JPH0513629A - Mounting structure for heat sink - Google Patents
Mounting structure for heat sinkInfo
- Publication number
- JPH0513629A JPH0513629A JP3167941A JP16794191A JPH0513629A JP H0513629 A JPH0513629 A JP H0513629A JP 3167941 A JP3167941 A JP 3167941A JP 16794191 A JP16794191 A JP 16794191A JP H0513629 A JPH0513629 A JP H0513629A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- spring
- ceramic substrate
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を冷却するた
めに使用されるヒートシンクを電子部品に取り付ける構
造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for attaching a heat sink used for cooling an electronic component to the electronic component.
【０００２】[0002]
【従来の技術】従来、電子装置等に使用される電子部品
が搭載されたプリント基板を強制対流冷却により冷却す
る場合は、ヒートシンクをプリント基板に搭載される発
熱量の大きい電子部品の上面部分に半田或いは熱伝導の
良好な接着剤等により固着し、電子部品より発する熱を
半田あるいは接着剤を経てヒートシンクに伝導し、ヒー
トシンクの放熱ファンより強制対流によりプリント基板
上に導かれている冷媒に伝達していた。2. Description of the Related Art Conventionally, when a printed circuit board mounted with electronic components used in electronic devices is cooled by forced convection cooling, a heat sink is mounted on the upper surface of the electronic component mounted on the printed circuit board and generating a large amount of heat. It is fixed with solder or an adhesive with good thermal conductivity, and the heat generated from electronic components is conducted to the heat sink via the solder or adhesive, and is transferred from the heat dissipation fan of the heat sink to the refrigerant guided on the printed circuit board by forced convection. Was.
【０００３】図３は従来のヒートシンクの取付構造の断
面図であり、ヒートシンク５を集積回路素子２を有する
セラミック基板１に固着し、プリント基板４に搭載し、
ファン等で冷媒を対流させ冷却していた。ヒートシンク
５は、複数の平板を直立させたもので、電子部品の集積
回路素子２のケースの一部であるセラミック基板１の表
面に接着剤７にて固着した一体構造とし、集積回路素子
２の発するジャンクション熱を対流している冷媒に伝達
していた。FIG. 3 is a sectional view of a conventional heat sink mounting structure, in which a heat sink 5 is fixed to a ceramic substrate 1 having an integrated circuit element 2 and mounted on a printed circuit board 4.
Cooling was performed by convection of the refrigerant with a fan or the like. The heat sink 5 is formed by erecting a plurality of flat plates and has an integral structure in which the surface of the ceramic substrate 1 which is a part of the case of the integrated circuit element 2 of the electronic component is fixed by an adhesive agent 7. The generated junction heat was transferred to the convective refrigerant.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来のヒート
シンクの取付構造において、電子部品の高集積化ととも
に電子部品の発熱量を年々大きくなっており、その為に
電子部品の冷却に使用されるヒートシンクのサイズも必
要な冷却能力の確保の為、年々大型化している。しか
し、ヒートシンクの高さは電子部品とヒートシンクの固
着条件（半田付け等）に制限される事が多く、また、ヒ
ートシンクと電子部品を半田リフローにて固着する場
合、ヒートシンクの熱容量が大きい為、固着可能な電子
部品と電子部品数が制限されてしまう。また、電子部品
を基板等に固着する際には、固着後の基板等の改造布線
を行なう際の作業性を確保する為にヒートシンクの大き
さを制限され、必要な冷却能力を得る事が困難になって
いる欠点があった。In the above-mentioned conventional heat sink mounting structure, the heat generation amount of the electronic component is increasing year by year as the electronic component is highly integrated. Therefore, the heat sink used for cooling the electronic component is increased. The size of is increasing year by year to ensure the necessary cooling capacity. However, the height of the heat sink is often limited by the fixing conditions (soldering, etc.) between the electronic component and the heat sink. Also, when fixing the heat sink and the electronic component by solder reflow, the heat capacity of the heat sink is large, so the fixing The available electronic components and the number of electronic components are limited. In addition, when fixing electronic components to a substrate or the like, the size of the heat sink may be limited in order to ensure workability when performing modified wiring of the substrate or the like after being fixed, and the required cooling capacity may be obtained. There was a drawback that became difficult.
【０００５】更にセラミック基板と、ヒートシンクを固
着する場合、セラミック基板の破損を防ぐ為にヒートシ
ンク材質はセラミック基板と熱膨張率が等しい材質を選
択する必要があり、たとえばモリブテン、タングステン
等の限れらた材料しか選択できなかった。これらの材料
は高価であり、また加工が難しく、重い欠点があった。Further, when fixing the heat sink to the ceramic substrate, it is necessary to select a material having the same coefficient of thermal expansion as that of the ceramic substrate in order to prevent damage to the ceramic substrate. For example, molybdenum, tungsten, etc. are limited. Only materials could be selected. These materials are expensive, difficult to process, and heavy.
【０００６】[0006]
【課題を解決するための手段】本発明のヒートシンクの
取付構造は、ヒートシンクに固着されたヒートシンクバ
ネ部により電子部品を挟み、前記ヒートシンクを前記電
子部品の表面に固定することを特徴とする。The heat sink mounting structure of the present invention is characterized in that an electronic component is sandwiched between heat sink spring portions fixed to the heat sink and the heat sink is fixed to the surface of the electronic component.
【０００７】本発明のヒートシンクの取付構造は、ヒー
トシンクと、中央部分が前記ヒートシンクに固着され前
記中央部分より続く部分が上方に折り曲げられた後に下
方に折り曲げられて側板部分を形成しさらに先端部分が
内側に曲げられて前記中央部分および前記先端部分の間
に電子部品の縁を挟んで前記ヒートシンクを前記電子部
品上に固定するヒートシンクバネ部とを含み、前記側板
部分を内側へ倒すことにより前記中央部分と前記先端部
分の間が開き前記ヒートシンクを前記電子部品から取り
外すことができることを特徴とする。According to the heat sink mounting structure of the present invention, the heat sink, the central portion is fixed to the heat sink, the portion continuing from the central portion is bent upward, and then is bent downward to form the side plate portion, and the tip portion is further formed. A heat sink spring portion that is bent inward and sandwiches an edge of an electronic component between the central portion and the tip portion to fix the heat sink on the electronic component; A space is opened between the portion and the tip portion, and the heat sink can be removed from the electronic component.
【０００８】本発明のヒートシンクの取付構造は、ヒー
トシンクの電子部品と接する面に熱伝導性の良好な樹脂
を充填する凹部を設けている。In the heat sink mounting structure of the present invention, the surface of the heat sink contacting the electronic parts is provided with a recess filled with a resin having good thermal conductivity.
【０００９】[0009]
【実施例】次に、本発明の実施例について図を参照して
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１０】図１および図２はそれぞれ本発明の一実施
例の斜視図およびＡＡ断面図である。1 and 2 are a perspective view and an AA sectional view of an embodiment of the present invention, respectively.
【００１１】１はセラミック基板であり、集積回路素子
２が搭載されており、キャップ３が取付けられ密封され
ている。セラミック基板のリード１−１はプリント基板
４に半田付けされている。ヒートシンク５のヒートシン
クベース部５−１には、ヒートシンクフィン部５−２が
直立しており、ヒートシンクベース部５−１はセラミッ
ク基板１と接する面の中央部と外周部に凹部５−３、５
−４を有しており、中央部の凹部５−３には熱伝導の良
好なシリコン樹脂６が充填されており、外周部の凹部５
−４にはヒートシンクバネ部５−５の中央部５−５１が
固着されている。Reference numeral 1 denotes a ceramic substrate on which an integrated circuit element 2 is mounted, and a cap 3 is attached and sealed. The lead 1-1 of the ceramic substrate is soldered to the printed circuit board 4. A heat sink fin portion 5-2 stands upright on the heat sink base portion 5-1 of the heat sink 5, and the heat sink base portion 5-1 has recesses 5-3, 5 at the central portion and the outer peripheral portion of the surface in contact with the ceramic substrate 1.
-4, the concave portion 5-3 at the central portion is filled with the silicone resin 6 having good heat conduction, and the concave portion 5 at the outer peripheral portion is formed.
The central portion 5-51 of the heat sink spring portion 5-5 is fixed to -4.
【００１２】ヒートシンクバネ部５−５の両端はまず、
上方にほぼ直角に折り曲げられており、次に、この上方
に折り曲げた部分に重ねるように下方に折り曲げられ、
これら上方および下方に折り曲げられた部分で側板部分
５−５２を形成し、更に先端部分５−５３を内側に向け
て折り曲げられている。ヒートシンクバネ部５−５の両
端の側板部分５−５２を内側に倒すように挟み込むこと
で先端部分５−５３と中央部分５−５１の間が広がり、
その間にセラミック基板１の縁を装着でき、次に側板部
分５−５２を挟み込むのを止めると、弾性力により先端
部分５−５３が中央部分５−５１の間にセラミック基板
１の縁を抱え込むことでヒートシンク５のヒートシンク
ベース部５−１をセラミック基板１に密着させている。First, both ends of the heat sink spring portion 5-5 are
It is bent upwards at a substantially right angle, and then it is bent downward so as to overlap this upwardly bent part,
A side plate portion 5-52 is formed by the portions bent upward and downward, and the tip portion 5-53 is further bent inward. By sandwiching the side plate portions 5-52 at both ends of the heat sink spring portion 5-5 so as to incline inward, the space between the tip portion 5-53 and the central portion 5-51 expands,
The edge of the ceramic substrate 1 can be mounted between them, and when the side plate portion 5-52 is stopped from being sandwiched, the tip portion 5-53 holds the edge of the ceramic substrate 1 between the central portion 5-51 by the elastic force. The heat sink base portion 5-1 of the heat sink 5 is brought into close contact with the ceramic substrate 1.
【００１３】熱の伝達は以下の様になる。まず集積回路
素子２が発したジャンクション熱はセラミック基板１を
通過し、ヒートシンクベース部５−１の凹部５−３に充
填されたシリコン樹脂６を経てヒートシンクフィン部５
−２に伝達され、更にヒートシンク５の周囲を対流して
いる冷媒に伝達される。The heat transfer is as follows. First, the junction heat generated by the integrated circuit element 2 passes through the ceramic substrate 1, passes through the silicon resin 6 filled in the recess 5-3 of the heat sink base portion 5-1, and then passes through the heat sink fin portion 5.
-2, and further to the refrigerant convection around the heat sink 5.
【００１４】ヒートシンク５はセラミック基板１に装着
された後でもヒートシンクバネ部５−５の上方に折り曲
げられた側板部分５−５１を内側に倒すように挟むこと
で、先端部分５−５３と中央部分が５−５１の間が開い
てセラミック基板１を解放し、セラミック基板から容易
に取外すことができる。このようにヒートシンク５のセ
ラミック基板１への着脱が容易なため、ヒートシンク５
はセラミック基板１をプリント基板４に半田付けする時
はセラミック基板１に装着しておく必要がなく、半田付
け後に装着すればよい。Even after the heat sink 5 is mounted on the ceramic substrate 1, the side plate portion 5-51 bent over the heat sink spring portion 5-5 is sandwiched so as to be tilted inward, whereby the tip portion 5-53 and the central portion. 5 to 51 are opened to release the ceramic substrate 1 and can be easily removed from the ceramic substrate. Since the heat sink 5 can be easily attached to and detached from the ceramic substrate 1 as described above,
When soldering the ceramic substrate 1 to the printed circuit board 4, it is not necessary to mount the ceramic substrate 1 on the ceramic substrate 1, but it may be mounted after soldering.
【００１５】[0015]
【発明の効果】以上説明したとおり本発明は、電子部品
にヒートシンクを密着させるヒートシンクバネ部を設け
ることにより、電子部品を半田付けする際に、熱容量の
大きいヒートシンクを予め電子部品に装着しておく必要
がなく、半田付け後に容易にヒートシンクを電子部品に
装着することができる。また、一度ヒートシンクを電子
部品に装着した後も容易に着脱できる為、電子部品をプ
リント基板に半田付けした後のプリント基板の改造布線
等が容易に行える効果がある。As described above, according to the present invention, the heat sink having the large heat capacity is preliminarily attached to the electronic component when the electronic component is soldered by providing the heat sink spring portion for adhering the heat sink to the electronic component. There is no need, and the heat sink can be easily attached to the electronic component after soldering. Further, since the heat sink can be easily attached and detached even after the electronic component is once attached to the electronic component, there is an effect that the modified wiring of the printed substrate after the electronic component is soldered to the printed substrate can be easily performed.
【００１６】また、ヒートシンクは電子部品と直接固着
されていない為、例えば電子部品がセラミック基板の場
合、ヒートシンクの材質はセラミック基板と熱膨張率の
等しい材質を選定する必要が無いので、例えば、アムミ
ニウム等の安価で加工が容易で軽量な材質を採用できる
効果ある。Further, since the heat sink is not directly fixed to the electronic component, for example, when the electronic component is a ceramic substrate, it is not necessary to select a material having the same coefficient of thermal expansion as that of the ceramic substrate. There is an effect that it is possible to adopt a lightweight material such as cheap and easy to process.
【００１７】また、ヒートシンクと電子部品の間には熱
伝導率の良好な樹脂が介在している為ヒートシンク〜電
子部品間の熱抵抗が低減され、電子部品の発する熱が効
率よくヒートシンクに伝達されヒートシンク冷却効率が
向上する効果がある。Further, since the resin having good thermal conductivity is interposed between the heat sink and the electronic component, the thermal resistance between the heat sink and the electronic component is reduced, and the heat generated by the electronic component is efficiently transmitted to the heat sink. This has the effect of improving the heat sink cooling efficiency.
【図１】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】図１のＡＡ断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】従来のヒートシンクの取付構造の断面図であ
る。FIG. 3 is a cross-sectional view of a conventional heat sink mounting structure.
１ セラミック基板 ２ 集積回路素子 ３ キャップ ４ プリント基板 ５ ヒートシンク ５−１ ヒートシンクベース部 ５−２ ヒートシンクフィン部 ５−３ 凹部 ５−４ 凹部 ５−５ ヒートシンクバネ部 ５−５１ 中央部分 ５−５２ 側板部分 ５−５３ 選択部分 ６ シリコン樹脂 ７ 接着剤 1 Ceramic substrate 2 integrated circuit elements 3 caps 4 printed circuit boards 5 heat sink 5-1 Heat sink base 5-2 Heat sink fin section 5-3 recess 5-4 recess 5-5 Heat sink spring part 5-51 central part 5-52 Side plate part 5-53 Selected part 6 Silicone resin 7 adhesive
Claims (3)
バネ部により電子部品を挟み、前記ヒートシンクを前記
電子部品の表面に固定することを特徴とするヒートシン
クの取付構造。1. A mounting structure of a heat sink, characterized in that an electronic component is sandwiched by a heat sink spring portion fixed to a heat sink, and the heat sink is fixed to a surface of the electronic component.
シンクに固着され前記中央部分より続く部分が上方に折
り曲げられた後に下方に折り曲げられて側板部分を形成
しさらに先端部分が内側に曲げられて前記中央部分およ
び前記先端部分の間に電子部品の縁を挟んで前記ヒート
シンクを前記電子部品上に固定するヒートシンクバネ部
とを含み、前記側板部分を内側へ倒すことにより前記中
央部分と前記先端部分の間が開き前記ヒートシンクを前
記電子部品から取り外すことができることを特徴とする
ヒートシンクの取付構造。2. A heat sink, a central portion of which is fixed to the heat sink, a portion continuing from the central portion is bent upward, and then bent downward to form a side plate portion, and a tip portion is bent inward to form the central portion. A heat sink spring portion for fixing the heat sink on the electronic component by sandwiching the edge of the electronic component between the portion and the tip portion, and by tilting the side plate portion inward, the space between the central portion and the tip portion. A mounting structure for a heat sink, characterized in that the heat sink can be removed from the electronic component by opening.
伝導性の良好な樹脂を充填する凹部を設けた請求項１ま
たは２記載のヒートシンクの取付構造。3. The mounting structure for the heat sink according to claim 1, wherein the surface of the heat sink in contact with the electronic component is provided with a recess filled with a resin having good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3167941A JPH0513629A (en) | 1991-07-09 | 1991-07-09 | Mounting structure for heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3167941A JPH0513629A (en) | 1991-07-09 | 1991-07-09 | Mounting structure for heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0513629A true JPH0513629A (en) | 1993-01-22 |
Family
ID=15858894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3167941A Pending JPH0513629A (en) | 1991-07-09 | 1991-07-09 | Mounting structure for heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513629A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898571A (en) * | 1997-04-28 | 1999-04-27 | Lsi Logic Corporation | Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
| US5977622A (en) * | 1997-04-25 | 1999-11-02 | Lsi Logic Corporation | Stiffener with slots for clip-on heat sink attachment |
| US6308772B1 (en) * | 1998-06-09 | 2001-10-30 | Minebea Co., Ltd. | Heat sink |
-
1991
- 1991-07-09 JP JP3167941A patent/JPH0513629A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977622A (en) * | 1997-04-25 | 1999-11-02 | Lsi Logic Corporation | Stiffener with slots for clip-on heat sink attachment |
| US5898571A (en) * | 1997-04-28 | 1999-04-27 | Lsi Logic Corporation | Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
| US6308772B1 (en) * | 1998-06-09 | 2001-10-30 | Minebea Co., Ltd. | Heat sink |
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