 1 is transferred to the heat-conducting fins 401 through the heat-conducting fins 2, the whole main board body 1 is covered by the frame 403, the heat-conducting fins 401 are distributed on the main board body 1, the frame 403 is fixed by the positioning block 404, the bonding state of the heat-conducting fins 401 and the heat-conducting fins 2 is ensured in the working process, after the heat on the heat-conducting fins 2 is transferred to the heat-conducting fins 401, the fan 408 is turned on, the fan 408 blows the generated cold air into the frame 403 through the air inlet 407, the heat on the main board body 1 and the heat-conducting fins 401 is discharged from the air outlet 405, the grille 406 in the air outlet 405 can effectively prevent the entering of impurities, and prevent the main board body 1 from being damaged or affecting the operation of the fan 408.

(2) Heat dissipation mechanism 4 mainly plays radiating function through the effect of fan 408, heat conduction mechanism 5 is through adsorbing the inside of horizontal heat conduction piece 501 with the heat above the mainboard body 1, the inside of the vertical heat conduction piece 502 of heat transfer again, on transferring the heat to brass piece 503 through vertical heat conduction piece 502, should have good heat transfer effect for the brass, and it is very fast at the radiating effect, fix brass piece 503 on heat dissipation base 505 through with diaphragm 504, heat dissipation base 505 contacts with the external world, give off the heat to the external world through heat dissipation base 505 at last, the combination of two kinds of radiating modes, the radiating effect is better.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a quick heat conduction's heat dissipation module, includes mainboard body (1), its characterized in that: the front surface of the main board body (1) is fixedly connected with a conducting piece (2), the outer side of the main board body (1) is fixedly connected with a fixed block (3), the front surface of the main board body (1) is fixedly connected with a heat dissipation mechanism (4), and the lower surface of the main board body (1) is fixedly connected with a heat conduction mechanism (5);

the heat dissipation mechanism (4) comprises a heat-conducting fin (401) fixedly connected to the front face of the main board body (1), a cover plate (402) is fixedly connected to the front face of the heat-conducting fin (401), a frame (403) is fixedly connected to the back face of the cover plate (402), a positioning block (404) is fixedly connected to the outer side of the frame (403), an air outlet (405) is formed in the upper surface of the frame (403), and a grid (406) is fixedly connected to the inner portion of the air outlet (405).

2. The rapid thermal conductivity thermal module of claim 1, wherein: the heat dissipation mechanism (4) further comprises a bottom plate (409) fixedly connected to the outer side of the main board body (1), and the back face of the frame (403) is fixedly connected with the bottom plate (409).

3. The rapid thermal conductivity thermal module of claim 1, wherein: an air inlet (407) is formed in the lower surface of the frame (403), and a fan (408) is fixedly connected inside the air inlet (407).

4. The rapid thermal conductivity thermal module of claim 1, wherein: the number of the heat conducting fins (401) is not less than two, and the heat conducting fins are vertically distributed on the front surface of the main board body (1).

5. The rapid thermal conductivity thermal module of claim 1, wherein: the heat conduction mechanism (5) comprises a transverse heat conduction block (501) fixedly connected to the lower surface of the mainboard body (1), one side of the transverse heat conduction block (501) far away from the mainboard body (1) is fixedly connected with a vertical heat conduction block (502), the front side of the vertical heat conduction block (502) is fixedly connected with a brass sheet (503), the front side of the brass sheet (503) is fixedly connected with a transverse plate (504), the back side of the vertical heat conduction block (502) is fixedly connected with a heat dissipation base (505), and the outer side of the heat dissipation base (505) is fixedly connected with a support (506).

6. The rapid thermal module of claim 5, wherein: the transverse heat conducting blocks (501) are fixedly connected inside the frame (403), and the transverse heat conducting blocks (501) are fixedly connected to the lower surface of the heat conducting fin (401).

7. The rapid thermal module of claim 5, wherein: the transverse heat conducting blocks (501) and the vertical heat conducting blocks (502) are all brass blocks, and the grating (406) is a stainless steel metal mesh.